JPH0226242U - - Google Patents
Info
- Publication number
- JPH0226242U JPH0226242U JP1988103292U JP10329288U JPH0226242U JP H0226242 U JPH0226242 U JP H0226242U JP 1988103292 U JP1988103292 U JP 1988103292U JP 10329288 U JP10329288 U JP 10329288U JP H0226242 U JPH0226242 U JP H0226242U
- Authority
- JP
- Japan
- Prior art keywords
- bonding wedge
- end surface
- wires
- bottom wall
- wall portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988103292U JPH0621240Y2 (ja) | 1988-08-05 | 1988-08-05 | ボンディングウェッジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988103292U JPH0621240Y2 (ja) | 1988-08-05 | 1988-08-05 | ボンディングウェッジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0226242U true JPH0226242U (enExample) | 1990-02-21 |
| JPH0621240Y2 JPH0621240Y2 (ja) | 1994-06-01 |
Family
ID=31333990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988103292U Expired - Lifetime JPH0621240Y2 (ja) | 1988-08-05 | 1988-08-05 | ボンディングウェッジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0621240Y2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0471245A (ja) * | 1990-07-12 | 1992-03-05 | Oki Electric Ind Co Ltd | ワイヤボンダ及びワイヤボンディング方法 |
| JP5953385B1 (ja) * | 2015-02-25 | 2016-07-20 | 本田技研工業株式会社 | 車両 |
-
1988
- 1988-08-05 JP JP1988103292U patent/JPH0621240Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0471245A (ja) * | 1990-07-12 | 1992-03-05 | Oki Electric Ind Co Ltd | ワイヤボンダ及びワイヤボンディング方法 |
| JP5953385B1 (ja) * | 2015-02-25 | 2016-07-20 | 本田技研工業株式会社 | 車両 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0621240Y2 (ja) | 1994-06-01 |