JPH0225119U - - Google Patents

Info

Publication number
JPH0225119U
JPH0225119U JP1988103719U JP10371988U JPH0225119U JP H0225119 U JPH0225119 U JP H0225119U JP 1988103719 U JP1988103719 U JP 1988103719U JP 10371988 U JP10371988 U JP 10371988U JP H0225119 U JPH0225119 U JP H0225119U
Authority
JP
Japan
Prior art keywords
light
emitting
circuit board
printed circuit
emitting display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988103719U
Other languages
English (en)
Other versions
JPH0646014Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988103719U priority Critical patent/JPH0646014Y2/ja
Publication of JPH0225119U publication Critical patent/JPH0225119U/ja
Application granted granted Critical
Publication of JPH0646014Y2 publication Critical patent/JPH0646014Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例にかかる発光表示装
置の一部破断斜視図、第２図は第１図のＩ―Ｉ断
面図、第３図は空気の循環を模式的に示した要部
断面図、第４図は従来の発光表示装置の斜視図、
第５図は従来の空気の循環を模式的に示した要部
断面図である。 １……発光表示板、２……発光ドツト、３……
表示面、５，６……発光駆動回路を実装したプリ
ント基板、７……放熱用貫通孔。

Claims (1)

  1. 【実用新案登録請求の範囲】 表面に発光ダイオードを用いた発光ドツトがマ
    トリツクス状に配列形成された発光表示板を縦横
    につなぎ合わせて表示面を形成し、該発光面背後
    に発光駆動回路を実装したプリント基板を取り付
    けた発光表示装置において、 上記プリント基板に複数の放熱用貫通孔を穿孔
    したことを特徴とする発光表示装置。
JP1988103719U 1988-08-04 1988-08-04 発光表示装置 Expired - Lifetime JPH0646014Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988103719U JPH0646014Y2 (ja) 1988-08-04 1988-08-04 発光表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988103719U JPH0646014Y2 (ja) 1988-08-04 1988-08-04 発光表示装置

Publications (2)

Publication Number Publication Date
JPH0225119U true JPH0225119U (ja) 1990-02-19
JPH0646014Y2 JPH0646014Y2 (ja) 1994-11-24

Family

ID=31334800

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988103719U Expired - Lifetime JPH0646014Y2 (ja) 1988-08-04 1988-08-04 発光表示装置

Country Status (1)

Country Link
JP (1) JPH0646014Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6214830B1 (ja) * 2016-12-28 2017-10-18 三菱電機株式会社 発光ユニット、表示装置及びマルチ表示装置
US10891881B2 (en) 2012-07-30 2021-01-12 Ultravision Technologies, Llc Lighting assembly with LEDs and optical elements

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009229471A (ja) * 2006-07-12 2009-10-08 Sharp Corp 光学部品、表示装置用照明装置および表示装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10891881B2 (en) 2012-07-30 2021-01-12 Ultravision Technologies, Llc Lighting assembly with LEDs and optical elements
JP6214830B1 (ja) * 2016-12-28 2017-10-18 三菱電機株式会社 発光ユニット、表示装置及びマルチ表示装置
WO2018122997A1 (ja) * 2016-12-28 2018-07-05 三菱電機株式会社 発光ユニット、表示装置及びマルチ表示装置

Also Published As

Publication number Publication date
JPH0646014Y2 (ja) 1994-11-24

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