JPH02251388A - Laser beam machine - Google Patents

Abstract

PURPOSE:To exactly measure the laser power and to exactly execute the positioning and the alignment adjustment of an optical axis by providing plural power monitors on a prescribed position of a work base. CONSTITUTION:At the time of measuring the laser power, the measurement is executed by condensing a laser light 2 to a power monitor 7-1 determined in advance among four pieces of power monitors 7-1-7-4 by an action of a mirror 3. In this case, an output of the monitor 7-1 is always monitored at the time when the laser light 2 is in the vicinity of the monitor 7-1, and a value at the time when its value becomes maximum is derived as the laser power. Also, as for a position of a work base 5, a position in which an output of each monitor 7-1-7-4 becomes maximum is derived as a position of each monitor 7-1-7-4, and by comparing a position of the work base 5 on a work base carrying means 8 and its position, its error is derived. By moving the work base 5 by the work base carrying means 8 by a portion of this error, positioning of the work base 5 is executed, and also, the alignment adjustment of an optical axis of the laser light and the work base 5 is also performed.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a laser processing device, and more particularly to a laser processing device that can simultaneously measure laser power and position a workpiece.

(Prior art) Conventionally, a laser head that emits a laser beam, a work table on which a workpiece to be processed is placed and positioned, and an optical system that focuses the laser beam emitted from the laser head onto the workpiece. In order to perform highly accurate processing in a laser processing device consisting of a laser processing device, the laser power is measured using, for example, a thermocouple-type power monitor to ensure that the power is always constant.

There are two methods for measuring laser power: one is to insert a power monitor directly onto the optical axis, and the other is to insert a power monitor mirror onto the optical axis and direct the optical axis to a power monitor located off the optical axis. How to measure guided laser power,
A known method is to estimate the actual laser power by providing a power monitor on the back surface of the laser head opposite to the laser light output surface and measuring the laser power leaking from the rear mirror.

(Problem to be solved by the invention) However, with the conventional measurement method of inserting a power monitor directly into the optical axis or inserting a monitor mirror, the power monitor can only be installed near the laser head due to the configuration of the device. Therefore, there is a problem in that the laser power that actually reaches the workpiece cannot be measured due to losses caused by the optical system until the laser power actually reaches the workpiece, making it impossible to accurately measure the power. Furthermore, the method of measuring the laser power leaking from the rear mirror also has the problem of not being able to accurately measure the laser power that actually reaches the workpiece, similar to the conventional example described above.

Furthermore, in any of the above-mentioned measurement methods, there is a problem in that, in addition to the optical system that allows laser light to reach the workpiece, another optical system for positioning is required for positioning the workpiece table.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and provide a laser processing device that can accurately measure laser power and also position a work table without using any other optical system. It is.

(Means for Solving the Problems) A laser processing apparatus of the present invention includes a laser head that emits a laser beam, a work table on which a workpiece to be processed is placed and positioned, and a laser beam emitted from the laser head. In a laser processing device consisting of an optical system that focuses light onto a workpiece, multiple power monitors are installed at predetermined positions on the workpiece table to measure the power of the laser beam and simultaneously position the workpiece on the workpiece table. It is also characterized by the implementation of the following.

(Function) In the above configuration, by attaching the power monitor to a predetermined position on the work table, it is possible to measure the laser power of the laser light that has passed through the same optical system as the laser light that is irradiated on the workpiece. can be measured. In addition, by sequentially irradiating laser light onto the power monitors using mirrors, etc., and comparing with the predetermined position of each power monitor on the workbench, accurate positioning of the workbench and control of the laser power can be achieved. Measurements can be performed simultaneously.

(Example) FIG. 1 is a diagram showing an example of the configuration of a main part of a laser processing apparatus of the present invention. The example shown in FIG. 1 is aimed at a laser trimming device, in which a laser beam 2 emitted from a laser head 1 passes through a mirror 3 and an optical system 4 to a work table 5.
The structure is such that the light can be focused on a workpiece 6 provided at a predetermined position above. At the four corners of the work table 5, for example, there are conventionally known thermocouple thermomobile type power monitors 7-1.
7-4 are provided at fixed positions with respect to the work table 5.

In the above-described apparatus, before trimming and scanning the work 6, the laser power is measured and the work 6, that is, the work table 5 is positioned. Measurement of laser power is 4
The laser beam 2 is applied to a predetermined power monitor 7-1 among the power monitors 7-1 to 7-4 by the action of the mirror 3.
The power monitor 7-1 is used for measurement.
The output of the laser beam 2 is constantly monitored when it is near the monitor 7-1, and the value when the value reaches the maximum is determined as the laser power. Further, the position of the work table 5 is similarly determined by determining the position where the output of each power monitor 7-1 to 7-4 is maximum as the position of each power monitor 7-1 to 7-4, and The position of the work table 5 is compared with that position to find the error, and the work table 5 is moved by the work table conveying means 8 by the amount of the error.
In addition to positioning, alignment adjustment between the optical axis of the laser beam 2 and the work table 5 is also performed. Therefore, by sequentially focusing the laser beam 2 on the power monitors 7-1 to 7-4 by the action of the mirror 3, it is possible to simultaneously measure the laser power of the laser beam 2 and position the work table 5, that is, the work 6.

After that, if a laser trimming operation is performed, accurate trimming operation can be performed using a laser beam having a predetermined power. Incidentally, if the determined error, that is, the amount of shift of the work table 5 is automatically fed back to the work transfer means 8, the position of the work table 5 can be automatically performed. In addition, the power monitors 7-1 to 7-1 described above
Since the position where the maximum value of 7-4 is the focal position of the laser beam 2, the laser beam 2 can be automatically focused.

The present invention is not limited only to the embodiments described above, and numerous modifications and changes are possible. For example, in the embodiment described above, four power monitors were used, but it is clear that at least one thin film is sufficient for positioning and optical axis alignment adjustment. Preferably, at least two or more of them are provided diagonally. In addition, in the above-mentioned embodiment, a laser trimming device was used as an example, but
It is clear that the present invention can be suitably applied to other laser processing devices.

(Effects of the Invention) As is clear from the above description, according to the laser processing apparatus of the present invention, since a plurality of power monitors are provided at predetermined positions on the work table, accurate laser power measurement can be carried out. At the same time, it is possible to accurately position the work table and accurately adjust the alignment of the optical axis without using a separate optical system.

[Brief explanation of drawings]

FIG. 1 is a diagram showing an example of the configuration of a main part of a laser processing apparatus according to the present invention. 1...Laser head 2...Laser beam 3...
Mirror 4...Optical system 5...Work table
6... Works 7-1 to 7-4... Power motor 8... Work table conveyance means

Claims (1)

[Claims] 1. A laser head that emits laser light, a work table on which the work to be processed is placed and positioned,
In laser processing equipment that consists of an optical system that focuses laser light emitted from a laser head onto a workpiece, multiple power monitors are installed at predetermined positions on the workpiece table to measure the power of the laser beam. A laser processing device characterized in that it also performs positioning of the upper workpiece.