JPH0224560U - - Google Patents
Info
- Publication number
- JPH0224560U JPH0224560U JP10203988U JP10203988U JPH0224560U JP H0224560 U JPH0224560 U JP H0224560U JP 10203988 U JP10203988 U JP 10203988U JP 10203988 U JP10203988 U JP 10203988U JP H0224560 U JPH0224560 U JP H0224560U
- Authority
- JP
- Japan
- Prior art keywords
- straight line
- terminals
- semiconductor device
- cover plate
- composite semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 6
- 238000005192 partition Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10203988U JPH0224560U (el) | 1988-08-04 | 1988-08-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10203988U JPH0224560U (el) | 1988-08-04 | 1988-08-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0224560U true JPH0224560U (el) | 1990-02-19 |
Family
ID=31331578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10203988U Pending JPH0224560U (el) | 1988-08-04 | 1988-08-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0224560U (el) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008198899A (ja) * | 2007-02-15 | 2008-08-28 | Mitsubishi Electric Corp | 半導体装置 |
-
1988
- 1988-08-04 JP JP10203988U patent/JPH0224560U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008198899A (ja) * | 2007-02-15 | 2008-08-28 | Mitsubishi Electric Corp | 半導体装置 |
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