JPH0224534U - - Google Patents

Info

Publication number
JPH0224534U
JPH0224534U JP10241788U JP10241788U JPH0224534U JP H0224534 U JPH0224534 U JP H0224534U JP 10241788 U JP10241788 U JP 10241788U JP 10241788 U JP10241788 U JP 10241788U JP H0224534 U JPH0224534 U JP H0224534U
Authority
JP
Japan
Prior art keywords
wafer
fixing device
dry etching
lower electrode
guide hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10241788U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10241788U priority Critical patent/JPH0224534U/ja
Publication of JPH0224534U publication Critical patent/JPH0224534U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
JP10241788U 1988-08-03 1988-08-03 Pending JPH0224534U (tr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10241788U JPH0224534U (tr) 1988-08-03 1988-08-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10241788U JPH0224534U (tr) 1988-08-03 1988-08-03

Publications (1)

Publication Number Publication Date
JPH0224534U true JPH0224534U (tr) 1990-02-19

Family

ID=31332310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10241788U Pending JPH0224534U (tr) 1988-08-03 1988-08-03

Country Status (1)

Country Link
JP (1) JPH0224534U (tr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05140771A (ja) * 1991-11-15 1993-06-08 Nissin Electric Co Ltd エツチング装置
JP2018121091A (ja) * 2018-05-15 2018-08-02 パナソニックIpマネジメント株式会社 プラズマ処理装置およびプラズマ処理方法
US10744693B2 (en) 2017-10-23 2020-08-18 Fanuc Corporation Control device for injection molding machine and control method for injection molding machine

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05140771A (ja) * 1991-11-15 1993-06-08 Nissin Electric Co Ltd エツチング装置
US10744693B2 (en) 2017-10-23 2020-08-18 Fanuc Corporation Control device for injection molding machine and control method for injection molding machine
JP2018121091A (ja) * 2018-05-15 2018-08-02 パナソニックIpマネジメント株式会社 プラズマ処理装置およびプラズマ処理方法

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