JPH0226274U - - Google Patents
Info
- Publication number
- JPH0226274U JPH0226274U JP10337688U JP10337688U JPH0226274U JP H0226274 U JPH0226274 U JP H0226274U JP 10337688 U JP10337688 U JP 10337688U JP 10337688 U JP10337688 U JP 10337688U JP H0226274 U JPH0226274 U JP H0226274U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- electrodes
- electrode
- substrate
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10337688U JPH0226274U (de) | 1988-08-04 | 1988-08-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10337688U JPH0226274U (de) | 1988-08-04 | 1988-08-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0226274U true JPH0226274U (de) | 1990-02-21 |
Family
ID=31334151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10337688U Pending JPH0226274U (de) | 1988-08-04 | 1988-08-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226274U (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2021038631A1 (de) * | 2019-08-23 | 2021-03-04 | ||
| WO2022220030A1 (ja) * | 2021-04-14 | 2022-10-20 | Ｊｏｈｎａｎ株式会社 | 電子部品実装方法及び回路実装基板 |
-
1988
- 1988-08-04 JP JP10337688U patent/JPH0226274U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2021038631A1 (de) * | 2019-08-23 | 2021-03-04 | ||
| WO2021038631A1 (ja) * | 2019-08-23 | 2021-03-04 | 株式会社Ｆｕｊｉ | 電子回路装置及びその製造方法 |
| WO2022220030A1 (ja) * | 2021-04-14 | 2022-10-20 | Ｊｏｈｎａｎ株式会社 | 電子部品実装方法及び回路実装基板 |