JPH02265186A - Ic socket with heat sink - Google Patents

Abstract

PURPOSE:To adjust the direction of radiation fins so as to be parallel with the wind direction for air-cooling with no regard to the mounting direction of an IC socket housing by making a heat sink for radiation rotatable to a socket cover. CONSTITUTION:A heat sink 3 is freely rotatably to a socket cover 2 attached thereto a rotary axis C. Accordingly, the highest radiation effect can be obtained by adjusting in parallel with the direction A of a wind flowing through the rows of the radiation fins 4. The same effect can be obtained about a socket for IC excepting the IC socket for a leadless chip carrier IC by using the rotatable heat sink 3. Thereby, the direction of the radiation fins can be freely adjusted corresponding to the flowing wind direction.

Description

[Detailed description of the invention] [Industrial application field] This invention is an IC used in Hashira's electronic products.

This invention relates to an IC socket with a heat sink in an LSI socket.

[Conventional technology]

As a conventional IC socket of this type, there is one shown in FIG. In FIG. 8G, 1 is an IC socket housing, 2 is a socket cover, 3 is a heat sink, 4 is a heat radiation fin, and 5 is a printed circuit board on which an IC nnant is mounted. Note that A indicates the direction of the wind flowing to cool 10.

In other words, in this case, a heat sink 3 fixed to a socket cover 2 is pressed from above to an xO (1,1 display w?5) housed in an IC socket housing 1, and the IC is fixed. A heat sink 3 radiates heat generated by the IC. Note that the heat radiation fins 4 serve to enhance this heat radiation effect.

(Problems to be Solved by the Invention) In the conventional IC socket with a heat sink, the heat sink 3 was fixed to the socket cover 2, so when the 10-inch housing l was mounted on the printed circuit board 5, the direction of the radiation fins 4 was fixed. Therefore, the mounting direction of the IC socket housing 1 must be determined so that the direction A of the air cooling air is parallel to the radiation fins 4.
Another disadvantage is that when the direction of the flowing wind changes, the angle of the radiation fins 4 relative to the wind cannot be adjusted accordingly.

This invention was made to solve the above-mentioned problems, and its object is to enable the direction of the radiation fins to be freely adjusted in accordance with the direction of the flowing wind.

Means for Solving the Problem] The IO socket with a heat sink according to the present invention has a movable contact portion between the heat sink and the socket cover to which the heat sink is attached, so that the heat sink can freely rotate around its central rotation axis. This is how it was done.

[Effect]

In this invention, the heat sink freely rotates about the rotation axis at the center of the heat sink with respect to the socket cover to which it is attached, and changes the direction of the radiation fins provided on the heat sink.

(Example) Hereinafter, an example of the present invention will be explained with reference to the drawings.
In FIG. 2, 1 contains lO6 and 7. : I
O socket housing, 2 is a socket cover, 3 is a circular heat sink that is rotatably fitted into the socket cover 2, and 4 is a heat dissipation fin thereof. Note that C indicates the central axis of rotation of the heat sink 3 attached to the socket cover 2.

In the 10-socket with heat sink configured as described above, the heat sink 3 can freely rotate around the rotation axis 0 with respect to the socket cover 2 to which it is attached, and therefore the heat dissipation provided on the top of the heat sink By adjusting the row of fins 4 to be parallel to the direction A of the wind, the highest heat radiation effect can be obtained.

In the above embodiment, a circular heat sink 3 is used, but a heat sink other than a circular shape may be used.

Further, in the above embodiment, an IO socket for a leadless chip carrier IC has been described, but similar effects can be obtained for other IO sockets by using the rotatable heat sink 3.

(Effects of the Invention) As described above, according to the present invention, since the heat sink for heat dissipation is configured to be rotatable with respect to the socket cover, the cooling air can be used regardless of the mounting direction of the IC socket housing. The direction of the heat radiation fins can be adjusted so that it is parallel to the direction of the heat dissipation fins, which has the effect of eliminating layout constraints with a simple configuration.

[Brief explanation of drawings]

FIG. 1 shows a latch with a heat sink according to an embodiment of the present invention.
FIG. 2 is a perspective view of an O socket, FIG. 2 is a sectional view thereof, and FIG. 8 is a perspective view of a conventional IC socket with a heat sink. In the figure, 1 is an IC socket housing, 2 is a socket cover, 3 is a heat sink, 4 is a radiation fin, 5 is a printed circuit board, and 6 is 1O. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

[Claims] An IC socket housing containing an IC, a socket cover covering the housing, and a finned heat sink attached to the socket cover and pressed against the IC, wherein the heat sink is rotatably fitted to the socket cover. An IC socket with a heat sink.