JPH02235304A - Inductance element and manufacture thereof - Google Patents
Inductance element and manufacture thereofInfo
- Publication number
- JPH02235304A JPH02235304A JP1056803A JP5680389A JPH02235304A JP H02235304 A JPH02235304 A JP H02235304A JP 1056803 A JP1056803 A JP 1056803A JP 5680389 A JP5680389 A JP 5680389A JP H02235304 A JPH02235304 A JP H02235304A
- Authority
- JP
- Japan
- Prior art keywords
- coil
- resin
- ferrite powder
- inductance element
- molded body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 5
- 229920005989 resin Polymers 0.000 claims abstract description 42
- 239000011347 resin Substances 0.000 claims abstract description 42
- 239000000843 powder Substances 0.000 claims abstract description 37
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims abstract description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000011230 binding agent Substances 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims 1
- 230000006866 deterioration Effects 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- 238000000748 compression moulding Methods 0.000 description 9
- 230000005291 magnetic effect Effects 0.000 description 5
- 238000001721 transfer moulding Methods 0.000 description 5
- 230000035699 permeability Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910017518 Cu Zn Inorganic materials 0.000 description 2
- 229910017752 Cu-Zn Inorganic materials 0.000 description 2
- 229910017943 Cu—Zn Inorganic materials 0.000 description 2
- 241000252233 Cyprinus carpio Species 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 229940093475 2-ethoxyethanol Drugs 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、各種電子機器に利用されるインダクタンス素
子およびその製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an inductance element used in various electronic devices and a method for manufacturing the same.
従来の技術
近年、電子機器の小型化軽量化に伴い、電子部品の高密
度面実装が進み、それに使われるチップ部品の小型化．
薄型化が要求されている。Conventional technology In recent years, as electronic devices have become smaller and lighter, electronic components have become more densely surface-mounted, and the chip components used in them have become smaller.
There is a demand for thinner products.
その中でインダクタンス素子は、導体をコイル状にした
構成としなければならないため、抵抗やコンデンサに比
べて小型化が遅れている。Among these, inductance elements must have a structure in which the conductor is coiled, so miniaturization has been slower than with resistors and capacitors.
巻線型のインダクタンス素子を小型化する場合にフェラ
イトの焼結体コアを小さくすることが必要で、現状です
でに小型化できる限界の大きさに達している。これ以上
の小型化の要望に対してこの焼結体コアを無くシたコア
レスインダクタンス素子が考案されている。しかし高透
磁率の焼結体コアを内包していないためインダクタンス
値は小さい。このインダクタンス値を上げるため、封止
成形樹脂中にフェライト粉本を混入する方式が考案され
ている。しかしトランスファー成形や射出成形方式で封
止成形しており、樹脂の流れ性が必要なため、樹脂量を
少なくすることができない。In order to miniaturize a wire-wound inductance element, it is necessary to reduce the size of the sintered ferrite core, and at present the size has already reached the limit for miniaturization. In response to the demand for further miniaturization, a coreless inductance element without this sintered core has been devised. However, since it does not include a sintered core with high magnetic permeability, the inductance value is small. In order to increase this inductance value, a method has been devised in which ferrite powder is mixed into the sealing molding resin. However, since sealing is performed using transfer molding or injection molding, and resin flowability is required, it is not possible to reduce the amount of resin.
このため、フェライト粉本の含有量は最大でも８７重量
％程度であり、フェライト粉末を含有した成形樹脂の初
透磁率（μｉａｃ ）は６〜９と小さく、これを成形樹
脂としたインダクタンス素子のインダクタンス値は小さ
い。Therefore, the content of ferrite powder is about 87% by weight at most, and the initial magnetic permeability (μiac) of molded resin containing ferrite powder is as small as 6 to 9, and the inductance of an inductance element using this molded resin is as low as 6 to 9. The value is small.
発明が解決しようとする課題
上述のようにコアレスイングクタンス素子は小型化，薄
型化が可能で有望であるものの、インダクタンス値が低
く、高特性化が望まれている。Problems to be Solved by the Invention As mentioned above, coreless inductance elements are promising because they can be made smaller and thinner, but they have a lower inductance value and are desired to have higher characteristics.
本発明はフェライト粉本を含有した成形樹脂の高透磁率
化とその封止成形方法を課題として険討し、高インダク
タンス値を有するコアレスのインダクタンス素子を提供
することを目的としている。The present invention aims to provide a coreless inductance element having a high inductance value by tackling the challenges of increasing the magnetic permeability of a molding resin containing ferrite powder and a sealing molding method thereof.
課題を解決するための手段
上記課題を解決するために本発明は，熱硬化性樹脂で固
化されたコイルが、樹脂をバインダーとしたフェライト
粉末成形体で封止成形された構成としたものである。Means for Solving the Problems In order to solve the above problems, the present invention has a structure in which a coil solidified with a thermosetting resin is sealed and molded with a ferrite powder molded body using resin as a binder. .
作用
上記構成とすることにより、高インダクタンス値を有し
、特性的にも優れたインダクタンス素子が提供できるこ
とになる。Effect: By having the above structure, an inductance element having a high inductance value and excellent characteristics can be provided.
実施例 以下、本発明の実施例について説明する。Example Examples of the present invention will be described below.
まず、本発明の基本的な考え方について説明する。First, the basic idea of the present invention will be explained.
高インダクタンス値にするために、成形樹脂中のフェラ
イト粉本の含有量を８８〜９７重量％に高めた。これに
よって成形樹脂は、ほとんどフェライト粉本となり、流
，れ性は極めて悪く従来のトランスファー成形や射出成
形を用いることはできない。そこで圧縮成形法を採用す
ることにし念。In order to obtain a high inductance value, the content of ferrite powder in the molding resin was increased to 88 to 97% by weight. As a result, the molding resin becomes mostly ferrite powder, and its flowability is extremely poor, making it impossible to use conventional transfer molding or injection molding. Therefore, we decided to use the compression molding method.
ところが圧縮成形法では、内蔵されたコイルが圧力によ
って変形し、シ１−トを起してしまうため、強度があり
かつ絶縁性の高い熱硬化性樹脂でコイルを固化すること
でコイルに耐圧性を持たせると共に、銅線間の絶縁性を
向上させ念。However, in the compression molding method, the built-in coil deforms due to pressure and causes sheets, so by solidifying the coil with a thermosetting resin that is strong and highly insulating, it is possible to make the coil pressure resistant. At the same time, it is important to improve the insulation between copper wires.
すなわち、第１図に示すように熱硬化性樹脂で固化され
たコイ）ｖ１が、コム端子２上に配置され、樹脂ヲパイ
ンダーとしたフェフイト粉木成形体３でコイル１および
コム端子２の一部を除いて封止成形したものである。That is, as shown in FIG. 1, a carp v1 solidified with a thermosetting resin is placed on the com terminal 2, and a part of the coil 1 and the com terminal 2 is placed on the fephite powder wood molded body 3 with resin as a binder. It is sealed and molded except for.
父、樹脂をバイングーとしたフェライト粉本成形体３に
おけるフェライト粉末の含有量を８８〜９７重量％に上
げたものである。First, the content of ferrite powder in the ferrite powder main molded body 3 in which the resin is baingu is increased to 88 to 97% by weight.
さらに、その製造方法は、絶縁性皮覆銅線を巻いたコイ
ルと作り、このコイルに溶剤で薄めた熱硬化性樹脂を倹
市含浸し、ついで固化熱処理を施し、この熱硬化性樹脂
で固化されたコイＡ／１を、樹脂をバインダーとしたフ
ェライト粉末成形体３で覆い加圧してコイルを封止成形
し、そのあと必要に応じて固化熱処理を施すことを特徴
とするものである。Furthermore, the manufacturing method involves making a coil wrapped with insulating coated copper wire, impregnating this coil with a thermosetting resin diluted with a solvent, then subjecting it to solidification heat treatment, and solidifying it with this thermosetting resin. The coil A/1 is covered with a ferrite powder molded body 3 using a resin as a binder and pressurized to seal and mold the coil, and then subjected to solidification heat treatment as required.
上述のように、熱硬化性樹脂でコイルを固定することに
より、圧縮成形でフェライト粉末を通してコイル１を加
圧しても、コイ〃１は約１ ｔｏｎ／，Ｊまでの圧力で
は冫１とんど変形せず又ショートを起こさない。As mentioned above, by fixing the coil with a thermosetting resin, even if the coil 1 is pressurized through ferrite powder by compression molding, the coil 1 will not be as strong as the coil 1 at pressures up to about 1 ton/J. It does not deform and does not cause short circuits.
又、圧縮成形により、成形体中のフェライト粉本含有量
を８８〜９７重量％に増すことができ，これによってフ
ェライト粉木成形体３の初透磁率をμｉｌｏ＝１０〜３
ｏと大巾に高めることができ，これによって封止成形し
たインダクタンス素子のインダクタンス値を高くするこ
とができる。Moreover, by compression molding, the content of ferrite powder in the molded body can be increased to 88 to 97% by weight, thereby increasing the initial magnetic permeability of the ferrite powder wood molded body 3 to μilo = 10 to 3.
o, and thereby the inductance value of the encapsulated inductance element can be increased.
以下本発明について具体的な実施例にて詳細に説明する
。The present invention will be described in detail below using specific examples.
銅線直径か３０μｍの絶縁皮覆銅線を直径がＱ．６ｍｍ
の芯棒に８０ターン巻線した。巻き巾はＱ．８ｆｆｌＯ
ｌに制限した。巻き上かつ念コイルの外径は１ｊｆｌｌ
ｌ１であった。熱硬化性樹脂である２液性のエボキシ樹
脂を混合し、そこへ溶剤として２エトキシエタノールを
エポキシ樹脂の重量の３倍のａを加えてかき混ぜた液を
、上述のコイ／Ｉ／Ｋ塗って中まで浸みこませ、軽く熱
風乾燥させて芯棒から外し，上述のエボキシ樹脂を固着
剤として塗布してあるコム端子２上にのせて１６０℃で
３０分熱処理してエボキシ樹脂を硬化させた。用いた銅
．％Ｉはポリウレタン皮覆銅線で，皮覆銅線の直径は４
４μｍあり九。この銅線の皮覆付の占積率は６８％で残
りの空間４２％にエボキシ樹脂が固化して・はいってい
ると考えられる。A copper wire with a diameter of Q. 6mm
80 turns were wound around the core rod. The roll width is Q. 8fflO
limited to l. The outer diameter of the winding coil is 1jfl
It was l1. Mix two-component epoxy resin, which is a thermosetting resin, and add 2-ethoxyethanol as a solvent in an amount of 3 times the weight of the epoxy resin and stir. Apply the above-mentioned Koi/I/K. It was soaked into the inside, lightly dried with hot air, removed from the core rod, placed on the com terminal 2 coated with the above-mentioned epoxy resin as a fixing agent, and heat-treated at 160° C. for 30 minutes to harden the epoxy resin. Copper used. %I is polyurethane coated copper wire, and the diameter of the coated copper wire is 4
9 with 4μm. The space factor of this copper wire covered with a skin is 68%, and the remaining space of 42% is thought to be filled with solidified epoxy resin.
一方、Ｎｉ − Ｚｎ系フェライト粉末を秤量し、そこ
へ上述のエポキシ樹脂溶液を溶剤を除いた重量で３〜１
６重量％分秤量し、フェライト粉本に混入しよく混合混
練した。On the other hand, Ni-Zn ferrite powder was weighed, and the above-mentioned epoxy resin solution was added thereto in an amount of 3 to 1
An amount of 6% by weight was weighed out, mixed into a ferrite powder, and thoroughly mixed and kneaded.
圧縮成形金型の下金型にコイル付コム端子を置いて固定
し，上金型を置いて組み合せ，コイ／Ｌ／１が上下金型
の中央部空間に浮いた状態にし、下ポンチをスベーサを
さしこんで下げて、前述のエポキシ樹脂が混練付着して
いるフェライト粉末を秤量して、金型の上部から入れ、
上ポンチを入れ、軽く振動を加えてから下ポンチのスペ
ーサを抜いて，エヤープレスで最大１ｔｏｎ／一の圧力
を上下ポンチに加えた。加圧時間は約１０秒間であった
。Place and fix the com terminal with coil in the lower mold of the compression molding mold, place the upper mold and assemble it, so that the Coil/L/1 is floating in the center space of the upper and lower molds, and the lower punch is placed on the flat surface. Weigh out the ferrite powder to which the epoxy resin is kneaded and adhered, and insert it into the mold from the top.
After inserting the upper punch and applying slight vibration, the spacer of the lower punch was removed, and a maximum of 1 ton of pressure was applied to the upper and lower punches using an air press. The pressurization time was about 10 seconds.
その後、金型から成形物を外し，１５０Ｃで３０分熱処
理してエボキシ樹脂を硬化させた。そのあとコム端子２
部を切断し曲げ加工して、縦１．６ｍｆｌｌ，横３．２
ｆｆｌｍ，高さ１ｊｍｍのインタリタンス素子とした。Thereafter, the molded product was removed from the mold and heat treated at 150C for 30 minutes to harden the epoxy resin. Then com terminal 2
After cutting and bending the part, it became 1.6mfl in length and 3.2m in width.
fflm, height 1jmm.
でき上がったインダクタンス素子の断面を模式的に示し
たのが第１図である。FIG. 1 schematically shows a cross section of the completed inductance element.
比較のため，従来法のものも準備した。従来法で、本発
明と異なるところは、巻き上がったコイルを固定するの
にアルコールで薄めたプチラール樹脂を用いたことと、
コイルの封止成形は、エポキシ樹脂とフェライト粉末混
練ペレット（フェライト粉木含有量８６重量％）を用い
て、トランスファー成形を行ったことである。For comparison, a conventional method was also prepared. The conventional method differs from the present invention in that petitral resin diluted with alcohol was used to fix the wound coil.
The coil was encapsulated by transfer molding using epoxy resin and ferrite powder kneaded pellets (ferrite powder content: 86% by weight).
その結果を下表に示す。The results are shown in the table below.
測定結果から５フェライト粉本の含有量を増すことによ
りインダクタンス値Ｌは向上し、又Ｑの最大値Ｑｍａｘ
も向上している。８５重量％ではトランスファー成形と
比較すると多少減少しているのはコイルを熱硬化性樹脂
で覆っているため、その分だけフェライト粉本の占める
体積割合がコイル近傍で減ったためと考えられる。From the measurement results, the inductance value L is improved by increasing the content of 5 ferrite powder, and the maximum value of Q
has also improved. At 85% by weight, there is a slight decrease compared to transfer molding, which is thought to be because the coil is covered with a thermosetting resin, so the volume ratio occupied by ferrite powder in the vicinity of the coil is reduced accordingly.
又、含有量を９７重量％を越して検討したが、樹脂の量
が少なすぎて、封止成形体の機械的強度が低下し、フェ
ライト粉木がとれたりすることがあり、実用上問題がで
た。それ故、本発明の効果を発揮するフェライト粉本含
有量は，従来法のトランスファー成形法等よりも明らか
に効果の出る８８〜９７重量％の範囲である。In addition, although we considered increasing the content to more than 97% by weight, the amount of resin was too small and the mechanical strength of the encapsulated molded body decreased and the ferrite powder could come off, which caused practical problems. It came out. Therefore, the ferrite powder content that exhibits the effects of the present invention is in the range of 88 to 97% by weight, which is clearly more effective than conventional transfer molding methods.
又、従来法でのコイルを用いて圧縮成形法で封止成形し
たところ、２ｏＯｋｇ／一の圧力においてもコイルがシ
曹−トを起し、インダクタンス値は九とえば０４０Ｂμ
Ｈというような極めて小さな値となった。Furthermore, when a conventional coil was encapsulated by a compression molding method, the coil caused carbonation even at a pressure of 200kg/1, and the inductance value was 9, for example, 040Bμ.
It became an extremely small value of H.
本発明における圧縮成形での圧力は、実施例の場合で最
大が１ｔｏｎ／一であった。１ｔｏｎ／，４を越えると
コイルが変形してシ望一トを起す場合が出た。又圧力を
４ｏＯｋｇ／一以下にすると、フェライト粉本成形体の
機械的強度が弱く、実用上問題が出た。それ故成形圧力
は４００〜１ｏｏＯｋｇ ／ （４と言える。しかし、
これは用いた樹脂の種類や品種によって左右され、コイ
ルを固定する熱硬化性樹脂として今以上に機械的強度の
強いものが開発されれば、１ｔｏｎ／ｒ−４以上の圧力
に対しても耐えられるであろう。又フェライト粉本を接
着する樹脂として接着力の強いもので小さな圧力で密度
が充分あげられるものがあれば、圧縮成形の圧力は４ｏ
ｏ ｋｇ ／一よりも下げられるであろう。The maximum pressure during compression molding in the present invention was 1 ton/1 in the example. When it exceeds 1 ton/.4, the coil may deform and cause a crash. Furthermore, when the pressure was lower than 4 okg/1, the mechanical strength of the ferrite powder molded body was weak, which caused a practical problem. Therefore, the molding pressure can be said to be 400 to 1ooOkg/(4.However,
This depends on the type and type of resin used, and if a thermosetting resin that fixes the coil with stronger mechanical strength than now is developed, it will be able to withstand pressures of 1 ton/r-4 or more. It will be done. Also, if the resin used to bond the ferrite powder book has a strong adhesive force and can sufficiently increase the density with a small pressure, the compression molding pressure should be 4 o.
It will be lower than 0 kg/1.
本発明におけるコイルを固定する熱硬化性樹脂は、エボ
キシ樹脂が最適であるが、池の熱硬化性樹脂、たとえば
ジアリルフタレート樹脂やフェノール樹脂も用いること
ができる。又、フェライト粉本と混ぜてパインダ・一と
して用いる樹脂としては、実施例ではエボキシ樹脂を用
いたが，コイル固定用の樹脂と同じにする必要はなく、
接着性や耐熱性を満足する樹脂であれば良くたとえば上
述のフェノール樹脂等を用いることができる。Epoxy resin is most suitable as the thermosetting resin for fixing the coil in the present invention, but other thermosetting resins such as diallyl phthalate resin and phenol resin can also be used. In addition, in the example, epoxy resin was used as the resin mixed with ferrite powder and used as a binder, but it is not necessary to use the same resin as the resin for fixing the coil.
Any resin that satisfies adhesive properties and heat resistance may be used, such as the above-mentioned phenol resin.
又、フェライト粉末については、実施例ではＮｉ −
Ｚｎ系フェライトを用いたが、Ｎｉ − Ｚｎ −Ｃｕ
系，Ｍｇ−Ｃｕ−Ｚｎ系など、要望される周波数特性や
損失特性に合わせて，種々の軟磁性フエ．ライト粉末を
用いなければならない。Further, regarding the ferrite powder, in the example, Ni −
Although Zn-based ferrite was used, Ni-Zn-Cu
Various soft magnetic ferromagnetic materials such as Mg-Cu-Zn type, Mg-Cu-Zn type, etc. are available depending on the desired frequency characteristics and loss characteristics. Light powder must be used.
発明の効果
以上のように、空芯コイルを熱硬化性樹脂で覆って固化
した構造にすることにより、圧縮成形法を採用すること
ができ、封止成形体中のフエツイト粉末の含有量を上げ
ることができ、巻線型のインダクタンス素子で小型薄型
の形状で高インダクタンスを有した素子が可能となった
。Effects of the Invention As described above, by covering the air-core coil with a thermosetting resin to form a solidified structure, compression molding can be adopted, and the content of feutzite powder in the sealed molded product can be increased. This has made it possible to create a wire-wound inductance element that is small and thin and has high inductance.
又，本発明のコアレスのインダクタンス素子ハ、コイル
の内外が全て同一のフェライト粉本成形体で覆われた構
造であるため、従来の有芯のインダクタンス素子におい
て大きな問題点となっていた焼結体のドラムコアと封止
成形体との熱膨張の違いなどということが無く、温度特
性やその池の信頼性試検における特性において優れたイ
ンダクタンス素子となっている。In addition, the coreless inductance element of the present invention has a structure in which the inside and outside of the coil are all covered with the same ferrite powder molded body, which is a major problem in conventional cored inductance elements. There is no difference in thermal expansion between the drum core and the sealed molded body, making it an inductance element with excellent temperature characteristics and characteristics in reliability tests.
第１図は、本発明のインダクタンス素子の一例の模式的
な断面図である。
１・・・・・・コイル、２・・・・・・コム端子、３・
・・・・・フェライト粉末成形体。FIG. 1 is a schematic cross-sectional view of an example of an inductance element of the present invention. 1... Coil, 2... Comb terminal, 3.
...Ferrite powder compact.
Claims (3)
ンダーとしたフェライト粉末成形体で封止成形されてい
ることを特徴とするインダクタンス素子。(1) An inductance element characterized in that a coil solidified with a thermosetting resin is sealed and molded with a ferrite powder molded body using the resin as a binder.
おいて、フェライト粉末の含有量が８８〜９７重量％で
ある請求項１記載のインダクタンス素子。(2) The inductance element according to claim 1, wherein the ferrite powder molded body uses a resin as a binder, and the ferrite powder content is 88 to 97% by weight.
イルに溶剤に溶かした熱硬化性樹脂を塗布含浸し、次い
で固化熱処理を施し、この熱硬化性樹脂で固化したコイ
ルを、樹脂をバインダーとしたフェライト粉末成形体で
覆い加圧してコイルを封止成形し、そのあと必要に応じ
て固化熱処理を施すことを特徴とするインダクタンス素
子の製造方法。(3) Make an air-core coil by winding an insulated copper wire, apply and impregnate the coil with a thermosetting resin dissolved in a solvent, and then perform a solidification heat treatment, and the coil solidified with this thermosetting resin, A method for manufacturing an inductance element, which comprises sealing and molding a coil by covering it with a ferrite powder molded body using resin as a binder and applying pressure, and then subjecting it to solidification heat treatment as necessary.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1056803A JPH02235304A (en) | 1989-03-08 | 1989-03-08 | Inductance element and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1056803A JPH02235304A (en) | 1989-03-08 | 1989-03-08 | Inductance element and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02235304A true JPH02235304A (en) | 1990-09-18 |
Family
ID=13037556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1056803A Pending JPH02235304A (en) | 1989-03-08 | 1989-03-08 | Inductance element and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02235304A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2021005967A1 (en) * | 2019-07-11 | 2021-01-14 |
-
1989
- 1989-03-08 JP JP1056803A patent/JPH02235304A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2021005967A1 (en) * | 2019-07-11 | 2021-01-14 | ||
| WO2021005967A1 (en) * | 2019-07-11 | 2021-01-14 | 株式会社村田製作所 | Inductor |
| CN114072886A (en) * | 2019-07-11 | 2022-02-18 | 株式会社村田制作所 | Inductor |
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