JPH02255351A - Led printer head - Google Patents
Led printer headInfo
- Publication number
- JPH02255351A JPH02255351A JP1079912A JP7991289A JPH02255351A JP H02255351 A JPH02255351 A JP H02255351A JP 1079912 A JP1079912 A JP 1079912A JP 7991289 A JP7991289 A JP 7991289A JP H02255351 A JPH02255351 A JP H02255351A
- Authority
- JP
- Japan
- Prior art keywords
- led
- substrate
- cathode
- led elements
- printer head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 230000007423 decrease Effects 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 2
- 240000001973 Ficus microcarpa Species 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Facsimile Heads (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】 〈産業上の利用分野〉 この発明は、ＬＥＤプリンタヘッドに関する。[Detailed description of the invention] <Industrial application field> The present invention relates to an LED printer head.
〈従来の技術〉
第５図はＬＥＤプリンタに使用される一般的なＬＥＤ素
子の断面図である。この第５図において、５１はＰ側電
極、５２は絶縁層、５３はＮ−ＧａＡｓＰ層、５４は上
記Ｎ−ＧａＡｓＰ層５３にＺｎを選択拡散して作成した
発光部、５５はＮ−ＧａＡｓ層、５６はＮ側電極である
。このＬＥＤ素子はＮ側電極５６が導電性Ａｇペースト
を用いて基板にグイボンドされる。<Prior Art> FIG. 5 is a sectional view of a typical LED element used in an LED printer. In this FIG. 5, 51 is a P-side electrode, 52 is an insulating layer, 53 is an N-GaAsP layer, 54 is a light emitting part created by selectively diffusing Zn into the N-GaAsP layer 53, and 55 is an N-GaAs layer. , 56 is an N-side electrode. The N-side electrode 56 of this LED element is firmly bonded to the substrate using conductive Ag paste.
第６図は上記ＬＥＤ素子を用いた従来のＬＥＤプリンタ
ヘッドの平面図である。このプリンタヘッドは基板６１
上にカソード電極６２を設け、このカソード電極６２上
に複数のＬＥＤ素子６３を一列にグイボンドしている。FIG. 6 is a plan view of a conventional LED printer head using the above LED element. This printer head has a board 61
A cathode electrode 62 is provided on top, and a plurality of LED elements 63 are bonded in a line on this cathode electrode 62.
そして、上記基板６１上に上記ＬＥＤ素子６３を駆動す
るためのドライバ用ＩＣ６４を各ＬＥＤ素子６３に対し
て一個設け、このドライバ用ｒｃ６４とＬＥＤ素子６３
のＰ側電極をワイヤボンドで接続している。上記ドライ
バ用ＩＣ６４およびカソード電極６２を介してＬＥＤ素
子６３に電圧を印加するとＬＥＤ素子６３に電流が流れ
てＬＥＤ素子６３を点灯させる。Then, one driver IC 64 for driving the LED elements 63 is provided on the substrate 61 for each LED element 63, and this driver rc 64 and the LED element 63
The P-side electrodes of the two are connected with a wire bond. When a voltage is applied to the LED element 63 via the driver IC 64 and the cathode electrode 62, a current flows through the LED element 63, causing the LED element 63 to light up.
〈発明が解決しようとする課題〉
ところで、ＬＥＤプリンタヘッドには敗多くのＬＥＤ素
子が使用される。たとえば、３００ＤＰ夏、Ａ３サイズ
のＬＥＤプリンタヘッドには通常３５８４個のＬＥＤ素
子が用いられている。各ＬＥＤ素子には約５１１ＩＡの
電流が流れるため、全部を点灯させた場合には１０敢Ａ
という大電流が流れることになる。<Problems to be Solved by the Invention> By the way, a large number of LED elements are used in an LED printer head. For example, a 300DP summer, A3 size LED printer head typically uses 3584 LED elements. Approximately 511 IA of current flows through each LED element, so when all of them are turned on, it is 10 A
A large current will flow.
このため、上記従来のＬＥＤプリンタヘッドにおいては
、カソード電極６２に上述したような大電流が流れ、こ
のカソード電極６２の抵抗分により電圧降下を起こし、
ＬＥＤ素子６３の発光出力が低下する。上記カソード電
極６２は両端部に電源コネクタが接続され、その電圧は
、第７図に示すように中央部で最も低く両端部で高くな
る。このように、中央部で電圧が低くなるため、ＬＥＤ
素子６３を全点灯した場合に中央部の発光出力が低下す
るという問題がある。Therefore, in the conventional LED printer head, a large current as described above flows through the cathode electrode 62, causing a voltage drop due to the resistance of the cathode electrode 62.
The light emitting output of the LED element 63 decreases. A power connector is connected to both ends of the cathode electrode 62, and the voltage thereof is lowest at the center and high at both ends, as shown in FIG. In this way, the voltage is lower in the center, so the LED
There is a problem in that when all the elements 63 are turned on, the light emission output in the central part decreases.
そこで、この発明の目的は、中央部における電圧降下を
少なくして、中央部のＬＥＤ＊子の発光出力とそれ以外
の部分のＬＥＤ素子の発光出力との差を少なくしたＬＥ
Ｄプリンタヘッドを提供することにある。Therefore, an object of the present invention is to reduce the voltage drop in the central part and reduce the difference between the light emitting output of the LED elements in the central part and the light emitting output of the LED elements in the other parts.
The purpose of the present invention is to provide a D printer head.
く課題を解決するための手段〉
上記目的を達成するため、この発明は、一つの基板上に
、一列に配列した複数のＬＥＤ素子と、上記複数のＬＥ
Ｄ素子の一方の電極を接続した共通電極を設け、上記Ｌ
ＥＤ素子の他方の電極と上記共通電極との間に電圧を印
加して上記ＬＥＤ素子を点灯するようにしたＬＥＤプリ
ンタヘッドにおいて、上記共通電極は、上記基板の両面
に形成した導電性部材を、その両端部において接続する
と共に、その中央部において、他の部分よりも、両導電
性部材間に電流を流すためのスルーホールをより多く配
置したことを特徴としている。Means for Solving the Problems> In order to achieve the above object, the present invention includes a plurality of LED elements arranged in a row on one substrate, and a plurality of LED elements arranged in a row on one substrate.
A common electrode connected to one electrode of the D element is provided, and the above L
In an LED printer head in which a voltage is applied between the other electrode of the ED element and the common electrode to light up the LED element, the common electrode includes a conductive member formed on both sides of the substrate. It is characterized in that it is connected at both ends, and more through holes for flowing current between the two conductive members are arranged in the center than in other parts.
く作用〉
上記構成において、共通電極の両端部に電源コネクタを
接続し、ＬＥＤ素子に重圧を印加すると、電流が電源コ
ネクタより基板の表面と裏面の導電性部材に供給される
。裏面の導電性部材に供給された電流は中央部により多
く配置されたスルーホールを通って表面の導電性部材へ
流れる。従って、共通電極の中央部での電圧降下が小さ
くなる。Effect> In the above configuration, when a power connector is connected to both ends of the common electrode and heavy pressure is applied to the LED element, current is supplied from the power connector to the conductive members on the front and back surfaces of the board. The current supplied to the conductive member on the back side flows to the conductive member on the front side through through holes arranged more in the center. Therefore, the voltage drop at the center of the common electrode is reduced.
〈実施例〉 以下、この発明を図示の実施例により詳細に説明する。<Example> Hereinafter, the present invention will be explained in detail with reference to illustrated embodiments.
第１図はこの発明の一実施例の３００ＤＰＩ、Ａ３サイ
ズのＬＥＤプリンタヘッドの配線パターンを示す図であ
り、（ａ）は表パターンを、（ｂ）は裏パターンを示す
。この第１図において、ｌは基板、２ａ、２ｂはそれぞ
れ上記基板１の表面と裏面に導電性部材をコの字型にパ
ターン形成した共通電極としてのカソードである。この
カソード２ａと２ｂとは、両端部に設けられた電源コネ
クタを接続するためのスルーホール３と、中央部に集中
的に６ｍｍピッチで設けられた両力ソード間に電流を流
すための直径０ 、５ ａｒｍのスルーホール４を通し
て接続されている。上記電源コネクタは上記スルーホー
ル３のランドに半田付けされ電流を基板両面のカソード
に供給する。FIG. 1 is a diagram showing the wiring pattern of a 300 DPI, A3 size LED printer head according to an embodiment of the present invention, in which (a) shows the front pattern and (b) shows the back pattern. In FIG. 1, 1 is a substrate, and 2a and 2b are cathodes as common electrodes formed by forming conductive members in a U-shaped pattern on the front and back surfaces of the substrate 1, respectively. These cathodes 2a and 2b have a through hole 3 provided at both ends for connecting a power connector, and a diameter of 0 for passing current between the two power swords provided centrally at a pitch of 6 mm. , 5 arm through hole 4. The power connector is soldered to the land of the through hole 3 and supplies current to the cathodes on both sides of the board.
第２図は上記パターン形成された基板に３５８４個のＬ
ＥＤ素子５とこのＬＥＤ素子を駆動するためのドライバ
ＩＣ６をグイボンドした本実施例のＬＥＤプリンタヘッ
ドの平面図である。上記ＬＥＤ素子５は第５図に示すし
ＦＤ素子と同一構造のものであり、基板ｌの表面に形成
されたカソード２ａ上に一列に配列され、Ｎ側電極が導
電性Ａｇペーストを用いてグイボンドされている。また
、上記ドライバＩＣ６は各ＬＥＤ素子５に対して１個設
けられており、それぞれ各ＬＥＤ素子５とワイヤボンド
で接続されている。Figure 2 shows 3584 L on the patterned substrate.
FIG. 2 is a plan view of the LED printer head of this embodiment in which an ED element 5 and a driver IC 6 for driving the LED element are bonded together. The LED element 5 shown in FIG. 5 has the same structure as the FD element, and is arranged in a line on the cathode 2a formed on the surface of the substrate l, and the N-side electrode is bonded using conductive Ag paste. has been done. Further, one driver IC 6 is provided for each LED element 5, and is connected to each LED element 5 by wire bonding.
いま、ＬＥＤ素子５をすべて点灯すると、電源コネクタ
からＩＯ数Ａの電流が供給される。この電流は基板表面
のカソード２ａを通ってＬＥＤ素子５に供給される電流
と、基板裏面のカソード２ｂからスルーホール４を通っ
て基板表面のカソード２ａに回りこんでＬＥＤ素子５に
供給される電流とに分かれる。従って、カソード２ａの
中央部での電圧降下が少なくなり、ＬＥＤ素子５の発光
出力の低下が少な（なる。Now, when all the LED elements 5 are turned on, a current of several IO A is supplied from the power supply connector. The current is supplied to the LED element 5 through the cathode 2a on the front surface of the substrate, and the current is supplied to the LED element 5 through the cathode 2b on the back surface of the substrate through the through hole 4 to the cathode 2a on the front surface of the substrate. It is divided into Therefore, the voltage drop at the center of the cathode 2a is reduced, and the light emission output of the LED element 5 is less reduced.
第３図はスルーホール４を両端部の間の幅全体に渡って
等間隔に配設した配線パターン図である。FIG. 3 is a wiring pattern diagram in which through holes 4 are arranged at equal intervals across the entire width between both ends.
このパターンの場合は、第６図に示す従来例の場合より
も電圧降下は小さくなるが、第１図に示すパターンの場
合よりも中央部での電圧降下が大きくなる。In this pattern, the voltage drop is smaller than in the conventional example shown in FIG. 6, but the voltage drop at the center is larger than in the pattern shown in FIG.
第４図はこの様子を示す電圧分布図であり、Ａは従来例
、Ｂは第３図のパターンの場合、Ｃは本実施例の場合を
それぞれ示す。FIG. 4 is a voltage distribution diagram showing this situation, where A shows the conventional example, B shows the case of the pattern of FIG. 3, and C shows the case of the present embodiment.
このように、基板の両面にカソード２ａ、２ｂを形成し
、この両力ソードを中央部に集中的に設けたスルーホー
ル４を通して接続することにより電圧降下を大幅に改善
することができ、ＬＥＤ素子５の発光出力の低下を少な
くすることができる。In this way, by forming the cathodes 2a and 2b on both sides of the substrate and connecting these bipolar cathodes through the through holes 4 that are concentrated in the center, the voltage drop can be greatly improved, and the LED element The decrease in the light emission output of No. 5 can be reduced.
〈発明の効果〉
以上より明らかなように、この発明のＬＥＤプリンタヘ
ッドは、一つの基板上に一列に配列した複数のＬ Ｅ
Ｄ素子の一方の電極を接続した共通電極が、上記基板の
両面に形成した導電性部材を、その両端部において接続
すると共に、その中央部において、他の部分よりも、両
溝電性部材間に電流を流すためのスルーホールをより多
く配置するようになっているので、電圧降下を改善する
ことができ、ＬＥＤ素子の発光出力の低下を少なくする
ことができる。<Effects of the Invention> As is clear from the above, the LED printer head of the present invention has a plurality of LEDs arranged in a row on one substrate.
A common electrode that connects one electrode of the D element connects the conductive members formed on both sides of the substrate at both ends thereof, and the center part of the common electrode connects the conductive members formed on both sides of the substrate more closely than the other parts. Since more through-holes are arranged to allow current to flow through, the voltage drop can be improved and the drop in the light emitting output of the LED element can be reduced.
第１図はこの発明のＬＥＤプリンタヘッドの一実施例の
電極パターン図、第２図は上記実施例のＬＥＤプリンタ
ヘッドの平面図、第３図はスルーホールを電極幅全体に
渡って配設した場合の電極パターン図、第４図は本実施
例による電圧降下の改善を示す電圧分布図、第５図はＬ
ＥＤプリンタヘッドに使用される一般的なＬＥＤ素子の
構造を示す断面図、第６図は従来のＬＥＤプリンタヘッ
ドの平面図、第７図は従来例における電圧分布図である
。
！・・・基板、２ａ、２ｂ・・・カソード、３・・・電
源コネクタ用スルーホール、４・・・スルーホール、５
・・・ＬＥＤ素子、６・・・ドライバＩＣ０
特 許 出 願 人 シャープ株式会社代 理 人
弁理士 青白 葆 ほか１名第１ 黒
メ３卜、
第２図
友塙
中決 ぢ塙
ＬＥＤフ′りンタヘ・ノトFig. 1 is an electrode pattern diagram of an embodiment of the LED printer head of the present invention, Fig. 2 is a plan view of the LED printer head of the above embodiment, and Fig. 3 shows through holes arranged over the entire electrode width. Figure 4 is a voltage distribution diagram showing the improvement in voltage drop according to this embodiment, and Figure 5 is an electrode pattern diagram for the case of L.
FIG. 6 is a cross-sectional view showing the structure of a typical LED element used in an ED printer head, FIG. 6 is a plan view of a conventional LED printer head, and FIG. 7 is a voltage distribution diagram in the conventional example. ! ... Board, 2a, 2b... Cathode, 3... Through hole for power connector, 4... Through hole, 5
...LED element, 6...Driver IC0 Patent applicant: Sharp Corporation Agent
Patent attorney Aohaku Ao and 1 other person 1st black mark 3 vol. 2nd picture Tomohanachu decision jihanawa LED light print head note
Claims (1)
子と、上記複数のＬＥＤ素子の一方の電極を接続した共
通電極を設け、上記ＬＥＤ素子の他方の電極と上記共通
電極との間に電圧を印加して上記ＬＥＤ素子を点灯する
ようにしたＬＥＤプリンタヘッドにおいて、 上記共通電極は、上記基板の両面に形成した導電性部材
を、その両端部において接続すると共に、その中央部に
おいて、他の部分よりも、両導電性部材間に電流を流す
ためのスルーホールをより多く配置したことを特徴とす
るＬＥＤプリンタヘッド。(1) A plurality of LED elements arranged in a line and a common electrode connected to one electrode of the plurality of LED elements are provided on one substrate, and between the other electrode of the LED element and the common electrode. In the LED printer head, the common electrode connects the conductive members formed on both sides of the substrate at both ends thereof, and at the center thereof, the common electrode connects the conductive members formed on both sides of the substrate. An LED printer head characterized by having more through holes for flowing current between both conductive members than in other parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1079912A JPH02255351A (en) | 1989-03-30 | 1989-03-30 | Led printer head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1079912A JPH02255351A (en) | 1989-03-30 | 1989-03-30 | Led printer head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02255351A true JPH02255351A (en) | 1990-10-16 |
Family
ID=13703501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1079912A Pending JPH02255351A (en) | 1989-03-30 | 1989-03-30 | Led printer head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02255351A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110325371A (en) * | 2017-04-05 | 2019-10-11 | 惠普发展公司，有限责任合伙企业 | The actuator of time shift on tube core is assessed |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63126773A (en) * | 1986-11-18 | 1988-05-30 | Sanyo Electric Co Ltd | Optical printer head |
-
1989
- 1989-03-30 JP JP1079912A patent/JPH02255351A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63126773A (en) * | 1986-11-18 | 1988-05-30 | Sanyo Electric Co Ltd | Optical printer head |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110325371A (en) * | 2017-04-05 | 2019-10-11 | 惠普发展公司，有限责任合伙企业 | The actuator of time shift on tube core is assessed |
| US10786987B2 (en) | 2017-04-05 | 2020-09-29 | Hewlett-Packard Development Company, L.P. | On-die time-shifted actuator evaluation |
| CN110325371B (en) * | 2017-04-05 | 2020-11-17 | 惠普发展公司，有限责任合伙企业 | On-die time-shifted actuator evaluation |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0719800Y2 (en) | LED array | |
| JP5193271B2 (en) | Light emitting device in which a plurality of light emitting cells are arranged | |
| US8222653B2 (en) | Light-emitting diode and lighting apparatus using the same | |
| JP5236924B2 (en) | Semiconductor light emitting device and manufacturing method thereof | |
| JPH02255351A (en) | Led printer head | |
| EP0881686A3 (en) | LED array and LED printer head | |
| CN112951971B (en) | All-in-one flip full-color SMD LED | |
| JPH01157577A (en) | Semiconductor light emitting device | |
| JP2001326383A (en) | Light-emitting diode array | |
| CN210511102U (en) | LED stage lamp and lamp panel module thereof | |
| JPH11186594A (en) | Light-emitting diode array | |
| TW493283B (en) | Edge light emitting device with increased light emission efficiency and self-scanning type light emitting device array using the edge light emitting device | |
| JPH033373A (en) | Semiconductor light emitting device | |
| JP2001257380A (en) | Light-emitting diode array and manufacturing method therefor | |
| JPH0831654B2 (en) | Submount for semiconductor laser device | |
| JPH04239185A (en) | Light emitting diode | |
| JP2001156329A (en) | Semiconductor light-emitting device | |
| JPH0241649Y2 (en) | ||
| JP2539499Y2 (en) | LED array | |
| JPH0528782Y2 (en) | ||
| CN217329455U (en) | Multi-colour temp. lamp strip and decorative lamp | |
| CN214477441U (en) | Structure of reflection luminous source | |
| JPH0560594B2 (en) | ||
| JPS6189683A (en) | Light emitting semiconductor device | |
| CN214672654U (en) | Light emitting element module and display device including the same |