JPH02258999A - Method and device for plating - Google Patents

Abstract

PURPOSE:To obtain the plating device capable of changing the position of an anode in accordance with the length of a material to be treated by freely adjusting the vertical height of the anode hung to a lift in the plating bath. CONSTITUTION:The rod as the material W to be treated is vertically held by hangers 20 and 21. The rod has a small diameter on both ends in the longitudinal direction and a large diameter at its central part, and the large-diameter part is dipped to the level L of the plating bath. The anodes 6, 6,... is made longer than the material W, the top is allowed to protrude from the level L, and the lower part is positioned far below the lower part of the material W. Under such a constitution, when a driving machine 11 is driven by utilizing the anode lift 3, lifting bodies 4 and 4 are raised, and a holding body 5 is also raised through a bracket 15. Accordingly, the base part 5A can be raised to the position shown by the virtual line in the figure. As a result, the thicknesses of the plating layers on the upper and lower parts of the material W are uniformized.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a uniform thickness plating apparatus and method, and particularly to a plating device in which the anode in an electrolytic plating tank can be adjusted up and down in accordance with the length of the metal to be plated. Apparatus and method.

[Conventional technology]

Conventionally, in the case of chrome plating, for example, in order to increase processing efficiency, a plurality of various processing tanks were arranged in a ring or in two rows, and the objects to be processed, which were suspended on a transport device, were processed at predetermined intervals. A completely automatic system is adopted in which the material is immersed in each processing tank, pulled out, sent to the next processing tank, immersed, and then repeats the same steps as described above until the final processing step.

In addition, 4 [in plating long rods, pipes, etc.]
- Four to six pieces of metal to be processed are hung and supported at equal intervals on the hangers of the conveyor of the table, and the anodes are arranged so as to surround the metal to be processed Nj4- from all sides, as shown in Figure 3. The IUMs are arranged at equal intervals in the processing tank.

[Problem to be solved by the invention]

In the conventional plating method, the length of the anode and the height (length) of the anode in the tank are fixed. As a result, depending on the length of the object to be treated, such as a rod, the correspondence with the anode may not be equalized, resulting in uneven plating layer thickness in areas near and below the surface of the plating solution, resulting in unevenness in the product. There was a big problem that occurred.

Particularly when there are only a few individual openings/nodules of the plated object, or when several lots of long rods are processed one after another with short nodules/nodules due to the movement of multiple conveying devices. Although the anode is suitable for rods with a long length, if a long anode is used as is for a short rod that is subsequently processed, the plating thickness tends to be uneven between the top and bottom of the short rod. was there.

The present invention was developed with the aim of solving these difficulties and providing a plating apparatus and method that can change the corresponding position of the anode in accordance with the length of the object to be processed.

[Means to solve the problem]

The present invention has been made in view of the above-mentioned problems and in order to solve the difficulties. A plating apparatus characterized in that the height of an anode in a processing bath can be freely adjusted up and down.

(2) The anode disposed in the processing bath is adjusted up and down according to the height of the object to be processed, so that the plating thickness in the vertical direction of the object to be processed is uniform. plating method.

A technical measure was taken.

[Effect]

In the present invention configured as described above, whereas the conventional anode is fixed at a limited height within the processing bath, the anode is suspended from the lifting device and the height is fixed within the processing bath. The length of the anode is the same, but the height of its placement position can be adjusted freely up and down, depending on the height (length) of the workpiece to be immersed in the tank, so the electrode action of the anode can be adjusted. The plating thickness can be made uniform regardless of the height difference in the vertical direction of the object to be treated.

〔Example〕

Embodiments of the invention will be described based on the drawings.

FIG. 1 is a sectional view from the front, and FIG. 2 is a plan view of the anode lifting device.

The plating device 1 has an anode lifting device 3 outside the processing bath 2.
is installed. The anode lifting device 3 includes a holding frame 5 provided on the lifting body 4, and a plurality of anodes 6.6 mounted on the holding frame 5.
... are erected at predetermined intervals, and the anodes 6...
- is configured to be movable up and down within the processing bath 2 on the holding frame 5.

Next, the configuration of the anode lifting device 3 will be specifically explained.

In the anode lifting device 3, a pair of supports 7, 7 are erected on the outer right side of the processing bath 2 in FIG.
A drive shaft 8 is horizontally suspended between them.

Binions 9.9 are fixed to both end edges of the drive shaft 8, and a transmission wheel 10 is fixed to the drive shaft 8.

A drive l1111 is disposed below the transmission shaft 10. A transmission mechanism 12 is disposed between the drive machine 11 and the transmission wheel 10, and the drive shaft 8 and pinions 9 are rotated by the drive of the drive machine 11. Although the drive 1fi11 can be of any type in principle, it can be controlled by an NC control device in the plating plant system, for example, by using a pulse motor, a servo motor, or the like.

As shown in FIG. 1, on the opposing surfaces of both the supports 7, 7, there are provided a predetermined interval (a width of the guide strip 4^ of the elevating body 4, which will be described later) on both sides at the upper edge of each of them. A pair of guide wheels 13.13 are pivotally mounted, and a pair of guide wheels 14, 14 are arranged below them at a predetermined interval.

The elevating body 4.4 is a substantially rectangular plate-like body, and a guide strip 4A that is long in the longitudinal direction is provided protruding from the center of the width of its wide surface. Thus, the guide strips 4^, 4A are attached to the support 7.
Both left and right guides M13.13, 14.7 on the opposing surfaces.
14, on the right end surface of the elevating body 4.4 in the figure, there are rack teeth 4B that can mesh with the binions 9.9,
4B are formed and meshed with the pinions 9.9, respectively.

Therefore, by driving the driving machine 11, the transmission mechanism 12
．． Conduction wheel 10. Conduction axis8. Both elevating bodies 4, 4 connect guide strips 4A, 4^ portions to guide wheels 13, 4 via binions 9, 9,
It is configured so that it can be moved up and down while kited between L3.14.14.

A bracket 15.15 is disposed at the top of the elevating bodies 4, 4 so as to protrude in the direction of the processing bath 2 in the figure.
A holding frame 5 is fixed to the tip of the bracket 15.15.

The holding frame 5 is composed of a base portion 5A arranged in a substantially lattice shape, and columnar portions 5B, 5B that stand perpendicularly at both longitudinal ends of one end side of the base portion 5A. Body part 58
．． The length of 58 is configured to approximately match the depth of the processing bath 2, and the tops of both pillar wooden parts 58.
5.15, respectively, and the elevating body 4.
It is configured such that it can be raised and lowered in the vertical direction within the processing bath 2 as the processing bath 4 is raised and lowered.

As shown in FIG. 2, a plurality of anodes 6, 6, . Reference numerals 17, 17, . . . in FIG. 1 are connection plates of the anode 6.

In the above configuration, the transfer device 16 is disposed on the left outer side of the processing bath 2 in FIG.
is horizontally projected above the processing bath 2. A hanging body 19 is hung from the tip edge of the support arm 18, and a plurality of hangers 20, 20, . . . are arranged below the hanging body 19. At the lower end of the hanger 20, 20... is attached a long and narrow piece of wood for binding the object to be processed, and the glue to be processed is as shown by the imaginary line T in FIG. 2. The hangers 20... are positioned equidistantly from neighboring anodes 6,6....

The conveyance device 16 is a general type and is configured to be able to raise and lower a support arm 18 along a support column 21.
The objects to be processed can be taken in and out of the processing bath 2. Further, when a plurality of processing baths 2 are arranged in parallel, the transport device 16 can transport the workpiece k for each processing bath along the rails 22.

The operation and effects of the present invention constructed as described above will be described below.

In FIG. 1, a rod as an object to be processed is vertically held on the hanger 20.20.

The rod has a small diameter at both longitudinal ends and a large diameter at the center, and the large diameter part is currently immersed in the plating bath up to level L. On the other hand, the length of the anode 6.6... is the length of the object to be treated -
The top of the plating bath protrudes above the level of the plating bath, but the bottom of the plating bath is located far below the lower end of the workpiece. If plating is performed in this state, there will be a difference in the balance of the electrolytic metal in the plating layer, resulting in non-uniformity in the thickness of the plating layer above and below the object to be processed, which tends to be thinner at the top.

Therefore, in this invention, when the anode elevating device 3 is used to drive the drive l111, the elevating bodies 4, 4 rise due to the above-mentioned operation, and the holding frame 5 also rises via the bracket 15, so that the base portion 5A It can be raised to the position shown by the imaginary line in FIG. As a result, the object to be processed -
Even if the length of the anode 6 is short, the corresponding length of the anode 6 to that length is also appropriate, resulting in the effect that the plating layer thickness above and below the workpiece is averaged.

In this invention, the type of the lifting device 3 is not limited to the embodiment, and the design can be changed as appropriate.

〔Effect of the invention〕

As explained above, the present invention has the following excellent effects.

(A) Even if the depth of the processing bath is constant and the length of the anode is long and constant, the anode must be raised when plating a short workpiece immediately after processing a long workpiece. Therefore, even when a large number of products with a small number of rods are processed continuously, the thickness of the plating layer on the top and bottom of the object to be processed can be made uniform, and the yield rate of products can be improved.

(8) Since the anode lifting device has a simple mechanism, it is easy to operate and has excellent maintenance durability.

(C) With conventional equipment and methods, the incidence of defective products increases due to uneven plating thickness, and in such cases, reprocessing is no longer necessary, resulting in increased costs and wasted labor. Although the present invention requires capital investment for installing an anode lifting device, it can be used immediately in existing equipment and the product can be improved.

[Brief explanation of drawings]

The drawings relate to embodiments of the present invention, and FIG. 1 is a longitudinal sectional front view of the main part, FIG. 2 is a plan view of the anode lifting device, and FIG. 3 is a schematic plan view showing the positional relationship between the object to be processed and the anode. be. 20...Hanger 22...Rail, L...Bath level.

Claims (2)

[Claims] (1) In a plating apparatus in which an anode is disposed inside a processing bath, the anode is suspended from a lifting device provided outside the processing bath, and the height of the anode in the processing bath can be freely adjusted up and down. This plating equipment is characterized by: (2) The anode disposed in the processing bath is adjusted up and down in accordance with the height of the object to be processed, thereby making the plating thickness uniform in the vertical direction of the object to be processed. Plating method.