JPH02243872A - Floor ground member - Google Patents

Abstract

PURPOSE:To obtain the superior function by holding a block in each partitioning chamber, of a flexible tray having a number of partitioning chambers and forming wiring grooves or piping grooves on the surface of the block. CONSTITUTION:In a flexible tray 1 made of synthetic resin, metal, etc., a plurality of partitioning chambers 3 are formed through a thin connecting part 4, and a block 2 made of cement, synthetic resin, or wooden material is held in each partitioning chamber 3. Further, a partitioning chamber 3' for wiring or the accommodation of piping blocks is formed in the tray 1, and a block 2' having wiring grooves or piping grooves 8 is held in the partitioning chamber 3'.

Description

[Detailed description of the invention] Industrial applications The present invention relates to a subfloor material used for floor assemblies in buildings.

Conventional technology and problems When constructing a floor structure by laying a large number of concrete blocks on a construction surface (for example, a concrete slab surface) and applying a finished flooring material to the top surface, it is difficult to carry in and lay a large number of blocks. It takes time and effort to construct, which avoids disadvantages in terms of construction period and cost, and requires skilled techniques for leveling construction.

On the other hand, Japanese Patent Application Laid-Open No. 62-33967 provides a subflooring material in the form of a set of blocks, in which each chamber of a flexible tray has a large number of partitioned chambers and each chamber holds a block.

This subflooring system enables the laying of aggregate materials from a large number of blocks held in trays in tray units, streamlining and simplifying floor assembly construction, and significantly reducing construction time and construction costs.

Furthermore, due to the flexibility of the tray, each block can be self-opening and laid to fit the unevenness of the construction surface, making it ideal for constructing floors on concrete slabs in reinforced concrete buildings, for example, and for flooring in equipment rooms for heavy equipment. Suitable as a base for assembly, etc.

On the other hand, subfloor materials are used as a construction surface for floor finishing materials, and in addition to supporting equipment and furniture with sufficient strength, floor heating functionality is also required as a requirement for subfloor materials that form living spaces. Improvement is desired.

The present invention improves the block-shaped subfloor material collected by the flexible tray so that it can be used appropriately as a floor heating material while effectively utilizing the above-mentioned characteristics of the subfloor material. This is intended to enrich functionality.

Means for Solving the Problems The present invention, as a means for achieving the above-mentioned object, provides the above-mentioned aggregated block-shaped subflooring material in which a large number of blocks are collected in a flexible tray. Wiring or piping grooves for floor heating, etc. are provided to communicate between the blocks of the subflooring material, and while supporting the flooring material on the upper surface, heat generating members are wired in an appropriate pattern directly under the floor covering material. Or it can be installed by piping.

Further, as a form of wiring or piping grooves for the heat generating member, etc., the wiring or piping grooves are formed on the outer surface of the block exposed at the open surface of each partition of the tray, and this surface is used as a support surface for the floor finishing material. By means of this method, or by installing and supporting the floor finishing material using the laid-out blocks as the flooring material in the above-mentioned laying of the flooring material group, an appropriate heat-generating material for heating can be placed directly under the flooring material. Arranged in a pattern.

Embodiments of the Invention The embodiments of the invention described above will be described in further detail with reference to FIGS. 1 to 10.

In the figure, 1 is a flexible tray made of synthetic resin, metal, paper, etc., and 2 is a rigid block made of cement, synthetic resin, wood, etc. The tray 1 has a large number of partitions 3 arranged in, for example, a grid pattern. Each partition 3 is defined by a bottom wall 5a and a peripheral wall 5b.

The blocks 2 are held in each partition room 3.

By way of example, the block 2 is accommodated in the compartment 3 movably, in particular vertically movable. That is, each block 2 is collected by the tray 1, and while maintaining the relative position using the tray 1 as a medium, each block is regulated by the peripheral wall 5b and bottom wall 5a of each partition 3, and moves along the peripheral wall 5b toward the opening. Make it movable.

The bottom wall of the tray partition holding the blocks is recessed together with the blocks, the wiring or piping grooves are formed on the outer surface of the bottom wall, and the floor finishing material is supported on this surface.

As described above, blocks are collected on flexible trays, and a large number of blocks are laid out on the floor construction surface in units of trays to form a wide-area subfloor. Each block group is independent, but due to the flexibility of the tray, it opens itself and is laid to conform to the unevenness of the construction surface. Furthermore, by laying a large number of these subfloor materials, a desired pattern of wiring or piping grooves that communicate with adjacent subfloor materials can be formed over the entire surface of the subfloor surface or over a certain area. As the heat generating material, a hot water vibrator, a heating wire, etc. are used.

A unit groove pattern for each tray is formed by collecting the wiring or piping grooves using individual grooved block trays, and a necessary groove pattern is completed by collecting and combining a large number of these unit trays.

As a means for compositing the tray 1 and the block 2, a fluid material mainly composed of cement and sand is poured into each partition chamber 3 of the tray 1 and is then hardened.

A tray 1 having a large number of partitions 3 is prepared in advance as the other side of the composite, and a separately formed block 2 is fitted into each partition 3. The block 2 held in the partition 3 is a single-layer structure or a multi-layer structure. This block 2 may be attached to the bottom wall 5a of the tray 1 with adhesive.

The partitions 3 forming the block 2 are independent and connected to each other at the periphery of the opening.

That is, the bottom wall 5a and the peripheral wall 5b that define each partition 3 are independent for each partition 3, and are connected to each other at the upper end of the peripheral wall 5b, leading to the connection part 4 between each peripheral wall 5b of each partition 3. A gap 6 is formed. The above-mentioned independent chambers can be formed by press-molding a synthetic resin sheet.

As a result of the above, each partition chamber 3 is made to have flexibility with respect to each other in the connecting portion 4. Therefore, each block held in each partition 3 is given flexibility using the tray 1 as a medium. The flexible tray is made flexible as a whole, or each partition is made of a rigid body, and the connecting portion 4 is made thin to provide flexibility.

A heat-generating member 7 for floor heating is placed on the surface of the subfloor material as described above.
A wiring or piping groove 8 is formed. The heat generating member 7 is, for example, a hot water pipe, a heating wire, or the like.

The wiring or piping groove 8 of the heat generating member is shown in FIG. 1A as an example.
, B. As shown in FIG. 2, it is formed on the outer surface of the block 2 exposed at the open surface of the tray partition 3.

In FIG. 1A, a partition chamber 3° for accommodating wiring or piping blocks that communicates across the unit flooring material in the tray 1 in the vertical or horizontal direction is formed, and the wiring or piping groove is formed in the partition chamber 3'. This shows the case where block 2' having 8 is held. The wiring or piping block 2° may be a plurality of small blocks, as shown in FIG.

In addition, in FIG. 1B, a large number of tubes 9 each having wiring or piping grooves 8 in the partition 3 surrounded on all sides by surrounding walls 5b are arranged so that the bottom wall 5a of the tray partition 3 is the upper surface (subfloor surface). In other words, a large number of blocks are laid so that the outer surface exposed from the partition 3 of the block 2 is supported on the floor construction surface 9, and the wiring or piping groove 8 is communicated between the subfloor materials of each unit. In this way, the floor finishing material 10 is applied on the bottom wall 5a.

As a result, wiring or piping grooves of a desired pattern are formed on the bottom surface of the tray, that is, on the outer surface of the bottom wall 5a of the partition room, directly under the finished flooring 10, and hot water pipes, heating wires, etc. can be piped or wired in advance. Then, underfloor heating is formed. In both the floor assembly structures shown in FIGS. 4 and 5, the 2.2° block held in the partition 3.3'' serves as a strength member that supports the load of walking or equipment.

Next, FIGS. 6 and 7 show the block partition 3 opened on one surface of the tray 1 and the partition 3 opened on the other surface.
A block 2, 2° is held in each partition 3.3, and a wiring or piping groove 8 is provided on the outer surface of the block 2 held in the partition 3' to hold a lock 2 between each block 2. This shows the case where the grooves 8 are made to communicate with each other.

As shown in FIG. 4, a large number of the above-mentioned flooring materials are laid on a floor construction surface 9 such as a concrete slab to form a flooring material, so that the wiring or piping grooves 8 are connected to the adjacent flooring material. The heat-generating member 7 is wired or piped in the wiring or piping groove 8 to form the required pattern, and the floor finishing material 1 is applied to the outer surface of the block group (subfloor surface) where the groove 8 is formed.
By supporting 0, floor heating etc. are constructed directly under the finishing material according to the same method. Floor finishing materials include various panels, sheets, solid colors, etc., which can be laid directly to form a single layer, or combined with insole materials to form a multilayer structure.

Further, FIG. 3 shows a case where the bottom wall 5a of the partition chamber 3 is recessed together with the block 2, and the wiring or piping groove 8 is formed on the outer surface of the bottom wall 5a.

As in the case of FIG. 1A, the partition chamber 3 and block 2 may be replaced by a communicating partition chamber 3 and a single horizontally long block 2°.

As shown in FIG. 5, the above-mentioned flooring material has a floor construction surface formed thereon. As shown in Fig. 9, the block 2'' in which the wiring or piping groove 8 is formed is a single or divided block that crosses each unit flooring material, that is, the tray 1, and the partition chamber 3° crosses the tray. It will be a communicating partition room.

Alternatively, the partitions 3 may be surrounded on all sides by peripheral walls, and each partition 3 may have a block having wiring or piping grooves 8.

As shown in FIG. 8, the flooring material is laid and supported on the floor construction surface 9 with the outer surface of the block 2 exposed on one surface of the tray 1, and the wiring or wiring exposed on the other surface of the tray 1 is supported. A subfloor surface for supporting the floor finishing material 10 is formed on the outer surface side of the piping block 2.

The wiring or piping groove 8 described in each of the above embodiments is the block 2.
2' is formed in an arbitrary shape as shown in FIGS. 10A to 10A. By selecting various forms, communication with adjacent unit subfloor materials can be achieved. The above-mentioned wiring or piping groove 8 can be formed and placed in every block 2.2° of each unit flooring material, and any groove can be used as a wiring or piping groove, or it can be placed in a specific block of each unit flooring material. This is done by providing wiring or piping grooves 8.

As described in detail of the invention, the above-mentioned flooring material can quickly form a flooring surface by laying a group of blocks on a floor construction surface in units of trays, and during this laying, the individual blocks Due to its self-opening properties, it absorbs the unevenness of the floor construction surface, creating a conforming structure, allowing construction to be performed without rattling without requiring leveling of individual blocks, and making it extremely easy to construct the subfloor.

The present invention achieves the above-mentioned effects while forming wiring or piping grooves as described above in the blocks, and by laying a large number of units of the above-mentioned subflooring material, thereby making it possible to improve the distance between adjacent subflooring materials. Wiring or piping grooves of a desired pattern for wiring or piping the heat generating material can be easily formed.

As described above, the present invention takes advantage of the characteristics of the aggregated block-shaped flooring material collected by flexible trays, and is further improved so that it can be appropriately implemented as a flooring material for floor heating, etc.
The purpose is to enrich its functionality and improve its practicality.

[Brief explanation of drawings]

FIG. 1A is a plan view of a subfloor material showing one embodiment of the present invention, FIG. 1B is a plan view of a subfloor material showing another example, and FIG. 2 is a plan view of a subfloor material showing another example.
, FIG. 3 is a sectional view of the subfloor material in Example B, FIG. 3 is a sectional view of the subfloor material in another example, and FIG. 4 is the same as in FIGS.
Fig. 2 is a sectional view showing an example of a floor assembly structure using the subfloor material shown in Fig. 3, Fig. 5 is a sectional view showing an example of a floor assembly structure using the subfloor material shown in Fig. 3, and Fig. 6 is a sectional view showing another example. FIG. 7 is a plan view of the tray in the same example, FIG. 8 is a cross-sectional view of the floor assembly structure using the flooring material of the same example, and FIG. 9 is a cross-sectional view of the flooring material used in the same example. Plan view illustrating wiring or piping block, first
0A to 0E are block plan views illustrating the forms of wiring or piping grooves, respectively. 1... Flexible tray, 2, 2゛... Block, 3... Partition, 8... Wiring or piping groove, 9...
・Floor construction surface, 10...Floor finishing material.

Claims (3)

[Claims] (1) A flooring material characterized by having a flexible tray having a large number of compartments, each compartment holding a block, and having wiring or piping grooves provided on the surface. (2) The flooring material according to claim 1, wherein the wiring or piping groove is formed on an exposed outer surface of the block. (3) A subflooring material characterized in that the wiring or piping groove is formed on the outer surface of the bottom wall of the partition by recessing the bottom wall together with the block.