JPH02272732A - Semiconductor wafer processor - Google Patents

Abstract

PURPOSE:To prevent electrification of a wafer so as to prevent adhesion of dust by filling electrification preventive gas into a chamber through spray nozzles provided on both sides of the chamber of a semiconductor wafer processor. CONSTITUTION:Spray nozzles 10, the introduction ports, are provided on both sides of a chamber 1, and introduction pipes 9 and valves 11 are mounted to them. And electrification preventive gas is introduced into the chamber 1 in processing of a semiconductor wafer so as to fill the inside of the chamber 1 with the electrification preventive gas. Accordingly, when applying treatments such as etching, drying, etc. to the semiconductor wafer 5, the wafer 5 is not electrified, whereby it can prevent dust from adhering to the wafer 5.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device manufacturing apparatus, and more particularly to a semiconductor wafer processing apparatus for chemically processing semiconductor wafers such as etching, oxidation, and cleaning.

[Conventional technology]

Conventionally, this type of semiconductor wafer processing equipment consists of a rotating table that holds and rotates the semiconductor wafer, a nozzle that drops a liquid onto the surface of the semiconductor wafer, and a chamber that houses these devices and the semiconductor wafer. .

FIG. 3 is a sectional view of a conventional semiconductor wafer processing apparatus. This semiconductor wafer processing apparatus includes a rotating table 4 to which a chuck for holding a semiconductor wafer 5 is attached, a rotating shaft 2 for rotating this rotating table 4, a bearing 3 for holding this rotating shaft, and a surface of the semiconductor wafer 5. a nozzle 8 for dropping a chemical solution or pure water into a container, a chamber 1 for housing these mechanical parts, and an exhaust pipe 6 for evacuating this chamber 1.
It has

Normally, in this semiconductor wafer processing apparatus, for example, a chemical solution is dropped from a nozzle 8 onto a rotating semiconductor wafer 5 to chemically process the wafer, or pure water is dropped to clean the wafer. Also, as another usage, for example,
Semiconductor wafer 5t - The semiconductor wafer 5 was being rotated and dried.

[Problem to be solved by the invention]

However, in the conventional wafer processing equipment described above,
While rotating the semiconductor wafer, the semiconductor wafer becomes electrically charged.
The drawback is that it tends to attract dirt from the surrounding area.

An object of the present invention is to provide a semiconductor wafer processing apparatus in which dust does not adhere to semiconductor wafers.

[Means to solve the problem]

The semiconductor wafer processing apparatus of the present invention includes a rotating table that holds and rotates a semiconductor wafer, a nozzle that drops a processing liquid onto the surface of the semiconductor wafer, and a chamber that accommodates the rotating table that loads the semiconductor wafer and the nozzle. A semiconductor wafer processing apparatus having a semiconductor wafer processing apparatus includes an inlet for discharging antistatic gas into the chamber.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a sectional view of a semiconductor wafer processing apparatus showing a first embodiment of the present invention. This semiconductor wafer processing apparatus is provided with spray nozzles 10 as introduction ports on both sides of a chamber 1, and an introduction pipe 9 and a valve 11 are attached to the spray nozzles 10.
This is to introduce an antistatic gas into the chamber and fill the chamber with the antistatic gas. Other than that, it is the same as the conventional example.

FIG. 2 is a sectional view of a semiconductor wafer processing apparatus showing a second embodiment of the present invention. This semiconductor wafer processing apparatus includes a spray nozzle 10a that introduces antistatic gas.
is provided in the upper part of the chamber 1, and the antistatic gas is sprayed so as to cover the surface of the semiconductor wafer 5.

This embodiment has an advantage over the first embodiment in that the amount of antistatic gas can be saved.

If the semiconductor wafer processing apparatus has such a structure, when the semiconductor wafer 5 is processed in the chamber 1 by etching, cleaning, drying, etc., the chamber 1 is filled with an antistatic gas, and the antistatic gas is filled with the antistatic gas. This treatment prevents the semiconductor wafer 5 from being electrically charged, and reduces dust adhering to the semiconductor wafer 5.

〔Effect of the invention〕

As explained above, the present invention has the effect that a semiconductor wafer processing apparatus can be obtained in which dust does not adhere to the semiconductor wafer by rotating the semiconductor wafer in an atmosphere of antistatic gas.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of a semiconductor wafer processing apparatus showing a first embodiment of the present invention, FIG. 2 is a cross-sectional view of a semiconductor wafer processing apparatus showing a second embodiment of the present invention, and FIG. FIG. 1 is a cross-sectional view of a semiconductor wafer processing apparatus showing an example. DESCRIPTION OF SYMBOLS 1... Chamber, 4... Turntable, 5... Semiconductor wafer, 8... Nozzle, 9.9a... Introducing pipe, 10
．． 10a...Spray nozzle, 11, lla...Valve.

Claims (1)

[Claims] A semiconductor wafer processing apparatus comprising: a rotating table that holds and rotates a semiconductor wafer; a nozzle that drops a processing liquid onto the surface of the semiconductor wafer; and a chamber that accommodates the rotating table that loads the semiconductor wafer and the nozzle; A semiconductor wafer processing apparatus characterized by having an inlet in a chamber for discharging an antistatic gas.