JPH0224536U - - Google Patents
Info
- Publication number
- JPH0224536U JPH0224536U JP10134288U JP10134288U JPH0224536U JP H0224536 U JPH0224536 U JP H0224536U JP 10134288 U JP10134288 U JP 10134288U JP 10134288 U JP10134288 U JP 10134288U JP H0224536 U JPH0224536 U JP H0224536U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- recess
- rotary table
- blade
- grind
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10134288U JPH0224536U (ar) | 1988-07-29 | 1988-07-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10134288U JPH0224536U (ar) | 1988-07-29 | 1988-07-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0224536U true JPH0224536U (ar) | 1990-02-19 |
Family
ID=31330246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10134288U Pending JPH0224536U (ar) | 1988-07-29 | 1988-07-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0224536U (ar) |
-
1988
- 1988-07-29 JP JP10134288U patent/JPH0224536U/ja active Pending