JPH02239438A - Optical card - Google Patents
Optical cardInfo
- Publication number
- JPH02239438A JPH02239438A JP1058967A JP5896789A JPH02239438A JP H02239438 A JPH02239438 A JP H02239438A JP 1058967 A JP1058967 A JP 1058967A JP 5896789 A JP5896789 A JP 5896789A JP H02239438 A JPH02239438 A JP H02239438A
- Authority
- JP
- Japan
- Prior art keywords
- optical card
- layer
- optical
- hard coat
- curable resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 63
- 229920005989 resin Polymers 0.000 claims abstract description 39
- 239000011347 resin Substances 0.000 claims abstract description 39
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 10
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229920002601 oligoester Polymers 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 16
- 230000005855 radiation Effects 0.000 claims description 6
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 5
- 238000010894 electron beam technology Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 abstract description 20
- 239000000203 mixture Substances 0.000 abstract description 14
- 238000003847 radiation curing Methods 0.000 abstract 4
- 238000006748 scratching Methods 0.000 abstract 2
- 230000002393 scratching effect Effects 0.000 abstract 2
- 238000003848 UV Light-Curing Methods 0.000 abstract 1
- 238000001227 electron beam curing Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 45
- 229920000515 polycarbonate Polymers 0.000 description 11
- 239000004417 polycarbonate Substances 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000004925 Acrylic resin Substances 0.000 description 5
- 229920000915 polyvinyl chloride Polymers 0.000 description 5
- 239000004800 polyvinyl chloride Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920005668 polycarbonate resin Polymers 0.000 description 3
- 239000004431 polycarbonate resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920005672 polyolefin resin Polymers 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 2
- 231100000987 absorbed dose Toxicity 0.000 description 2
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- BCHZICNRHXRCHY-UHFFFAOYSA-N 2h-oxazine Chemical compound N1OC=CC=C1 BCHZICNRHXRCHY-UHFFFAOYSA-N 0.000 description 1
- AGIJRRREJXSQJR-UHFFFAOYSA-N 2h-thiazine Chemical compound N1SC=CC=C1 AGIJRRREJXSQJR-UHFFFAOYSA-N 0.000 description 1
- GJCOSYZMQJWQCA-UHFFFAOYSA-N 9H-xanthene Chemical compound C1=CC=C2CC3=CC=CC=C3OC2=C1 GJCOSYZMQJWQCA-UHFFFAOYSA-N 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- 241000272168 Laridae Species 0.000 description 1
- 229930192627 Naphthoquinone Natural products 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000000298 carbocyanine Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- QDLAGTHXVHQKRE-UHFFFAOYSA-N lichenxanthone Natural products COC1=CC(O)=C2C(=O)C3=C(C)C=C(OC)C=C3OC2=C1 QDLAGTHXVHQKRE-UHFFFAOYSA-N 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- DZVCFNFOPIZQKX-LTHRDKTGSA-M merocyanine Chemical compound [Na+].O=C1N(CCCC)C(=O)N(CCCC)C(=O)C1=C\C=C\C=C/1N(CCCS([O-])(=O)=O)C2=CC=CC=C2O\1 DZVCFNFOPIZQKX-LTHRDKTGSA-M 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- QWYZFXLSWMXLDM-UHFFFAOYSA-M pinacyanol iodide Chemical compound [I-].C1=CC2=CC=CC=C2N(CC)C1=CC=CC1=CC=C(C=CC=C2)C2=[N+]1CC QWYZFXLSWMXLDM-UHFFFAOYSA-M 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は読み出し専用、追加書き込み可能、記録消去が
可能な光カードに関する.
く従来の技術〉
従来より低融点金属或いは存機染料からなる薄膜を記録
層として基村上に設け、これにレーザ光等によりデータ
を薄膜上に記録せしめ、記録されたデータを光学的に再
生する光学記録媒体が知られており、とくにカード状の
光学記録媒体は(以下、光カードとする)記録容量の大
きさから!■気、ICを利用したカードに比べ記録媒体
として最も効果が高いと考えられている.しかし、記録
及び再生を光学的に行うため、その照射の精度を安定的
に維持することが重要であるとともに、情報の書き込み
及び読み出しの際のエラーを生しさせないことが必要で
ある.
光カード(C)は第3図に示すようにカード面上に光記
録部(6)を設けたものであり、従来の光カードにおけ
るその基本構成は、第2図に示す如く光カ一どの特性上
少なくとも次の三つの層から成る.図中(11は表面層
並びに支持体を兼ねる透明基材層であり、記録再生に使
用する光源の波長域で透過率が高く、且つ後工程に於で
変形、劣化等を生じることなく、また機械的強度、光学
的特性を満たすものであれば特に限定されるものではな
く、酸にはポリカーポネート樹脂、アクリル樹脂、ウレ
タン樹脂、エボキシ樹脂、ポリ塩化ビニル樹脂、ポリオ
レフィン樹脂、スチレンボリカーボネートブレンド樹脂
等が用いられる.図中(2)は前記透明基材層に設けら
れる光記録層であり、例えばダイレクト・リード・アフ
ター・ライト(DI?AW)型ではテルル、ビスマス、
アルミニウム等の低融点金属およびその合金からなる無
機系材料或いはアントラキノン系、ナフトキノン系、ト
リフェニルメタン系、カルボシアニン系、メロシアニン
系、キサンテン系、アゾ系、アジン系、チアジン系、オ
キサジン系、フタ口シアニン系等有機色素含む有機染料
で一般に形成され、また消去書き込み可能(EDRAM
)型ではTbFe−GdTbFe, GdTbFe,
TbFe系等光磁気型と相変化型で形成され、また読み
出し専用(ROM>型であればアルミニウム等の高反射
性金属により予め情報を記録した形で形成される.更に
接着層(3)を介して先の透明基材(1)、光記録層(
2)を支持する裏打ち基板(4)がある.この裏打ち基
板は光記録層の保護並びに支持体を兼ねるものであり、
一般には先の透明基材層と同一の材質であるポリカーボ
ネート樹脂、アクリル樹脂、ウレタン樹脂、エボキシ樹
脂、ポリ塩化ビニル樹脂、ポリオレフィン樹脂、スチレ
ンボリカーボネートブレンド樹脂等が用いられる.この
線に光カードは、概ね支持体である透明基材と透明また
は不透明基材である裏打ち基板により光学記録材料を中
に挟持した構造になっている.
この光カードに対する記録・再生方法は、透明基板を通
して光記録層に半導体レーザ等のレーザ光を照射し、そ
のレーザ光の熱によって孔すなわちピット形成させるこ
とにより情報を記録し、この記録の再生は記録時と同一
のレーザ光源を用い、I/!0程度に照射光量を弱めて
記録層に照射し、反射率の変化を検出することで情報を
読み取るというものである.
〈発明が解決しようとする!II!>
しかしながら、記録層上に積層される透明基材は耐擦傷
性が光カードの情報の言き込みおよび読み出しの信頼性
に橿めて大きな影響を及ぼすものである.すなわち従来
より用いられてきたボリカーボネート樹脂、アクリル樹
脂、ウレタン樹脂、エボキシ樹脂、ポリ塩化ビニル樹脂
、ポリオレフィン樹脂、スチレンボリカーボネートブレ
ンド樹脂等の透明基板は多少にかかわらず耐擦傷性が不
十分であり、情報の書き込み、読み出しのエラーの原因
の一つである光カードの携帯、長期間の使用等による傷
が記録面表面に発生し、さらにこの傷に汚れ等が付着す
ることがある.
このため光カードとして実用化する場合の信転性に問題
を残していることになる.
そこで、本発明は上述の問題点を解決すべくなされたも
ので、記録面の耐擦傷性を向上させ、機械的強度および
光学特性に極めて優れた光カードの保護層を設けること
を目的とする.
〈課題を解決するための手段〉
カード基材(裏打ち基板)上に光記録層、透明基材の各
層が順次積層されてなる光カードにおいて、前記透明基
材上に少なくともアクリロイル基をそれぞれ二つ以上有
する放射線硬化型樹脂を二層以上積層してなるハードコ
ート層を設けてなる光カードであり、放射線硬化型樹脂
は紫外線硬化型樹脂または電子線硬化型樹脂であり、少
くともオリゴエステルアクリレート及びウレタンアクリ
レートの混合系からなり、さらにII!する放射線硬化
型樹脂層を最外層に向かうほど硬度が高くなるようにし
た光カードである.
〈作用〉
本発明によれば透明基材の光記録部形成面と反対面に少
なくともアクリロイル基をそれぞれ二つ以上存する放射
線硬化型樹脂を二層以上aNし、最外層に向かうほど硬
度の高い樹脂とすることにより、光カードの携帯および
長期間の使用においても傷の発生を抑え、情報の書き込
み、読み出しに影響を与えることなく、さらに光カード
の可撓性に十分追随可能とするハードコート層が形成さ
れ、従って耐擦傷性および可撓性の高い光カードが得ら
れる.
く実施例〉
以下、本発明を図面の実施例に基づいて詳細に説明する
.
第1図は本発明による光カードの部分拡大断面図であり
、図中(1)で示す透明基材に少なくとも一部に光記録
層(2)を設け、接着層(3)を介して裏打ち基板(4
)を積層し、透明基材(+)の光記録N(2)の積層面
と反対面に少なくとも二層以上のハードコード層(5)
を積層してなる光カードである.本発明におけるハード
コート層(5)は少なくともアクリロイル基をそれぞれ
二つ以上有する放射線硬化型樹脂を二層以上積層したも
ので、この放射線硬化型樹脂は紫外線硬化型樹脂または
電子線硬化型樹脂であり、二層以上積層する場合は最外
層に向ってその硬度が高くなるように積層する.放射線
硬化型樹脂は少なくともアクリロイル基を二つ以上有す
るウレタンアクリレート樹脂、エポキシアクリレート樹
脂、アクリレート樹脂、オリゴエステル、アクリレート
樹脂等があり、好ましくはウレタンアクリレート樹脂お
よびオリゴエステルアクリレート樹脂の混合系からなる
ものがよく、ウレタンアクリレート樹脂成分によりカー
ドに可撓性を付与し、またオリゴエステルアクリレリー
トm脂成分により硬度が付与される.さらに透明基材側
に低い硬度から順次硬度が高くなるように積層すること
により表面の保護層としての役割とともにカードの可撓
性を維持できるものである.
以下、その具体的な実施例について説明する。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a read-only, additionally writable, and record-erasable optical card. Conventional technology> Conventionally, a thin film made of a low-melting point metal or organic dye is provided as a recording layer on the base layer, data is recorded on the thin film using laser light, etc., and the recorded data is optically reproduced. Optical recording media are known, especially card-shaped optical recording media (hereinafter referred to as optical cards) because of their large recording capacity! ■It is considered to be the most effective recording medium compared to cards that use IC. However, since recording and reproduction are performed optically, it is important to maintain stable irradiation accuracy, and it is also necessary to prevent errors when writing and reading information. The optical card (C) has an optical recording section (6) on the card surface as shown in FIG. 3, and the basic structure of a conventional optical card is as shown in FIG. Characteristically, it consists of at least the following three layers. In the figure (11 is a transparent base material layer that serves as both a surface layer and a support), which has high transmittance in the wavelength range of the light source used for recording and reproduction, and which does not cause deformation or deterioration in the subsequent process. There is no particular limitation as long as it satisfies mechanical strength and optical properties, and acids include polycarbonate resins, acrylic resins, urethane resins, epoxy resins, polyvinyl chloride resins, polyolefin resins, and styrene polycarbonate blends. In the figure, (2) is an optical recording layer provided on the transparent base material layer, and for example, in a direct read after write (DI?AW) type, tellurium, bismuth,
Inorganic materials made of low melting point metals such as aluminum and their alloys, or anthraquinone-based, naphthoquinone-based, triphenylmethane-based, carbocyanine-based, merocyanine-based, xanthene-based, azo-based, azine-based, thiazine-based, oxazine-based, lid opening It is generally formed from organic dyes containing organic dyes such as cyanine, and is erasable and writable (EDRAM).
) type is TbFe-GdTbFe, GdTbFe,
It is formed of a magneto-optical type such as TbFe type and a phase change type, and if it is a read-only type (ROM> type, it is formed with information recorded in advance using a highly reflective metal such as aluminum. Furthermore, an adhesive layer (3) is formed. The transparent base material (1) and the optical recording layer (
There is a backing substrate (4) that supports 2). This backing substrate serves both as a protector and a support for the optical recording layer.
Generally, the same materials as the transparent base layer, such as polycarbonate resin, acrylic resin, urethane resin, epoxy resin, polyvinyl chloride resin, polyolefin resin, and styrene polycarbonate blend resin, are used. In this line, an optical card generally has a structure in which an optical recording material is sandwiched between a transparent substrate as a support and a backing substrate as a transparent or opaque substrate. The recording/reproducing method for this optical card is to record information by irradiating the optical recording layer with a laser beam such as a semiconductor laser through a transparent substrate and forming holes or pits by the heat of the laser beam. Using the same laser light source as during recording, I/! In this method, the recording layer is irradiated with a weak irradiation light amount to about 0, and information is read by detecting changes in reflectance. <Invention tries to solve! II! > However, the scratch resistance of the transparent base material laminated on the recording layer has a large effect on the reliability of writing and reading information on the optical card. In other words, transparent substrates made of conventionally used polycarbonate resins, acrylic resins, urethane resins, epoxy resins, polyvinyl chloride resins, polyolefin resins, styrene polycarbonate blend resins, etc. have insufficient scratch resistance regardless of the degree of scratch resistance. , one of the causes of errors in writing and reading information, is the fact that optical cards are carried around and used for long periods of time, which can cause scratches on the recording surface, and dirt can also adhere to these scratches. For this reason, there remains a problem with reliability when it is put into practical use as an optical card. Therefore, the present invention has been made to solve the above-mentioned problems, and its object is to provide a protective layer for an optical card that improves the scratch resistance of the recording surface and has extremely excellent mechanical strength and optical properties. .. <Means for Solving the Problems> In an optical card in which an optical recording layer and a transparent base material layer are sequentially laminated on a card base material (backing substrate), at least two acryloyl groups are provided on each of the transparent base materials. This is an optical card provided with a hard coat layer formed by laminating two or more layers of radiation curable resin having the above, and the radiation curable resin is an ultraviolet ray curable resin or an electron beam curable resin, and at least oligoester acrylate and Consisting of a mixed system of urethane acrylate, and II! This is an optical card with a radiation-curable resin layer whose hardness increases toward the outermost layer. <Function> According to the present invention, two or more layers of radiation-curable resin each having at least two acryloyl groups are formed on the surface opposite to the surface on which the optical recording portion is formed of the transparent substrate, and the hardness of the resin increases toward the outermost layer. This hard coat layer suppresses the occurrence of scratches even when the optical card is carried and used for long periods of time, does not affect the writing and reading of information, and can sufficiently follow the flexibility of the optical card. is formed, thus providing an optical card with high scratch resistance and flexibility. Embodiments Hereinafter, the present invention will be explained in detail based on embodiments shown in the drawings. FIG. 1 is a partially enlarged cross-sectional view of an optical card according to the present invention, in which an optical recording layer (2) is provided on at least a part of a transparent base material shown as (1) in the figure, and is backed with an adhesive layer (3). Substrate (4
) and at least two or more hard code layers (5) on the surface opposite to the laminated surface of the optical recording N (2) of the transparent substrate (+).
This is an optical card made by laminating multiple layers. The hard coat layer (5) in the present invention is a laminated layer of two or more radiation-curable resins each having two or more acryloyl groups, and the radiation-curable resin is an ultraviolet-curable resin or an electron beam-curable resin. If two or more layers are laminated, the hardness increases toward the outermost layer. Radiation-curable resins include urethane acrylate resins having at least two or more acryloyl groups, epoxy acrylate resins, acrylate resins, oligoesters, acrylate resins, etc., and preferably those consisting of a mixed system of urethane acrylate resins and oligoester acrylate resins. The urethane acrylate resin component often imparts flexibility to the card, and the oligoester acrylate resin component imparts hardness. Furthermore, by laminating layers of hardness from low to high on the transparent base material side, it is possible to maintain the flexibility of the card as well as the role of a surface protective layer. A specific example will be described below.
ll1二土
■厚さ0.4s/mで100■/懸X 80m/−サイ
ズの溶融押し出し成形ポリカーボネート基仮に紫外線硬
化型樹脂を塗布し、溝ピッチ12μm、溝幅2.5 μ
m溝深さ0.2ttmの案内溝を成形した厚さ0.3m
7mのニッケルスタンバ板を押しあてポリカーボネート
基板側から紫外線を照射し、樹脂を硬化させることによ
り案内溝を形成した透明基材(1)を作製した.
■■で得た透明基材(1)の案内溝面倒にTeを300
人の厚さで抵抗加熱法により蒸着し、光記録層(2)を
形成した.
■この光記録層(2)上にエボキシ系接着剤(3)(チ
バガイギー社製、アラダイト)を介して0.3a/mの
厚さでIQOmls X Floats サイズの硬質
白色PVC (4)を接着し、硬化後カードサイズ85
.5m/■ X 54m/一に打ち抜き光カードを得た
.
■次に■で得られた光カードのポリカーボネート面上に
、下記組成(a)より成る塗工剤をスピンコーターにて
、乾燥硬化後の膜厚が2〜3ミクロンになるように塗工
して第一ハードコート(51)を得た.
組成(a) ウレタンアクリレート(根上工業四社製
:アートレジンON−730}1c) 50部オリゴ
エステルアクリレート(東亜合成■社製:ア口ニックス
M−6100) 50部計 100部
■■で得られた第一ハードコート(5?)の上に、更に
下記組成(t))より成る塗工剤をスピンコーターにて
、乾燥硬化後の膜厚が2〜3ミクロンになるように塗工
して第二ハードコー} (52)を得た.組成Φ》 ウ
レタンアクリレート(根上工業■社製:アートレジ:/
ON−730IC) 50部オリゴエステルアク
リレート(東亜合成一社製:アロ二ックスM−8030
) 50部計 100部
■その後■■のようにして得られた第一ハードコート層
(51)及び第二ハードコート層(52)を、電子線照
射装宜(日新ハイボルテージ株社製:キャアトロン)を
用いて、吸収線量3.OMradの条件で硬化させ光カ
ードを得た.
■以上のようにして得られた光カードを半導体レーザ(
8aL IOOKHZ)で記録したところ良好な記録が
なされ、更に0.6mWの半導体レーザにて再生処理し
たところ良好な信号が得られ、耐衝撃性や耐折り曲げ性
等の機械的強度もカード使用に十分耐えられるものであ
った.
1」1班二二F
■厚さ0.4m/一で100−/a X 80鏝/−サ
イズの}容融押し出し成形ポリカーボネー}1板の片面
に、下記組成(C)より成る塗工剤を、スプレーガンに
て、乾燥硬化後の膜厚が2〜3ミクロンになるように塗
工して第一ハードコート層(51)を得た.組成(C)
ウレタンアクリレート(II上工業■社製:アート
レジンON−7301IC) 50部オリゴエステ
ルアクリレート(東亜合成■社製:アロニックス?I−
6100) 50部計 100部
■■で得られた第一ハードコート層(51)の上に、更
下記組成(d)より成る塗工剤を、スプレーガンにて、
乾燥硬化後の膜厚が2〜3ミクロンになるように塗工し
て第二ハードコート(52)を得た.組成(d)
ウレタンアクリレート(根上工業一社製=7 − }
レシ:/UN−730}IC) 30部オリゴエステ
ルアクリレート(日本化薬■社製: KAYARAD
MAND) 70部計 100部
■その後■■のようにして得られた第一ハードコート層
(51)及び第二ハードコートli (52)を、電子
線照射装置(日新ハイボルテージ■社製:キュアトロン
)を用いて、吸収線量3.0Mradの条件で硬化させ
た.
■次にこの第一ハードコート層(51)及び第二ハード
コート層(52)を存するポリカーボネート基板の未塗
工面に、紫外線硬化型樹脂を塗布し、溝ビッチ12 t
i m s溝暢2.5 μm、溝深さ0.2μmの案内
溝を成形した厚さ0.3一/一のニッケルスタンバ板を
押しあて、ボリカーボネート基板側から紫外線を照射し
、樹脂を硬化させることにより透明基Fi(1)に案内
溝を形成した.■次に■で得た透明基板(1)の案内湧
面倒にTeを300人の厚さで抵抗加熱法により蒸着し
、光記録層(2)を形成した.
■この光記録層(2)上にエポキシ系接着剤(3)(チ
バガイギー社製、アラルダイト)を介して0.3s/s
の厚さで100m/s X 80■/−サイズの硬質白
色pvc(4)を接着し、硬化後カードサイズ85.5
g/鴎×54一/―に打ち抜き光カードを得た.
■以上のようにして得られた光カードを半導体レーザ(
8a1 10κIIZ)で記録したところ良好な記録が
なされ、更に0.6−kの半導体レーザにて再生処理し
たところ良好な信号が得られ、耐衝撃性や耐折り曲げ性
等の機械的強度もカード使用に十分耐えられるものであ
った.
次に本発明の有効性を確認するために比較例を記載し、
説明する.
i乱且二土
■実施例−1の■■■に記載の方法にて得た光カードの
ポリカーボネート基板面上に同じく実施例−1の■に記
載の組成(alより成る塗工剤を、スピンコーターにて
、乾燥硬化後の膜厚が杓lOミクロンに成るよう塗工し
てハードコート層を付与した.
4医」L例一二」エ
■実施例−1の■■■に記載の方法にて得た光カードの
ポリカーボネートx仮面上に実施例−2の■に記載の組
成(d)より成る塗工剤を、スピンコーターにて、乾燥
硬化後の膜厚が約lOミクロンに成るように塗工してハ
ードコート層を付与した.実施例−1、実施例−2、比
較例−1及び比較例−2にて得られた光カードを半導体
レーザ(8mW,’ IOKHZ)で記録した後、それ
ぞれのハードコート面を、学振型染色物摩擦堅牢試験機
(大栄科学精器製作所社製)を用いて、荷重lOOgの
条件下にて、11500の祇ヤスリで1回擦った.その
後それぞれの光カードを0.6一けの半導体レーザにて
エラーレートを測定した結果を表1に示す.
表一 l
上記の如く、本発明によれば可撓性および耐擦傷性にす
ぐれた光カードが得られることが明らかになった.
く効果〉
以上述べたように本発明による光カードは保護層として
のハードコート層は記録感度を低下さ仕ることなく、光
カードの携帯および長期間の使用においても傷の発律を
抑え、さらに光カードの可廃性に十分追随可能とし得る
ものであるため、安定した高い信転性を与えることが可
能となる.ll1 Two soil ■ Thickness 0.4 s/m, 100 ■ / hanging x 80 m / - size melt extrusion molded polycarbonate base Temporarily coated with UV curable resin, groove pitch 12 μm, groove width 2.5 μm
0.3m thick molded guide groove with depth 0.2ttm
A transparent substrate (1) with guide grooves formed was prepared by pressing a 7 m long nickel standby plate against the polycarbonate substrate and irradiating it with ultraviolet rays to harden the resin. 300 Te in the guide groove of the transparent base material (1) obtained in ■■
The optical recording layer (2) was formed by vapor deposition using a resistance heating method to a thickness of about 100 yen. ■ On this optical recording layer (2), adhere a hard white PVC (4) of IQOmls x Floats size with a thickness of 0.3 a/m via an epoxy adhesive (3) (manufactured by Ciba Geigy, Alladite). , card size 85 after curing
.. A punched optical card was obtained at 5m/■ x 54m/1. ■Next, on the polycarbonate surface of the optical card obtained in step (■), a coating agent consisting of the following composition (a) is applied using a spin coater so that the film thickness after drying and curing is 2 to 3 microns. The first hard coat (51) was obtained. Composition (a) Urethane acrylate (manufactured by Negami Kogyo Shisha Co., Ltd.: Art Resin ON-730} 1c) 50 parts Oligoester acrylate (manufactured by Toagosei ■ Co., Ltd.: Aguchi Nix M-6100) 50 parts total 100 parts Obtained from On top of the first hard coat (5?), a coating agent consisting of the following composition (t)) was further applied using a spin coater so that the film thickness after drying and curing was 2 to 3 microns. Second hard call} (52) was obtained. Composition Φ》 Urethane acrylate (manufactured by Negami Kogyo: Art Register: /
ON-730IC) 50 parts oligoester acrylate (manufactured by Toagosei: Aronix M-8030
) Total of 50 parts 100 parts■Then, the first hard coat layer (51) and second hard coat layer (52) obtained as in ■■ were subjected to electron beam irradiation equipment (manufactured by Nissin High Voltage Co., Ltd.: Absorbed dose 3. An optical card was obtained by curing under OMrad conditions. ■The optical card obtained in the above manner is heated using a semiconductor laser (
8aL IOOKHZ), a good recording was made, and further processing with a 0.6mW semiconductor laser gave a good signal, and the mechanical strength such as impact resistance and bending resistance was sufficient for card use. It was bearable. 1" 1 Group 22F ■ Coating consisting of the following composition (C) on one side of 1 sheet of {melt extrusion molded polycarbonate} of 100-/a x 80-/- size with a thickness of 0.4 m/1. The agent was applied with a spray gun so that the film thickness after drying and curing was 2 to 3 microns to obtain a first hard coat layer (51). Composition (C)
Urethane acrylate (manufactured by II Kamikogyo Co., Ltd.: Art Resin ON-7301IC) 50 parts Oligoester acrylate (manufactured by Toagosei Co., Ltd.: Aronix?I-
6100) 50 parts total 100 parts On top of the first hard coat layer (51) obtained in ■■, a coating agent consisting of the following composition (d) was applied with a spray gun,
A second hard coat (52) was obtained by coating so that the film thickness after drying and curing was 2 to 3 microns. Composition (d) Urethane acrylate (manufactured by Negami Kogyo Co., Ltd. = 7 − }
Recipe: /UN-730}IC) 30 parts oligoester acrylate (manufactured by Nippon Kayaku Corporation: KAYARAD
MAND) 70 copies total 100 copies ■Then, the first hard coat layer (51) and second hard coat li (52) obtained as in ■■ were heated using an electron beam irradiation device (Nissin High Voltage ■: manufactured by Nissin High Voltage ■). Curetron) at an absorbed dose of 3.0 Mrad. ■Next, an ultraviolet curable resin is applied to the uncoated surface of the polycarbonate substrate containing the first hard coat layer (51) and the second hard coat layer (52), and a groove bit 12 t is applied.
A 0.31/1 thick nickel stand board with a guide groove of 2.5 μm in groove width and 0.2 μm in depth was pressed against it, and ultraviolet rays were irradiated from the polycarbonate substrate side to remove the resin. Guide grooves were formed in the transparent base Fi(1) by curing. (2) Next, Te was deposited to a thickness of 300 nm on the guide surface of the transparent substrate (1) obtained in (2) by resistance heating to form an optical recording layer (2). ■ On this optical recording layer (2), an epoxy adhesive (3) (manufactured by Ciba Geigy, Araldite) is applied at 0.3 s/s.
Glue hard white PVC (4) with a thickness of 100m/s
I got a punched optical card for g/gull x 54 1/-. ■The optical card obtained in the above manner is heated using a semiconductor laser (
8a1 10k It was sufficiently durable. Next, a comparative example will be described to confirm the effectiveness of the present invention,
explain. ■ A coating agent of the composition (aluminum) also described in Example-1 (■) was applied on the surface of the polycarbonate substrate of an optical card obtained by the method described in ■■■ of Example-1. A hard coat layer was applied using a spin coater so that the film thickness after drying and curing was 10 microns. On the polycarbonate x mask of the optical card obtained by the method, a coating agent consisting of the composition (d) described in Example 2 (■) was applied using a spin coater until the film thickness after drying and curing was about 10 microns. The optical cards obtained in Example-1, Example-2, Comparative Example-1, and Comparative Example-2 were recorded with a semiconductor laser (8 mW, 'IOKHZ). After that, each hard coat surface was rubbed once with a 11500 Gio file using a Gakushin-type dyed abrasion fastness tester (manufactured by Daiei Kagaku Seiki Seisakusho Co., Ltd.) under a load of lOOg. After that, the error rate of each optical card was measured using a 0.6-digit semiconductor laser, and the results are shown in Table 1. Table 1 As described above, the present invention has excellent flexibility and scratch resistance. It has become clear that an optical card can be obtained. Effects> As described above, in the optical card according to the present invention, the hard coat layer as a protective layer makes the optical card portable and long-lasting without reducing the recording sensitivity. It suppresses the occurrence of scratches even when used for a period of time, and can sufficiently follow the disposable properties of optical cards, making it possible to provide stable and high reliability.
第1図は本発明の光カードの部分拡大断面図であり、第
2図は従来の光カードの部分拡大断面図であり、第3図
は一般的な光カードの正面図である.
(11 3!i明基材
(2) 光記録層
(3) 接着層
(4) 裏打ち基板
(5) ハードコート層
(6) 光記録部
(5l} 第一ハードコート層
(52) 第二ハードコート層
(Cl 光カード
特 許 出 願 人
凸版印刷株式会社
代表者 鈴木和夫FIG. 1 is a partially enlarged sectional view of an optical card of the present invention, FIG. 2 is a partially enlarged sectional view of a conventional optical card, and FIG. 3 is a front view of a general optical card. (11 3! i Bright base material (2) Optical recording layer (3) Adhesive layer (4) Backing substrate (5) Hard coat layer (6) Optical recording section (5l) First hard coat layer (52) Second hard coat Layer (Cl) Optical card patent application Representative Kazuo Suzuki, Toppan Printing Co., Ltd.
Claims (3)
次積層されてなる光カードにおいて、前記透明基材層上
に、少なくともアクリロイル基をそれぞれ二つ以上有す
る放射線硬化型樹脂を二層以上積層してなるハードコー
ト層を設けてなることを特徴とする光カード。(1) In an optical card in which an optical recording layer and a transparent base material layer are sequentially laminated on a card base material, a radiation curable resin each having at least two or more acryloyl groups is provided on the transparent base material layer. An optical card characterized by having a hard coat layer formed by laminating two or more layers.
電子線硬化型樹脂であり、少くともオリゴエステルアク
リレート及びウレタンアクリレートの混合系からなるこ
とを特徴とする請求項1記載の光カード、(2) The optical card according to claim 1, wherein the radiation curable resin is an ultraviolet curable resin or an electron beam curable resin, and is composed of a mixed system of at least oligoester acrylate and urethane acrylate.
ードコート層を有する光カードにおいて、積層する放射
線硬化型樹脂を最外層に向けて硬度を高くすることを特
徴とする請求項1記載の光カード。(3) In the optical card having a hard coat layer formed by laminating two or more layers of the radiation curable resin, the hardness of the laminated radiation curable resin is increased toward the outermost layer. light card.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1058967A JPH02239438A (en) | 1989-03-10 | 1989-03-10 | Optical card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1058967A JPH02239438A (en) | 1989-03-10 | 1989-03-10 | Optical card |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02239438A true JPH02239438A (en) | 1990-09-21 |
Family
ID=13099616
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1058967A Pending JPH02239438A (en) | 1989-03-10 | 1989-03-10 | Optical card |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02239438A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008217980A (en) * | 2000-06-28 | 2008-09-18 | Tdk Corp | Evaluation method of optical information medium |
JP2009190307A (en) * | 2008-02-15 | 2009-08-27 | Bridgestone Corp | Manufacturing method of electroformed mold |
-
1989
- 1989-03-10 JP JP1058967A patent/JPH02239438A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008217980A (en) * | 2000-06-28 | 2008-09-18 | Tdk Corp | Evaluation method of optical information medium |
JP2012018756A (en) * | 2000-06-28 | 2012-01-26 | Tdk Corp | Evaluation method of optical information medium |
JP2009190307A (en) * | 2008-02-15 | 2009-08-27 | Bridgestone Corp | Manufacturing method of electroformed mold |
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