JPH02252275A - Heat shield plate - Google Patents
Heat shield plateInfo
- Publication number
- JPH02252275A JPH02252275A JP1071971A JP7197189A JPH02252275A JP H02252275 A JPH02252275 A JP H02252275A JP 1071971 A JP1071971 A JP 1071971A JP 7197189 A JP7197189 A JP 7197189A JP H02252275 A JPH02252275 A JP H02252275A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat shield
- frp
- shield plate
- eddy current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 abstract description 11
- 229910052782 aluminium Inorganic materials 0.000 abstract description 9
- 229910052802 copper Inorganic materials 0.000 abstract description 5
- 229920002430 Fibre-reinforced plastic Polymers 0.000 abstract description 2
- 239000011151 fibre-reinforced plastic Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 2
- 230000002265 prevention Effects 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 239000010949 copper Substances 0.000 description 5
- 229910052734 helium Inorganic materials 0.000 description 5
- 239000001307 helium Substances 0.000 description 5
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 101000579123 Homo sapiens Phosphoglycerate kinase 1 Proteins 0.000 description 1
- 102100028251 Phosphoglycerate kinase 1 Human genes 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Landscapes
- Containers, Films, And Cooling For Superconductive Devices (AREA)
Abstract
Description
【発明の詳細な説明】 [産業上の利用分野] 本発明は、低温容器の熱シールド板に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a heat shield plate for a cryogenic container.
[従来の技術]
液体ヘリウムによってコイルを冷却し、超電導効果によ
って磁場を発、生する超電導磁石は、液体ヘリウムを入
れたヘリウム容器に収容され、且つ、ヘリ9ム容器は断
熱性の高い低温容器によつで囲まれている。この低温容
器は、ヘリウム容器は外部よりの輻射熱を防ぐために複
数の熱シールド板を備え、これらシールド板は銅または
アルミニューム等の電気的には導体の材料によって形成
されている。[Prior art] A superconducting magnet whose coil is cooled by liquid helium and generates a magnetic field by the superconducting effect is housed in a helium container containing liquid helium, and the helium container is a low-temperature container with high insulation properties. surrounded by. In this low-temperature container, the helium container is equipped with a plurality of heat shield plates to prevent radiant heat from the outside, and these shield plates are made of an electrically conductive material such as copper or aluminum.
一方、超電導磁石にはパルス的に電流が加えられ、この
結果として、パルス的に磁場(パルス磁場と呼ぶ)が発
生する。On the other hand, a pulsed current is applied to the superconducting magnet, and as a result, a pulsed magnetic field (referred to as a pulsed magnetic field) is generated.
[発明が解決しようとする課題]
従来の超電導磁石においては、パルス磁場によって、低
温容器の熱シールド板にうず電流が発生する。このうず
電流によりジュール熱がシールド板に発生し、熱侵入現
象が起こる。[Problems to be Solved by the Invention] In conventional superconducting magnets, eddy currents are generated in the heat shield plate of the low temperature container due to the pulsed magnetic field. This eddy current generates Joule heat in the shield plate, causing a heat intrusion phenomenon.
[課題を解決するための手段]
本発明によれば、帯状の熱シールド部材と、前記熱シー
ルド部材の電気抵抗より大きい電気抵抗を有する高抵抗
部材とを有し、前期熱シールド部材の両端を前記高抵抗
部材で接続したことを特徴とする熱シールド板が得られ
る。[Means for Solving the Problems] According to the present invention, there is provided a band-shaped heat shield member and a high resistance member having an electrical resistance larger than the electrical resistance of the heat shield member, and both ends of the heat shield member are connected to each other. A heat shield plate characterized in that it is connected by the high-resistance member is obtained.
[作用]
本発明による熱シールド板においては、うず電流を切る
ために、シールド板の一部にFRPを用い、うず電流の
閉回路に電気抵抗の大きい部分をつくっている。[Function] In the heat shield plate according to the present invention, in order to cut off eddy current, FRP is used for a part of the shield plate, and a portion with high electrical resistance is created in a closed circuit for eddy current.
[実施例]
次に、本発明の一実施例を示した図面を参照して、本発
明をより詳細に説明する。[Example] Next, the present invention will be described in more detail with reference to the drawings showing an example of the present invention.
第1図を参照すると、本発明の一実施例による熱シール
ド板は、銅(Cu)またはアルミニュームCAD )製
の帯状熱輻射シールド部材1と、シールド部材1を環状
にしその両端を接続された繊維強化プラスチック(以下
、FRPという)2と、シールド部材1とPRP 2と
を接続するFRP製のボルト3とから構成されている。Referring to FIG. 1, a heat shield plate according to an embodiment of the present invention includes a band-shaped heat radiation shield member 1 made of copper (Cu) or aluminum (CAD), and a ring-shaped shield member 1 connected at both ends thereof. It is composed of a fiber reinforced plastic (hereinafter referred to as FRP) 2 and a bolt 3 made of FRP that connects the shield member 1 and the PRP 2.
FRP 2の表面には、銅またはアルミニュームによる
蒸着を施すか、またはアルミ粘着テープ4が張りつれら
れている。Copper or aluminum is vapor-deposited on the surface of the FRP 2, or an aluminum adhesive tape 4 is attached.
本実施例においては、熱輻射シールド部材1がPRP
2により電気的に切断されているので、うず電流は流れ
ず、したがって、うず電流によるシールド板部材の発熱
を防止できる。In this embodiment, the thermal radiation shield member 1 is made of PRP.
Since it is electrically disconnected by 2, eddy current does not flow, and therefore heat generation of the shield plate member due to eddy current can be prevented.
熱輻射シールド部材1の部分がFRPだけだと、放射係
数が高くなるので、熱輻射量が多くなる。If the thermal radiation shielding member 1 is made only of FRP, the radiation coefficient will be high and the amount of thermal radiation will be large.
このため、本実施例においては、FRP 2の表面を放
射係数の低い銅またはアルミニュームで蒸着するかアル
ミニューム粘着テープを貼りつけている。For this reason, in this embodiment, the surface of the FRP 2 is vapor-deposited with copper or aluminum having a low radiation coefficient, or an aluminum adhesive tape is attached.
これにより、シールド板への熱輻射を反射させ、入熱を
少なくすることができる。Thereby, it is possible to reflect thermal radiation to the shield plate and reduce heat input.
[発明の効果]
以上説明したように、本発明によれば、熱シールド部材
を環状にする際に、熱シールド部材の両端を、熱シール
ド部材の電気抵抗より大きい電気抵抗を有する部材で接
続しているので、うず電流が発生しにくい。[Effects of the Invention] As explained above, according to the present invention, when forming the heat shield member into an annular shape, both ends of the heat shield member are connected with a member having an electrical resistance larger than the electrical resistance of the heat shield member. eddy current is less likely to occur.
第1図は本発明の一実施例による熱シールド板の平面図
である。
1:熱輻射シールド部材、2:FRP、3:ボルト、4
ニアルミ粘着テープ。FIG. 1 is a plan view of a heat shield plate according to an embodiment of the present invention. 1: Heat radiation shield member, 2: FRP, 3: Bolt, 4
aluminum adhesive tape.
Claims (1)
気抵抗より大きい電気抵抗を有する高抵抗部材とを有し
、前記熱シールド部材の両端を前記高抵抗部材で接続し
たことを特徴とする熱シールド板。1. A heat shield comprising a band-shaped heat shield member and a high resistance member having an electrical resistance greater than the electrical resistance of the heat shield member, and both ends of the heat shield member are connected with the high resistance member. shield board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1071971A JPH02252275A (en) | 1989-03-27 | 1989-03-27 | Heat shield plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1071971A JPH02252275A (en) | 1989-03-27 | 1989-03-27 | Heat shield plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02252275A true JPH02252275A (en) | 1990-10-11 |
Family
ID=13475863
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1071971A Pending JPH02252275A (en) | 1989-03-27 | 1989-03-27 | Heat shield plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02252275A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05206529A (en) * | 1992-01-24 | 1993-08-13 | Hitachi Ltd | Permanent current switch and superconducting device |
-
1989
- 1989-03-27 JP JP1071971A patent/JPH02252275A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05206529A (en) * | 1992-01-24 | 1993-08-13 | Hitachi Ltd | Permanent current switch and superconducting device |
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