JPH02257665A - Ic package - Google Patents

Abstract

PURPOSE:To make intervals of outer leads regular and eliminate the need for performing corrective work when bending work is performed by forming each groove in advance in the direction which intersects almost perpendicularly to the longitudinal direction of each outer lead at faces where the bent insides of the outer leads are formed. CONSTITUTION:This device is composed of an IC package 10 as well as a lead frame 11 equipped with numerous outer leads 11a and the like. Then linear grooves 13a and 13b are formed at prescribed positions of the numerous outer leads 11a. As these grooves 13a and 13b are formed into the exceedingly shallow shapes, for example, by chemical etching and mechanical pressing when the lead frame is formed or molded, the formation of them are performed at the positions where the outer leads 11a are to be bent; besides, faces making up the bent insides are disposed in the directions which intersect almost perpendicularly to longitudinal direction of each outer lead 11a. This configuration makes intervals of the outer leads 11a regular and eliminates the need for performing corrective manual work.

Description

[Detailed Description of the Invention] [Summary] Regarding the outer leads of an IC package, the outer leads are bent and formed into a predetermined shape for the purpose of keeping the outer lead interval constant during bending and eliminating the need for manual correction work. In an IC package with external leads,
The outer lead is configured by forming a groove in a direction substantially perpendicular to the longitudinal direction of the outer lead on the inner surface of the outer lead.

[Industrial application field]

The present invention relates to an IC puff cage, and more particularly to an IC puff cage having an outer lead that is bent into a predetermined shape.

Generally, the outer leads protruding outward from the IC pancage are
It is bent and formed into a shape that takes into account mounting on a board.

[Conventional technology]

As for the conventional bending and forming of outer leads, for example, in FIG.
, B at once and pressing down the press member C, the plurality of outer leads 1 are bent as shown by broken lines.

[Problem to be solved by the invention]

However, in such conventional bending,
A slight error tends to occur in the bending direction of each outer lead, and if this error is large, there is a problem in that the outer lead intervals after bending become uneven as shown in FIG. 8.

This is because when bending stress is applied to a metal material, the part that first begins to deform is a defective part or a small cross-section part of the metal material, so it depends on the degree and position of the defective part of each outer lead. It is thought that the error in the bending direction occurs due to a slight difference in the cross-sectional shape of the outer lead.

Particularly, in recent buff cages with multiple pins, the problem of uneven outer lead spacing is a big problem. This is because if an irregularity occurs, manual correction work is required, and the larger the number of bins, the longer the correction work time will be.

The present invention was made in view of these problems, and
The purpose is to keep the outer lead spacing constant during bending, eliminating the need for manual correction work.

[Means to solve the problem]

In order to achieve the above object, an IC package according to the present invention has an outer lead that is bent into a predetermined shape.
In the C package, the outer lead is configured by forming a groove in a direction substantially perpendicular to the longitudinal direction of the outer lead on the inner surface of the outer lead.

[Effect]

In the present invention, the groove portion of the outer lead becomes a portion corresponding to a small cross-section portion or a defective portion, and deformation when bending stress is applied starts from this portion. Therefore, since each outer lead is bent along the groove, errors in the bending direction are suppressed and the intervals between the outer leads are made constant.

〔Example〕

Hereinafter, the present invention will be explained based on the drawings.

1 to 3 are views showing one embodiment of an IC package according to the present invention.

In FIG. 1, 10 is an IC package, and 11 is a lead frame having a large number of outer leads lla, each of which has linear grooves 13a, 13b at predetermined positions.
is formed.

Here, the grooves 13a and 13b are formed very shallowly by, for example, chemical etching or mechanical pressing during lead frame production or molding, and the grooves 13a and 13b are formed at the position where the outer lead is to be bent, and where the outer lead is to be bent. It is arranged on the curved inner surface in a direction substantially perpendicular to the longitudinal direction of the outer lead 1laO.

Furthermore, Figure 2 is a side view of the IC pancake.
The outer lead is in the state before being bent.

In such a configuration, when the outer lead lla is started to be bent, for example, by the method shown in FIG. 7, the initial deformation is performed along the groove (for example, 13a) of the outer lead lla (see FIG. 3). Therefore, each outer lead 11. As the leads a are guided by the grooves (for example, 13a) and are correctly bent in the same direction, bending errors are suppressed, and the distance between adjacent outer leads lla is kept constant, eliminating the problem of misalignment.

As described above, in this embodiment, by simply forming grooves (for example, 13a, 13b) on the outer leads 11a in advance, it is possible to keep the intervals between the outer leads constant and avoid unevenness, and manual correction work is not required. It can be done.

In particular, as shown in FIG. 4, the outer leads 14 are formed in an IC puff cage with a relatively narrow interval, and as shown in FIG. 5, the outer leads 15 are relatively thick and are bent at a large bending angle. It is preferable to apply the present invention to an IC package in which the bending shape of the outer lead 16 is complicated as shown in FIG.

In addition, although the said Example showed the example in which one groove|channel is formed in one bending part, it is not limited to this and a plurality of grooves may be formed side by side in one bending part. By the way, by doing this, it is possible to bend and form a smooth curve,
It can be made favorable in terms of strength when bent at a large angle.

13a.

13b...Groove.

〔Effect of the invention〕

According to the present invention, the interval between the outer leads can be made constant during the bending process, and manual correction work can be made unnecessary.

[Brief explanation of drawings]

1 to 3 are diagrams showing an embodiment of the IC buff cage according to the present invention. FIG. 1 is a plan view thereof, FIG. 2 is a view in the direction of the ■ arrow in FIG. Figures showing the folded state, 4th ~
Figure 6 is a diagram showing various IC packages to which the present invention is applied, Figures 7 and 8 are diagrams showing a conventional example, Figure 7 is a diagram explaining its bending, and Figure 8 is its diagram. FIG. 7 is a diagram showing irregular intervals between outer leads. 11a... Outer lead, Figure 4 showing a preferable IC buffing cage to which the present invention is applied
Figure 1: A view from the ■ arrow in Figure 2. Figure 5: A diagram showing a preferred IC package to which the present invention is applied.
Figure 6 shows a preferred IC package to which the present invention is applied.
FIG. 3 is a diagram showing a state in which the outer lead of the embodiment shown in FIG. 1 is bent.

Claims (1)

[Scope of Claims] In an IC package having an outer lead that is bent into a predetermined shape, the outer lead is preliminarily provided with a bend in a direction substantially perpendicular to the longitudinal direction of the outer lead on the inner side of the bend. An IC package characterized by having a groove formed therein.