JPH0226250U - - Google Patents
Info
- Publication number
- JPH0226250U JPH0226250U JP1988105198U JP10519888U JPH0226250U JP H0226250 U JPH0226250 U JP H0226250U JP 1988105198 U JP1988105198 U JP 1988105198U JP 10519888 U JP10519888 U JP 10519888U JP H0226250 U JPH0226250 U JP H0226250U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- bonding pad
- chip element
- fixing
- pad surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Casings For Electric Apparatus (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988105198U JPH0226250U (enFirst) | 1988-08-09 | 1988-08-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988105198U JPH0226250U (enFirst) | 1988-08-09 | 1988-08-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0226250U true JPH0226250U (enFirst) | 1990-02-21 |
Family
ID=31337595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988105198U Pending JPH0226250U (enFirst) | 1988-08-09 | 1988-08-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226250U (enFirst) |
-
1988
- 1988-08-09 JP JP1988105198U patent/JPH0226250U/ja active Pending