JPH0225271A - Laser soldering device - Google Patents

Abstract

PURPOSE:To make effective utilization of laser light energy and to improve soldering quality by disposing a nozzle near soldering parts and executing soldering while ejecting an assist gas from the nozzle. CONSTITUTION:The nozzle 1 is disposed near the soldering parts such as lead wires 6 of an IC and the soldering is executed by the laser light 5 of a laser light emission optical system 4 while the assist gas such as gaseous nitrogen is ejected in the direction of an arrow 2 from the nozzle 2. The assist gas ejected form the nozzle 2 forces the smoke generated at the time of soldering to flow in the direction of the arrow 3, thereby preventing the suction of the smoke to the laser light 5 and the oxidation of the soldering parts. The laser energy at the time of soldering is effectively utilized in this way and the soldering quality is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser soldering device, and more particularly to a laser soldering device for soldering components using laser light.

Previously, this type of laser soldering equipment was equipped with a suction-type smoke evacuation mechanism with a suction port located near the laser beam inside the equipment housing; It is described in the publication No.-67670. As shown in FIG. 3, this is a suction type exhaust system that removes the smoke generated when the IC leads 116 are soldered to the pattern 8 on the board 9 using the laser beam 5 from the laser beam emitting optical system 4. The smoke machine tank 34 sucks in the direction of the arrow 31. Note that 35 is a nozzle (suction port), 36 is a hose, and 37 is a pump.

In general, it is known that if the solder or the parts to be soldered are oxidized during laser beam irradiation, the solder will not fit well, the solder alloy layer will not be homogeneous and stable, and it will become weak electrically and mechanically. There is.

However, in the conventional laser soldering device described above, the nozzle used to remove the smoke generated during soldering is a suction type, so it is impossible to prevent the parts from being oxidized by the thermal energy of the laser beam. There were drawbacks.

1. SUMMARY OF THE INVENTION An object of the present invention is to provide a laser soldering device that can prevent components from being oxidized by the thermal energy of laser light and eliminate smoke generated during soldering.

The laser soldering device of the present invention is a laser soldering device that uses laser light to solder components, and includes a nozzle provided in the vicinity of the component, and the component soldered through the nozzle. The present invention is characterized by removing smoke generated during soldering and by spraying assist gas to prevent oxidation of parts during soldering.

shaku 11 Hereinafter, the present invention will be explained in detail using the drawings.

FIG. 1 is a sectional view showing the configuration of a first embodiment of a laser soldering apparatus according to the present invention.
In the laser soldering apparatus according to the embodiment, the apparatus includes a nozzle l and a laser beam emitting optical system 4, and is used to solder an IC lead wire 6 to a pattern 8 on a substrate 9. Note that 7 is solder.

The nozzle 1 sprays assist gas sent from an assist gas spraying device (not shown) from a hole 11 in the direction of an arrow 2. The assist gas is a gas for preventing oxidation of the parts to be soldered, and a well-known inert gas such as nitrogen gas or argon gas is used.

In this configuration, the lead wires 6 of the IC are connected to the pattern 8 on the substrate 9 by the laser beam 5 from the laser beam emitting optical system 4.
When soldering the assist gas from nozzle 1 to arrow 2
If the smoke is sprayed in the direction of arrow 3, the smoke generated by the half [11 attachment] will flow in the direction of arrow 3. This allows the thermal energy of the laser beam to be used effectively without being absorbed by smoke, and also prevents the soldering parts from oxidizing.

FIG. 2 also shows that the laser soldering according to the present invention is performed in the second part of the apparatus.
In FIG. 1, which is a cross-sectional view showing the configuration of an embodiment of the present invention, a laser soldering device according to a second embodiment of the present invention has a nozzle 21.
, a laser beam emitting optical system 4, and a hose 25, and the leads a6 of the IC are soldered to a pattern (not shown) on the substrate 9. In addition, 7 is solder,
26 is a capacitor.

The nozzle 21 has a hole 22 coaxially with the laser beam 5 from the laser beam emitting optical system 4 .

The hose 25 is for sending assist gas sent from an assist gas spraying device (not shown) to the nozzle 21.

In this configuration, if the assist gas is blown from the nozzle 21 in the direction of arrow 2, the smoke generated by soldering will flow in the direction of arrow 23 or 24, as in the first embodiment described above. As a result, the thermal energy of the laser beam can be used effectively as described above, and the soldering portion can be prevented from oxidizing.

Further, in the case of this embodiment, even when components such as the capacitor 26 are mounted nearby, soldering can be performed without the nozzle getting in the way.

Note that in the first and second embodiments, it is clear that air may be used instead of the assist gas if only to remove smoke generated during soldering.

It is also clear that in both embodiments, if a suction-type smoke evacuation mechanism similar to that shown in FIG. 3 is provided in the apparatus, the smoke that has been blown away can be removed.

As explained above, the present invention uses an assist gas to blow away the smoke that sometimes occurs during soldering outside the laser beam irradiation range, so that the thermal energy of the laser beam is not absorbed by the smoke and is effectively used without wasting it. Soldering has the effect of preventing oxidation of the parts and obtaining high quality soldering.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing the configuration of a laser soldering device according to a first embodiment of the present invention, and FIG. 2 is a sectional view showing the configuration of a laser soldering device according to a second embodiment of the present invention. FIG. 3 is a schematic diagram of a conventional laser soldering device. Explanation of symbols of main parts 1.21... Nozzle 4... Laser beam output optical system 25... Hose Figure 1 Figure 2

Claims (1)

[Claims] (1) A laser soldering device that uses laser light to solder components, which includes a nozzle provided near the component;
A laser soldering apparatus characterized in that an assist gas is sprayed from the nozzle to remove smoke generated when soldering the parts and to prevent oxidation of the soldered parts.