JPH02256300A - Insertion of electronic component into substrate and device therefor - Google Patents

Abstract

PURPOSE:To improve the inserting rate into a substrate and to effect the operation with high efficiency by inspecting a folding, a bend, and an interval failure of lead wires prior to the insertion of an electronic component into a substrate and by excluding the electronic components which are defective in shape previously in order to insert only good-quality components into the substrate. CONSTITUTION:The inspection of lead wires 6a of an electronic component 6 are performed by inserting the lead wires 6a in inspection holes 2a of an inspection block 2 in which the inspection holes 2a of the same internal diameter as that of an electronic component inserting hole 10a are formed in the same intervals as those of the electronic component inserting holes 10a of a substrate 10 in which the plural lead wires 6a of an electronic component 6 are to be inserted. Then, the defectives comprising failures such as folding, bend, and an interval failure are previously excluded and only good parts which can be surely inserted are mounted on the substrate 10. Thus, the insertion failure due to folding, bend, and an interval failure of the lead wires 6a can be prevented surely and the operating efficiency of insertion can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method and apparatus for inserting an electronic component into a board, and in particular, prior to inserting the electronic component into the board, it is possible to prevent bending or folding of the lead wire of the electronic component. By inspecting for poor spacing, eliminating electronic components with defective shapes in advance, and inserting only good products into the board, the board and electronic components are not damaged, and the rate of insertion into the board is reduced. The present invention relates to a method and apparatus for inserting electronic components into a board, which improves the efficiency of work.

Conventional technology Conventionally, the method for mounting electronic components on a board is to fix the board in a predetermined position, and then use a clamping device to clamp the electronic component supplied by a parts feeder and transport the electronic component to the position on the board where it is to be mounted. The lead wire protruding from the bottom of the board is cut to a predetermined length by a device installed on the bottom of the board, and the lead wire is then inserted into the electronic component insertion hole of the board to further increase the strength of mounting on the board. The method used was to bend it.

- A long thin wire-shaped electronic component glue wire for boat fishing is
It is not uncommon for the lead wires to be bent during the manufacturing process or subsequent transportation process, and if electronic components with such deformed lead wires are mixed in and supplied, the lead wires may be mounted on the board in a bent state. Therefore, the lead wires must be soldered without being inserted into the electronic component insertion holes of the board, resulting in a defective board. In addition, if even one of the several lead wires in one electronic component is bent, the unbendable lead wire will not be able to connect with the electronic component when it is inserted into the board. Not only will the electronic components and circuit board be damaged, but the electronic components cannot be inserted into the specified position, causing automatic machinery to detect this abnormality and stop operation. However, each time an operator removes the abnormal parts and starts the automatic machine again, there is a drawback that work efficiency is significantly reduced.

The above-mentioned lead wire insertion failure phenomenon cannot be prevented even by improving the relative positioning accuracy between the board and electronic components during insertion, and the electronic component insertion holes and lead wires must be manufactured with high precision. However, there was a drawback that the manufacturing cost was extremely high.

Purpose The present invention has been made to eliminate the drawbacks of the above-mentioned prior art, and its purpose is to mount an electronic component on a board that is equal to the electronic component insertion hole of the board before mounting the electronic component on the board. A non-defective product that can be inspected by inserting the lead wire into an inspection block with inspection holes formed in the interval and inner diameter, and eliminating defective products with abnormal lead wires such as folds, bends, and spacing in advance to ensure reliable insertion. By mounting only the lead wires on the board, it is possible to reliably prevent insertion failures due to lead wire bending, bending, and poor spacing, thereby eliminating defects in the completed board. The goal is to reduce the number of inspection processes.

Another purpose is to prevent damage to the board and electronic components by preventing electronic components with abnormalities such as bends, bends, or poor spacing from being forced into the board, and to prevent damage to the board and electronic components. The purpose is to significantly improve the work efficiency of inserting electronic components by reducing the number of operation stoppages.

Another purpose is to enable electronic component lead wires and electronic component insertion holes to be mounted on a board without having to manufacture them with high precision, and to make the positioning accuracy of electronic component mounting equipment higher than necessary. The objective is to eliminate the need for precision and to create a small and inexpensive device.

In summary, the method of the present invention (claim 1) is an inspection method having an inner diameter that is equal to the interval between the electronic component insertion holes of the board into which a plurality of lead wires of the electronic component are inserted, and that is equal to the inner diameter of the electronic component insertion holes. The lead wire of the electronic component is inserted into the inspection hole of the inspection block in which the hole is formed, and only the electronic component that has been successfully inserted is held by a clamping device and transported to the board position, and defective products are The electronic component is inserted into the electronic component insertion hole of the board after the lead wires of the electronic component are inspected for folds, bends, and spacing defects in advance.

Further, the device of the present invention (claim 2) forms inspection holes having an interval equal to the interval between the electronic component insertion holes of the board into which the plurality of lead wires of the electronic component are inserted, and an inner diameter equal to the inner diameter of the electronic component insertion holes. an inspection block that is movable in the vertical direction; an elastic member that presses and urges the inspection block upward;
a sensor that detects that when the lead wire of the electronic component is inserted into the test hole of the test block, the insertion is normal and the test block is in a predetermined position, and sends a signal; and a sensor that sends a signal from the sensor. The present invention is characterized by comprising a clamping device that clamps the electronic component in response to a sent signal, transports the electronic component to the substrate position, and inserts the electronic component into the electronic component insertion hole of the substrate.

The present invention will be explained below based on embodiments shown in the drawings. 1st
In the figure, an electronic component insertion device 1 according to the present invention includes an inspection block 2, an elastic member 3, a sensor 4, and a clamping device 5. 1 and 2, the inspection block 2 inserts the lead wire 6a of the electronic component 6 into the inspection hole 2a, and inspects the lead wire 6a for folds, bends, and poor spacing prior to mounting on the board 10. A rectangular parallelepiped inspection object 2 made of a light metal such as aluminum, for example.
Two parallel guide bodies 2C fixed to b with screws 8 fit into guide holes 9a formed in the movable table 9 and move in the vertical direction (
It is configured to be slidable in the directions of arrows A and B). The test object 2b also has an electronic component insertion hole 1 formed in the substrate 10.
Inspection holes 2a having the same interval and hole diameter as 0a are formed parallel to the sliding direction (direction of arrow A or B) of the inspection body 2b, and the lead wire 6a can be inserted into the inspection hole 2a.

The compression spring 3, which is an example of an elastic member, is used to constantly press and bias the test block upward (in the direction of arrow A) to hold the test block at the uppermost position.
C, and is mounted in a compressed state between the inspection object 2b and the guide body 9b of the moving table 9, and applies a force in the direction of arrow A, which is somewhat stronger than the weight of the inspection block 2, to the inspection block 2. The inspection block 2 is held at the uppermost position where the lower surface 9C of the guide body 9b and the stopper 2d fixed to one end of the guide body 2C are in contact with each other.

The spring force of the compression spring 3 is such that when the lead wire 6a is brought into contact with the upper surface 2e of the test object 2b from its axial direction and pushed down in the direction of arrow B, the lead wA6a is not bent and the test object 2b is lowered. The force is set to be weak, and the spring constant of the compression spring 3 is also manufactured to be as small as possible, so when the compression spring 3 is compressed by applying a force in the direction of arrow B to the inspection block 2 from above, the amount of compression is Even if the angle changes, the force acting in the direction of arrow A due to the compression spring 3 changes little, and the structure is such that the test object 2b can be lowered without bending the lead wire 6a.

The sensor 4 detects whether the test block 2 is in a predetermined position and sends a signal when the lead wire 6a of the electronic component 6 is inserted into the test hole 2a. 2a, and a second sensor 12 that detects whether the test block 2 is in a predetermined position.

The first sensor 11 includes, for example, a reflective optical sensor attached to the holding plate 14 fixed to the test object 2b with screws 13.
The electronic component 6 is fixed with a nut 15 at the top, and the presence or absence of the electronic component 6 is detected by emitting light to the electronic component 6 with a lead wire 6a inserted into the inspection hole 2a and detecting the light reflected by the electronic component 6. It is designed to detect and send a signal. The second sensor 12 is, for example, a light passing type sensor 17 fixed by a screw 18 to a sensor stand 9g fixed to the upper part of the movable table 9 by a screw 16, and has a light emitting part 12a and a light receiving part 12b facing each other. It is formed in a bifurcated shape, and is configured so that the light emitted from the light emitting part 12a is received by the light receiving part 12b and a signal is sent out.

By moving the inspection block 2 in the direction of arrow A or B, the shielding plate 20 fixed to the inspection object 2b with screws 19 blocks or passes the light emitted from the light emitting section 12a toward the light receiving section 12b. It has become. The test object 2b is always in the uppermost position due to the compression spring 3, and the shield plate 20 is located above the second sensor 12 to allow light to pass therethrough, and when the test object 2b is pushed down in the direction of arrow B, it is shielded. The plate 20 is configured to be inserted between the light emitting section 12a and the light receiving section 12b to block light.

The movable table 9 has a guide groove 9 formed on the negative side surface 9d.
It is guided by the guide portion 21a of the base 21 that fits into the portion e, and can slide together with the inspection block 2 and sensor 4 in the direction of arrow A or B. Also, screws 22 are attached to the base 21.
An air cylinder 24, which is an example of an actuating device, is fixed to the mounting base 21b fixed by a screw 23, and one end of the piston rod 24a of the air cylinder is fixed to the lower end 9f of the moving table 9 with a nut 25. There is. By operating the air cylinder 24, the movable table 9 is slid in the direction of the arrow A or B.

The clamping device 5 clamps the electronic component 6 and transports it to a board position or a defective electronic component stocker (not shown), and moves the pair of clamping arms 5a toward or away from each other by a drive device (not shown). The electronic component 6 is actuated to clamp the electronic component 6, and in response to the signal sent by the sensor 4, the electronic component 6 is transported to the board position and inserted into the electronic component insertion hole 10a of the board 10, or the defective electronic component 6 is placed in the defective electronic component stocker. Electronic parts 6
is configured to convey.

The method according to the present invention (claim 1) provides a method for forming a plurality of lead wires 6a of the electronic component 6 at intervals equal to the interval between the electronic component insertion holes 10a of the board 10 into which the plurality of lead wires 6a of the electronic component 6 are inserted, and with the inner diameter of the electronic component insertion holes 10a. The lead wire 6a of the electronic component 6 is inserted into the inspection hole 2a of the inspection block 2 in which the inspection hole 2a of the same inner diameter is formed, and only the electronic component 6 that has been correctly inserted is held by the clamping device 5 and placed on the board. In this method, defective products are removed in advance, and the lead wires 6a of the electronic component 6 are inspected for folds, bends, and spacing defects before being inserted into the electronic component insertion hole 10a of the board 10. .

Function The present invention is constructed as described above, and its function will be explained below. In FIG. 2, air cylinder 24
The piston rod 24a is at the lowest position, and therefore the movable table 9 is also stationary at the lowest position, but the inspection block 2 is pressed upward by the action of the compression spring 3, so the guide body The shielding plate 20 is located at the uppermost position where the lower surface 9C of the guide body 2e comes into contact with the stopper 2d of the guide body 2e.
is located above the second sensor 12, and the light emitted from the light emitting part 12a is received by the light receiving part 12b, detecting that the inspection block 2 is in a predetermined position, and sending out a signal.

On the other hand, the clamping device 5 clamps electronic components 6 arranged and supplied by a parts feeder (not shown) between a pair of clamping arms 5a, transports them to a position above the inspection block 2, and inserts the leads of the electronic components 6 into the inspection hole 2a of the inspection block 2. The wires 6a are positioned facing each other, and the wires 6a are lowered until there is a slight gap (for example, 2 to 3 dragons) between the upper surface 2e of the test object 2b and the lead wire 6a, and then stopped.

Referring also to FIG. 3, when compressed air is supplied from a compressed air supply source (not shown) to the supply port 24b of the air cylinder 24 and the piston rod 24a is raised, the movable table 9
The electronic component 6 moves up in the direction of the arrow C together with the inspection block 2 while being guided along the guide portion 21a of the base 21, but the electronic component 6, which is a good product without any bends, bends, or poor spacing in the lead wire 6a, is held by the clamping device 5. If the lead wire 6a is inserted into the inspection hole 2a without resistance, the inspection block 2
The second
The relative position of the second sensor 12 and the shielding plate 20 does not change, and the second sensor 12 continues to send out a signal that detects that the test block 2 is in a predetermined position.

When the movable table 9 rises in the direction of arrow C to a position where the lead wire 6a is inserted into the inspection hole 2a by a predetermined length, the light emitted from the first sensor 11 is reflected by the electronic component 6.
By receiving the reflected light with the first sensor 11, it is detected that the electronic component 6 is at the insertion position and a signal is sent.

That is, when a good electronic component 6 is inspected with no broken, bent, or poor spacing in the lead wire 6a, the first sensor 11
A signal is sent from the second sensor 12 to detect that the electronic component 6 is at the inspection position, and the second sensor 12 transmits the light emitted from the light emitting part 12a to the light receiving part 12b without blocking the light. The signal being received is sent out.

When the above two signals are detected, the electronic component 6 under inspection is determined to be a good product, and the electronic component 6 is transported by the holding device 5 in the direction of the arrow (FIG. 1) and the electronic component 6 is placed at a predetermined position on the tryi 10. Insert into the component insertion hole 10a. On the other hand, a switching valve (not shown) that supplies compressed air to the air cylinder 24
is switched, the supply of compressed air to the supply port 24b is stopped, and the compressed air is supplied to the supply port 24C, so that the piston rod 2
4a is lowered, and along with this, the movable table 9 is also lowered while being guided by the guide portion 21a of the base 21 and returns to its original position, in preparation for the next inspection.

Next, a case will be described with reference to FIG. 4 in which a defective electronic component 6 is supplied with lead wires 6a that are bent, bent, or have poor spacing. The process of transporting the electronic component 6 from the parts feeder to a predetermined position on the inspection block 2 by clamping it with the clamping device 5 is the same as the process described for the non-defective electronic component 6, so a description thereof will be omitted. When compressed air is supplied to the supply port 24b of the air cylinder 24, the movable table 9 is guided by the guide portion 21a of the base 21 and moves along with the inspection block 2, first and second sensors 11, 12 in the direction of arrow C. However, the bent lead wire 6a is not inserted into the inspection hole 2a and comes into contact with the upper surface 2e of the inspection object 2b. When the movable table 9 further rises in the direction of arrow C, the object to be inspected 2b is moved up by arrow C.
Since the movement in this direction is blocked by the lead wire 6a, the inspection object 2b cannot move, and only the movable stage 9 moves up together with the second sensor 12 while compressing the compression spring 3.

That is, the inspection object 2b has moved relative to the movable table 9 in the direction of the arrow E, and the shielding plate 20 has moved toward the second sensor 1.
2, and blocks the light emitted by the light emitting part 12a, so the light receiving part 12b
It becomes impossible to receive light.

The first sensor 11 receives reflected light from the electronic component 6 and sends out a signal to detect that the electronic component is at the insertion position.

In other words, if a defective electronic component 6 with broken, bent, or poor spacing in the lead wire 6a is inspected, the first sensor 11
A signal detecting that the electronic component 6 is at the inspection position is sent from the second sensor 12, and a shielding plate 20 blocks light from the second sensor 12, and the light emitted from the light emitting part 12a is transmitted to the light receiving part 12b. This means that a signal that has not been received will be sent out.

When the above-mentioned two signals are detected, the electronic component 6 under inspection is determined to be a defective product, and the electronic component 6 is transported by the holding device 5 to the defective electronic component stocker. Further, when a defective electronic component 6 is detected, a buzzer or a warning light (not shown) may be used to notify the operator.

Note that the force of the compression spring 3 is set to an extremely weak force, so even if the lead wire 6a contacts the upper surface 2e of the test object 2b and presses down the test object 2b while compressing the compression spring 3, the lead wire 6a Since the force acting on the electronic component 6 is weak and does not significantly deform the lead wire 6a, the electrical characteristics of the electronic component 6 do not change either, and the electronic component 6 can be used simply by correcting the deformation of the lead wire 6a.

The electronic component insertion device 1 according to the present invention inspects the electronic components 6 in advance as described above, automatically eliminates defective electronic components 6, and inserts only good electronic components 6 into the board 10. Do not damage the board 10 by bringing the wire 6a into contact with the board 10, or force the electronic component 6 that cannot be inserted into the board 10.
There is no need to press the lead wire 6a to extreme deformation and change the electrical characteristics. Further, since defective electronic components 6 are automatically removed, the electronic component insertion device 1 can be operated completely automatically without an operator.

In addition, in the above embodiment, the inspection block 2 is the base 2.
Although the inspection block 2 has been described as being disposed on a movable base 9 that slides on the inspection block 2, the inspection block 2 is not limited to being disposed on the movable base 9, and the inspection block 2 may be disposed on a fixed base. Alternatively, the holding device 5 may be moved up and down.

Effects The present invention, before mounting electronic components on a board as described above, performs an inspection by inserting lead wires into a test block in which test holes are formed with the same spacing and hole diameter as the electronic component insertion holes of the board, By eliminating defective products with broken, bent, or incorrect spacing in the lead wires, we only mount good products that can be inserted reliably on the board, ensuring that there are no insertion defects due to broken, bent, or incorrect spacing of the lead wires. It has the effect of preventing This also has the effect of reducing the number of defects in the completed board and reducing the number of inspection steps for the completed board.

In addition, it prevents bent, bent, or improperly spaced electronic components from being forcibly inserted into the board, which prevents damage to the board and electronic components, and reduces the number of times the automatic electronic component insertion device stops operating. This has the effect of greatly improving insertion work efficiency. Furthermore, there is an effect that the lead wires of the electronic components and the holes for inserting the electronic components can be efficiently mounted on the board without having to manufacture them with high precision.

Further, since it is not necessary to make the positioning accuracy of the electronic component mounting apparatus highly accurate, there is an effect that the apparatus can be made small and inexpensive.

[Brief explanation of drawings]

The drawings relate to embodiments of the present invention, and FIG. 1 is a perspective view showing the entire electronic component insertion device, FIG. 2 is a front view of the electronic component insertion device showing the state before the start of inspection, and FIG. FIG. 4 is a front view showing a state where an electronic component is being inspected, and FIG. 4 is a front view showing a state where a defective electronic component is being inspected. 1 is an electronic component insertion device, 2 is an inspection block, 2a is an inspection hole, 3 is a compression spring which is an example of an elastic member, 5 is a clamping device,
6 is an electronic component, 6a is a lead wire, 9 is a moving table, 10 is a board, 10a is an electronic component insertion hole, 11 is a first sensor, 1
2 is a second sensor, 20 is a shielding plate, 21 is a base, and 24 is an air cylinder which is an example of an actuating device. Patent applicant Far East Engineering Co., Ltd.

Claims (1)

[Scope of Claims] 1. An inspection block in which inspection holes are formed at intervals equal to the intervals of electronic component insertion holes of a board into which a plurality of lead wires of electronic components are inserted, and with an inner diameter equal to the inner diameter of the electronic component insertion holes. The lead wire of the electronic component is inserted into the inspection hole, and only the electronic components that have been successfully inserted are held by a holding device and transported to the board position, and defective items are removed in advance. A method for inserting an electronic component into a board, the method comprising: inspecting lead wires of the electronic component for folds, bends, and spacing defects beforehand, and then inserting the electronic component into an electronic component insertion hole of the board. 2. Inspection in which inspection holes are formed at intervals equal to the interval between the electronic component insertion holes of the board into which multiple lead wires of the electronic component are inserted and have an inner diameter equal to the inner diameter of the electronic component insertion holes, and are movable in the vertical direction. a block; an elastic member that presses and biases the test block upward; and when a lead wire of the electronic component is inserted into the test hole of the test block, the test block is properly inserted. A sensor that detects the position and sends a signal, and in response to the signal sent from the sensor, the electronic component is held and transported to the board position and inserted into the electronic component insertion hole of the board. 1. A device for inserting an electronic component into a board, comprising: a clamping device. 3. The inspection block is disposed on a movable table that slides vertically on the base using an actuating device fixed to a base, and the electronic component is moved upward by the actuating device. A lead wire is inserted into an inspection hole of the inspection block, and the sensor includes a detection section fixed to the movable table and a shielding plate fixed to the inspection block. 2. The device for inserting an electronic component into a board according to item 2.