JPH02251777A - Burn-in test device - Google Patents

Burn-in test device

Info

Publication number
JPH02251777A
JPH02251777A JP1071841A JP7184189A JPH02251777A JP H02251777 A JPH02251777 A JP H02251777A JP 1071841 A JP1071841 A JP 1071841A JP 7184189 A JP7184189 A JP 7184189A JP H02251777 A JPH02251777 A JP H02251777A
Authority
JP
Japan
Prior art keywords
test
signal
input
internal logic
logic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1071841A
Other languages
Japanese (ja)
Inventor
Toshihiro Yoshida
吉田 利弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1071841A priority Critical patent/JPH02251777A/en
Publication of JPH02251777A publication Critical patent/JPH02251777A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

PURPOSE:To enable execution of a test of high precision by a simple test circuit board and a signal generator by a method wherein an output signal of an internal logic circuit to be tested and an input signal at the time of an actual operation are taken in an input buffer selectively. CONSTITUTION:Input buffers 5 to 7, an internal logic circuit 14 and output terminals 11 to 13 thereof and a basic test signal input terminal 15 are provided. A switching signal is inputted to a switching terminal 4 to put the buffers 5 to 7 in a test mode, and a test signal is impressed on the terminal 15 from the signal generator. Then the circuit 14 starts to operate, a logic output signal thereof is outputted to the terminals 11 to 13 and also inputted in feedback to the buffers 5 to 7, the signal thus inputted is given as a new test signal to the circuit 14, and thus a test is continued. On the occasion, input terminals 8 to 10 are made open to maintain a potential of a set level and thereby execution of a test of the circuit 14 is enabled. According to this constitution, it is possible to simplify a wiring of a test circuit board, to lessen the number of test signals and to execute a test of excellent precision.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、半導体集積回路装置のテストに関するもの
で、さらに具体的には半導体集積回路装置における内部
論理回路のバーンインテストを実施するバーンインテス
ト装置に関するものである。
[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to testing of semiconductor integrated circuit devices, and more specifically to a burn-in test device that performs a burn-in test of internal logic circuits in a semiconductor integrated circuit device. It is related to.

〔従来の技術〕[Conventional technology]

第4図は従来のバーンインテスト装置を示すブロック接
続図であり、図において、1は半導体集積回路装置、2
は上記半導体集積回路装置1を搭載するバーンインテス
ト用のテスト基板、3は上記半導体集積回路装置1にテ
スト信号を入力するための信号発生器である。
FIG. 4 is a block connection diagram showing a conventional burn-in test device. In the figure, 1 is a semiconductor integrated circuit device, 2 is a
3 is a test board for a burn-in test on which the semiconductor integrated circuit device 1 is mounted, and 3 is a signal generator for inputting a test signal to the semiconductor integrated circuit device 1.

次に動作について説明する。一般に、バーンインテスト
は半導体集積回路装置の初期不良を除去するために実施
される。また、このバーンインテストの中でも、信号を
印加した状態でテストするダイナミックバーンインテス
トが最も効果が高い。
Next, the operation will be explained. Generally, burn-in tests are performed to eliminate initial defects in semiconductor integrated circuit devices. Furthermore, among these burn-in tests, a dynamic burn-in test in which a test is performed while a signal is applied is the most effective.

まず、テスト信号は信号発生器3で作られ、テスト基板
2の配線を経て半導体集積回路装置1に印加される。こ
のようにテスト信号を半導体集積回路装置1に印加して
いる状態で、半導体集積回路装置1をバーンインテスト
環境下に置き、所定時間テストを実施する。
First, a test signal is generated by the signal generator 3 and applied to the semiconductor integrated circuit device 1 via the wiring on the test board 2. With the test signal being applied to the semiconductor integrated circuit device 1 in this manner, the semiconductor integrated circuit device 1 is placed under a burn-in test environment, and a test is performed for a predetermined period of time.

こ0バーンインテストによって、初期不良を起としかけ
ていた半導体集積回路装置1は不良を起ζし、この後に
行う7アンクシ曹ンテスト(半導体集積回路装置1の機
能が正しく動作しているかどうかをチエツクするテスト
)Kよって不良として除去される。
This burn-in test causes the semiconductor integrated circuit device 1 that was about to develop an initial failure to become defective, and a subsequent 7-anxy test (to check whether the functions of the semiconductor integrated circuit device 1 are operating correctly) is performed. (test) K, it is removed as defective.

したがって、このようなバーンインテストでは、半導体
集積回路装置1の内部回路が動作すれば動作するほど、
初期不良が摘出し易くな夛、精度の良いテストであると
いうことができる。
Therefore, in such a burn-in test, the more the internal circuit of the semiconductor integrated circuit device 1 operates, the more
It can be said that it is a highly accurate test since it is easy to identify initial defects.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来のバーンインテスト装置は以上のように構成されて
いるので、半導体集積回路装置1の内部回路をできるだ
け十分に動作させて精度の良いテストを実施しようとす
ると、すべての入力端子にテスト信号を入力しなければ
ならず、しかもそのテスト信号を周期的な信号ではなく
乱数的な信号にすることが必要で、また、テスト基板2
上の配線が複雑になシ、色々なテスト信号が発生できる
高価な信号発生器が必要になるなどの課題があり九。な
お、従来のバーンイン試験装置として、ミル規格(MI
L−8TD−883C方法1015.4の規定)に同様
の記載がある。
Since the conventional burn-in test equipment is configured as described above, in order to operate the internal circuit of the semiconductor integrated circuit device 1 as fully as possible to perform a highly accurate test, it is necessary to input test signals to all input terminals. Moreover, it is necessary to make the test signal a random signal rather than a periodic signal, and the test board 2
There are problems such as the above wiring is complicated and an expensive signal generator that can generate various test signals is required. In addition, as a conventional burn-in test device, the MIL standard (MI
There is a similar description in L-8TD-883C Method 1015.4 (Regulations).

この発明は上記のような課題を解消するためKなされた
もので、簡単なテスト基板と信号発生器によシ精度の高
いバーンインテストを実施できるバーンインテスト装置
を得ることを目的とする。
The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a burn-in test device that can perform a burn-in test with high accuracy using a simple test board and a signal generator.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係るバーンインテスト装置は、テスト対象の
内部論理回路の出力信号および実動作時の入力信号を選
択的に入力バッファKJI)込むようにし、%に、テス
ト時には、切換え信号入力用の切換え端子に切換え信号
を入力して、上記入力バッファをテストモードとして、
テスト信号が入力される上記内部論理回路の出力信号を
選択して、この内部論理回路にフィードバック入力する
とともに、上記入力端子を設定電位に保持するようにし
たものである。
The burn-in test device according to the present invention selectively inputs the output signal of the internal logic circuit to be tested and the input signal during actual operation into the input buffer (KJI), and inputs the input signal into the input buffer (KJI) at the time of the test. Input a switching signal to set the above input buffer to test mode.
The output signal of the internal logic circuit to which the test signal is input is selected and fed back to the internal logic circuit, and the input terminal is held at a set potential.

〔作用〕[Effect]

この発明における入力バッファは、テスト動作と実動作
の切換え信号に従って動作モードが切換えられ、特に、
テスト動作時には、内部論理回路の出力信号を新たなテ
スト用入方信号として、その内部論理回路にフィードバ
ック入力し、これによルさらに新たな論理出力信号を出
力させるようにする。
In the input buffer of the present invention, the operation mode is switched according to a switching signal between test operation and actual operation, and in particular,
During a test operation, the output signal of the internal logic circuit is fed back to the internal logic circuit as a new input signal for testing, thereby causing a new logic output signal to be output.

〔発明の実施例〕[Embodiments of the invention]

以下、この発明の一実施例を図について説明する。第1
図において、1は半導体集積回路装置、2はテスト基板
、3は信号発生器で、これらは第4図に示したものと同
様のものである。4はテスト動作と実動作を切換え選択
する切換え信号入力用の切換え端子である。
An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, 1 is a semiconductor integrated circuit device, 2 is a test board, and 3 is a signal generator, which are similar to those shown in FIG. Reference numeral 4 denotes a switching terminal for inputting a switching signal for switching and selecting test operation and actual operation.

また、第2図は上記半導体集積回路装置1の詳細を示す
ブロック接続図であシ、5〜7は入力バッファ、8〜1
0は実動作時の入力信号用の入力端子、11〜13はテ
スト対象である内部論理回路14の出力端子、15は信
号発生器3から基本のテスト信号を入力するためのテス
ト信号入力端子で、上記入力バラ775〜7はテスト時
に、上記入力端子の入力信号に代えて、内部論理回路1
4の出力をフィードバック入力する。
FIG. 2 is a block connection diagram showing details of the semiconductor integrated circuit device 1, in which 5 to 7 are input buffers, 8 to 1 are input buffers, and 8 to 1 are input buffers.
0 is an input terminal for input signals during actual operation, 11 to 13 are output terminals of the internal logic circuit 14 to be tested, and 15 is a test signal input terminal for inputting basic test signals from the signal generator 3. , the input roses 775 to 7 are input to the internal logic circuit 1 in place of the input signals of the input terminals during testing.
Input the output of step 4 as feedback.

次に動作について説明する。Next, the operation will be explained.

まず、切換え端子4に切換え信号を入力して、各入力バ
ッファ5−7をテストモードに設定し、さらに、信号発
生器3からテスト信号をテスト信号入力端子15に印加
する。これにより、このテスト信号を基に半導体集積回
路装置1の内部論理回路14・が動作し始め、この内部
論理回路14の論理出力信号が出力端子11〜13に得
られる。−方、この論理出力信号は入力バッファ5〜T
にフィードバック入力されて、新たなテスト信号として
内部論理回路14に加えられ、テストが続けられる。こ
こで上記各出力端子11〜13から入力バッファ5〜7
に返されるテスト信号のパターンは、内部論理回路14
の構成にもよるが、信号発生器3から与えられる周期的
な変化のテスト信号よシも多種多様であシ、半導体集積
回路装置1の動作を活発にさせる。
First, a switching signal is input to the switching terminal 4 to set each input buffer 5 - 7 to the test mode, and then a test signal is applied from the signal generator 3 to the test signal input terminal 15 . As a result, the internal logic circuit 14 of the semiconductor integrated circuit device 1 starts operating based on this test signal, and logic output signals of this internal logic circuit 14 are obtained at the output terminals 11-13. - On the other hand, this logic output signal is input from input buffer 5 to T.
The signal is fed back to the internal logic circuit 14 as a new test signal, and the test is continued. Here, from each of the above output terminals 11 to 13 to input buffers 5 to 7
The pattern of test signals returned to the internal logic circuit 14
Although it depends on the configuration of the semiconductor integrated circuit device 1, the periodically changing test signals given from the signal generator 3 can be of various kinds, and can activate the operation of the semiconductor integrated circuit device 1.

また、この時、入力端子8〜10は開放のままとして、
設定レベルの電位を維持させて、上記テスト信号による
内部論理回路14のパ、ンインテストを実行可能にする
Also, at this time, input terminals 8 to 10 are left open,
By maintaining the potential at the set level, it is possible to perform a pin-in test of the internal logic circuit 14 using the test signal.

なお、上記実施例では内部論理回路14にはテスト動作
用の回路を付加しないものを示したが、第3図に示すよ
うに1内部論理回路14内のエツジ・センスのラッチ素
子に、テスト動作時にはレベル・センスになるような制
御端子を設けても良い。ここで、16〜18はテスト動
作と実動作を切換える切換え端子4によりて、テスト動
作時にはレベル・センスになるエツジ・センスのラッチ
素子である。この実施例によれば%ラッチ素子16〜1
8は切換え端子4に切換え信号を入力することよシ、テ
スト動作に設定されることKよりてレベル・センスにな
ル、ラッチ素子16〜18のクロック端子における信号
が1Hルベル(又は1L″レベル)固定になりても、ラ
ッチ素子16〜18の入力と出力間はスルーとなシ、後
段の内部論理回路14Aの動作を止めることはなくなる
In the above embodiment, a test operation circuit is not added to the internal logic circuit 14, but as shown in FIG. In some cases, a control terminal may be provided for level sensing. Here, reference numerals 16 to 18 are edge-sensing latch elements which become level-sensing during test operation using a switching terminal 4 for switching between test operation and actual operation. According to this embodiment, % latch elements 16-1
8 is set to test operation by inputting a switching signal to the switching terminal 4, and the signal at the clock terminal of the latch elements 16 to 18 is set to the 1H level (or 1L" level). ) Even if it is fixed, there will be no through between the input and output of the latch elements 16 to 18, and the operation of the internal logic circuit 14A at the subsequent stage will not be stopped.

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明によればテストモード時にテス
ト対象である内部論理回路の出力端子から信号を入力バ
ッファに返すことによりて、信号発生器からの基本のテ
スト信号を基に生成したテスト信号を得て、これを上記
内部−論理回路に入力することができるように構成した
ので、テスト基板上の配線を簡素にでき、まえ、外部か
らテスト信号を与える信号発生器も、生成すべきテスト
信号の数が少なくて済み、かつ精度の良いバーンインテ
ストが行えるものが得られる効果がある。
As described above, according to the present invention, by returning a signal from the output terminal of the internal logic circuit to be tested to the input buffer during the test mode, the test signal is generated based on the basic test signal from the signal generator. Since the configuration is such that it can be input into the internal logic circuit, the wiring on the test board can be simplified, and the signal generator that provides the test signal from the outside can also be used to generate the test signal. This has the advantage of requiring fewer signals and allowing highly accurate burn-in testing.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一実施例によるバーンインテスト装
置を示すブロック接続図、第2図はこの発明における半
導体集積回路装置の詳細を示すブロック接続図、第3図
はこの発明における他の半導体集積回路装置の詳細を示
すブロック接続図、第4図は従来のバーンインテスト装
置を示すブロック接続図である。 1は半導体集積回路装置、4は切換え端子、5゜6.7
は入力バッファ、8.9.10は入力端子、14は内部
論理回路。 なお、図中、同一符号は同一、又は相当部分を示す。
FIG. 1 is a block connection diagram showing a burn-in test device according to an embodiment of the invention, FIG. 2 is a block connection diagram showing details of a semiconductor integrated circuit device according to the invention, and FIG. 3 is a block connection diagram showing details of a semiconductor integrated circuit device according to the invention. A block connection diagram showing details of the circuit device. FIG. 4 is a block connection diagram showing a conventional burn-in test device. 1 is a semiconductor integrated circuit device, 4 is a switching terminal, 5°6.7
is an input buffer, 8.9.10 is an input terminal, and 14 is an internal logic circuit. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【特許請求の範囲】[Claims] テスト対象として半導体集積回路装置内に設けられ、か
つ外部からテスト信号を受けて所定パターンの出力信号
を出力する内部論理回路と、この内部論理回路の出力信
号および実動作時の入力信号のいずれかを選択して、上
記内部論理回路へ出力する入力バッファと、上記内部論
理回路のテスト時に、上記入力バッファを上記出力信号
を選択してテストモードとする切換え信号入力用の切換
え端子と、上記内部論理回路のテスト時に設定電位に保
持される、上記実動作時の入力信号用の入力端子とを備
えたバーンインテスト装置。
An internal logic circuit that is provided in a semiconductor integrated circuit device as a test target and that receives a test signal from the outside and outputs a predetermined pattern of output signals, an output signal of this internal logic circuit, and an input signal during actual operation. an input buffer that selects the output signal and outputs it to the internal logic circuit, a switching terminal for inputting a switching signal that selects the output signal of the input buffer and puts it into test mode when testing the internal logic circuit; A burn-in test device comprising: an input terminal for the input signal during actual operation, which is held at a set potential during testing of a logic circuit.
JP1071841A 1989-03-27 1989-03-27 Burn-in test device Pending JPH02251777A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1071841A JPH02251777A (en) 1989-03-27 1989-03-27 Burn-in test device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1071841A JPH02251777A (en) 1989-03-27 1989-03-27 Burn-in test device

Publications (1)

Publication Number Publication Date
JPH02251777A true JPH02251777A (en) 1990-10-09

Family

ID=13472170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1071841A Pending JPH02251777A (en) 1989-03-27 1989-03-27 Burn-in test device

Country Status (1)

Country Link
JP (1) JPH02251777A (en)

Similar Documents

Publication Publication Date Title
US4503536A (en) Digital circuit unit testing system utilizing signature analysis
US5422891A (en) Robust delay fault built-in self-testing method and apparatus
RU2260813C2 (en) Check of the asynchronous reset of a circuit
JPH06249919A (en) Interterminal-connection test method of semiconductor integrated circuit device
JPS61155874A (en) Method and device for detecting fault of large-scale integrated circuit
US6789219B2 (en) Arrangement and method of testing an integrated circuit
WO2020038570A1 (en) Extended jtag controller and method for functional reset using the extended jtag controller
JPH02251777A (en) Burn-in test device
DE69030209D1 (en) Event-enabled test architecture for integrated circuits
JPH11101850A (en) Ic tester
US6857091B2 (en) Method for operating a TAP controller and corresponding TAP controller
US6205566B1 (en) Semiconductor integrated circuit, method for designing the same, and storage medium where design program for semiconductor integrated circuit is stored
JPH01156680A (en) Fault diagnosing method for logic circuit
JPS63271966A (en) Semiconductor integrated circuit
JPH04244979A (en) Delay test pattern and generation thereof
JPS63178340A (en) Integrated circuit for control
JPH0611486Y2 (en) Reset status detection circuit
JPH04169879A (en) Method for testing mounted large scale integration
JPH10240559A (en) Test facilitating circuit
JPS63103985A (en) Inspecting device for integrated circuit element
JP2001021619A (en) Lsi reset circuit and electronic equipment using the same
JPS63138600A (en) Auxiliary circuit for ram test
JPH06258404A (en) Digital integrated circuit
JPH0377081A (en) Testing device for lsi
JPH02249982A (en) Semiconductor integrated circuit device