JPH0225246Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a hybrid integrated circuit device, and particularly to a hybrid integrated circuit device configured by connecting a plurality of circuit boards.

Conventionally, for example, the document image signal reading device of a facsimile machine uses a MOS or CCD sensor called an IC sensor.
A one-dimensional array such as the above was used, but the optical path length of the reduction optical system was required to be about 20 cm to 30 cm, making it difficult to miniaturize the device and causing problems in terms of economy. For this reason, compact devices are being put into practical use that incorporate a long reading device that corresponds one-to-one with the document width, and that reduce the size of the reduction optical system to about 30 mm or less. Naturally, the functional elements constituting the reading device are required to be uniform over the entire area of a large-area substrate and to realize defect-free fine wiring.

FIG. 1 is a sectional view of an example of a conventional contact type reading device.

This device has a photoelectric conversion element array section and a drive circuit section for operating the photoelectric conversion elements formed on a transparent glass substrate 1.
Regarding the dimensions of the glass substrate 1, for example, when reading an A4 size original image, a large-area substrate of about 50 mm in width and 250 mm in length is required. A transparent common electrode 2 is formed on a glass substrate 1, and a photoelectric conversion material 3 made of, for example, amorphous silicon is formed on this. Furthermore, on top of this, high-density individual electrodes 4 are each separated.
form. Further, a lower layer electrode 8 of the drive circuit section is formed, and then a multilayer wiring section consisting of an insulating layer 9 and an upper layer electrode 5 is formed. Finally, fix the drive IC6,
A lead wire 7 is bonded between the electrode and the individual electrode 4 to complete the basic structure. Note that the signal light 10 from the original is received from below the substrate 1. For driving
The IC6 has the number of electrodes corresponding to the number and density of the individual electrodes 4, so for example, for A4 size, 8 electrodes/
To construct a reading device with a size of mm, the number of elements is approximately 2000. Therefore, although the number of chips of the driving IC 6 varies depending on the degree of integration, a large number of ICs, approximately 50, are mounted on the glass substrate 1. In this way, many circuit elements are constructed on a single, large-area substrate.

Typically, the electrical signal level of a reading device that performs this type of photoelectric conversion is very small, less than 10 ^-6 A. Therefore, it is necessary to ensure that the individual electrodes 4 are separated from each other and have sufficient insulation, and at the same time, there must be no disconnection. However, since the driving circuit section and the photoelectric conversion element section are wired with high density over the entire area on the glass substrate 1, the aforementioned defective parts are likely to occur, and the electrical signals are not transmitted regardless of the image light 10. There have been problems in which the image light 10 may flow or not react to the image light 10. In addition, in order to eliminate such defects, it is necessary to repeat strict inspections for a long time to confirm that there are no defects, and even if there is a defect in only one place on the glass substrate 1, it cannot be put into practical use, which poses an economical problem. It was hot.

In addition, the drive circuit section includes a multilayer wiring section in which an insulating layer 9 is sandwiched between an upper layer electrode 5 and a lower layer electrode 8.
This deterioration in the insulation properties of the insulating layer 9 directly leads to deterioration in the performance of the reading device, and the electrical characteristics of this portion become dominant. However, when forming a multilayer wiring section after forming a photoelectric conversion material 3 such as amorphous silicon, if the entire substrate 1 is brought to a curing temperature at which the insulating layer 9 exhibits sufficient insulation, the photoelectric conversion material 3
affects the electrical properties of Therefore, the insulating layer 9 must be cured at a low temperature, resulting in unstable and unreliable use of the insulating layer 9 as it is. In addition, if this order of formation is reversed and the multilayer wiring is created first and then the photoelectric conversion element section is formed, the performance of the insulating layer 9 itself improves, but due to the effect of the step in this part, the individual electrodes It became difficult to form a fine wiring pattern in the photoelectric conversion material 3, and furthermore, unnecessary impurities were mixed in during the formation of the photoelectric conversion material 3, resulting in deterioration of the photoelectric conversion characteristics.

The purpose of this invention is to eliminate the above drawbacks, improve economy,
It is an object of the present invention to provide a hybrid integrated circuit device which has excellent reliability and can be used not only as a reading device but also in practical use.

The hybrid integrated circuit device of the present invention includes a plurality of circuit boards each having a group of circuit elements and a group of connection terminals formed on one main surface, and a conductor film on the side surface of a cylindrical insulator corresponding to the group of connection terminals. is provided, and the conductive film is connected to a group of connection terminals of at least one circuit board of the plurality of circuit boards, and is connected to a group of connection terminals of another circuit board directly or by a flat connector. and a cylindrical connector connected through the conductor film wiring, and the distance between the conductive film wirings
The relationship between N ₀ and the distance N between the connecting terminal wires is N
=N ₀ /2n (n = real number greater than or equal to 1).

According to the present invention, the hybrid integrated circuit device configured as described above has a circuit board divided according to functions.
Therefore, since each functional element group can be manufactured individually under optimal conditions, a hybrid integrated circuit board with high performance and high reliability can be realized. Furthermore, even when inspecting a fine wiring pattern, since it is divided into small pieces, it is advantageous in terms of area and it becomes possible to easily judge whether it is good or bad. As a result, it is possible to easily manufacture a completely defect-free functional element group, and it is only necessary to connect each element, thereby obtaining a hybrid integrated circuit device that is easily systemized. Particularly when using large-sized substrates such as facsimile reading devices, thermal recording heads, etc., it is better to divide the substrate into individual functional elements and reduce the substrate size as much as possible to reduce the number of substrates that can be accommodated in various film forming devices. It also becomes suitable for mass production.

Embodiments of the present invention will be described with reference to the drawings.

FIG. 2 is a diagram of a first embodiment of the present invention.

A transparent common electrode 22 made of ITO or the like, a photoelectric conversion material film 23 made of amorphous silicon, and about 2000 separated individual electrodes 24 with a wiring density of 8 wires per 1 mm are placed on a glass substrate 21 with a length of about 250 mm. It consists of a photoelectric conversion element section consisting of the basic structure of, connection terminals 241 arranged linearly on another insulating substrate 211 with the same wiring density and number of wiring as the individual electrodes 24, a lower layer electrode 28, polyimide resin, etc. Insulating layer 2
9. Provide a multilayer wiring section with upper layer electrodes 25 that also serve as external lead lines, and further mount a driving IC 26,
A terminal of the IC is connected to a wiring electrode on the substrate by a bonding wire 27. That is, the substrate of this reading device is divided into two functional parts: a photoelectric conversion element part and a drive circuit part. The individual electrodes 24 on the glass substrate 21 and the connection terminals 241 on the other insulating substrate 211 are arranged opposite to each other, and a cylindrical connector 31 is formed with a conductor film formed on the circumferential surface of the cylindrical insulator. are interposed, and the two are electrically connected by pressure contact.

FIG. 3 is a plan view of the cylindrical connector shown in FIG. 2.

A conductive film 33 is formed on the side surface of a cylindrical glass rod 32 having a length of about 250 mm. The conductor film 33 is separated and electrically insulated with a wiring density that is more than twice that of the individual electrodes 24, connection terminals 241, and the like.
The conductive film 33 is made of Au, Cu, A, etc., which are commonly used as electrode materials, and is formed to have a uniform thickness. Since this conductor film 33 is used to electrically connect circuit boards installed above and below, it is sufficient that the conductor film 33 is formed to have a circumferential angle of at least 180 degrees in cross section.

Since the contact type reading device with such a structure receives the image light 10 from below, the substrate 21 of the photoelectric conversion section needs to be made of transparent glass, but the substrate 211 of the drive circuit section does not need to be transparent. Other thermally stable substrate materials can be used so that the die bonding process and wire bonding process of the driving IC 26 can be performed reliably and stably. The amorphous silicon used as the photoelectric conversion material 23 usually deteriorates at around 200°C, so when all the elements were conventionally formed on a single substrate, deterioration of the photoelectric conversion characteristics was observed. There will be none. Furthermore, since the insulating layer 29 made of polyimide resin or the like can be cured at a sufficiently high temperature, a stable multilayer wiring section is formed, and insulation failure will not occur even when reading weak optical signals of 10 ^-6 A or less. disappears. It also becomes possible to use glass insulation materials made using thick film technology. On the other hand, the glass substrate constituting the photoelectric conversion element section is not coated with any material that would adversely affect the formation of the amorphous silicon film, making it possible to obtain a high-performance photoelectric conversion material film. Also, the width of each individual board is 1/1/2 that of the conventional one.
It is possible to reduce the size by about 2 to 1/3, and when forming a film,
The structure is very suitable for mass production by increasing the number of devices that can be accommodated simultaneously in the manufacturing equipment and reducing the number of man-hours required for inspecting defective elements and wiring defects.

FIG. 4 is a sectional view of a second embodiment of the present invention.

This embodiment is an example of a thermal recording head. In this embodiment, a resistor 44, a lead electrode 42, and an abrasion resistant layer 43 are formed on an alumina ceramic substrate 41, and a heating element is formed on the other ceramic substrate 411. is formed, and a drive circuit section in which lead wires 47 are bonded from these terminals to the terminals of the drive IC 46. The lower layer electrode 4 is located at the input/output terminal 45 portion.
8. A multilayer wiring made of an insulating layer 49 is formed, and the main planes of each substrate are arranged on the same plane. The lead electrodes 45 on the heat generating part substrate 41 and the connection terminals 451 of the drive circuit part are formed by, for example, eight high-density fine wirings per 1 mm arranged in a straight line over a length of about 250 mm. Furthermore, one connection tool 31 shown in FIG. 3 is installed in each of these parts, and the connections are made with a flat connection tool 51 having a conductive film 52 having the same wiring density interposed therebetween.

The heat-sensitive recording head having such a structure has the features described in the embodiment shown in FIG. The heat-sensitive recording paper is pressed onto the resistor, so that it can be structured so that recording can be easily performed while sliding.

In the above embodiments, a glass substrate or a ceramic substrate was used as the substrate material, and a glass rod was used as the connector material, but the present invention is not limited thereto. In addition, since the wiring density of the conductor formed on the circumferential surface of the connecting tool is more than twice the wiring density of the conductor or connection terminal on the board on which each functional element is formed, it is especially important when making pressure contact with each board. Another advantage is that electrical connection is possible even when placed at any position without requiring alignment.

Further, in the above embodiments, the connection between the cylindrical connector and the circuit board is performed by pressure welding, but the present invention is not limited to this. For example, a stronger connection can be achieved by applying a low melting point metal film such as solder and press-welding, and then melting the low melting point metal film by heating.

As explained in detail above, according to the present invention,
The use of cylindrical connectors facilitates the connections between circuit boards and therefore allows individual functional circuit elements to be manufactured under optimal conditions, making overall manufacturing easier, more economical, and more reliable. Accordingly, it is possible to obtain a hybrid integrated circuit device that can ensure highly efficient operation.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of an example of a conventional contact type reading device, FIG. 2 is a sectional view of a first embodiment of the present invention, and FIG. 3 is a plan view of the cylindrical connector shown in FIG. FIG. 4 is a sectional view of a second embodiment of the present invention. 1, 21... Glass substrate, 2, 22... Transparent electrode, 3, 23... Photoelectric conversion material, 4, 24... Individual electrode, 5, 25, 45... Upper layer electrode, 6, 26,
46... Drive IC, 7, 27, 47... Bonding line, 8, 28, 48... Lower layer electrode, 9, 2
9,49...Insulating layer, 10...Signal light, 41,4
11... Insulating substrate, 241,451... Connection terminal, 31... Cylindrical connector, 32... Glass round bar, 33, 52... Conductor film, 42... Lead electrode, 43... Wear-resistant layer, 44...Resistor, 51...
... Flat connector, 52 ... Conductor film, 53 ... Insulating substrate, 211 ... Insulating substrate, 451 ... Connection terminal portion.

Claims (1)

[Scope of utility model registration request] A plurality of circuit boards each having a circuit element group and a connection terminal group formed on one principal plane are provided, and a conductor film is provided on a side surface of a cylindrical insulator corresponding to the connection terminal group, and the conductor film is connected to the connection terminal group. A cylindrical connector that connects to a group of connection terminals on at least one of the circuit boards and connects to a group of connection terminals on another circuit board directly or via a flat connector, The distance N ₀ between the conductor film wirings and the distance N between the connection terminal wirings
A hybrid integrated circuit characterized in that the relationship between the two is N=N ₀ /2n (n=a real number of 1 or more).