JPH02248300A - Thermal transfer foil - Google Patents
Thermal transfer foilInfo
- Publication number
- JPH02248300A JPH02248300A JP7014489A JP7014489A JPH02248300A JP H02248300 A JPH02248300 A JP H02248300A JP 7014489 A JP7014489 A JP 7014489A JP 7014489 A JP7014489 A JP 7014489A JP H02248300 A JPH02248300 A JP H02248300A
- Authority
- JP
- Japan
- Prior art keywords
- thermal transfer
- transfer foil
- release layer
- mold
- base sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011888 foil Substances 0.000 title claims abstract description 53
- 238000002347 injection Methods 0.000 claims abstract description 17
- 239000007924 injection Substances 0.000 claims abstract description 17
- 229920001707 polybutylene terephthalate Polymers 0.000 claims abstract description 16
- 238000001746 injection moulding Methods 0.000 claims abstract description 12
- -1 polybutylene terephthalate Polymers 0.000 claims abstract description 12
- 238000007493 shaping process Methods 0.000 claims description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 abstract description 26
- 239000011347 resin Substances 0.000 abstract description 26
- 239000000463 material Substances 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 41
- 238000000034 method Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Decoration By Transfer Pictures (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は特定材質の離型層を有する基材シートを使用し
てなる熱転写箔に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a thermal transfer foil using a base sheet having a release layer made of a specific material.
現在、多種多様の熱転写箔が存在しており、その代表的
なものとして、基材シート上に絵柄層や金属蒸着層等の
転写層を積層形成してなり、被転写体に重ね合わせてロ
ール転写法等を用いて加圧（加熱）して圧着させてから
基材シートを剥がすことにより転写層を被転写体に転写
させる一般的な熱転写箔が知られている。この他にも、
射出成形金型内に転写箔を装着して通常の射出成形を行
い、脱型後に基材シートを剥離することにより、得られ
る射出成型品の表面に所望の凹凸形状を転写賦形したり
或いはその表面に絵柄層等を転写することができる射出
成形同時転写タイプの転写箔、いわゆるインモールド用
熱転写箔がある。Currently, there are a wide variety of thermal transfer foils, and a typical one is one in which a transfer layer such as a pattern layer or a metal-deposited layer is laminated on a base sheet, which is superimposed on the object to be transferred and then rolled. A general thermal transfer foil is known in which a transfer layer is transferred to an object to be transferred by applying pressure (heating) to bond the foil using a transfer method or the like and then peeling off the base sheet. In addition to this,
By installing a transfer foil in an injection molding mold and performing normal injection molding, and peeling off the base sheet after demolding, a desired uneven shape can be transferred onto the surface of the resulting injection molded product, or There is a so-called in-mold thermal transfer foil, which is an injection molding simultaneous transfer type transfer foil that can transfer a pattern layer or the like onto its surface.
これら従来の熱転写箔はいずれのものも、最終的に基材
シートを剥離除去することにより転写を行うものであり
、その基材シートの剥離を容易に行うようにするため必
要に応じて該シートに、シリコン、ワックス、ウレタン
、繊維素系樹脂等の熱可塑性樹脂や、エポキシ樹脂、メ
ラミン樹脂、熱硬化アクリル、アミノアルキッド、尿素
樹脂等の熱硬化性樹脂等の樹脂や電離放射線硬化性樹脂
からなる離型層を設けている。In all of these conventional thermal transfer foils, transfer is ultimately performed by peeling and removing the base sheet, and in order to facilitate the peeling of the base sheet, the sheet may be removed as necessary. From thermoplastic resins such as silicone, wax, urethane, and cellulose resins, thermosetting resins such as epoxy resins, melamine resins, thermosetting acrylics, amino alkyds, and urea resins, and ionizing radiation-curable resins. A mold release layer is provided.
しかしながら、上記前者の一般タイブの熱転写箔では被
転写体の平面部分のみに転写を行う場合には特に問題は
ないものの、被転写体の曲面部分や複雑形状の被転写体
への転写を行う場合、凸状箇所や角（隅）部において転
写用ロール等の加圧度合いが平坦部分に比して増大する
ため、その箇所で転写箔が加圧延伸されて被転写体にく
っついてしまい基材シートを剥がしにくくなる欠点があ
る。しかもこの時、基材シー［・を無理に剥がすと当該
箇所において転写層の艶等の状態が変化してしまう不具
合が生じる。However, with the former general type thermal transfer foil, there is no particular problem when transferring only to a flat part of the object to be transferred, but when transferring to a curved part of the object or an object with a complicated shape. The degree of pressure applied by the transfer roll, etc. at convex areas and corners (corners) is greater than that at flat areas, so the transfer foil is pressure-stretched at those areas and sticks to the transferred object, causing damage to the base material. The drawback is that the sheet is difficult to peel off. Moreover, at this time, if the base material sheet [.
一方、後者のインモールド用熱転写箔は、成形時の溶融
樹脂の高熱等の影響を受けて一般的に基材シートの剥離
が円滑に行い難い問題があり、この剥離性の改善が望ま
れていた。またこの種の転写箔のうち射出成形品表面に
凹凸形状を賦形するタイプのものにおいては、転写箔に
設けた凹凸形状が射出成型時の高熱により熱変形してし
まい、射出成形品に正確な賦形が行えず、特にこのよう
な事情から微細なエンボス形状の転写賦形などは殆ど不
可能というのが実情であった。On the other hand, the latter thermal transfer foil for in-mold generally has the problem that it is difficult to peel off the base sheet smoothly due to the effects of the high heat of the molten resin during molding, and it is desired to improve this peelability. Ta. In addition, among these types of transfer foils, the type that forms uneven shapes on the surface of injection molded products, the uneven shapes provided on the transfer foil are thermally deformed by the high heat during injection molding, and the injection molded products cannot be accurately formed. In particular, due to these circumstances, it was almost impossible to transfer and form fine embossed shapes.
本発明者は上記課題に鑑みて鋭意研究を重ねた結果、離
型層をポリブチレンテレフタレートにて構成することに
より従来技術の欠点を克服でき、その他のメリットも生
じることを見出し、本発明を完成するに至った。As a result of intensive research in view of the above-mentioned problems, the present inventor discovered that by forming the mold release layer with polybutylene terephthalate, the drawbacks of the conventional technology could be overcome and other advantages would also arise, and the present invention was completed. I ended up doing it.
即ち本発明は、
（１）ポリブチレンテレフタレートからなる離型層を設
けた基材シートを使用することを特徴とする熱転写箔。That is, the present invention provides: (1) A thermal transfer foil characterized in that it uses a base sheet provided with a release layer made of polybutylene terephthalate.
（２）請求項１の熱転写箔において離型層表面に賦形用
凹凸形状を付してなる熱転写箔であって、射出成形金型
内に装着して射出成形を行い射出成型品に上記凹凸形状
を転写賦形することを特徴とするインモールド用熱転写
箔。(2) A thermal transfer foil according to claim 1, in which the surface of the mold release layer is provided with an uneven shape for shaping, and the thermal transfer foil is mounted in an injection mold to perform injection molding, and the unevenness is formed on the injection molded product. A thermal transfer foil for in-mold use that is characterized by transferring and shaping shapes.
（３） 基材シートがポリエチレンテレフタレートフ
ィルムである請求項Ｉ又は２記載の熱転写箔。(3) The thermal transfer foil according to claim I or 2, wherein the base sheet is a polyethylene terephthalate film.
を要旨とするものである。The main points are as follows.
以下、本発明の実施例を図面に基づいて説明する。 Embodiments of the present invention will be described below based on the drawings.
本発明の熱転写箔１は、図示のように少なくとも基材シ
ートとして、ポリブチレンテレフタレート（以下、ＰＢ
Ｔ樹脂と略称する）からなる離型層２を設けた基材シー
ト３を使用して構成されるものである。The thermal transfer foil 1 of the present invention has polybutylene terephthalate (hereinafter referred to as PB) as at least a base sheet as shown in the figure.
It is constructed using a base sheet 3 provided with a release layer 2 made of (abbreviated as T resin).
本発明熱転写箔１は、例えば第１図に図示の如く基材シ
ート３の離型層２上に被転写体に転写するための転写層
４を設けて構成したものである。The thermal transfer foil 1 of the present invention is constructed by providing a transfer layer 4 for transferring onto an object on a release layer 2 of a base sheet 3, as shown in FIG. 1, for example.
転写層４としては絵柄層、金属蒸着層等が挙げられ、こ
れらは従来の転写箔に設けられている周知のものを同様
に設けることができる。また転写層を被転写体に確実に
移行させるため、必要に応じて転写層としての接着剤層
を設けてもよい。Examples of the transfer layer 4 include a pattern layer, a metal vapor deposition layer, and the like, and these can be provided in the same manner as well-known ones provided in conventional transfer foils. Further, in order to reliably transfer the transfer layer to the object to be transferred, an adhesive layer may be provided as a transfer layer, if necessary.
また本発明熱転写Ｆ＆１は、第２図に図示の如く基材シ
ート３の離型層２表面に、射出成型品に転写賦形するた
めの賦形用凹凸形状５を付した構成のインモールド用熱
転写箔１ａとして構成される。The thermal transfer F&1 of the present invention is for in-mold use, as shown in FIG. It is configured as a thermal transfer foil 1a.
インモールド用熱転写箔１ａは離型層２上に上記転写Ｎ
４を同様に積層形成し、該転写層を射出成型品表面に転
写させるよう構成してもよい（この場合、離型層表面の
凹凸形状５はあっても又はなくてもよい）。The thermal transfer foil 1a for in-mold is applied to the above-mentioned transfer layer N on the release layer 2.
4 may be similarly laminated and the transfer layer may be transferred to the surface of the injection molded product (in this case, the uneven shape 5 on the surface of the release layer may or may not be present).
基材シート３の材質としては、周知の転写箔に適用され
ているものを使用することができ、例えば、ポリエチレ
ンテレフタレート、塩化ビニル、ナイロン、ポリカーボ
ネート、セロハン等が挙げられる。なかでも耐熱性、フ
ィルム厚み均一性、加熱寸法安定性の理由からポリエチ
レンテレフタレートフィルムが好ましく、この材質は特
にインモールド用熱転写箔にＲ通である。As the material of the base sheet 3, those applied to well-known transfer foils can be used, and examples thereof include polyethylene terephthalate, vinyl chloride, nylon, polycarbonate, cellophane, and the like. Among these, polyethylene terephthalate film is preferred for reasons of heat resistance, film thickness uniformity, and heating dimensional stability, and this material is particularly suitable for use in in-mold thermal transfer foils.
本発明における離型層２は、ＰＢＴ樹脂が押出成形可能
な材質であることから、従来品における離型層が採用し
ていたドライラミート法に頼らず、エキストルージョン
ラミネート法にて設けることが可能である。このラミネ
ート加工法を適用できるため、特に第２図に図示の如き
熱転写箔の製造を容易成らしめられる利点があり、基材
シート３としてポリエチレンテレフタレートフィルムを
使用した場合に該フィルムとＰＢＴ樹脂との感熱接着が
でき有益である０Ｍ型層２の厚さは転写箔の用途に応じ
て適宜設定されるが、インモールド用の場合は１〜５０
μｍ程度が好ましい。Since PBT resin is a material that can be extruded, the mold release layer 2 in the present invention can be formed by extrusion lamination instead of relying on the dry laminate method used for mold release layers in conventional products. It is possible. Since this lamination processing method can be applied, it has the advantage that it can easily manufacture a thermal transfer foil as shown in FIG. The thickness of the 0M type layer 2, which is useful for heat-sensitive adhesion, is set appropriately depending on the use of the transfer foil, but in the case of in-mold use, it is 1 to 50.
The thickness is preferably about μm.
ここで、第２図に示すインモールド用熱転写箔の製造方
法の一例について説明する。第３図に示すようにＰＢＴ
樹脂６を押出ａｌｌで加熱溶融してＴダイアのスリット
からフィルム状に押し出し、この押し出されたＰＢＴ樹
脂６をその片側から供給される基材シート３にラミネー
トさせると共に、ＰＢＴ樹脂層側から送り出される凹凸
賦形用フィルム８とラミネートさせ、加圧ロール９と冷
却ロール１２の間で３者を圧着冷却させた後、凹凸賦形
用フィルム８をＰＢＴ樹脂層面から剥離させることによ
り、該フィルム８の凹凸１０が表面に賦形された離型層
２を基材シート３にラミネートしてなるインモールド用
熱転写箔１ａが得られる。Here, an example of a method for manufacturing the in-mold thermal transfer foil shown in FIG. 2 will be described. PBT as shown in Figure 3
The resin 6 is heated and melted in an extruder and extruded through the slit of the T-dia in the form of a film, and the extruded PBT resin 6 is laminated onto the base sheet 3 supplied from one side thereof, and the PBT resin layer is sent out from the PBT resin layer side. After laminating the uneven shaping film 8 and cooling the three members by pressing between the pressure roll 9 and the cooling roll 12, the uneven shaping film 8 is peeled from the PBT resin layer surface. An in-mold thermal transfer foil 1a is obtained by laminating a release layer 2 on the surface of which unevenness 10 is formed on a base sheet 3.
尚、上記製造方法においてＰＢＴ樹脂層（離型層）への
凹凸形状の賦形は１、凹凸賦形用フィルム８に代えて、
ＰＢＴ樹脂層側の加圧ロール９として凹凸１０を有する
エンボス用ロールを用いてｊテうこともできる。又、凹
凸賦形様フィルム８の剥離は、第３図に図示の如く該フ
ィルム８、基材シート３及びＰＵＴ樹脂６の３者を一体
化した後に直ぐに剥がす態様に限らず、例えば、」二記
３者を手前側の冷却ロール１２に暫く当接させておき、
該ロール１２の適当な位置に設置した剥離用ロール（図
示せず）を介して剥がしたり、或いは賦形用フィルム８
を重ねたままで一旦巻き取り、その後、オフラインでフ
ィルム８を剥がずようにしても良い。In addition, in the above manufacturing method, the uneven shape is formed on the PBT resin layer (mold release layer) by replacing the uneven shape forming film 8 with 1,
It is also possible to use an embossing roll having unevenness 10 as the pressure roll 9 on the PBT resin layer side. In addition, the peeling of the uneven-formed film 8 is not limited to the method in which the film 8, the base sheet 3, and the PUT resin 6 are peeled off immediately after integrating the film 8, the base sheet 3, and the PUT resin 6 as shown in FIG. Keep the three persons in contact with the cooling roll 12 on the front side for a while,
It can be peeled off via a peeling roll (not shown) installed at an appropriate position on the roll 12, or the shaping film 8
It is also possible to once wind up the film 8 while stacking them, and then do not peel off the film 8 off-line.
上記の如き構成からなる本発明熱転写箔は、第１図の示
すような通常の転写箔の場合は被転写体つ
に重ね合わせ、ロール転写法、アップダキン転写、イン
モールド転写、プレス転写等により加熱加圧した後、基
材シート３を１ｌＪｉｌて転写Ｎ４を被転写体側に転写
させる。一方、第２図に示すようなインモールド用熱転
写箔の場合は、射出成型用金型内に離型層２をキャビテ
ィー側に向けて装着させ、咳金型内に射出樹脂を注入充
填して射出成型を行い、脱型後に基材シートを剥離する
ことにより離型層の凹凸形状５が転写賦形された射出成
型品を得ることができる。In the case of a normal transfer foil as shown in FIG. 1, the thermal transfer foil of the present invention having the above-mentioned structure is superimposed on two transfer objects and heated by a roll transfer method, up-dakin transfer, in-mold transfer, press transfer, etc. After applying pressure, the base sheet 3 is moved 1 lJil to transfer the transfer N4 onto the object to be transferred. On the other hand, in the case of in-mold thermal transfer foil as shown in Fig. 2, the release layer 2 is installed in the injection mold facing the cavity side, and the injection resin is injected and filled into the mold. By performing injection molding and peeling off the base sheet after demolding, an injection molded product in which the uneven shape 5 of the release layer has been transferred and shaped can be obtained.
上記射出樹脂としては、従来から射出成形法に使用され
ている樹脂材質を用いることができ、例えばＡＢＳ、Ａ
Ｓ、ポリスチレン、アクリル等の樹脂を使用することが
できる。As the injection resin, resin materials conventionally used in injection molding methods can be used, such as ABS, A
Resins such as S, polystyrene, and acrylic can be used.
次に、具体的実施例を挙げて本発明を更に詳細に説明す
る。Next, the present invention will be explained in more detail by giving specific examples.
ｎ−例。n-example.
基材シートとして厚さ２５μｍのポリエチレンテレフタ
レートフィルムを用い、微細な凹凸形状の賦形用フィル
ムを使用して、第３図に示す製造方法にて表面に賦形用
の微細凹凸を有するＰＢＴ樹脂層を基材シートにラミネ
ートさせ、インモールド用熱転写箔を得た。Using a polyethylene terephthalate film with a thickness of 25 μm as a base sheet and a shaping film with fine irregularities, a PBT resin layer having fine irregularities for shaping on the surface was produced by the manufacturing method shown in Fig. 3. was laminated onto a base sheet to obtain a thermal transfer foil for in-mold use.
得られた熱転写箔を射出成形用金型内に装着させ、２３
０°Ｃに溶融させたアフリロニトリル・スチレン樹脂を
金型内に注入して射出成形を行い、脱型後に基材シート
を２１１離した。このときの剥離は極めてスムーズに行
え、また忠実に微細凹凸が賦形された成形品を得る得る
ことができた。The obtained thermal transfer foil was installed in an injection mold, and 23
Afrylonitrile styrene resin melted at 0°C was injected into the mold to perform injection molding, and after demolding, the base sheet was separated by 211 cm. Peeling at this time was carried out extremely smoothly, and a molded article in which fine irregularities were faithfully formed could be obtained.
圧潰
離型層形成用樹脂と、してポリエチレンテレフタレート
樹脂を用い、エクストルージョンコートの方法にて基材
シートにラミネートさせた他は、実施例と同様にしてイ
ンモールド用熱転写箔を作成し、それを用いて同じく射
出成形したところ、基材シートの剥離が一部困難な箇所
が生じ、また得られた成形品の微細凹凸も一部変形して
いるところが確認された。A thermal transfer foil for in-mold was prepared in the same manner as in the example except that polyethylene terephthalate resin was used as the resin for forming the crushed release layer and laminated to the base sheet by extrusion coating. When injection molding was carried out using the same method, it was confirmed that there were some parts where the base sheet was difficult to peel off, and some of the fine irregularities of the obtained molded product were also deformed.
以」二説明したように、本発明熱転写箔はｒ’１３Ｔ樹
脂からなる離型層を有する基材シートを使用しているた
め、離型層が耐熱性に優れていると共に転写時における
基材シートの剥離性に優れたちのきなる。そのため一般
の熱転写箔において大きなメリットがあるのは勿論のこ
と、特にインモールド用熱転写箔の場合、射出成形時の
高熱に対しても充分な耐久性を有し、射出樹脂との離型
性にも優れた効果があり、しかも従来品では不可能であ
った微細なエンボスを射出成形品表面に容易に転写賦形
することも可能となる。As explained below, since the thermal transfer foil of the present invention uses a base sheet having a release layer made of r'13T resin, the release layer has excellent heat resistance and the base material during transfer. Tachi-no-Kinaru has excellent sheet removability. Therefore, it goes without saying that general thermal transfer foils have great advantages, but especially in the case of in-mold thermal transfer foils, they have sufficient durability against the high heat during injection molding, and have excellent mold releasability from injection resin. It also has excellent effects, and it also makes it possible to easily transfer and shape fine embossing onto the surface of injection molded products, which was impossible with conventional products.
また本発明によれば、ＰＢＴ樹脂が押出成形可能な特性
を有することからエキストルージッンラミネート法にて
離型層を基材シート上に形成することができ、その結果
、離型層の形成が容易となり、この効果はインモールド
用熱転写箔の製造を簡便ならしめるために特に有益とな
る。Further, according to the present invention, since the PBT resin has extrusion moldable characteristics, the mold release layer can be formed on the base sheet by the extrusion lamination method, and as a result, the mold release layer can be formed. This effect is particularly useful for simplifying the production of in-mold thermal transfer foils.
第１図、第２図は本発明熱転写箔の一実施例を示す縦断
面図、第３図は第２図のインモールド用熱転写箔の製造
方法の一例を示す説明図である。
１・・熱転写箔
ｌａ・・インモールド用熱転写箔
２・・離型層 ３・・基材シート５・・賦形用
凹凸形状
５・・・斌型用凹凸形状
ｌａ・・・インモールド用熱転写潰1 and 2 are longitudinal cross-sectional views showing one embodiment of the thermal transfer foil of the present invention, and FIG. 3 is an explanatory view showing an example of the method for manufacturing the thermal transfer foil for in-mold use shown in FIG. 2. 1...Thermal transfer foil la...Thermal transfer foil for in-mold 2...Release layer 3...Base sheet 5...Irregular shape for shaping 5...Irregular shape for pin mold la...Thermal transfer for in-mold Crush
Claims (3)
けた基材シートを使用することを特徴とする熱転写箔。(1) A thermal transfer foil characterized by using a base sheet provided with a release layer made of polybutylene terephthalate.
凹凸形状を付してなる熱転写箔であって、射出成形金型
内に装着して射出成形を行い射出成型品に上記凹凸形状
を転写賦形することを特徴とするインモールド用熱転写
箔。(2) A thermal transfer foil according to claim 1, in which the surface of the mold release layer is provided with an uneven shape for shaping, and the thermal transfer foil is mounted in an injection mold to perform injection molding, and the unevenness is formed on the injection molded product. A thermal transfer foil for in-mold use that is characterized by transferring and shaping shapes.
ムである請求項１又は２記載の熱転写箔。(3) The thermal transfer foil according to claim 1 or 2, wherein the base sheet is a polyethylene terephthalate film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7014489A JP2840751B2 (en) | 1989-03-22 | 1989-03-22 | Thermal transfer foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7014489A JP2840751B2 (en) | 1989-03-22 | 1989-03-22 | Thermal transfer foil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02248300A true JPH02248300A (en) | 1990-10-04 |
| JP2840751B2 JP2840751B2 (en) | 1998-12-24 |
Family
ID=13423086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7014489A Expired - Fee Related JP2840751B2 (en) | 1989-03-22 | 1989-03-22 | Thermal transfer foil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2840751B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005002850A1 (en) * | 2003-07-01 | 2005-01-13 | Sumitomo Bakelite Co., Ltd. | Mold release film and process for producing flexible printed wiring board therewith |
| WO2010128613A1 (en) * | 2009-05-08 | 2010-11-11 | 株式会社トーツヤ・エコー | Transfer method to sheet, transfer device, and sheet product |
| JP2013126741A (en) * | 2011-12-19 | 2013-06-27 | Okura Ind Co Ltd | Transfer base film with support layer, method of film forming the same, and method of decorating the molding using the same |
| JP2021070234A (en) * | 2019-10-31 | 2021-05-06 | フジコピアン株式会社 | Mark formation transfer sheet |
| JP2021070233A (en) * | 2019-10-31 | 2021-05-06 | フジコピアン株式会社 | Mark formation transfer sheet |
-
1989
- 1989-03-22 JP JP7014489A patent/JP2840751B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005002850A1 (en) * | 2003-07-01 | 2005-01-13 | Sumitomo Bakelite Co., Ltd. | Mold release film and process for producing flexible printed wiring board therewith |
| WO2010128613A1 (en) * | 2009-05-08 | 2010-11-11 | 株式会社トーツヤ・エコー | Transfer method to sheet, transfer device, and sheet product |
| JP2010280211A (en) * | 2009-05-08 | 2010-12-16 | Totsuya Echo:Kk | Transfer method to sheet, transfer device, and sheet product |
| CN102421607A (en) * | 2009-05-08 | 2012-04-18 | 东艳惠光股份有限公司 | Transfer method to sheet, transfer device, and sheet product |
| JP2013126741A (en) * | 2011-12-19 | 2013-06-27 | Okura Ind Co Ltd | Transfer base film with support layer, method of film forming the same, and method of decorating the molding using the same |
| JP2021070234A (en) * | 2019-10-31 | 2021-05-06 | フジコピアン株式会社 | Mark formation transfer sheet |
| JP2021070233A (en) * | 2019-10-31 | 2021-05-06 | フジコピアン株式会社 | Mark formation transfer sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2840751B2 (en) | 1998-12-24 |
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