JPH02260447A - Ic package - Google Patents

Ic package

Info

Publication number
JPH02260447A
JPH02260447A JP8033189A JP8033189A JPH02260447A JP H02260447 A JPH02260447 A JP H02260447A JP 8033189 A JP8033189 A JP 8033189A JP 8033189 A JP8033189 A JP 8033189A JP H02260447 A JPH02260447 A JP H02260447A
Authority
JP
Japan
Prior art keywords
outer leads
chipped
external circuit
bonded
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8033189A
Other languages
Japanese (ja)
Inventor
Yoshifumi Kitayama
Shunichi Yabusaki
Tokuhito Hamane
Yukio Maeda
Yutaka Makino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8033189A priority Critical patent/JPH02260447A/en
Publication of JPH02260447A publication Critical patent/JPH02260447A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To enhance connection reliability between an outer lead and an external circuit by a method wherein the outer lead exposed from a chipped-off part of an insulating support film is bonded to the chipped-off part.
CONSTITUTION: Outer leads 22 used to connect an IC chip 10 sealed inside a package material 40 to an external circuit protrude to the outside of the package material 40, and the outer leads 22 are bonded to the external circuit. Chipped-off parts 51 are formed partly on a face opposite to a bonding connection face with reference to the outer leads 22. The outer leads 22 are exposed to the side opposite to the bonding connection face only at the chipped-off parts 51, and the parts are bonded to an insulating support film 50. Thereby, while a protective function of the outer leads 22 by the insulating support film 50 is utilized sufficiently, bonding connection realiability between the outer leads 22 and the external circuit can be enhanced.
COPYRIGHT: (C)1990,JPO&Japio
JP8033189A 1989-03-30 1989-03-30 Ic package Pending JPH02260447A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8033189A JPH02260447A (en) 1989-03-30 1989-03-30 Ic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8033189A JPH02260447A (en) 1989-03-30 1989-03-30 Ic package

Publications (1)

Publication Number Publication Date
JPH02260447A true JPH02260447A (en) 1990-10-23

Family

ID=13715272

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8033189A Pending JPH02260447A (en) 1989-03-30 1989-03-30 Ic package

Country Status (1)

Country Link
JP (1) JPH02260447A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5932927A (en) * 1996-07-24 1999-08-03 Nec Corporation High-frequency device package

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61242051A (en) * 1985-04-19 1986-10-28 Matsushita Electronics Corp Lead frame

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61242051A (en) * 1985-04-19 1986-10-28 Matsushita Electronics Corp Lead frame

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5932927A (en) * 1996-07-24 1999-08-03 Nec Corporation High-frequency device package

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