JPH0225242Y2 - - Google Patents
Info
- Publication number
- JPH0225242Y2 JPH0225242Y2 JP9296384U JP9296384U JPH0225242Y2 JP H0225242 Y2 JPH0225242 Y2 JP H0225242Y2 JP 9296384 U JP9296384 U JP 9296384U JP 9296384 U JP9296384 U JP 9296384U JP H0225242 Y2 JPH0225242 Y2 JP H0225242Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- electronic components
- metal plating
- plating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 18
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- FYADHXFMURLYQI-UHFFFAOYSA-N 1,2,4-triazine Chemical compound C1=CN=NC=N1 FYADHXFMURLYQI-UHFFFAOYSA-N 0.000 description 1
- 241000270281 Coluber constrictor Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- OQZCSNDVOWYALR-UHFFFAOYSA-N flurochloridone Chemical compound FC(F)(F)C1=CC=CC(N2C(C(Cl)C(CCl)C2)=O)=C1 OQZCSNDVOWYALR-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は塔載されるチツプ素子又は半導体素子
などの電子部品から発生する熱の散放性をより向
上させ、さらには耐水性を向上させた有機系樹脂
基板からなる電子部品塔載用プリント配線板に関
する。[Detailed description of the invention] [Industrial application field] The present invention further improves the dissipation of heat generated from electronic components such as chip elements or semiconductor elements mounted on a tower, and further improves water resistance. The present invention relates to a printed wiring board for mounting electronic components, which is made of an organic resin substrate.
従来、半導体素子などの電子部品を塔載する基
板としてガラスエポキシ樹脂基板又は紙フエノー
ル樹脂基板などの有機系樹脂基板であるプリント
配線板が用いられている。後示する図面（第３
図）は有機系樹脂基板からなる電子部品塔載用プ
リント配線板の一例であり、プリント配線用基板
１の表面に少なくとも導体回路部２と電子部品塔
載部７が形成され、前記７に対応する基板裏面に
金属メツキ被膜５が平滑に形成されたものであ
る。
Conventionally, printed wiring boards, which are organic resin substrates such as glass epoxy resin substrates or paper phenol resin substrates, have been used as substrates on which electronic components such as semiconductor elements are mounted. Drawings shown later (3rd
Figure) is an example of a printed wiring board for mounting electronic components made of an organic resin substrate, in which at least a conductor circuit section 2 and an electronic component mounting section 7 are formed on the surface of the printed wiring board 1, and corresponds to 7 above. A metal plating film 5 is smoothly formed on the back surface of the substrate.
しかしながら、これら従来の電子部品塔載用プ
リント配線板において、有機系樹脂基板の熱伝導
率が小さいためこれらに塔載した電子部品からの
発熱に対して基板の熱伝導を介して十分な熱放散
性が得られず、低消費電力すなわち発熱が小さい
電子部品のみに応用されるに止まり、最近の大規
膜集積回路素子ICなどの塔載には熱放散の面で
不十分である。また、有機系樹脂基板は耐湿性が
セラミツクス基板と比較し非常に低いため外部か
らの湿気が基板を透過し電子部品まで達すること
により電子部品を腐蝕させるために、耐湿性に対
して高い信頼性が要求される分野には電子部品塔
載用プリント配線板として有機系樹脂基板を使用
することは困難である。
However, in these conventional printed wiring boards for mounting electronic components, due to the low thermal conductivity of the organic resin substrate, sufficient heat dissipation is required for the heat generated by the electronic components mounted on these through the thermal conduction of the substrate. However, it is only applied to electronic components with low power consumption, that is, low heat generation, and is insufficient in terms of heat dissipation for mounting in recent large-scale membrane integrated circuit devices such as ICs. In addition, since organic resin substrates have very low moisture resistance compared to ceramic substrates, moisture from the outside can penetrate through the substrate and reach electronic components, corroding them. It is difficult to use organic resin substrates as printed wiring boards for mounting electronic components in fields where this is required.
本考案は上記従来技術の問題点を除去・改善す
ることを目的とし、電子部品塔載用プリント配線
板において、電子部品塔載用凹部に対応する基板
裏面の導体回路部に相当する部分以外に、できる
限り凹部及び凸部を形成し金属メツキ被膜が形成
されている電子部品塔載用プリント配線板を提供
するものである。それ故、電子部品塔載部とそれ
に対応する基板裏面の金属メツキ被膜間の有機系
樹脂層を薄くすることができ、さらには基板裏面
の凹凸部をもつてこの凹凸部に形成される金属メ
ツキ被膜の外気との接触面積を増やすことによつ
て電子部品から発生する熱の放散を効率よく外部
へ行うことができる。また、基板裏面凹凸部に形
成される金属メツキ被膜をもつて、外部の湿気が
基板側面及び裏面から透過して電子部品への侵入
を著しく低下させることができる。
The purpose of the present invention is to eliminate and improve the problems of the prior art described above. The present invention provides a printed wiring board for mounting electronic components in which concave and convex portions are formed as much as possible and a metal plating film is formed. Therefore, the organic resin layer between the electronic component mounting part and the corresponding metal plating film on the back side of the board can be made thinner, and the metal plating formed on the uneven part on the back side of the board can be made thinner. By increasing the contact area of the film with the outside air, heat generated from the electronic component can be efficiently dissipated to the outside. Further, by having a metal plating film formed on the uneven portion of the back surface of the substrate, it is possible to significantly reduce the possibility of external moisture permeating through the side surface and back surface of the substrate and entering into electronic components.
本考案は、上記の如く熱放散性及び耐湿性がよ
い優れた電子部品塔載用プリント配線板を提供す
ることを目的としたものである。 The object of the present invention is to provide an excellent printed wiring board for mounting electronic components, which has good heat dissipation properties and moisture resistance as described above.
以下、本考案を図面に基づいて具体的に説明す
る。
Hereinafter, the present invention will be specifically explained based on the drawings.
第１図は本考案の電子部品塔載用プリント配線
板の一実施例の縦断面図であり、第２図はその基
板裏面側から見た斜視図である。この図面におい
て１は有機系樹脂基板であるプリント配線用基板
であり、プリント配線用基板として代表的なもの
は、ガラスエポキシ樹脂基板、紙エポキシ樹脂基
板、紙フエノール樹脂基板、カラスポリイミド樹
脂基板、ガラストリアジン樹脂基板などである。
このプリント配線用基板１に導体回路部２とザグ
リ加工により電子部品塔載用凹部６が形成され、
前記凹部６に対応するプリント配線用基板１の裏
面にザグリ加工、レーサー加工又は穴あけ加工な
どにより導体回路部２に相当する部分以外に凹部
３凸部４が形成される。前記凹部３凸部４の配列
状態は格子状整列、ランダム又は渦巻き状であ
り、それらはできる限り多数形成されることが外
気との接触面積を増す上で有利である。また、凹
部３はできる限り深く形成することが熱放散の上
で有利である。さらにこの凹部３及び凸部４に、
導体回路部２に電気的障害を生じさせない程度に
金属メツキ被膜５が形成される。本考案の特徴で
あるプリント配線用基板１の裏面に形成されてい
る凹部３及び凸部４と金属メツキ被膜５によつ
て、電子部品塔載用凹部６と金属メツキ被膜５と
の間の熱伝導率の小さいプリント配線用基板１を
薄くすることが可能であり、さらに熱伝導率の大
きい金属メツキ被膜５と外気との接触面積が増え
ることにより電子部品より発生する熱を効率よく
放散することができる。また、外部の湿気がプリ
ント配線用基板１の側壁面及び裏面を透過して電
子部品塔載用凹部６への侵入を著しく低下させる
ことができる。前記金属メツキ被膜５は、銅メツ
キ、ニツケルメツキなどである。なお前記凹部６
に金属メツキ被膜５を形成することによりさらに
熱放散性、耐湿性を向上させることができる。必
要により金属メツキ被膜５の表面に有機系樹脂塗
膜を形成しても本考案の効果は減少しない。 FIG. 1 is a longitudinal sectional view of one embodiment of the printed wiring board for mounting electronic components according to the present invention, and FIG. 2 is a perspective view of the printed wiring board as seen from the back side of the board. In this drawing, 1 is a printed wiring board which is an organic resin board. Typical printed wiring boards are glass epoxy resin board, paper epoxy resin board, paper phenol resin board, glass polyimide resin board, glass Such as triazine resin substrate.
A recess 6 for mounting an electronic component is formed on this printed wiring board 1 by a conductor circuit portion 2 and counterbore processing.
Concave portions 3 and convex portions 4 are formed on the back surface of the printed wiring board 1 corresponding to the concave portions 6 in areas other than those corresponding to the conductor circuit portions 2 by counterboring, racer machining, or drilling. The concave portions 3 and convex portions 4 are arranged in a grid-like arrangement, random, or spirally, and it is advantageous to form as many of them as possible in order to increase the area of contact with the outside air. Furthermore, it is advantageous for heat dissipation to form the recess 3 as deep as possible. Furthermore, in this concave portion 3 and convex portion 4,
The metal plating film 5 is formed to such an extent that it does not cause any electrical disturbance to the conductor circuit portion 2 . By the recesses 3 and protrusions 4 and the metal plating film 5 formed on the back surface of the printed wiring board 1, which is a feature of the present invention, the heat between the electronic component mounting recess 6 and the metal plating film 5 is reduced. It is possible to make the printed wiring board 1 with low conductivity thin, and also to efficiently dissipate heat generated by electronic components by increasing the contact area between the metal plating film 5 having high thermal conductivity and the outside air. Can be done. Further, it is possible to significantly reduce the possibility of external moisture passing through the side wall surface and back surface of the printed wiring board 1 and entering the electronic component mounting recess 6. The metal plating film 5 is copper plating, nickel plating, or the like. Note that the recess 6
By forming the metal plating film 5 on the surface, heat dissipation properties and moisture resistance can be further improved. Even if an organic resin coating film is formed on the surface of the metal plating film 5 if necessary, the effects of the present invention will not be reduced.
以上のように本考案の電子部品塔載用プリント
配線板は、有機系樹脂基板であるプリント配線用
基板の欠点である熱放散性および耐湿性が著しく
改善され、電子部品の耐久性が向上するとともに
有機系樹脂基板から成る電子部品塔載用プリント
配線板の使用範囲を拡げることが可能である。
As described above, the printed wiring board for mounting electronic components of the present invention significantly improves heat dissipation and moisture resistance, which are disadvantages of printed wiring boards made of organic resin substrates, and improves the durability of electronic components. At the same time, it is possible to expand the scope of use of printed wiring boards for mounting electronic components made of organic resin substrates.
第１図は本考案の電子部品塔載用プリント配線
板の縦断面図、第２図は本考案の電子部品塔載用
プリント配線板の裏面の斜視図、第３図は従来の
電子部品塔載用プリント配線板の縦断面図であ
る。
１……プリント配線用基板、２……導体回路
部、３……凹部、４……凸部、５……金属メツキ
被膜、６……電子部品塔載用凹部、７……電子部
品塔載部。
Fig. 1 is a vertical cross-sectional view of a printed wiring board for mounting electronic components according to the present invention, Fig. 2 is a perspective view of the back side of the printed wiring board for mounting electronic parts according to the present invention, and Fig. 3 is a conventional electronic component mounting board. FIG. 3 is a longitudinal cross-sectional view of the mounted printed wiring board. DESCRIPTION OF SYMBOLS 1... Printed wiring board, 2... Conductor circuit portion, 3... Recessed part, 4... Convex part, 5... Metal plating film, 6... Recessed part for electronic component mounting, 7... Electronic component mounting Department.
Claims (1)
ける半導体素子等の電子部品搭載面である表面
側の任意の部分に少なくとも導体回路部２が形
成され、前記電子部品搭載面と反対面である裏
面側のほぼ電子部品搭載部と対応する部分に凹
部３及び凸部４が形成され、これら凹部および
凸部の表面に金属メツキ被膜５が形成されてな
る電子部品搭載用プリント配線板。 ２ 前記電子部品搭載部に凹部６が形成されてい
ることを特徴とする実用新案登録請求の範囲第
１項記載の電子部品搭載用プリント配線板。 ３ 前記凹部６の表面に金属メツキ被膜５が形成
されることを特徴とする実用新案登録請求の範
囲第２項記載の電子部品搭載用プリント配線
板。[Claims for Utility Model Registration] 1. At least a conductor circuit portion 2 is formed on any part of the front surface of the printed wiring board 1 made of an organic resin material, which is the surface on which electronic components such as semiconductor elements are mounted, and A concave portion 3 and a convex portion 4 are formed on the back surface side, which is the opposite side to the front surface, in a portion corresponding to the electronic component mounting portion, and a metal plating film 5 is formed on the surfaces of these concave portions and convex portions. printed wiring board. 2. The electronic component mounting printed wiring board according to claim 1, wherein a recess 6 is formed in the electronic component mounting portion. 3. The printed wiring board for mounting electronic components according to claim 2, wherein a metal plating film 5 is formed on the surface of the recess 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9296384U JPS619866U (en) | 1984-06-21 | 1984-06-21 | Printed wiring board for mounting electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9296384U JPS619866U (en) | 1984-06-21 | 1984-06-21 | Printed wiring board for mounting electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS619866U JPS619866U (en) | 1986-01-21 |
| JPH0225242Y2 true JPH0225242Y2 (en) | 1990-07-11 |
Family
ID=30650218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9296384U Granted JPS619866U (en) | 1984-06-21 | 1984-06-21 | Printed wiring board for mounting electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS619866U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4592458B2 (en) * | 2005-03-22 | 2010-12-01 | 株式会社フジクラ | Printed wiring board, electronic circuit device and manufacturing method thereof |
-
1984
- 1984-06-21 JP JP9296384U patent/JPS619866U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS619866U (en) | 1986-01-21 |
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