JPH0226259U - - Google Patents
Info
- Publication number
- JPH0226259U JPH0226259U JP10505688U JP10505688U JPH0226259U JP H0226259 U JPH0226259 U JP H0226259U JP 10505688 U JP10505688 U JP 10505688U JP 10505688 U JP10505688 U JP 10505688U JP H0226259 U JPH0226259 U JP H0226259U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- element pellet
- lid
- pair
- main electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000008188 pellet Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000000605 extraction Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988105056U JPH0617316Y2 (ja) | 1988-08-09 | 1988-08-09 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988105056U JPH0617316Y2 (ja) | 1988-08-09 | 1988-08-09 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0226259U true JPH0226259U (US07860544-20101228-C00003.png) | 1990-02-21 |
| JPH0617316Y2 JPH0617316Y2 (ja) | 1994-05-02 |
Family
ID=31337331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988105056U Expired - Lifetime JPH0617316Y2 (ja) | 1988-08-09 | 1988-08-09 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0617316Y2 (US07860544-20101228-C00003.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6393126A (ja) * | 1986-10-08 | 1988-04-23 | Fuji Electric Co Ltd | 半導体装置 |
-
1988
- 1988-08-09 JP JP1988105056U patent/JPH0617316Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6393126A (ja) * | 1986-10-08 | 1988-04-23 | Fuji Electric Co Ltd | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0617316Y2 (ja) | 1994-05-02 |
