JPH01138750U - - Google Patents
Info
- Publication number
- JPH01138750U JPH01138750U JP1988035572U JP3557288U JPH01138750U JP H01138750 U JPH01138750 U JP H01138750U JP 1988035572 U JP1988035572 U JP 1988035572U JP 3557288 U JP3557288 U JP 3557288U JP H01138750 U JPH01138750 U JP H01138750U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- conductive
- substrate
- wiring
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 238000003491 array Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Description
第１図は本考案実施例の光プリントヘツドの要
部断面図で第２図はそれに用いる基板の要部平面
図、第３図は本考案の他の実施例の光プリントヘ
ツドの要部断面図である。 １，１１……基板、１ａ，１ａ，１１ａ，１１
ａ……導電部、１ｂ，１ｂ……配線導電箔、１ｄ
，１ｄ，１１ｄ，１１ｄ……スルホール、１ｅ…
…帯状導電部、２，２……発光ダイオードアレイ
、３……接着剤、４，４，１４，１４……配線手
段、１５……駆動素子。
部断面図で第２図はそれに用いる基板の要部平面
図、第３図は本考案の他の実施例の光プリントヘ
ツドの要部断面図である。 １，１１……基板、１ａ，１ａ，１１ａ，１１
ａ……導電部、１ｂ，１ｂ……配線導電箔、１ｄ
，１ｄ，１１ｄ，１１ｄ……スルホール、１ｅ…
…帯状導電部、２，２……発光ダイオードアレイ
、３……接着剤、４，４，１４，１４……配線手
段、１５……駆動素子。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 表面に１列に整列して設けられた複数の導
電部を有した基板と、整列された導電部に接着剤
等で整列して載置固着された複数の発光ダイオー
ドアレイと、発光ダイオードアレイの近傍の基板
上に配置された駆動素子又は基板上に設けられた
多数の配線導電箔と、発光ダイオードアレイと駆
動素子又は配線導電箔とを配線する配線手段とを
具備した事を特徴とする光プリントヘツド。 (2) 表面及び裏面にスルホールで接続された導
電部を有した基板と、表面の導電部に接着剤等で
載置固着された発光ダイオードアレイとを具備し
、前記スルホールは前記導電部の発光ダイオード
アレイの載置部の外側に設けられている事を特徴
とする光プリントヘツド。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988035572U JPH01138750U (ja) | 1988-03-17 | 1988-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988035572U JPH01138750U (ja) | 1988-03-17 | 1988-03-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01138750U true JPH01138750U (ja) | 1989-09-21 |
Family
ID=31262217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988035572U Pending JPH01138750U (ja) | 1988-03-17 | 1988-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01138750U (ja) |
-
1988
- 1988-03-17 JP JP1988035572U patent/JPH01138750U/ja active Pending