JPH02270967A - Pretreatment of electroless plating for polymer molded body - Google Patents
Pretreatment of electroless plating for polymer molded bodyInfo
- Publication number
- JPH02270967A JPH02270967A JP9176689A JP9176689A JPH02270967A JP H02270967 A JPH02270967 A JP H02270967A JP 9176689 A JP9176689 A JP 9176689A JP 9176689 A JP9176689 A JP 9176689A JP H02270967 A JPH02270967 A JP H02270967A
- Authority
- JP
- Japan
- Prior art keywords
- molded body
- pretreatment
- electroless plating
- metathesis
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007772 electroless plating Methods 0.000 title claims abstract description 29
- 229920000642 polymer Polymers 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 40
- 238000005649 metathesis reaction Methods 0.000 claims abstract description 28
- 239000003054 catalyst Substances 0.000 claims abstract description 25
- 238000007747 plating Methods 0.000 claims abstract description 20
- 238000000465 moulding Methods 0.000 claims abstract description 16
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000001301 oxygen Substances 0.000 claims abstract description 15
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 15
- 239000000178 monomer Substances 0.000 claims description 25
- 238000011282 treatment Methods 0.000 claims description 19
- 238000006116 polymerization reaction Methods 0.000 claims description 17
- 238000002203 pretreatment Methods 0.000 claims description 8
- 230000004913 activation Effects 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 abstract description 2
- 229910052739 hydrogen Inorganic materials 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 abstract 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- 239000002932 luster Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 42
- -1 cyclic olefins Chemical class 0.000 description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 14
- 239000002685 polymerization catalyst Substances 0.000 description 12
- 239000007788 liquid Substances 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000004033 plastic Substances 0.000 description 9
- 229920003023 plastic Polymers 0.000 description 9
- 229920001971 elastomer Polymers 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 7
- 229910052763 palladium Inorganic materials 0.000 description 7
- 239000000654 additive Substances 0.000 description 6
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 6
- 229920006037 cross link polymer Polymers 0.000 description 6
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 6
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 5
- 239000012190 activator Substances 0.000 description 5
- 239000005060 rubber Substances 0.000 description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 5
- 229910052721 tungsten Inorganic materials 0.000 description 5
- 239000010937 tungsten Substances 0.000 description 5
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 4
- 238000010306 acid treatment Methods 0.000 description 4
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
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- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 150000003658 tungsten compounds Chemical class 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000013543 active substance Substances 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 150000002902 organometallic compounds Chemical class 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- KPGXUAIFQMJJFB-UHFFFAOYSA-H tungsten hexachloride Chemical compound Cl[W](Cl)(Cl)(Cl)(Cl)Cl KPGXUAIFQMJJFB-UHFFFAOYSA-H 0.000 description 3
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 2
- OJOWICOBYCXEKR-KRXBUXKQSA-N (5e)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C/C)/CC1C=C2 OJOWICOBYCXEKR-KRXBUXKQSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- 239000002879 Lewis base Substances 0.000 description 2
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000003929 acidic solution Substances 0.000 description 2
- 125000005234 alkyl aluminium group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- 239000003599 detergent Substances 0.000 description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 2
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 150000007527 lewis bases Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 2
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000001119 stannous chloride Substances 0.000 description 2
- 235000011150 stannous chloride Nutrition 0.000 description 2
- LFXVBWRMVZPLFK-UHFFFAOYSA-N trioctylalumane Chemical compound CCCCCCCC[Al](CCCCCCCC)CCCCCCCC LFXVBWRMVZPLFK-UHFFFAOYSA-N 0.000 description 2
- VYXHVRARDIDEHS-UHFFFAOYSA-N 1,5-cyclooctadiene Chemical compound C1CC=CCCC=C1 VYXHVRARDIDEHS-UHFFFAOYSA-N 0.000 description 1
- 239000004912 1,5-cyclooctadiene Substances 0.000 description 1
- MWWFCLSPQOGSCM-UHFFFAOYSA-N 1-[2-(1-bicyclo[2.2.1]hept-2-enyl)phenyl]bicyclo[2.2.1]hept-2-ene Chemical compound C1(=C(C=CC=C1)C12C=CC(CC1)C2)C21C=CC(CC2)C1 MWWFCLSPQOGSCM-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- XHAXVDWUMCHTCY-UHFFFAOYSA-N 2,2,2-trichloroethyl acetate Chemical compound CC(=O)OCC(Cl)(Cl)Cl XHAXVDWUMCHTCY-UHFFFAOYSA-N 0.000 description 1
- XFEKIQFBJSDMQB-UHFFFAOYSA-N 2,2,2-trichloroethylbenzene Chemical compound ClC(Cl)(Cl)CC1=CC=CC=C1 XFEKIQFBJSDMQB-UHFFFAOYSA-N 0.000 description 1
- NOGFHTGYPKWWRX-UHFFFAOYSA-N 2,2,6,6-tetramethyloxan-4-one Chemical compound CC1(C)CC(=O)CC(C)(C)O1 NOGFHTGYPKWWRX-UHFFFAOYSA-N 0.000 description 1
- PNRZRBBBDPNPQM-UHFFFAOYSA-N 2-ethylhexyl 5-methylbicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCC(CC)CCCC)(C)CC1C=C2 PNRZRBBBDPNPQM-UHFFFAOYSA-N 0.000 description 1
- VSKJLJHPAFKHBX-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 VSKJLJHPAFKHBX-UHFFFAOYSA-N 0.000 description 1
- KXYDGGNWZUHESZ-UHFFFAOYSA-N 4-(2,2,4-trimethyl-3h-chromen-4-yl)phenol Chemical compound C12=CC=CC=C2OC(C)(C)CC1(C)C1=CC=C(O)C=C1 KXYDGGNWZUHESZ-UHFFFAOYSA-N 0.000 description 1
- OWETXGRKCLKMMD-UHFFFAOYSA-N 5-(phenoxymethyl)bicyclo[2.2.1]hept-2-ene Chemical compound C1C(C=C2)CC2C1COC1=CC=CC=C1 OWETXGRKCLKMMD-UHFFFAOYSA-N 0.000 description 1
- INYHZQLKOKTDAI-UHFFFAOYSA-N 5-ethenylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C=C)CC1C=C2 INYHZQLKOKTDAI-UHFFFAOYSA-N 0.000 description 1
- OJOWICOBYCXEKR-UHFFFAOYSA-N 5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=CC)CC1C=C2 OJOWICOBYCXEKR-UHFFFAOYSA-N 0.000 description 1
- PCBPVYHMZBWMAZ-UHFFFAOYSA-N 5-methylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C)CC1C=C2 PCBPVYHMZBWMAZ-UHFFFAOYSA-N 0.000 description 1
- PGNNHYNYFLXKDZ-UHFFFAOYSA-N 5-phenylbicyclo[2.2.1]hept-2-ene Chemical compound C1=CC2CC1CC2C1=CC=CC=C1 PGNNHYNYFLXKDZ-UHFFFAOYSA-N 0.000 description 1
- KNOVZEUMNAFMCY-UHFFFAOYSA-N C12CCC(C=C1)C2.C21CCC(C=C2)C1.C=C Chemical compound C12CCC(C=C1)C2.C21CCC(C=C2)C1.C=C KNOVZEUMNAFMCY-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
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- UTGQNNCQYDRXCH-UHFFFAOYSA-N N,N'-diphenyl-1,4-phenylenediamine Chemical compound C=1C=C(NC=2C=CC=CC=2)C=CC=1NC1=CC=CC=C1 UTGQNNCQYDRXCH-UHFFFAOYSA-N 0.000 description 1
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- NSYYPXSKPGPMBW-UHFFFAOYSA-N [O-2].[O-2].[Ti+4].Cl Chemical compound [O-2].[O-2].[Ti+4].Cl NSYYPXSKPGPMBW-UHFFFAOYSA-N 0.000 description 1
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- 150000001412 amines Chemical class 0.000 description 1
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- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
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- 229920003002 synthetic resin Polymers 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- AFCAKJKUYFLYFK-UHFFFAOYSA-N tetrabutyltin Chemical compound CCCC[Sn](CCCC)(CCCC)CCCC AFCAKJKUYFLYFK-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- PIILXFBHQILWPS-UHFFFAOYSA-N tributyltin Chemical compound CCCC[Sn](CCCC)CCCC PIILXFBHQILWPS-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
a、産業上の利用分野
本発明は、メタセシス重合性モノマーをメタセシス重合
触媒系の存在下で重合と同時に成型も行なって得る重合
体成型物に対する改良された無電解メッキ方法に間する
ものである。さらに詳しくは、無電解メッキの触媒付与
、活性化処理に売立っての前処理方法の改良に関するも
のである。Detailed Description of the Invention a. Industrial Application Field The present invention relates to improved electroless plating of a polymer molded product obtained by simultaneously polymerizing and molding a metathesis polymerizable monomer in the presence of a metathesis polymerization catalyst system. This is an intermediate method. More specifically, the present invention relates to improvements in pretreatment methods for catalyst application and activation treatment in electroless plating.
b、従来技術
有否環状オレフィンか、メタセシス重合触媒系によって
開環重合する事は公知である。それを利用してジシクロ
ペンタジェンの如く安価に得られるメタセシス重合性モ
ノマーを、メタセシス重合触媒系が主触媒成分と活性化
剤成分の二成分がらなり、かかる二つの成分の各々を含
有するモノマーの反応性溶液を、混合後、直ちに鋳型に
流し込み、その中でバルク重合を行ない重合と成型を一
段でおこなう方法か提案された(例えは特開昭58−i
29013号公報参照)。b. Prior art: It is known that ring-opening polymerization of cyclic olefins can be carried out using a metathesis polymerization catalyst system. The metathesis polymerization catalyst system consists of two components, a main catalyst component and an activator component, and a monomer containing each of these two components A method has been proposed in which a reactive solution of 100% is poured into a mold immediately after mixing, and bulk polymerization is performed therein to perform polymerization and molding in one step.
(See Publication No. 29013).
かかる方法によれば、安価な鋳型を用いて、大型の成型
物が得られるため、広範な用途に使用出来る可能性を有
する。According to this method, a large-sized molded product can be obtained using an inexpensive mold, so it has the possibility of being used in a wide range of applications.
所が、かかる成型品は、用途によって全体或は部分の表
面をメタライジングして用いる事が要求される場合か多
い。However, such molded products are often required to be used with the entire or partial surface metallized depending on the intended use.
かかるメタライジング方法としては、真空下での金属蒸
着、或はそれに類する方法と、メッキによる方法の二つ
があげられる。Such metallizing methods include two methods: metal vapor deposition under vacuum or a similar method, and plating.
特に金属感があり、耐久性のあるメタライジング法とし
てはメッキ法が常用されている。所で、不電導体である
プラスチック類に電気メッキを施すためには、プラスチ
ック表面に先ず、無電解メッキにより導体層を形成せし
める方法がとられる。A plating method is commonly used as a metallizing method that has a particularly metallic feel and is durable. In order to apply electroplating to plastics, which are non-conductive conductors, a method is used in which a conductive layer is first formed on the surface of the plastic by electroless plating.
かかる無電解メッキは、洗浄等の細かい工程を略すると
次の三工程に従って実施されるのが常法である。即ち、
(1)前処理 (2)触媒付与、活性化処理 (3無電
解メッキ処理である。(1)前処理においては、プラス
チック表面を化学薬剤の処理により酸化等によって表面
に親水性基を導入することと “もに、場合によっては
多少表面をエツチングして、以後の触媒が表面に付着や
、無電解メッキ層の固着がよくなるようにする工程であ
り、(2)触媒付与、活性化処理は塩化パラジウムを第
1塩化スズ等の還元作用によってコロイド状の金属パラ
ジウムをプラスチック表面に付出せしめt、i m を
解メッキ処理では、例えば塩化ニッケルと還元剤を組合
せた液で処理し、上記で形成せしめたコロイド金属パラ
ジウムを核としてこの場合はニッケル無電解メッキ層を
形成せしめる事になる。Such electroless plating is conventionally carried out according to the following three steps, omitting detailed steps such as cleaning. That is,
(1) Pretreatment (2) Catalyst application and activation treatment (3) Electroless plating treatment. (1) In pretreatment, hydrophilic groups are introduced to the surface of the plastic by oxidation etc. using chemical agents. (2) Catalyst application and activation treatment Colloidal metal palladium is deposited on the plastic surface by reducing palladium chloride with stannous tin chloride, etc. In the deplating process, for example, the metal palladium t, i m is treated with a solution containing a combination of nickel chloride and a reducing agent, and then In this case, an electroless nickel plating layer is formed using the colloidal metal palladium as a core.
かくして得られた無電解メッキ層を導体として、一般に
電解メッキを銅、ニッケル等の順序で形成せしめる事に
なる訳である。Using the thus obtained electroless plating layer as a conductor, electrolytic plating is generally performed in the order of copper, nickel, etc.
上記三工程において、(21及び(31については、グ
ラスチックの種類にかかわらず、一般的な方法が確立し
ている。(1)については、当然、プラスチックの種類
によって最適方法が異なる場合があるが、最も多くメッ
キして用いられるABS樹脂をはじめとして最も、一般
に用いられる方法はクロム酸−硫酸の水溶液で処理する
方法である。In the above three steps, general methods have been established for (21 and (31) regardless of the type of plastic. As for (1), the optimal method may naturally differ depending on the type of plastic. However, the most commonly used method, including ABS resin, which is most commonly used for plating, is treatment with an aqueous solution of chromic acid and sulfuric acid.
メタセシス重合体成型物の場合も、不飽和結合を多く有
するゴム成分を含有しているABS樹脂を化学的には類
似しており、同様の処理方法がそ・のまま用い得る事が
予想された。In the case of metathesis polymer molded products, it is chemically similar to ABS resin, which contains a rubber component with many unsaturated bonds, and it was expected that the same treatment method could be used as is. .
所が、ABS樹脂よりも、さらに不飽和結合を多く含有
しているためか、同様の方法を適用すると、表面のエツ
チングがかなり進み凹凸の多い表面となり、以後の工程
を終ると、金属は付着はするが、表面の凹凸が激しすぎ
るため、つや消しのようなメッキ表面となり、元来の光
沢のよい無電解メッキ層が得られない事が判った。そこ
で、粂件をマイルドにすると今度はメッキ層の固着が充
分でない事が判った。However, perhaps because ABS resin contains more unsaturated bonds than ABS resin, when the same method is applied, the surface is considerably etched, resulting in a surface with many unevenness, and after the subsequent steps, the metal will not adhere. However, it was found that the unevenness of the surface was too severe, resulting in a matte plating surface, making it impossible to obtain the original high-gloss electroless plating layer. Therefore, when the coating was made milder, it was found that the adhesion of the plating layer was not sufficient.
C1発明の構成
そこで、本発明者はかかるメタセシス重合樹脂成型物の
無電解メッキのための前処理を見出すべく鋭意検討の結
果、成型物を例えば、ある時間以上空気中で放置してお
くだけで、表面が空気中の酸素により酸化され、親水化
される事によって、他の特別の化学薬剤等による前処理
を全く行わずとも、さらに+21.[3)の工程をほど
こす事により光沢にすぐれよく固着した無電解メッキ層
を生成しろる事を見出し得なものである。C1 Structure of the Invention Therefore, as a result of intensive studies to find a pretreatment for electroless plating of such a metathesis polymer resin molded product, the present inventor found that, for example, it is possible to simply leave the molded product in the air for a certain period of time. , the surface is oxidized by oxygen in the air and made hydrophilic, resulting in an additional +21. It has been discovered that by performing the step [3), it is possible to produce an electroless plated layer with excellent gloss and good adhesion.
即ち、本発明は、
メタセシス重合触媒系の共存下で、メタセシス重合性モ
ノマーを重合と同時に成型して得たメタセシス重合体成
型物の表面に無電解メッキを、(1)前処理 (2)触
媒付与、活性化処理 (3無電解メッキ処理の工程によ
ってほどこすに当って、前処理法として、該成型物を酸
素分子と接触せしめる事により親水化する方法を用いる
事を特徴とする無電解メッキ用前処理方法である。That is, the present invention provides electroless plating on the surface of a metathesis polymer molded product obtained by molding a metathesis polymerizable monomer simultaneously with polymerization in the coexistence of a metathesis polymerization catalyst system, (1) pretreatment (2) catalyst Electroless plating characterized by using a method of making the molded product hydrophilic by bringing it into contact with oxygen molecules as a pre-treatment method before application through the electroless plating process (3). This is a pretreatment method for use.
本発明において、処理のために用いられる重合体成型物
としては、前記の如く、メタセシス重合性環状オレフィ
ンの少なくとも1種をモノマー成分の少なくとも一部と
して用い、
メタセシス重合触媒系の存在下重合と成型を同時におこ
なって得られた重合体成型物であればその構成ポリマー
の成分に炭素炭素不飽和結合を繰返し単位中に少なくと
も一つ有することになり、本発明の処理を適用する事が
出来る。In the present invention, as described above, at least one type of metathesis-polymerizable cyclic olefin is used as at least a part of the monomer component in the polymer molded product used for the treatment, and polymerization and molding are carried out in the presence of a metathesis polymerization catalyst system. A polymer molded product obtained by simultaneously carrying out the above steps will have at least one carbon-carbon unsaturated bond in the repeating unit of its constituent polymer components, and the treatment of the present invention can be applied thereto.
特に、メタセンス重合性環状オレフィン類を主モノマー
として、そのうちの少なくとも一部をメタセシス重合性
の環状オレフィンを2個以上有する環状オレフィンを用
い、かつメタセシス重合触媒の主触媒成分と活性化剤成
分を各々、分けて、モノマーとともに、反応溶液A、B
二液を調製し、この二液を衝突混合等の急速混合によっ
て混合し、それを型内に注入して重合と成型を同時にお
こなって得た架橋重合体成型物が好ましい。In particular, a cyclic olefin containing metasense polymerizable cyclic olefins as the main monomer, at least a part of which has two or more metathesis polymerizable cyclic olefins, and a main catalyst component and an activator component of the metathesis polymerization catalyst, respectively. , separately, together with the monomer, the reaction solution A, B
A crosslinked polymer molded product obtained by preparing two liquids, mixing the two liquids by rapid mixing such as collision mixing, and injecting the two liquids into a mold to perform polymerization and molding at the same time is preferable.
メタセシス重合性環状オレフィン基としては歪みの大き
いものが重合性が大きく好ましい、特に、ノルボルネン
構造のものが製造の容易さ、重合性の面から好ましい。As the metathesis-polymerizable cyclic olefin group, those having a large strain are preferred because of their high polymerizability, and those having a norbornene structure are particularly preferred from the viewpoint of ease of production and polymerizability.
架橋重合体を形成しうる環状オレフィン類の好適な例と
しては、ジシクロペンタジェン、トリシクロペンタジェ
ン、 i、4,5.8−ジメタノ−1,4,4a。Suitable examples of cyclic olefins that can form crosslinked polymers include dicyclopentadiene, tricyclopentadiene, i,4,5.8-dimethano-1,4,4a.
5.8,8a−ヘキサヒドロナフタレン、 1,4,5
,8,9.10トリメタノ−1,4,4a、5,8.8
a、9.9a、10,10a−デカヒドロアントラセン
、1,5−シクロオクタジエンとシクロペンタジェンの
1,2−付加体、エチレンビスノルボルネン、フェニレ
ンビスノルボルネン等をあけることが出来る。5.8,8a-hexahydronaphthalene, 1,4,5
,8,9.10 trimethano-1,4,4a,5,8.8
a, 9.9a, 10,10a-decahydroanthracene, 1,2-adduct of 1,5-cyclooctadiene and cyclopentadiene, ethylene bisnorbornene, phenylene bisnorbornene, etc. can be used.
一方、メタセシス重合に対しては2官能性として働く環
状オレフィン類として、ノルボルネン。On the other hand, norbornene is a cyclic olefin that acts as a difunctional compound for metathesis polymerization.
5−メチルノルボルネン、5−エチリデンノルボルネン
、5−フェニルノルボルネン、ビニルノルボルネン、ジ
ヒドロジシクロペンタジェン、シクロペンタジェン−メ
チルシクロペンタジェン共二量体、 1,4,5.8−
ジメタノ−1,4,4a、5,6,7,8,8a−オク
タヒドロナフタレン、6−メチル−1,4,5゜8−ジ
メタノ−1,4,4a、5,6,7,8,8a−才クタ
ヒド口ナフタレン、6−エチリデン−1,4,5,8−
ジメタノ−1,4,4a、5,7,8.8a−オクタヒ
ドロナフタレン等をあげることが出来る。5-methylnorbornene, 5-ethylidenenorbornene, 5-phenylnorbornene, vinylnorbornene, dihydrodicyclopentadiene, cyclopentadiene-methylcyclopentadiene codimer, 1,4,5.8-
Dimethano-1,4,4a, 5,6,7,8,8a-octahydronaphthalene, 6-methyl-1,4,5°8-dimethano-1,4,4a, 5,6,7,8, 8a-Naphthalene, 6-ethylidene-1,4,5,8-
Dimethano-1,4,4a, 5,7,8.8a-octahydronaphthalene and the like can be mentioned.
上記の如き、炭化水素よりのみからなる環状オレフィン
類に加えて、異種元素を含有する環状オレフィン類、即
ち極性基を有する環状オレフィン類も、モノマーの1部
として使用することが出来る。極性基としては、エステ
ル基、エーテル基。In addition to the above-mentioned cyclic olefins consisting only of hydrocarbons, cyclic olefins containing different elements, that is, cyclic olefins having polar groups, can also be used as part of the monomer. Polar groups include ester groups and ether groups.
シアノ基、N−置換イミド基、ハロゲン等が好ましい。Preferred are cyano group, N-substituted imide group, halogen, and the like.
かかる共重合モノマーの具体例としては、5−メトキシ
カルボニルノルボルネン、5−(2−エチルへキシロキ
シ)カルボニル−5−メチルノルボルネン、5−フェニ
ロキシメチルノルボルネン。Specific examples of such copolymerizable monomers include 5-methoxycarbonylnorbornene, 5-(2-ethylhexyloxy)carbonyl-5-methylnorbornene, and 5-phenyloxymethylnorbornene.
5−シアノノルボルネン、6−ジアツー1.4.5.8
−ジメタノ−1,4,4a、 5.6.7.8.8a−
オクタヒドロナフタレン、N−ブチルナデイック酸イミ
ド。5-cyanonorbornene, 6-diatu 1.4.5.8
-dimethano-1,4,4a, 5.6.7.8.8a-
Octahydronaphthalene, N-butylnadic acid imide.
5.6−ジクロルノルボルネンなどをあげることが出来
る。Examples include 5.6-dichloronorbornene.
上述した如き、メタセシス重合性多環シクロオレフィン
は、メタセシス重合触媒を不活性化する如き、不純物が
極力少ないものであることが要求される。The metathesis-polymerizable polycyclic cycloolefin as described above is required to contain as few impurities as possible that would deactivate the metathesis-polymerization catalyst.
本発明に用いられる重合体成型物の特に好適なモノマー
組成としては、ジシクロペンタジェン100〜50モル
%残余を上記の如き、ノルボルネン構造単位を有するメ
タセシス重合性環状オレフィン類との組合せをあげるこ
とが出来る。A particularly preferred monomer composition of the polymer molded product used in the present invention is a combination of 100 to 50 mol % of dicyclopentadiene remaining with a metathesis-polymerizable cyclic olefin having a norbornene structural unit as described above. I can do it.
本発明で用いる重合体成型物を得る場合に用いられるメ
タセシス重合触媒系における触媒成分としてはタングス
テン、レニウム、タンタル、モリブデン等のハライドな
どの塩類が用いられるか、特にタングステン化合物が好
ましい、かかるタングステン化合物としては、タングス
テンハライド。As the catalyst component in the metathesis polymerization catalyst system used to obtain the polymer molded product used in the present invention, salts such as halides such as tungsten, rhenium, tantalum, and molybdenum are used, and tungsten compounds are particularly preferred. For example, tungsten halide.
タングステンオキシハライドなどが好ましくより具体的
には、タングステンへキサクロライド、タングステオキ
シクロライドなどが好ましい、また、有機アンモニウム
タングステン酸塩なども用いることか出来る。かかるタ
ングステン塩化合物は、直接前記モノマーに添加すると
、直ちにカチオン重合を開始することが判っており好ま
しくない。Tungsten oxyhalide is preferable, and more specifically, tungsten hexachloride, tungsteoxychloride, etc. are preferable, and organic ammonium tungstate and the like can also be used. It is known that when such a tungsten salt compound is added directly to the monomer, cationic polymerization immediately starts, which is not preferable.
従ってかかるタングステン塩化合物は不活性溶媒例えは
ベンゼン、トルエン、り凸ロベンゼンなどに予め懸濁し
、少量のアルコール系化合物またはフェノール系化合物
を添加することによって可溶化させて使用するのが好ま
しい。Therefore, it is preferable to use such a tungsten salt compound by first suspending it in an inert solvent such as benzene, toluene, polybenzene, etc., and solubilizing it by adding a small amount of an alcoholic compound or a phenolic compound.
さらに、上述した如き、好ましくない重合を予防するた
めにタングステン化合物1モルに対し、約1〜5モルの
ルイス塩基又はキレート化剤を添加することが好ましい
、かかる添加剤としてはアセチルアセトン、アセト酢酸
アルキルエステル類。Further, in order to prevent undesirable polymerization as described above, it is preferable to add about 1 to 5 mol of a Lewis base or a chelating agent to 1 mol of the tungsten compound. Such additives include acetylacetone, alkyl acetoacetate, etc. Esters.
テトラヒドロフラン、ベンゾニトリルなどをあげること
ができる。Examples include tetrahydrofuran and benzonitrile.
かくして、触媒成分を含むモノマー溶液(溶液A)は、
実用上充分な安定性を有することになる。Thus, the monomer solution containing the catalyst component (solution A) is
It has sufficient stability for practical use.
一方メタセシス重合触媒系における活性他剤成分は、周
期律表第1〜第■族の金属のアルキル化物を中心とする
有機金属化合物、特にテトラアルキルスズ、アルキルア
ルミニウム化合物、アルキルアルミニウムハライド化合
物が好ましく、具体的には、塩化ジエチルアルミニウム
、ジ塩化エチルアルミニウム、トリオクチルアルミニウ
ム1ジオクチルアルミニウムアイオダイド、テトラブチ
ル錫、トリブチル錫、ハイドライドなどをあげることが
できる。これら活性他剤成分としての有機金属化合物を
、混合単量体に溶解することにより、活性化剤を含むモ
ノマー溶液(溶液B)が形成さノする。On the other hand, the active component in the metathesis polymerization catalyst system is preferably an organometallic compound mainly consisting of alkylated products of metals of Groups 1 to Ⅰ of the periodic table, particularly tetraalkyltin, alkylaluminum compounds, and alkylaluminum halide compounds. Specific examples include diethylaluminum chloride, ethylaluminum dichloride, trioctylaluminum 1-dioctylaluminum iodide, tetrabutyltin, tributyltin, hydride, and the like. A monomer solution (solution B) containing an activator is formed by dissolving these organometallic compounds as active agent components in the mixed monomer.
本発明においては、基本的に前記′a液A及び溶iBを
混合することによって、重合体成形物を得ることかでき
るが、上記組成のままでは、重合反応が非常に速く開始
されるので、成型用鋳型に充分流れ込まない間に硬化が
起ることがあり、度々問題となる場合が多く、前述の如
くそのために活性調節剤を用いることかこのましい。In the present invention, a polymer molded product can basically be obtained by mixing the above-mentioned solution A and solution iB, but the polymerization reaction starts very quickly if the above composition remains as it is. Hardening may occur before it has sufficiently flowed into the mold, which often poses a problem, and for this purpose it is preferable to use an activity regulator as described above.
かかる調節剤としては、ルイス塩基類が一般に用いられ
、就中エーテル類、エステル類、ニトリル類などが用い
られる。具体例としては安息香酸エチル、ブチルエーテ
ル、ジグライムなどをあげることが出来る、かかる調節
剤は一般的に、有機金属化合物の活性化剤の成分の溶液
の側に添加して用いられる。前述の如くにルイスペース
である極性基を有するモノマーを使用する場合には、そ
れに調節剤の役目をかねさせることが出来る。As such regulators, Lewis bases are generally used, among which ethers, esters, nitriles, etc. are used. Specific examples include ethyl benzoate, butyl ether, diglyme, etc. Such regulators are generally added to the solution of the organometallic compound activator component. As mentioned above, when a monomer having a polar group such as Lewis space is used, it can serve as a regulator.
メタセシス重合触媒系の使用量は例えば触媒成分として
タングステン化合物を用いる場合は、上記原料単量体に
対するタングステン化合物の比率は、モル基準で、約1
000対1〜15000対1、好ましくは2000対1
の付近でありまた、活性他剤成分はアルキルアルミニウ
ム類を用いる場合には、上記原料単量体に対するアルミ
ニウム化合物の比率は、モル基準で約100対1〜約2
000対1、好ましくは約200対1〜約500対1の
付近が用いられる。The amount of the metathesis polymerization catalyst system used is, for example, when a tungsten compound is used as a catalyst component, the ratio of the tungsten compound to the raw material monomer is about 1 on a molar basis.
000:1 to 15000:1, preferably 2000:1
In addition, when an alkyl aluminum is used as the active ingredient, the ratio of the aluminum compound to the raw material monomer is about 100:1 to about 2 on a molar basis.
000:1, preferably around 200:1 to about 500:1.
更に上述の如き、マスク剤や調節剤については、実験に
よって上記触媒系の使用量に応じて、適宜、調節して用
いることが出来る。Further, as described above, the masking agent and the regulating agent can be appropriately adjusted and used depending on the amount of the catalyst system to be used through experiments.
本発明における重合体成型物の製造において、残留モノ
マーの減少のため、活性ハロゲン化合物、例えばトリク
ロルメチルトルエン1 トリクロル酢酸エチル1イソフ
タル酸クロライド、或いは酸無水物例えば安息香酸無水
物などを少量添加して用いることか出来る。In the production of the polymer molded product according to the present invention, a small amount of an active halogen compound such as trichloromethyltoluene, trichloroethyl acetate, isophthalic acid chloride, or an acid anhydride such as benzoic anhydride is added to reduce residual monomers. It can be used.
本発明に用いる架橋重合体成型物には、実用に当って、
その特性を改良または維持するために、さらに各種添加
剤を配合することができる。かかる添加剤としては、充
填剤1顔料、酸化防止剤1光安定剤、難燃化剤、可燃剤
、高分子改良剤などがある。このような添加剤において
も本発明の架橋重合体が成形されて後は添加することが
不可能であるから、添加する場合には予め前記した原料
溶液に添加しておく必要がある。In practical use, the crosslinked polymer molded product used in the present invention has the following:
In order to improve or maintain its properties, various additives can be further added. Such additives include fillers, pigments, antioxidants, light stabilizers, flame retardants, combustible agents, polymeric modifiers, and the like. Since it is impossible to add such additives after the crosslinked polymer of the present invention is molded, it is necessary to add them to the above-mentioned raw material solution in advance when adding them.
その最も容易な方法としては、前記溶液Aおよび溶液B
のいずれか又は両方に前もって添加しておく方法をあげ
ることが出来るか、その場合、その液中の反応性の強い
触−媒成分や、活性他剤成分や酸無水物類と実用上さし
つかえある程度には反応せず、かつ重合を阻害しないも
のでなくては、ならない、どうしても、その反応がさけ
えないが共存しても、重合は実質的に阻害しないものの
場合は、単量体と混合して、第三液を調整し、重合直前
に、混合使用することも出来る。また、固体の充填剤の
場合であって、両成分が混合されて、重合反応を開始す
る直前あるいは重合をしながら、その空隙を充分にうず
め得る形状のものについては、成型用鋳型的中に、充填
しておくことも、可能である。The easiest method is to use the solution A and solution B.
Is there a method in which it is added in advance to either or both of the following? In that case, there is a certain degree of practical interference with highly reactive catalyst components, other active agent components, and acid anhydrides in the liquid. It must be something that does not react with the monomer and does not inhibit the polymerization.If the reaction is unavoidable, but if it coexists with the monomer it will not substantially inhibit the polymerization, it should not be mixed with the monomer. It is also possible to prepare a third liquid and use the mixture immediately before polymerization. In addition, in the case of solid fillers, if the two components are mixed and have a shape that can sufficiently fill the voids immediately before starting the polymerization reaction or during polymerization, it is necessary to , it is also possible to fill it up.
添加剤としての補強材又は充填剤は、曲げモジュラスを
向上するのに効果がある。かかるものとしてはガラス繊
維、雲母、カーボンブラック、ウオラストナイトなどを
あげることか出来る。これらを、いわゆるシランカップ
ラーなどによって表面処理したものも好適に使用できる
。Reinforcements or fillers as additives are effective in improving the flexural modulus. Examples of such materials include glass fiber, mica, carbon black, and wollastonite. Those surface-treated with a so-called silane coupler can also be suitably used.
また、本発明に用いられる架橋重合体成形物は、酸化防
止剤を添加しておくことが好ましく、そのなめフェノー
ル系又はアミン系の酸化防止剤を予め溶液中に加えてお
くことが望ましい、これら酸化防止剤の具体例としては
、2.6−t−ブチル−P−クレゾール、N、N’−ジ
フェニル−P−フェニレンジアミン、テトラキスしメチ
レン(3,5−ジ−t−ブチル−4−ヒドロキシシンナ
メート)1メタンなどがあげられる。Further, it is preferable to add an antioxidant to the crosslinked polymer molded article used in the present invention, and it is desirable to add a phenol-based or amine-based antioxidant to the solution in advance. Specific examples of antioxidants include 2,6-t-butyl-P-cresol, N,N'-diphenyl-P-phenylenediamine, tetrakis methylene (3,5-di-t-butyl-4-hydroxy Cinnamate) 1Methane, etc.
また、本発明に用いる架橋重合体成形物は、他の重合体
を単量体溶液状態の時に添加しておくことが出来る。か
かる重合体添加剤としてはエラストマーの添加が成形物
の耐衝撃性を強めること及び溶液の粘度を調節する上で
効果がある。かかる目的に用いられるエラストマーとし
ては、スチレン−ブタジェン−スチレントリブロックゴ
ム、スチレン−イソプレン−スチレントリブロックゴム
。Further, other polymers can be added to the crosslinked polymer molded product used in the present invention when it is in a monomer solution state. As such polymer additives, the addition of elastomers is effective in increasing the impact resistance of molded products and adjusting the viscosity of the solution. Elastomers used for this purpose include styrene-butadiene-styrene triblock rubber and styrene-isoprene-styrene triblock rubber.
ポリブタジェン、ポリイソプレン、ブチルゴム1エチレ
ンブロビレンージエンターボリマー、ニトリルゴムなど
を広範なエラストマーをあげることが出来る。A wide range of elastomers include polybutadiene, polyisoprene, butyl rubber, 1-ethylene brobylene-dienter polymer, and nitrile rubber.
本発明に用いられる重合体成型物は、前記した如く、重
合と成型とを同時に行うことによって製造される。The polymer molded product used in the present invention is produced by simultaneously performing polymerization and molding, as described above.
かかる成型法としては前述の如く、触媒と原料単量体と
をスタティックミキサ等で混合したプレミックスを型の
中に流入せしめるレジンインジェクション方式、触媒系
を二つに分けた溶液Aと溶液Bをヘッド部で衝突混合せ
しめてそのまま型に流し込むRIM方式か採用すること
が出来る。特にRIM方式が一般に用いられる。As mentioned above, such molding methods include the resin injection method, in which a premix in which the catalyst and raw material monomer are mixed using a static mixer or the like is flowed into the mold, and the resin injection method, in which the catalyst system is divided into two parts, solution A and solution B. It is possible to adopt the RIM method in which the mixture is mixed by collision at the head and then poured directly into the mold. In particular, the RIM method is commonly used.
いずれの場合も鋳型(モールド)への注入圧力は比較的
低圧であることができ、従って安価な鋳型を使用するこ
とか可能である。また、型内の重合反応が開始されると
反応熱によって型内の温度は急速に上昇し、短時間に重
合反応か終了する。In either case, the injection pressure into the mold can be relatively low, making it possible to use inexpensive molds. Further, when the polymerization reaction inside the mold starts, the temperature inside the mold rapidly rises due to the reaction heat, and the polymerization reaction ends in a short time.
ポリウレタン−RIMの場合と異なり、モールドから離
脱は容易であり、特別の雛形剤を必要としない場合が多
い。Unlike polyurethane-RIMs, demolding is easy and often does not require special molding agents.
かくして得られた重合体成型物に対し前述の如き、メッ
キ処理工程でおこなう事になる。The polymer molded product thus obtained is subjected to a plating process as described above.
前述した3段階の工程以外には、洗浄工程を先ず、おこ
なう事が推奨される。つまり、メッキ処理される表面が
油脂分その他で汚れている場合は、以後の工程が難しい
ためよく洗浄してそれを除いておく必要がある。一般の
プラスチック成型物は、その表面に成型金型からの離型
のための離型剤が付着している事が多く、問題であるが
、本発明の重合体は、成型直後は、一般に表面エネルギ
ーが小さく離型性が良好であり、上述の如く特別の離型
剤を用いる事なく成型出来るため、一般に表面の汚れは
少なく、中性洗剤でよく洗浄する程度で充分である。In addition to the three-step process described above, it is recommended to perform a cleaning process first. In other words, if the surface to be plated is contaminated with oil or fat, it is necessary to thoroughly clean it to remove it because subsequent steps are difficult. General plastic molded products often have a mold release agent attached to their surface for release from the mold, which is a problem, but the polymer of the present invention generally has a surface Since it requires little energy and has good mold releasability, and can be molded without using a special mold release agent as mentioned above, there is generally little dirt on the surface, and cleaning well with a neutral detergent is sufficient.
さらに、本発明の前処理法は前述の如く最も簡単な実施
g様は、単に空気中常温で、成型後一定時間放置する事
によって達成されるため、洗浄工程は、本発明の前処理
をすませた後、行なっても差支えない事になる。ただ、
表面が汚れていた場合、酸素分子との触媒が妨げられる
なめ、汚れの程度によっては、前処理より以前に行なう
事が出来る。Furthermore, as described above, the pretreatment method of the present invention can be carried out in the simplest manner by simply leaving it in the air at room temperature for a certain period of time after molding. After that, there is no harm in doing it. just,
If the surface is dirty, the catalyst with oxygen molecules will be hindered, so depending on the degree of dirt, this can be done before pretreatment.
本発明によるメタセシス重合体の前処理は、前述の如く
、成型物を室温で、空気中に放置する事によって達成さ
れる。The pretreatment of the metathesis polymer according to the present invention is accomplished by leaving the molded product in air at room temperature, as described above.
かかる空気との接触によって即ち、酸素分子との接触に
よって不飽和結合や、アリル型の3級水素が多く含まれ
ているメタセシス重合体が酸化され、極性基が導入され
る事によって適度な親水化が果されるためである。かか
る親水化の程度は表面の赤外吸収スペクトルの測定で当
初重合体にはなかった例えばカルボニルの特性吸収の増
加度によっても、追跡出来るが、より簡便、直裁的な方
法としては、各種の表面エネルギーの液を調製しておき
それで、表面のぬれてみて、表面エネルギーを推定する
方法をあげる事か出来る。かかる方法によるとジシクロ
ペンタジェンをモノマーとして用いて得たメタセシス重
合体の場合、成型直後の表面のぬれエネルギーは34d
yne/■程度であるが、常温8時間ぐらいの放置で、
38dyne/(2)に増加するが、その程度以上にな
ると後述の如きメッキの付着が良好になってくる事が判
った。By contact with such air, that is, by contact with oxygen molecules, the metathesis polymer containing a large amount of unsaturated bonds and allylic tertiary hydrogen is oxidized, and polar groups are introduced, resulting in appropriate hydrophilicity. This is so that it can be fulfilled. The degree of hydrophilization can also be tracked by measuring the infrared absorption spectrum of the surface and determining the degree of increase in the characteristic absorption of carbonyl, which was not present in the polymer initially, but a simpler and more direct method is to measure the infrared absorption spectrum of the surface. There is a method for estimating the surface energy by preparing a surface energy liquid and wetting the surface with it. According to this method, in the case of a metathesis polymer obtained using dicyclopentadiene as a monomer, the wetting energy of the surface immediately after molding is 34 d.
It is about yne/■, but if you leave it at room temperature for about 8 hours,
Although it increases to 38 dyne/(2), it has been found that when it exceeds that level, the adhesion of plating becomes better as described below.
即ち、メタセシス重合体成型物の表面のぬれを、酸素分
子との触媒によって38dyne/ Cl11以上にす
る事により前処理が達成される事になる。That is, the pretreatment is achieved by increasing the wettability of the surface of the metathesis polymer molded product to 38 dyne/Cl11 or more using a catalyst with oxygen molecules.
前述の如く、空気中、常温8時間以上の放置で、かかる
値は、一般に達成出来るが、かかる酸化反応は周知の如
く温度をあげれば、加速する事が出来る。さらに空気等
の酸素の存在下のその照射やコロナ放電等の手段によっ
ても同様に表面の酸化は加速出来る。As mentioned above, such a value can generally be achieved by leaving the product in air at room temperature for 8 hours or more, but as is well known, such an oxidation reaction can be accelerated by raising the temperature. Furthermore, the oxidation of the surface can be similarly accelerated by means such as irradiation with oxygen in the presence of air or the like or corona discharge.
酸素分子含有物としては、空気を用いるのが最も経済的
であり好ましいが、必要によってはさらに酸素濃度のた
かい濃度酸素空気を用いる事も出来る。As the material containing oxygen molecules, it is most economical and preferable to use air, but if necessary, oxygen-containing air with a higher oxygen concentration can also be used.
取扱いのやっかいなりロム酸、硫酸やその他溶剤処理等
、一般のプラスチックの無電解メッキ用の前処理に用い
られるものに比して極めて簡便に実施出来る事にその特
長がある事が容易に理解出来る。It is easy to understand that the advantage of this process is that it can be carried out extremely easily compared to pre-treatments used for general electroless plating of plastics, such as treatment with romic acid, sulfuric acid, or other solvents, which are difficult to handle. .
上述の如く、必要に応じて洗浄と前処理を終った成型物
は、次いで(2J触媒付与・活性化処理がおこなわれる
。As mentioned above, the molded product that has been washed and pretreated as necessary is then subjected to (2J catalyst application and activation treatment).
かかる触媒付与・活性化処理としては、先ず、成型物表
面を塩化第1すず一塩酸や、二酸化チタン−塩酸等、還
元性イオン含有の酸性溶液で、処理をしておき、次いで
塩化パラジウム−塩酸或は金や白金の同様な塩−酸性溶
液で処理する事により、パラジウムや金1白金の還元コ
ロイド状粒子を表面に形成せしめる方法をあげる事が出
来る。In this catalyst application/activation treatment, the surface of the molded product is first treated with an acidic solution containing reducing ions, such as stannous chloride monohydrochloride or titanium dioxide-hydrochloric acid, and then palladium chloride-hydrochloric acid is applied. Another method is to form reduced colloidal particles of palladium or gold-platinum on the surface by treating with a similar salt-acidic solution of gold or platinum.
また、さらに、塩化第1スズと塩化パラジウムを塩酸中
で混合して液内にパラジウムコロイドを生成せしめ、こ
れを安定化した溶液を用いる方法が案出され現在はこの
方法がより一般に用いられている。この場合はパラジウ
ムコロイドの表面を活性化するため、安定化しているイ
オンを溶解するための酸処理がつづいて必要である。Furthermore, a method was devised in which stannous chloride and palladium chloride were mixed in hydrochloric acid to form a palladium colloid in the solution, and a method using a stabilized solution was devised, and this method is now more commonly used. There is. In this case, in order to activate the surface of the palladium colloid, a subsequent acid treatment is necessary to dissolve the stabilized ions.
かくして成型物の表面にコロイド核が付着した状態に対
し、無電解メッキ液を接触せしめ無電解メッキ層を形成
せしめる工程がつついて適用される。かかる無電解メッ
キ液としては、ニッケル系のものと銅系のものがよく用
いられるが、特に、ニッケル系のものが、多く用いられ
る。かかる無電解メッキ液は、原理的には各々適当なP
H条件下で、該当する金属イオンとそれを金属に還元し
うる還元剤とから基本的になり、ニッケルの場合ハイポ
フォスファイト塩やボランを還元剤として用いるものか
用いられる。一般には、イオン液と還元剤液は、別々に
調製されており、使用の直前に混合して使用される。混
合後の寿命についてはその組成・使用条件によって事な
る。With the colloidal nuclei thus attached to the surface of the molded product, a step of bringing the molded product into contact with an electroless plating solution to form an electroless plating layer is applied. As such electroless plating solutions, nickel-based ones and copper-based ones are often used, and nickel-based ones are particularly often used. In principle, such electroless plating solutions each contain an appropriate amount of P.
It basically consists of the relevant metal ion and a reducing agent capable of reducing it to the metal under H conditions, and in the case of nickel, a hypophosphite salt or borane is used as the reducing agent. Generally, the ionic liquid and the reducing agent liquid are prepared separately and mixed immediately before use. The lifespan after mixing depends on its composition and usage conditions.
かかる無電解メッキ処理は、液組成によって適当な温度
、処理時間は異なるか、最初は、90°C付近の高温用
いるものか多かったが改良によって一般に25〜40°
Cの比較的低温でおこなうものか多くなっている。In this electroless plating process, the appropriate temperature and treatment time differ depending on the liquid composition.Initially, high temperatures around 90°C were often used, but with improvements, the temperature is generally 25 to 40°C.
Increasingly, it is carried out at relatively low temperatures of C.
かかる無電解メッキによるメッキ層の付着の均一さや、
固着の丈夫さは、前記の如き、前処理工程の良否に大き
く影響をうける事になり、本発明の処理方法は一般表面
を深くエツチングする異なくマイルドな条件下で親水化
がおこなわれているため、表面か平滑で、かつ、活性化
が均一におこない得るため、うずくとも光沢のある無電
解メッキ層が、非常に均一に付着しうる所に特徴を有す
る。The uniformity of the adhesion of the plating layer by such electroless plating,
The strength of the adhesion is greatly affected by the quality of the pretreatment process as described above, and the treatment method of the present invention generally performs hydrophilization under mild conditions, unlike the deep etching of the surface. Therefore, the surface is smooth and activation can be performed uniformly, so that an electroless plating layer with a tingling and gloss can be deposited very uniformly.
かかる無電解メッキの後、常法により銅−ニラゲル−ク
ロム等のメッキを頭にほどこす事により、金属表面の成
形体を得る事が出来、各種運搬機器、電気機器、ハウジ
ング、建築部材等広範な用途に用いる事が出来る。After such electroless plating, a molded product with a metal surface can be obtained by plating copper, nilagel, chromium, etc. on the head using a conventional method, and can be used in a wide range of applications such as various transportation equipment, electrical equipment, housings, and building materials. It can be used for various purposes.
本発明方法により、平滑な表面性のよい無電解メッキ層
を用いた表面性の良好なメッキをした製品が得られる。By the method of the present invention, a plated product with good surface properties can be obtained using an electroless plating layer with smooth and good surface properties.
以下に実施例をあげて、本発明を詳述する。なお、実施
例は説明のためであってそれに限定されるものではない
。The present invention will be explained in detail with reference to Examples below. Note that the examples are for illustrative purposes only and are not limited thereto.
実施例1〜2.比較例
くハロゲン化処理用成型板の作成〉
[触媒成分溶液の調製コ
六塩化タングステン20重量部を乾燥トルエン70容量
部に窒素気流中下で添加し、次いでノニルフェノール2
1重量部及びトルエン16容量部よりなる溶液を添加し
て0.5Mのタングステン含有触媒溶液を調製し、この
溶液に対し、窒素ガスを一晩パージして、六塩化タング
ステンとノニルフェノールとの反応によって生成された
塩化水素ガスを除去して、さらにかかる溶液10容量部
に対し、1容量部のアセチルアセトンを加えた重合用触
媒溶液とした。Examples 1-2. Comparative Example: Preparation of molded plate for halogenation treatment> [Preparation of catalyst component solution] 20 parts by weight of tungsten hexachloride was added to 70 parts by volume of dry toluene under a nitrogen stream, and then nonylphenol 2
A 0.5 M tungsten-containing catalyst solution was prepared by adding a solution of 1 part by weight and 16 parts by volume of toluene, and the solution was purged with nitrogen gas overnight to react with tungsten hexachloride and nonylphenol. The generated hydrogen chloride gas was removed, and 1 part by volume of acetylacetone was added to 10 parts by volume of the solution to prepare a polymerization catalyst solution.
精製ジシクロペンタジェン95重量部、精製エチリデン
ノルボルネン5重量部よりなるモノマー混合物に対し、
エチレン含量70モル%のエチレン−プロピレン−エチ
リデンノルボルネン共重合ゴム3重量部、酸化安定剤と
して、エタノツクスフ022重量部を加えた溶液に、上
記重合用触媒溶液をタングステン含量が0.OOi M
になるように加えて、触媒成分溶液(溶液A)を調製し
た。For a monomer mixture consisting of 95 parts by weight of purified dicyclopentadiene and 5 parts by weight of purified ethylidene norbornene,
The above polymerization catalyst solution was added to a solution containing 3 parts by weight of ethylene-propylene-ethylidene norbornene copolymer rubber with an ethylene content of 70 mol% and 22 parts by weight of Ethanoxfu 0 as an oxidation stabilizer. OOi M
A catalyst component solution (solution A) was prepared.
[活性止剤成分溶液の調製]
トリオクチルアルミニウム85.ジオクチルアルミニウ
ムアイオダイド15.ジグライム100のモル割合で混
合調製した重合用活性止剤混合溶液を精製ジシクロペン
タジェン95重量部、精製エチリデンノルボルネン5重
量部、上記と同じエチレン−プロピレン−エチリデンノ
ルボルネン共重合ゴム3重量部よりなる混合物に、アル
ミニウム含量か0.003 Mになる割合で混合し、活
性止剤成分溶液(溶液B)を調製した。[Preparation of active inhibitor component solution] Trioctyl aluminum 85. Dioctyl aluminum iodide 15. A mixed solution of an activator for polymerization prepared by mixing in a molar ratio of 100 parts of diglyme was prepared using 95 parts by weight of purified dicyclopentadiene, 5 parts by weight of purified ethylidene norbornene, and 3 parts by weight of the same ethylene-propylene-ethylidene norbornene copolymer rubber as above. The active agent component solution (solution B) was prepared by mixing the mixture with aluminum at a ratio of 0.003 M.
上記の如く、調製した溶液A及び溶液Bを用いて、反応
射出成型機によって厚さ3 ms+のメタセジス重合体
よりなる成型板を作成した。射出時の液温30℃、金型
温度80°Cにておこなった。Using Solution A and Solution B prepared as described above, a molded plate made of metasedis polymer having a thickness of 3 ms+ was produced using a reaction injection molding machine. The injection was carried out at a liquid temperature of 30°C and a mold temperature of 80°C.
かくして得られた平板を、成型直後、1時間。The thus obtained flat plate was molded for 1 hour immediately after molding.
2時間、4時開、8時間、24時間、48時間、常温で
放置した。その間適当な時間に契丹製薬味製エースクリ
ーン洗浄剤50t/lの水溶液中50〜60℃5分間の
洗浄後、水洗して表面脱脂洗浄をおこなっておいた。It was left open at room temperature for 2 hours, 4 o'clock, 8 hours, 24 hours, and 48 hours. During that time, the surface was degreased by washing for 5 minutes at 50 to 60°C in an aqueous solution of 50 t/l of Aclean detergent manufactured by Khitan Pharmaceutical Flavors, followed by washing with water.
上記時開経過後、表面のぬれを予め調製した各種表面エ
ネルギーの液のぬれぐあいを見る方法で測定すると各々
34.34.35.36.38.38.38dyne/
c−の値をしめしたこの各々の板を、所定時間経過後、
契丹製薬製キャタリストA −3080[+11と濃塩
酸150+nlを水で11に希釈した濃度の触媒付与液
に25℃で2分間浸漬した水洗の後次いで触媒活性化の
ために濃塩酸100(II+を水で11に稀釈した液に
35℃2分間浸漬しその後水洗した。After the above-mentioned time has elapsed, the surface wetting was measured by looking at the wetting of liquids with various surface energies prepared in advance, and the results were 34.34.35.36.38.38.38dyne/
After a predetermined period of time, each plate showing the value of c- is
Catalyst A-3080 [+11 manufactured by Khitan Pharmaceutical Co., Ltd. and concentrated hydrochloric acid 150+nl diluted to 11 with water were immersed in a catalyst-imparting solution for 2 minutes at 25°C, followed by water washing. It was immersed in a solution diluted to 11 with water at 35°C for 2 minutes, and then washed with water.
その後、契丹製薬製TMP化学ニッケルA160山1、
B 160m1を水で11に希釈した無電解メッキ液に
35°Cで7分間浸漬した。水洗の後ドライヤで乾燥し
て、無電解メッキ処理板を得た。メッキの付着状況を観
測すると成型及び洗浄直後(34dyne/ cs )
全くメッキ付量せず、1時間後(34dyne/C11
)一部メッキ付量しているがつめでこすると簡単に剥離
している程度で密着誠意不良2時間後(35dyne/
am) 4時間後(36dyne/ (m )かなり
メッキ付量しているか未着部分も残っており、ただ、メ
ッキ付量部分の定着性は良好でありなかなか剥離しない
。After that, TMP chemical nickel A160 mountain 1 manufactured by Khitan Pharmaceutical,
160 ml of B was immersed in an electroless plating solution diluted to 11 with water for 7 minutes at 35°C. After washing with water, it was dried with a dryer to obtain an electroless plated plate. Observing the plating adhesion status, it was immediately after molding and cleaning (34 dyne/cs)
After 1 hour without plating at all (34dyne/C11
) There is some plating, but it peels off easily when rubbed with a fingernail, and the adhesion is poor after 2 hours (35dyne/
am) After 4 hours (36 dyne/(m)) There was a considerable amount of plating, and some unplated areas remained, but the fixation of the plated areas was good and did not peel off easily.
8時間後〜48時間後(38dyne/ CI+ >全
面、光沢あるメッキにおおわれておりかつ密着性は非常
に良好であった。After 8 hours to 48 hours (38 dyne/CI+) The entire surface was covered with shiny plating and the adhesion was very good.
比較のため、クロム酸による前処理を試みた。For comparison, we tried pretreatment with chromic acid.
無水クロム酸400に、濃硫酸380 gを水で11に
希釈した処理液中65℃で処理した。成型後、4時間以
上、経過した板を用いた場合、処理時間2分間以上で表
面か白化し、以後の無電解メッキ処理までの処理によっ
てニッケルはついているか表面は灰色で白濁しており光
沢は全くないものしか得られなかった。It was treated at 65° C. in a treatment solution prepared by diluting chromic anhydride (400 g) and concentrated sulfuric acid (380 g) to 11 (11:1) with water. If you use a plate that has been molded for more than 4 hours, the surface will turn white after 2 minutes or more of processing time, and the surface will become gray and cloudy with no nickel attached due to the subsequent electroless plating process. All I got was nothing.
一方、成型後1時間以内のものを同様にクロム酸処理す
ると、2分間〜4時間の処理では、無電解メッキ上がり
のものは黒色にしかなっておらず、・5〜8分間の処理
で灰色の表面となるクロム酸処理によって光沢あるメッ
キ面が得られない事、また、空気放置を充分おこなって
いない成型物では、短期間のクロム酸処理をしてもその
程度か充分でないとメッキの付量もうまくいかない事が
判り、酸素と共有せしめる事による処理が、前処理とし
て極めて重要な効果を有している事か判る。On the other hand, when we similarly treat objects with chromic acid within 1 hour after molding, after 2 minutes to 4 hours of treatment, the electroless plated surface becomes only black, and after 5 to 8 minutes of treatment, it turns gray. A shiny plating surface cannot be obtained by the chromic acid treatment, and if the molded product is not left in the air for a long time, the plating may not adhere even if the chromic acid treatment is applied for a short period of time. It was found that the amount of oxygen was also not effective, indicating that treatment by sharing oxygen with oxygen has an extremely important effect as a pretreatment.
また一般のプラスチックに慣用されているクロム酸処理
ではメタセシス重合体成型物の場合光沢のあるメッキ表
面が得られない事が判った4手続補正書(岐)
特願平 1−91766 号
2、発明の名称
重合体成型物の無電解メッキ用前処理方法(1)明細書
第10頁1〜2行の「タングステオキシクロライド」を
「タングステンオキシクロライド」と訂正する。In addition, it was found that the chromic acid treatment commonly used for general plastics does not produce a shiny plating surface in the case of metathesis polymer moldings. 4th Amendment (Written) Patent Application No. 1-91766 No. 2, Invention Pretreatment method for electroless plating of polymer molded articles (1) "Tungsteoxychloride" in lines 1 and 2 on page 10 of the specification is corrected to "tungsten oxychloride."
以上that's all
Claims (1)
モノマーを重合と同時に成型して得たメタセシス重合体
成型物の表面に無電解メッキを、 (1)前処理 (2)触媒付与、活性化処理 (3)無電解メッキ処理の工程によってほどこすに当っ
て前処理法として、該成型物を酸素分子と接触せしめる
事により親水化する方法を用いる事を特徴とする無電解
メッキ用前処理方法。[Scope of Claims] Electroless plating on the surface of a metathesis polymer molded product obtained by molding a metathesis polymerizable monomer simultaneously with polymerization in the presence of a metathesis polymerizable catalyst system, (1) Pretreatment (2) Catalyst Application and Activation Treatment (3) Electroless plating characterized by using a method of making the molded product hydrophilic by bringing it into contact with oxygen molecules as a pretreatment method before applying the electroless plating process. Pretreatment method for plating.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9176689A JPH02270967A (en) | 1989-04-13 | 1989-04-13 | Pretreatment of electroless plating for polymer molded body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9176689A JPH02270967A (en) | 1989-04-13 | 1989-04-13 | Pretreatment of electroless plating for polymer molded body |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21873894A Division JP2509084B2 (en) | 1994-09-13 | 1994-09-13 | Plated cross-linked polymer molding |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02270967A true JPH02270967A (en) | 1990-11-06 |
Family
ID=14035682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9176689A Pending JPH02270967A (en) | 1989-04-13 | 1989-04-13 | Pretreatment of electroless plating for polymer molded body |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02270967A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008094923A (en) * | 2006-10-11 | 2008-04-24 | Kanto Gakuin Univ Surface Engineering Research Institute | Surface modification method of cycloolefin polymer material, surface-modified cycloolefin polymer material obtained using the same, method for forming metallic film on surface-modified cycloolefin polymer material, and cycloolefin polymer material with metallic film |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51148771A (en) * | 1975-06-17 | 1976-12-21 | Showa Denko Kk | Plating of norbornene polymer |
JPS55106234A (en) * | 1979-02-08 | 1980-08-14 | Kokoku Gomme Kogyo Kk | Surface metallizing method of resin product and modified resin used therefor |
JPS58129013A (en) * | 1982-01-25 | 1983-08-01 | 帝人メトン株式会社 | Thermosettable homopolymer, manufacture and catalyst portion of double decomposition catalyst system |
JPS63103076A (en) * | 1986-10-20 | 1988-05-07 | Jujo Kako Kk | Formation of metal film |
-
1989
- 1989-04-13 JP JP9176689A patent/JPH02270967A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51148771A (en) * | 1975-06-17 | 1976-12-21 | Showa Denko Kk | Plating of norbornene polymer |
JPS55106234A (en) * | 1979-02-08 | 1980-08-14 | Kokoku Gomme Kogyo Kk | Surface metallizing method of resin product and modified resin used therefor |
JPS58129013A (en) * | 1982-01-25 | 1983-08-01 | 帝人メトン株式会社 | Thermosettable homopolymer, manufacture and catalyst portion of double decomposition catalyst system |
JPS63103076A (en) * | 1986-10-20 | 1988-05-07 | Jujo Kako Kk | Formation of metal film |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008094923A (en) * | 2006-10-11 | 2008-04-24 | Kanto Gakuin Univ Surface Engineering Research Institute | Surface modification method of cycloolefin polymer material, surface-modified cycloolefin polymer material obtained using the same, method for forming metallic film on surface-modified cycloolefin polymer material, and cycloolefin polymer material with metallic film |
JP4738308B2 (en) * | 2006-10-11 | 2011-08-03 | 株式会社関東学院大学表面工学研究所 | Method for producing cycloolefin polymer material with metal film and cycloolefin polymer material with metal film obtained by using the method |
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