JPH02235363A - Hermetic seal cover and its manufacture - Google Patents
Hermetic seal cover and its manufactureInfo
- Publication number
- JPH02235363A JPH02235363A JP5489089A JP5489089A JPH02235363A JP H02235363 A JPH02235363 A JP H02235363A JP 5489089 A JP5489089 A JP 5489089A JP 5489089 A JP5489089 A JP 5489089A JP H02235363 A JPH02235363 A JP H02235363A
- Authority
- JP
- Japan
- Prior art keywords
- cover
- seal ring
- seal
- ring
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims abstract description 7
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 6
- 239000000956 alloy Substances 0.000 claims abstract description 6
- 238000002844 melting Methods 0.000 claims abstract description 5
- 230000008018 melting Effects 0.000 claims abstract description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052738 indium Inorganic materials 0.000 claims abstract description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 4
- 230000001590 oxidative effect Effects 0.000 claims abstract description 4
- 238000005219 brazing Methods 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000005304 joining Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 abstract 2
- 239000000919 ceramic Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は低コスト高信頼性のハーメチックシール力バー
とその製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a low cost and highly reliable hermetic sealing force bar and a method for manufacturing the same.
半導体素子のパンケージングの一種にセラミックパソケ
ージがある。この型のパッケージは内部に配線を形成し
た積層セラミック基板を用いるもので、素子搭載部の上
部を金属製（通常コバール製）カバーで覆うようになっ
ている。このようなカバーをハーメチックシールカバー
と呼んでいる。A type of pancaging for semiconductor devices is a ceramic pathcage. This type of package uses a multilayer ceramic substrate with wiring formed inside, and the top of the element mounting area is covered with a metal cover (usually made of Kovar). Such a cover is called a hermetic seal cover.
このハーメチックシールカバーは種々の構造のものがあ
り、最も簡単なものではコバール板を所要の寸法に打抜
き成型しただけのものがあり、最も複雑なものではこれ
にニッケルメッキと金メッキを施し、更にリング状に成
型したろう材（シールリング）を張り合せたものが代表
的である。This hermetic seal cover has various structures, the simplest one is just a Kovar plate punched and molded to the required dimensions, and the most complex one is nickel-plated and gold-plated, and has a ring. A typical example is one made by laminating brazing filler metal (seal ring) molded into a shape.
第４図に拡大して断面図で示すシール力バー１はそのよ
うなハーメチックシールカバーの一種で、金属製カバー
本体２に鉛、錫、インジウム等を主成分とする合金ろう
材製のシールリング３が被着されている．このシールカ
バー１はカバー本体２とシールリング３を周縁がほぼ一
致するように重ね合せ、非酸化性雰囲気中で該シールリ
ングの融点よりも低い温度に加熱すると共に周縁部全周
に亘って加圧してカバーとシールリングを接合せしめる
ことにより得られる．このようにカバー１は比較的簡単
に製造できる上、シールリング３を保持しているので、
セラミック基板の所要箇所に載置して全体を加熱するだ
けで金属製カバー本体２をセラミック基板に接合するこ
とができ、低コストのパンケージングが可能である．
〔発明が解決しようとする課題〕
ところがこの構造のシール力バー１を用いたパッケージ
は、第５図に示すようにカバー本体２の側面がろう材３
で濡れず、断面でみるとカバー本体２の外側にろう材３
が山形に盛り上った形状となる．このような接合状況は
カバー本体２とセラミンク基板８との接合に不信感を抱
かせる上、実際上もろう材３の山とカバー本体２との間
の溝が原因で気密が破れる可能性がある。The sealing force bar 1 shown in an enlarged cross-sectional view in FIG. 3 is attached. This seal cover 1 is made by stacking a cover main body 2 and a seal ring 3 so that their circumferential edges almost coincide with each other, heating the cover body 2 to a temperature lower than the melting point of the seal ring in a non-oxidizing atmosphere, and applying heat to the entire circumference of the seal ring. Obtained by pressing the cover and seal ring together. In this way, the cover 1 can be manufactured relatively easily, and since it holds the seal ring 3,
The metal cover main body 2 can be bonded to the ceramic substrate simply by placing it on a desired location on the ceramic substrate and heating the whole, making it possible to perform pancaging at low cost. [Problems to be Solved by the Invention] However, in a package using the sealing force bar 1 having this structure, as shown in FIG.
If you look at the cross section, there is a brazing material 3 on the outside of the cover body 2.
becomes a mountain-like shape. Such a bonding situation not only makes the bonding between the cover body 2 and the ceramic substrate 8 untrustworthy, but also actually raises the possibility that the airtightness will be broken due to the groove between the peak of the filler metal 3 and the cover body 2. be.
本発明の目的は上記構造のシールカバーの欠点を解消し
、信鎖性の高いハーメチックシールカバーを提供するこ
とにある。An object of the present invention is to eliminate the drawbacks of the seal cover having the above structure and to provide a hermetic seal cover with high reliability.
上記目的を達成するため本発明のハーメチックシールカ
バーは金属製カバーの側面にも主面と同一の合金ろう材
を被着した点に特徴がある。またこのハーメチックシー
ルカバーの製造方法は、金属製カバーとその外形より幾
分大き目の外形寸法を有するシールリングとを重ね、該
金属製カバーがほぼ収容し得る大きさの窪みを有する金
型にシールリングを下向きにして嵌め込み、非酸化性雰
囲気中で該シールリングの融点よりも低い温度に加熱し
且つ上記カバーの周縁部を全周に亘って加圧してカバー
とシールリングを接合すると共にカバー側面もシールリ
ングのろう材で被覆する点に特徴がある。In order to achieve the above object, the hermetic seal cover of the present invention is characterized in that the side surfaces of the metal cover are coated with the same alloy brazing material as the main surface. In addition, this method for manufacturing a hermetic seal cover involves stacking a metal cover and a seal ring having an outer dimension slightly larger than the outer diameter of the metal cover, and sealing the cover in a mold having a recess that is large enough to accommodate the metal cover. The ring is fitted with the ring facing downward, heated in a non-oxidizing atmosphere to a temperature lower than the melting point of the seal ring, and the periphery of the cover is pressurized all around to join the cover and the seal ring, and the side surface of the cover is The seal ring is also characterized by being covered with a brazing filler metal.
第１図は本発明のハーメチックシールカバー１１の拡大
断面図で、金属製カバー本体１２の下面周縁部及び側面
に全周に亘って鉛、錫、インジウム等を主成分とする合
金ろう材ｌ３が被着されている．このシールカバー１１
は第３図に示すように金属製カバー１２がほぼ収容し得
る大きさの窪み１４を有する金型１５に、カバー本体１
２より外形が幾分大きいシールリング１６を置き、その
上にカバー本体１２を置いて上方より押圧棒ｌ７で押し
付けてシールリングｌ６とカバー本体ｌ２を窪みｌ４に
嵌入させ、非酸化性雰囲気中でシールリング１６の融点
よりも低い温度に加熱し且つ上記カバー本体１２を更に
加圧することによって得ることができる．該窪み１４か
らのカバー１１の取出しは、押上げ棒１８の上昇によっ
て行うことができる．
〔作 用〕
本発明のシールカバー１１を用いたパッケージは第２図
に示すようにカバー本体１２の側面までろう材１３で覆
われ、外観上も実際上も信顧性の高いものである。FIG. 1 is an enlarged sectional view of the hermetic seal cover 11 of the present invention, in which an alloy brazing filler metal 13 mainly composed of lead, tin, indium, etc. is applied to the lower peripheral edge and side surface of the metal cover body 12 all around the circumference. It is covered. This seal cover 11
As shown in FIG. 3, the cover body 1 is placed in a mold 15 having a recess 14 large enough to accommodate the metal cover 12.
Place the seal ring 16 whose outer diameter is somewhat larger than that of the seal ring 16, place the cover body 12 on top of the seal ring 16, and press it from above with a pressing rod l7 to fit the seal ring l6 and the cover body l2 into the recess l4, and then place the cover body 12 on top of the seal ring 16. This can be obtained by heating the cover body 12 to a temperature lower than the melting point of the seal ring 16 and further pressurizing the cover body 12. The cover 11 can be removed from the recess 14 by raising the push-up rod 18. [Function] As shown in FIG. 2, the package using the seal cover 11 of the present invention is covered with the brazing material 13 up to the side surface of the cover body 12, and is highly reliable both in appearance and in practice.
カバー本体１２は通常金属条のプレス打抜きによって得
られるが、このような打抜き品の場合、その側面は剪断
面と破断面を有する。第４図に示すカバー本体２もその
ような側面を有し、破断面が酸化し易いためにろう材３
に対して濡れにくくなると思われる。これに対して本発
明のように破断面の酸化が起る前に周縁部と側面へろう
材を被着せしめればもはや側面の酸化を防止でき、濡れ
性の良好なシール部が得られるのである。The cover body 12 is usually obtained by press punching a metal strip, and in the case of such a punched product, its side surfaces have sheared surfaces and fractured surfaces. The cover main body 2 shown in FIG. 4 also has such a side surface, and since the fractured surface is easily oxidized,
It seems that it becomes difficult to get wet. On the other hand, if the brazing material is applied to the peripheral edge and side surfaces before the oxidation of the fractured surface occurs as in the present invention, oxidation of the side surfaces can be prevented and a seal with good wettability can be obtained. be.
カバー本体１２が酸化し易い材質であるときは、カバー
本体１２を太き目に作っておき、シールリングを加熱圧
接した後、シールリング層を下に向けてプレスに供し、
上金型と下金型のクリアランスを小さ《して所要の大き
さのシール力バーを打抜くと良い．このようにすればカ
バー本体の側面が形成されるのと殆んど同時にろう材で
の被覆が行われ、側面を酸化膜の全くない状態で被覆す
為ことができる．
〔発明の効果〕
本発明のシール力バーによれば、外観上も実質上も充分
なハーメチックシールを行うことができ、半導体パッケ
ージの信鯨性を高めることができる．When the cover body 12 is made of a material that is easily oxidized, the cover body 12 is made thicker, the seal ring is welded under heat and pressure, and then the seal ring layer is turned downward and subjected to pressing.
It is best to reduce the clearance between the upper and lower molds and punch out a sealing force bar of the required size. In this way, the coating with the brazing metal is carried out almost at the same time as the side surfaces of the cover body are formed, and it is possible to coat the side surfaces with no oxide film at all. [Effects of the Invention] According to the sealing force bar of the present invention, sufficient hermetic sealing can be performed both visually and practically, and the reliability of the semiconductor package can be improved.
第１図は本発明のハーメチックシールカバーの拡大断面
図、第２図はこれを用いた半導体装置パッケージのシー
ル部断面図、第３図は本発明のハーメチックシール力バ
ーを製造するための装置の概念図、第４図は従来のハー
メチックシールカバーの拡大断面図、第５図はこれを用
いた半導体装置パッケージのシール部断面図である。
１１・・・本発明のハーメチックシールカバー、１２・
・・カバー本体、ｌ３・・・合金ろう材、１５・・・金
型、１６・・・シールリング、ｌ７・・・押圧棒．！Ｉ
３ａｌＩ
特許出願人 住友金属鉱山株式会社FIG. 1 is an enlarged cross-sectional view of the hermetic seal cover of the present invention, FIG. 2 is a cross-sectional view of the seal portion of a semiconductor device package using the cover, and FIG. 3 is a diagram of an apparatus for manufacturing the hermetic seal force bar of the present invention. A conceptual diagram, FIG. 4 is an enlarged sectional view of a conventional hermetic seal cover, and FIG. 5 is a sectional view of a seal portion of a semiconductor device package using the same. 11... Hermetic seal cover of the present invention, 12.
...Cover body, l3...Alloy brazing material, 15...Mold, 16...Seal ring, l7...Press rod. ! I
3alI Patent applicant Sumitomo Metal Mining Co., Ltd.
Claims (2)
の周縁部及び側面に全周に亘って鉛、錫、インジウム等
を主成分とする合金ろう材が被着されていることを特徴
とするハーメチックシールカバー。(1) A metal cover for a hermetic seal is characterized by having an alloy brazing filler metal mainly composed of lead, tin, indium, etc. applied to the peripheral edge and side surface of one main surface all around the circumference. Hermetic seal cover.
の外形より幾分大き目の外形寸法を有する鉛、錫、イン
ジウム等を主成分とする合金ろう材製のシールリングと
を重ね合せ、これらをシールリングを下向きにして金属
製カバーをほぼ収容し得る大きさの窪みを有する金型に
嵌め込み、非酸化性雰囲気中で該シールリングの融点よ
りも低い温度に加熱すると共に上記カバーの周縁部を全
周に亘って加圧してカバーをシールリングと接合すると
共にカバー側面もシールリングのろう材で被覆すること
を特徴とするハーメチックシールカバーの製造方法。(2) A metal cover for hermetic sealing and a seal ring made of an alloy brazing material whose main components are lead, tin, indium, etc. and whose external dimensions are slightly larger than the outer dimensions of the cover are overlapped, and these are sealed. The ring is placed facing downward into a mold having a recess large enough to accommodate the metal cover, heated in a non-oxidizing atmosphere to a temperature lower than the melting point of the seal ring, and the entire periphery of the cover is heated. A method for producing a hermetic seal cover, which comprises joining the cover to the seal ring by applying pressure around the circumference, and also covering the side surface of the cover with the brazing material of the seal ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5489089A JPH02235363A (en) | 1989-03-09 | 1989-03-09 | Hermetic seal cover and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5489089A JPH02235363A (en) | 1989-03-09 | 1989-03-09 | Hermetic seal cover and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02235363A true JPH02235363A (en) | 1990-09-18 |
Family
ID=12983187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5489089A Pending JPH02235363A (en) | 1989-03-09 | 1989-03-09 | Hermetic seal cover and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02235363A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04174544A (en) * | 1990-11-07 | 1992-06-22 | Mitsubishi Materials Corp | Hermetic seal lid |
-
1989
- 1989-03-09 JP JP5489089A patent/JPH02235363A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04174544A (en) * | 1990-11-07 | 1992-06-22 | Mitsubishi Materials Corp | Hermetic seal lid |
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