JPH0227521Y2 - - Google Patents
Info
- Publication number
- JPH0227521Y2 JPH0227521Y2 JP1983059033U JP5903383U JPH0227521Y2 JP H0227521 Y2 JPH0227521 Y2 JP H0227521Y2 JP 1983059033 U JP1983059033 U JP 1983059033U JP 5903383 U JP5903383 U JP 5903383U JP H0227521 Y2 JPH0227521 Y2 JP H0227521Y2
- Authority
- JP
- Japan
- Prior art keywords
- base
- thermistor
- glass
- cover
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 21
- 238000010304 firing Methods 0.000 claims description 9
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 239000000843 powder Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
Description
【考案の詳細な説明】 この考案はサーミスタに関する。[Detailed explanation of the idea] This invention relates to a thermistor.
渦流量計において温度検出器として用いられる
サーミスタは、一般に、リード線が埋め込まれた
ガラス製の基台と、この基台の一方の面に配置さ
れてリード線に接続されたフレーク型のサーミス
タ素子片と、この素子片を覆つて基台の一方の面
に設けられ、基台と同質のガラスからなるカバー
とで形成されている。ところで、このようなサー
ミスタは、リード線を予め埋め込んだ基台の一方
の面にサーミスタ素子片を配置し、この素子片と
リード線とを導電性ペーストの焼成でもつて接続
した後に、粉末ガラス入りのペーストの焼成でも
つて基台の一方の面にカバーを形成して製造され
るが、しかし乍ら、このようなサーミスタでは、
カバー形成における焼成時、基台の溶融が同時に
生じ、リード線の基台による支持が良好になされ
なくなり、リード線が基台から脱落し、リード線
に接続されたサーミスタ素子片が破損される虞れ
があり、それ程製造性に優れたものであるとはい
い難い。 A thermistor used as a temperature detector in a vortex flowmeter generally consists of a glass base with embedded lead wires and a flake-shaped thermistor element placed on one side of the base and connected to the lead wires. A cover is provided on one side of the base to cover the element piece, and is made of glass of the same quality as the base. By the way, such a thermistor is made by placing a thermistor element piece on one side of a base in which lead wires are embedded in advance, and after connecting the element piece and the lead wires by firing a conductive paste, a powder glass-filled However, in such a thermistor, a cover is formed on one side of the base by firing the paste.
During firing during cover formation, the base will melt at the same time, and the lead wires will no longer be supported properly by the base, leading to the lead wires falling off the base and potentially damaging the thermistor element pieces connected to the lead wires. Therefore, it is difficult to say that the product has excellent manufacturability.
本考案は前記諸点に鑑みなされたものであり、
その目的とするところは、製造中にリード線が外
れたり、サーミスタ素子片が割れたりすることを
なくし得、製造性を向上せしめることができるサ
ーミスタを提供することにある。 This invention was made in view of the above points,
The purpose is to provide a thermistor that can prevent lead wires from coming off and breakage of the thermistor element pieces during manufacturing, and can improve manufacturability.
前記目的は、本考案によれば、リード線が埋め
込まれたガラス製の基台と、前記リード線に電気
的に接続されて前記基台の一方の面に設けられた
サーミスタ素子片と、該サーミスタ素子片を覆う
べく、前記基台の軟化温度よりも低い作業温度で
当該基台の一方の面に焼成により形成されたガラ
ス製のカバーとを有してなるサーミスタによつて
達成される。 According to the present invention, the object includes: a glass base in which a lead wire is embedded; a thermistor element piece electrically connected to the lead wire and provided on one surface of the base; This is achieved by a thermistor having a glass cover formed on one side of the base by firing at an operating temperature lower than the softening temperature of the base to cover the thermistor element piece.
次に本考案による好ましい一具体例を図面に基
づいて説明する。 Next, a preferred embodiment of the present invention will be explained based on the drawings.
第１図及び第２図において、ステンレス鋼等の
金属製の円筒状ケース１内には、高軟化温度を有
するガラスからなる基台２が形成されている。基
台２を形成するこの高軟化温度を有するガラスと
しては、例えば軟化点（s.p.）＝650℃、作業点
（w.p.）＝1015℃、熱膨張係数（α）＝92×10-7／
℃旭硝子(株)製ASF201等を用いることができる。
このように電気的絶縁材からなる基台２にはpt線
等の金属製のリード線３及び４が埋め込まれてお
り、リード線３及び４の一端は、Au、Ag−pd、
又はpt等からなる金属製の接続部５及び６を介し
て夫々フレーク型のサーミスタ素子片７に電気的
に接続されている。基台２の一方の面８に配置さ
れた素子片７と接続部５，６とを覆つて保護用の
カバー９が面８上に形成されている。カバー９
は、基台２の軟化温度よりも低い作業温度を有す
るガラスから形成されており、例えば日本電気硝
子(株)製のGA−１（軟化点s.p.＝595℃、作業点w.p.
＝620℃、熱膨張係数α＝60×10-7／℃）、GA−
８（軟化点s.p.＝490℃、作業点w.p.＝560℃、熱膨
張係数α＝90×10-7／℃）、GA−９（軟化点s.p.＝
430℃、作業点w.p.＝520℃、熱膨張係数α＝81×
10-7／℃）又は旭硝子(株)製のASF1305（軟化点s.
p.＝400℃、作業点w.p.＝約500℃、熱膨張係数α
＝95×10-7／℃）等を用いることができる。 1 and 2, a base 2 made of glass having a high softening temperature is formed inside a cylindrical case 1 made of metal such as stainless steel. The glass having a high softening temperature that forms the base 2 has, for example, a softening point (sp) of 650°C, a working point (wp) of 1015°C, and a coefficient of thermal expansion (α) of 92×10 -7 /
°C ASF201 manufactured by Asahi Glass Co., Ltd., etc. can be used.
In this way, metal lead wires 3 and 4 such as PT wires are embedded in the base 2 made of an electrically insulating material, and one ends of the lead wires 3 and 4 are connected to Au, Ag-PD,
Alternatively, they are electrically connected to flake-shaped thermistor element pieces 7 via metal connecting parts 5 and 6 made of PT or the like. A protective cover 9 is formed on one surface 8 of the base 2 to cover the element piece 7 and the connecting portions 5 and 6 arranged on one surface 8 of the base 2 . cover 9
is made of glass having a working temperature lower than the softening temperature of the base 2, such as GA-1 manufactured by Nippon Electric Glass Co., Ltd. (softening point sp = 595°C, working point wp).
= 620℃, thermal expansion coefficient α = 60×10 -7 /℃), GA−
8 (softening point sp = 490℃, working point wp = 560℃, thermal expansion coefficient α = 90 × 10 -7 /℃), GA-9 (softening point sp =
430℃, working point wp=520℃, thermal expansion coefficient α=81×
10 -7 /℃) or ASF1305 manufactured by Asahi Glass Co., Ltd. (softening point s.
p.=400℃, working point wp=approx. 500℃, coefficient of thermal expansion α
= 95×10 -7 /°C), etc. can be used.
このように構成されるサーミスタ２０は次のよ
うにして製造される。第３図に示すように、ケー
ス１内に形成され、リード線３及び４が埋め込ま
れたガラス製の基台２の一方の面８に、金属酸化
物の焼結体からなるフレーク型のサーミスタ素子
片（幅0.2mm、長さ0.8mm、厚さ0.015mm）７を配置
し、導電性ペーストの焼成により接続部５及び６
を形成してリード線３及び４の一端と素子片７と
を電気的に接続する。次に、第４図に示すよう
に、基台２の軟化温度よりも低い作業温度を有す
るガラス粉末入りのペーストをスクリーン印刷機
等によつて面８に薄く、すなわち焼成後の厚さｔ
が20μｍ〜30μｍとなる程度に印刷し、ペースト
層２１を面８上に形成する。その後、基台２の軟
化温度よりも低い層２１のガラス粉末の作業温度
を加えて層２１のガラス粉末を溶融し、素子片
７、接続部５及び６を外部から遮断するような電
気的に絶縁な保護用のカバー９を焼成する。例え
ば、基台２の材料にASF201を、カバー９の材
料、すなわちガラス粉末にGA−１、GA−８、
GA−９又はASF1305を用いる場合には、各々約
620℃（GA−１）、560℃（GA−８）、520℃
（GA−９）又は500℃（ASF1305）の温度で層２
１を焼成してカバー９を形成する。尚、ガラス粉
末の粒度は325メツシユパス程度が好ましい。 The thermistor 20 configured as described above is manufactured as follows. As shown in FIG. 3, a flake-type thermistor made of a sintered metal oxide is attached to one surface 8 of a glass base 2 formed inside the case 1 and in which the lead wires 3 and 4 are embedded. The element pieces (width 0.2 mm, length 0.8 mm, thickness 0.015 mm) 7 are arranged, and the connecting parts 5 and 6 are formed by baking the conductive paste.
is formed to electrically connect one ends of the lead wires 3 and 4 and the element piece 7. Next, as shown in FIG. 4, a paste containing glass powder having a working temperature lower than the softening temperature of the base 2 is applied to the surface 8 by using a screen printer or the like to thinly coat the surface 8 with a thickness t after firing.
The paste layer 21 is formed on the surface 8 by printing to an extent of 20 μm to 30 μm. Thereafter, a working temperature of the glass powder in the layer 21 is applied which is lower than the softening temperature of the base 2 to melt the glass powder in the layer 21. The insulating protective cover 9 is fired. For example, the material for the base 2 is ASF201, and the material for the cover 9, that is, glass powder, is GA-1, GA-8, etc.
When using GA-9 or ASF1305, each approximately
620℃ (GA-1), 560℃ (GA-8), 520℃
(GA-9) or layer 2 at a temperature of 500℃ (ASF1305)
1 is fired to form a cover 9. The particle size of the glass powder is preferably about 325 mesh pass.
ところで、このようなサーミスタ２０では、カ
バー９の材料が基台２の材料の軟化温度より低い
作業温度を有するため、基台２の軟化温度より低
い温度でカバー９の焼成を行い得、この焼成にお
いて基台２の溶融を生ぜしめない結果、リード線
３及び４の基台２からの脱落、この脱落にともな
うサーミスタ素子片７の折損等の事故をなくし得
る。 By the way, in such a thermistor 20, since the material of the cover 9 has a working temperature lower than the softening temperature of the material of the base 2, the cover 9 can be fired at a temperature lower than the softening temperature of the base 2, and this firing Since the base 2 is not melted, accidents such as the lead wires 3 and 4 falling off the base 2 and the thermistor element piece 7 breaking due to this falling can be avoided.
尚、サーミスタ素子片７の熱膨張係数（一般に
α＝90〜95×10-7／℃を有する）と同等の熱膨張
係数を有するガラス及びガラス粉末を基台２及び
カバー９の形成のために夫々用いると、カバー９
の焼成時の冷却において及び製造後の環境温度の
大幅な変化において熱膨張係数の差による素子片
７の割れ等の事故を好ましく防ぎ得る。 Note that glass and glass powder having a thermal expansion coefficient equivalent to that of the thermistor element piece 7 (generally α=90 to 95×10 -7 /°C) are used to form the base 2 and the cover 9. When used respectively, cover 9
Accidents such as cracking of the element pieces 7 due to differences in thermal expansion coefficients can be preferably prevented during cooling during firing and during significant changes in environmental temperature after manufacture.
前記の如く、本考案によれば、基台の軟化温度
よりも低い作業温度を有するガラスからカバーが
形成されているため、サーミスタの製造に於い
て、ガラス製のカバーの焼成を、ガラス製の基台
の軟化温度よりも低い作業温度で行ない得るた
め、当該基台には溶融が生じ難く、その結果リー
ド線の基台からの脱落をなくし得る上に、サーミ
スタ素子片の破断等をなくし得、製造性に優れた
サーミスタを提供し得る。 As described above, according to the present invention, the cover is formed from glass having a working temperature lower than the softening temperature of the base, so in the production of thermistors, the firing of the glass cover is replaced by the glass cover. Since the work can be carried out at a working temperature lower than the softening temperature of the base, the base is unlikely to melt, and as a result, it is possible to prevent the lead wire from falling off the base, and also to prevent breakage of the thermistor element piece. , it is possible to provide a thermistor with excellent manufacturability.
第１図は本考案による好ましい一具体例の平面
図、第２図は第１図に示す−線断面図、第３
図及び第４図は第１図に示す具体例の製造方法の
説明図である。
２……基台、３，４……リード線、７……サー
ミスタ素子片、９……カバー。
FIG. 1 is a plan view of a preferred embodiment of the present invention, FIG. 2 is a sectional view taken along the line shown in FIG. 1, and FIG.
The drawings and FIG. 4 are explanatory diagrams of the manufacturing method of the specific example shown in FIG. 1. 2... Base, 3, 4... Lead wire, 7... Thermistor element piece, 9... Cover.
Claims (1)
記リード線に電気的に接続されて前記基台の一方
の面に設けられたサーミスタ素子片と、該サーミ
スタ素子片を覆うべく、前記基台の軟化温度より
も低い作業温度で当該基台の一方の面に焼成によ
り形成されたガラス製のカバーとを有してなるサ
ーミスタ。 a glass base in which a lead wire is embedded; a thermistor element piece electrically connected to the lead wire and provided on one side of the base; A thermistor comprising a glass cover formed on one side of the base by firing at a working temperature lower than the softening temperature of the thermistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5903383U JPS59164203U (en) | 1983-04-20 | 1983-04-20 | thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5903383U JPS59164203U (en) | 1983-04-20 | 1983-04-20 | thermistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59164203U JPS59164203U (en) | 1984-11-02 |
| JPH0227521Y2 true JPH0227521Y2 (en) | 1990-07-25 |
Family
ID=30189293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5903383U Granted JPS59164203U (en) | 1983-04-20 | 1983-04-20 | thermistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59164203U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH054256Y2 (en) * | 1986-04-04 | 1993-02-02 |
-
1983
- 1983-04-20 JP JP5903383U patent/JPS59164203U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59164203U (en) | 1984-11-02 |
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