JPH0227599Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a lead bending mechanism for an electronic component fixing device.

More specifically, the present invention relates to a lead bending mechanism of an electronic component fixing device that fixes the electronic component to the printed film board by bending the lead of the electronic component that is inserted into the mounting hole of the printed film board and protrudes toward the side opposite to the insertion surface. It is something.

(Prior Art) An electronic component fixing device that fixes the electronic component to the printed circuit board by bending the leads of the electronic component inserted into a mounting hole penetrated through a printed circuit board and protruding toward the side opposite to the insertion surface is conventional. Various models have been developed in This method could not be adopted in the case of film substrates.

That is, the conventional electronic component fixing device, as shown in FIG.
Since the lead 4 of the electronic component 3 inserted into the board is pushed by the movable cutter 5 and bent toward the bottom side of the board 1 using the edge of the hole 2 as a fulcrum, the printed board 1 is supported by the peripheral edge of the bottom side. Even if it is possible and can be adopted in the case of a thick rigid board such as a printed Bakelite board with a strong edge of the mounting hole 2, it can be used in the case of a thin flexible printed film board whose bottom surface needs to be fully supported. In some cases, it could not be adopted.

Therefore, in the case of a printed film board, the lower surface of the printed film board is fully supported by a support table that has recesses for holding parts on its support surface, and the electronics with leads inserted upward into the mounting holes of this board are used. setting the component in the recess,
An operator used an appropriate processing tool to bend and fix the leads protruding toward the top of the board one by one, but this type of bending resulted in low work efficiency and also caused problems with the direction of bending and the position of the bent leads relative to the board. The pressure contact state etc. was not constant, which was unfavorable in terms of quality.

(Problem to be solved by the invention) Therefore, the inventors of the present invention started developing an automatic fixing device to automate the manual lead bending described above, and developed a bending mechanism suitable for this purpose. As a result of intensive studies from various angles, they discovered that by configuring the lead to run on grooved rollers, the bending direction and the state of pressure contact of the bending lead against the board can be kept constant at all times.

(Means for Solving the Problems) That is, the lead bending mechanism of the electronic component fixing device according to the present invention is designed to bend the leads of the electronic component inserted into the nine holes of the printed film board and protruding toward the side opposite to the insertion surface. In the lead bending mechanism of the electronic component fixing device that fixes the electronic component to the printed film board by bending the lead, a first vertical shaft whose upper end is connected to a piston rod of a fluid pressure actuator, and a lower end of the first vertical shaft. a fixed support; a second vertical shaft that is movable up and down and fixed to the support; and an upper end surface opposite to the lower end surface that comes into contact with the substrate surface from which the lead is protruded; a substrate holding shoe having a rack at the bottom thereof and fixed to the lower end of the second vertical shaft; a shaft support bracket rotatably supporting a pinion that is engaged with the rack and a grooved roller that bends the lead; The present invention is characterized in that a leaf spring is provided, one end of which is fixed to the pivot bracket, and the other end of which is fixed to the support.

(Example) Below, a more specific explanation will be given based on the drawings.
In FIG. 1, which is a front view of the lead bending mechanism, 10 is a first vertical axis, 11 is a second vertical axis, 12 is a first support, 13 is a second support, 14 is an intermediate support, 15 is a compression coil spring, and 16 17 is a substrate holding shoe, 17 is a shaft support bracket, 18 is a leaf spring, the first support 12 is fixed near the upper end of the first vertical shaft 10, and the second support 13 is fixed to the lower end thereof, and, The second vertical shaft 11 is supported by both supports 12 and 13 so as to be able to move up and down, and an intermediate support 14 located between the first support 12 and the second support 13 is fixed to the second vertical shaft 11. and supports the first vertical shaft 10 so as to be movable up and down, and a compression coil spring 15 is provided around the second vertical shaft 11 and interposed between the first support 12 and the intermediate support 14. .

On the other hand, the substrate holding shoe 16 is fixed to the lower end of the second vertical shaft 11;
The second vertical shaft 11 is attached to the hole 16a shown in the figure.
The lower end of is inserted and fixed, and its lower end surface 16b
A rack 16d is provided on the upper end surface 16c on the opposite side.

Further, the pivot bracket 17 is connected to the second support 1
3, one end of which is fixed to the lower end of a leaf spring 18, which includes a pinion 19 that is engaged with the rack 16d of the board holding shoe 16, and a pair of A grooved roller 20 is rotatably supported. Note that 21 shown in FIG. 1 is a shaft joint, through which the upper end of the first vertical shaft 10 and the piston rod 22 of the fluid pressure actuator are connected.

According to the lead bending mechanism configured in this way, the fluid pressure actuator is attached to an appropriate means (for example, attached to an articulated robot) and suspended above a printed film substrate supported on a support table. In this state, the intermediate support 14 contacts the second support 13 to prevent the second vertical shaft 11 from coming off, and the pinion 19 is pushed by the leaf spring 18 and engaged with the rack 16d. ing.

Next, when bending the lead, the piston rod 22 of the hydraulic actuator is projected toward the substrate below.

As shown in FIG. 4, the lower surface of the printed film board is fully supported by a vacuum box type support table 23, and the leads 4 of the electronic components 3 are attached to the printed film board 24.
is inserted into the mounting hole and protrudes toward the top surface of the board. Note that the electronic component 3 is inserted and set in a component holding recess 23a provided on the support surface of the support table 23.

Therefore, when the piston rod 22 of the fluid pressure actuator is protruded, the entire lead bending mechanism moves downward, and its substrate holding shoe 16 and grooved roller 20 come into contact with the upper surface of the printed film substrate 24, and the lead bending mechanism is further protruded. Then, as shown in FIG. 1, the second support 13 moves downward and is separated from the intermediate support 14, and the second
It abuts against a stopper 25 fixed at a predetermined position on the vertical shaft 11. At the same time, the shaft support bracket 17 is pushed by the leaf spring 18 and the pinion 1
9 is rotated and moved toward the tip 16e of the substrate holding shoe 16.

For this reason, as shown in Figure 5,
The lead 4 of the electronic component 3 can be bent inward by the grooved roller 20 that rotates and moves together with the pinion 19, but in this case,
The bending direction can be kept constant at all times, and the pressure of the bent lead against the board can also be kept constant at all times.Furthermore, since the downward movement of the second support 13 is restricted by the stopper 25, the pinion 19 This prevents the board from moving excessively and falling from the tip 16e of the board holding shoe 16.
Furthermore, while the air inside the table is forcibly extracted from the exhaust port 23b of the support table 23, the portion to be bent is locally nipped with the substrate holding shoe 16, so that the printed film substrate 24 can be kept under tension. Lead bending is possible.

Note that since a pair of grooved rollers 20 are installed, after bending the lead 4 of one electronic component 3 with one grooved roller 20, this mechanism is rotated at an appropriate angle to bend the lead 4 of one electronic component 3 to the adjacent electronic component 3. The other grooved roller 20 can be positioned and bent with respect to the leads 4 of the pair of grooved rollers 2, and the pitch between the leads 4 of the adjacent electronic components 3 can be adjusted
If the pitch is equal to 0, both leads 4 can be bent at the same time.

When the bending is completed, the piston rod 22 of the hydraulic actuator is depressed, and the entire lead bending mechanism is moved to its original position, that is, above the printed film substrate 24.

Although the most preferred embodiment of the lead bending mechanism according to the present invention has been described above, the present invention may be provided in other embodiments.

For example, the first support 12 and the compression coil spring 15 may be omitted from the lead bending mechanism in the embodiment described above.
The compression coil spring 15 is omitted, and the intermediate support 14 is replaced with a second one so as not to support the first vertical shaft 10.
It may also be provided in a form that is simply fixed to the vertical shaft 11. Note that it is preferable that a shaft rotation prevention means, such as a spline or a parallel key, be attached to the first vertical shaft 10 or the second vertical shaft 11 in order to prevent the pinion 19 from shifting with respect to the rack 16d. Furthermore, various modes of mounting the lead bending mechanism in a suspended state can be provided.

That is, when the support table 23 supporting the printed film board 24 is mounted so that it can rotate in a horizontal plane and move in both the X and Y axes directions perpendicular to each other, an appropriate fixed frame structure is used. It is only necessary to provide a lead bending mechanism so that the mounting position on the body remains unchanged when viewed from above.On the contrary, if the support table 23 is mounted in such a way that it cannot be moved, it is possible to It is sufficient to install a lead bending mechanism so that the lead bending mechanism can be freely moved. By mounting in this manner, leads arranged in multiple directions can be bent by one bending mechanism. Note that the grooved rollers may also be provided not only in a circular shape but also in a square shape, and when provided in this manner, the leads can be bent in an arc shape with respect to the substrate.

(Effects of the invention) As described above, according to the invention, when bending and fixing the lead of an electronic component to a thin flexible printed film board, the bending direction and the pressure contact state of the bent lead to the board can be adjusted. A lead bending mechanism that can always keep the lead bending mechanism constant is obtained.

[Brief explanation of the drawing]

1 to 5 show an embodiment of the present invention, FIG. 1 is a perspective view of the lead bending mechanism, FIG. 2 is a perspective view of the substrate holding shoe, and FIG. 3 is a shaft support for a pinion and a pair of grooved rollers. FIG. 4 is a vertical cross-sectional view of the support table, FIG. 5 is a vertical cross-sectional view showing a lead bending mode, and FIG. 6 is a vertical cross-sectional view showing a conventional lead bending mode. 3...Electronic component, 4...Lead, 10...1st
Vertical axis, 11... Second vertical axis, 13... Second support, 14... Intermediate support, 16... Board holding shoe, 16d... Rack, 17... Axial support bracket, 18... Leaf spring, 19 ...Pinion, 20...
... Grooved roller, 22 ... Piston rod of fluid pressure actuator, 24 ... Printed film board.

Claims (1)

[Scope of utility model registration request] In a lead bending mechanism of an electronic component fixing device that fixes the electronic component to the printed film board by bending the lead of the electronic component that is inserted into the mounting hole of the printed film board and protrudes toward the side opposite to the insertion surface, the upper end thereof is bent. a first vertical shaft connected to the piston rod of the fluid pressure actuator; a support fixed to the lower end of the first vertical shaft; a second vertical shaft mounted on the support so as to be movable up and down and prevented from coming off; A board holding shoe, which has a rack on its upper end surface opposite to the lower end surface that comes into contact with the board surface from which the leads are protruding, is engaged with the rack, and is fixed to the lower end of the second vertical shaft. A shaft support bracket rotatably supports a pinion and a grooved roller for bending the lead, and a leaf spring having one end fixed to the shaft support bracket and the other end fixed to the support. A lead bending mechanism for an electronic component fixing device characterized by: