JPH0223348A - Photosensitive planographic printing plate - Google Patents
Photosensitive planographic printing plateInfo
- Publication number
- JPH0223348A JPH0223348A JP17468788A JP17468788A JPH0223348A JP H0223348 A JPH0223348 A JP H0223348A JP 17468788 A JP17468788 A JP 17468788A JP 17468788 A JP17468788 A JP 17468788A JP H0223348 A JPH0223348 A JP H0223348A
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive
- sol
- printing plate
- compd
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 150000002736 metal compounds Chemical class 0.000 claims description 7
- 229920005989 resin Polymers 0.000 abstract description 25
- 239000011347 resin Substances 0.000 abstract description 25
- 229910052751 metal Inorganic materials 0.000 abstract description 14
- 239000002184 metal Substances 0.000 abstract description 14
- 229910052759 nickel Inorganic materials 0.000 abstract description 8
- 229910052804 chromium Inorganic materials 0.000 abstract description 7
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 abstract description 6
- 238000011161 development Methods 0.000 abstract description 6
- 150000002739 metals Chemical class 0.000 abstract description 6
- 150000002989 phenols Chemical class 0.000 abstract description 6
- 150000002576 ketones Chemical class 0.000 abstract description 5
- 229910052725 zinc Inorganic materials 0.000 abstract description 5
- 150000001299 aldehydes Chemical class 0.000 abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 abstract description 4
- 238000004381 surface treatment Methods 0.000 abstract description 4
- 229910052748 manganese Inorganic materials 0.000 abstract description 3
- 238000006068 polycondensation reaction Methods 0.000 abstract description 3
- FHIVAFMUCKRCQO-UHFFFAOYSA-N diazinon Chemical compound CCOP(=S)(OCC)OC1=CC(C)=NC(C(C)C)=N1 FHIVAFMUCKRCQO-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052718 tin Inorganic materials 0.000 abstract description 2
- 229910052719 titanium Inorganic materials 0.000 abstract description 2
- 229910052726 zirconium Inorganic materials 0.000 abstract description 2
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 abstract 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 36
- 239000000203 mixture Substances 0.000 description 26
- 238000000576 coating method Methods 0.000 description 20
- 239000011248 coating agent Substances 0.000 description 19
- -1 Specifically Substances 0.000 description 18
- 229910052742 iron Inorganic materials 0.000 description 18
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 15
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- 150000001875 compounds Chemical class 0.000 description 14
- 238000002360 preparation method Methods 0.000 description 14
- 239000000243 solution Substances 0.000 description 12
- 239000007864 aqueous solution Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- 229920003986 novolac Polymers 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- 229910000831 Steel Inorganic materials 0.000 description 8
- 229910052799 carbon Inorganic materials 0.000 description 8
- 239000010959 steel Substances 0.000 description 8
- 239000011651 chromium Substances 0.000 description 7
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 229920002554 vinyl polymer Polymers 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000000178 monomer Substances 0.000 description 5
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 4
- 239000011572 manganese Substances 0.000 description 4
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229910000975 Carbon steel Inorganic materials 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 229910001507 metal halide Inorganic materials 0.000 description 3
- 150000005309 metal halides Chemical class 0.000 description 3
- AICOOMRHRUFYCM-ZRRPKQBOSA-N oxazine, 1 Chemical compound C([C@@H]1[C@H](C(C[C@]2(C)[C@@H]([C@H](C)N(C)C)[C@H](O)C[C@]21C)=O)CC1=CC2)C[C@H]1[C@@]1(C)[C@H]2N=C(C(C)C)OC1 AICOOMRHRUFYCM-ZRRPKQBOSA-N 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000010186 staining Methods 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- LLWJPGAKXJBKKA-UHFFFAOYSA-N victoria blue B Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC(=CC=1)N(C)C)=C(C=C1)C2=CC=CC=C2C1=[NH+]C1=CC=CC=C1 LLWJPGAKXJBKKA-UHFFFAOYSA-N 0.000 description 3
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 206010016807 Fluid retention Diseases 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- NMJJFJNHVMGPGM-UHFFFAOYSA-N butyl formate Chemical compound CCCCOC=O NMJJFJNHVMGPGM-UHFFFAOYSA-N 0.000 description 2
- 239000010962 carbon steel Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 229940118056 cresol / formaldehyde Drugs 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 238000010297 mechanical methods and process Methods 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 239000012286 potassium permanganate Substances 0.000 description 2
- 229940079877 pyrogallol Drugs 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229940124530 sulfonamide Drugs 0.000 description 2
- YBBRCQOCSYXUOC-UHFFFAOYSA-N sulfuryl dichloride Chemical compound ClS(Cl)(=O)=O YBBRCQOCSYXUOC-UHFFFAOYSA-N 0.000 description 2
- MGSRCZKZVOBKFT-UHFFFAOYSA-N thymol Chemical compound CC(C)C1=CC=C(C)C=C1O MGSRCZKZVOBKFT-UHFFFAOYSA-N 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- WPWWKBNOXTZDQJ-UHFFFAOYSA-N xanthopurpurin Chemical group C1=CC=C2C(=O)C3=CC(O)=CC(O)=C3C(=O)C2=C1 WPWWKBNOXTZDQJ-UHFFFAOYSA-N 0.000 description 2
- FHBXQJDYHHJCIF-UHFFFAOYSA-N (2,3-diaminophenyl)-phenylmethanone Chemical compound NC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1N FHBXQJDYHHJCIF-UHFFFAOYSA-N 0.000 description 1
- HNAGHMKIPMKKBB-UHFFFAOYSA-N 1-benzylpyrrolidine-3-carboxamide Chemical compound C1C(C(=O)N)CCN1CC1=CC=CC=C1 HNAGHMKIPMKKBB-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 1
- RCSKFKICHQAKEZ-UHFFFAOYSA-N 1-ethenylindole Chemical compound C1=CC=C2N(C=C)C=CC2=C1 RCSKFKICHQAKEZ-UHFFFAOYSA-N 0.000 description 1
- CTXUTPWZJZHRJC-UHFFFAOYSA-N 1-ethenylpyrrole Chemical compound C=CN1C=CC=C1 CTXUTPWZJZHRJC-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 1
- JXFITNNCZLPZNX-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxypropoxy)propane Chemical compound CCOCC(C)OCC(C)OC JXFITNNCZLPZNX-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- VEUMBMHMMCOFAG-UHFFFAOYSA-N 2,3-dihydrooxadiazole Chemical compound N1NC=CO1 VEUMBMHMMCOFAG-UHFFFAOYSA-N 0.000 description 1
- VZQBDGHUOBRFAA-UHFFFAOYSA-N 2-(2,6-dihydroxyphenyl)benzaldehyde Chemical compound C1(O)=C(C(O)=CC=C1)C1=CC=CC=C1C=O VZQBDGHUOBRFAA-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- JIKJXWFVPDDJNU-UHFFFAOYSA-N 2-[2-(4-methoxyphenyl)ethenyl]-5-(trichloromethyl)-1,3,4-oxadiazole Chemical compound C1=CC(OC)=CC=C1C=CC1=NN=C(C(Cl)(Cl)Cl)O1 JIKJXWFVPDDJNU-UHFFFAOYSA-N 0.000 description 1
- WHBAYNMEIXUTJV-UHFFFAOYSA-N 2-chloroethyl prop-2-enoate Chemical compound ClCCOC(=O)C=C WHBAYNMEIXUTJV-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- FCYVWWWTHPPJII-UHFFFAOYSA-N 2-methylidenepropanedinitrile Chemical compound N#CC(=C)C#N FCYVWWWTHPPJII-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical class [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 description 1
- VGVHNLRUAMRIEW-UHFFFAOYSA-N 4-methylcyclohexan-1-one Chemical compound CC1CCC(=O)CC1 VGVHNLRUAMRIEW-UHFFFAOYSA-N 0.000 description 1
- LZDOYVMSNJBLIM-UHFFFAOYSA-N 4-tert-butylphenol;formaldehyde Chemical compound O=C.CC(C)(C)C1=CC=C(O)C=C1 LZDOYVMSNJBLIM-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 1
- 229910001339 C alloy Inorganic materials 0.000 description 1
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- JGFBQFKZKSSODQ-UHFFFAOYSA-N Isothiocyanatocyclopropane Chemical compound S=C=NC1CC1 JGFBQFKZKSSODQ-UHFFFAOYSA-N 0.000 description 1
- 229910000617 Mangalloy Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- RJUFJBKOKNCXHH-UHFFFAOYSA-N Methyl propionate Chemical compound CCC(=O)OC RJUFJBKOKNCXHH-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 229930192627 Naphthoquinone Natural products 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 241001069925 Orestes Species 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- DIQMPQMYFZXDAX-UHFFFAOYSA-N Pentyl formate Chemical compound CCCCCOC=O DIQMPQMYFZXDAX-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004111 Potassium silicate Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 239000005844 Thymol Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- ALVGSDOIXRPZFH-UHFFFAOYSA-N [(1-diazonioimino-3,4-dioxonaphthalen-2-ylidene)hydrazinylidene]azanide Chemical compound C1=CC=C2C(=N[N+]#N)C(=NN=[N-])C(=O)C(=O)C2=C1 ALVGSDOIXRPZFH-UHFFFAOYSA-N 0.000 description 1
- MPGOFFXRGUQRMW-UHFFFAOYSA-N [N-]=[N+]=[N-].[N-]=[N+]=[N-].O=C1C=CC=CC1=O Chemical compound [N-]=[N+]=[N-].[N-]=[N+]=[N-].O=C1C=CC=CC1=O MPGOFFXRGUQRMW-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- DPXJVFZANSGRMM-UHFFFAOYSA-N acetic acid;2,3,4,5,6-pentahydroxyhexanal;sodium Chemical compound [Na].CC(O)=O.OCC(O)C(O)C(O)C(O)C=O DPXJVFZANSGRMM-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001253 acrylic acids Chemical class 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229940051881 anilide analgesics and antipyretics Drugs 0.000 description 1
- 150000003931 anilides Chemical class 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- HRBFQSUTUDRTSV-UHFFFAOYSA-N benzene-1,2,3-triol;propan-2-one Chemical compound CC(C)=O.OC1=CC=CC(O)=C1O HRBFQSUTUDRTSV-UHFFFAOYSA-N 0.000 description 1
- OBNCKNCVKJNDBV-UHFFFAOYSA-N butanoic acid ethyl ester Natural products CCCC(=O)OCC OBNCKNCVKJNDBV-UHFFFAOYSA-N 0.000 description 1
- 229940043232 butyl acetate Drugs 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- PWLNAUNEAKQYLH-UHFFFAOYSA-N butyric acid octyl ester Natural products CCCCCCCCOC(=O)CCC PWLNAUNEAKQYLH-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- VSGNNIFQASZAOI-UHFFFAOYSA-L calcium acetate Chemical compound [Ca+2].CC([O-])=O.CC([O-])=O VSGNNIFQASZAOI-UHFFFAOYSA-L 0.000 description 1
- 239000001639 calcium acetate Substances 0.000 description 1
- 229960005147 calcium acetate Drugs 0.000 description 1
- 235000011092 calcium acetate Nutrition 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- RECUKUPTGUEGMW-UHFFFAOYSA-N carvacrol Chemical compound CC(C)C1=CC=C(C)C(O)=C1 RECUKUPTGUEGMW-UHFFFAOYSA-N 0.000 description 1
- HHTWOMMSBMNRKP-UHFFFAOYSA-N carvacrol Natural products CC(=C)C1=CC=C(C)C(O)=C1 HHTWOMMSBMNRKP-UHFFFAOYSA-N 0.000 description 1
- 235000007746 carvacrol Nutrition 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- MLUCVPSAIODCQM-NSCUHMNNSA-N crotonaldehyde Chemical compound C\C=C\C=O MLUCVPSAIODCQM-NSCUHMNNSA-N 0.000 description 1
- MLUCVPSAIODCQM-UHFFFAOYSA-N crotonaldehyde Natural products CC=CC=O MLUCVPSAIODCQM-UHFFFAOYSA-N 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- GCFAUZGWPDYAJN-UHFFFAOYSA-N cyclohexyl 3-phenylprop-2-enoate Chemical compound C=1C=CC=CC=1C=CC(=O)OC1CCCCC1 GCFAUZGWPDYAJN-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229940061607 dibasic sodium phosphate Drugs 0.000 description 1
- SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical compound [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- KTLZQSZGORXBED-UHFFFAOYSA-N dimethyl 2-methylidenepropanedioate Chemical group COC(=O)C(=C)C(=O)OC KTLZQSZGORXBED-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 1
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- MEGHWIAOTJPCHQ-UHFFFAOYSA-N ethenyl butanoate Chemical compound CCCC(=O)OC=C MEGHWIAOTJPCHQ-UHFFFAOYSA-N 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- OUGJKAQEYOUGKG-UHFFFAOYSA-N ethyl 2-methylidenebutanoate Chemical compound CCOC(=O)C(=C)CC OUGJKAQEYOUGKG-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 229940093499 ethyl acetate Drugs 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 description 1
- WBJINCZRORDGAQ-UHFFFAOYSA-N formic acid ethyl ester Natural products CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- WYXXLXHHWYNKJF-UHFFFAOYSA-N isocarvacrol Natural products CC(C)C1=CC=C(O)C(C)=C1 WYXXLXHHWYNKJF-UHFFFAOYSA-N 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- AWJZTPWDQYFQPQ-UHFFFAOYSA-N methyl 2-chloroprop-2-enoate Chemical compound COC(=O)C(Cl)=C AWJZTPWDQYFQPQ-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229940017219 methyl propionate Drugs 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- JEPAGMKWFWQECH-UHFFFAOYSA-N n-(4-chlorophenyl)prop-2-enamide Chemical compound ClC1=CC=C(NC(=O)C=C)C=C1 JEPAGMKWFWQECH-UHFFFAOYSA-N 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- UUIQMZJEGPQKFD-UHFFFAOYSA-N n-butyric acid methyl ester Natural products CCCC(=O)OC UUIQMZJEGPQKFD-UHFFFAOYSA-N 0.000 description 1
- BPCNEKWROYSOLT-UHFFFAOYSA-N n-phenylprop-2-enamide Chemical compound C=CC(=O)NC1=CC=CC=C1 BPCNEKWROYSOLT-UHFFFAOYSA-N 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- 125000004957 naphthylene group Chemical group 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 239000001818 polyoxyethylene sorbitan monostearate Substances 0.000 description 1
- 235000010989 polyoxyethylene sorbitan monostearate Nutrition 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 229940093956 potassium carbonate Drugs 0.000 description 1
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 1
- 229910052913 potassium silicate Inorganic materials 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 229940001593 sodium carbonate Drugs 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229960000790 thymol Drugs 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 229940001496 tribasic sodium phosphate Drugs 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、鉄材を支持体とする感光性平版印刷版に関し
、特に特殊な親水化処理を施した鉄材上に0−キノンジ
アジド化合物を含有する感光性層を有する感光性平版印
刷版に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a photosensitive lithographic printing plate using an iron material as a support, and in particular, a photosensitive planographic printing plate containing an 0-quinonediazide compound on the iron material which has been subjected to a special hydrophilic treatment. The present invention relates to a photosensitive lithographic printing plate having a photosensitive layer.
感光性平版印刷版用の支持体としては、紙、プラスチッ
クかラミネートされt;紙、アルミニウム、亜鉛、鉄、
銅などのような金属板、プラスチックフィルム、上記の
金属がめつき、ラミネートもしくは蒸着された紙もしく
はプラスチックフィルムが知られている。Supports for photosensitive lithographic printing plates include paper, plastic or laminates; paper, aluminum, zinc, iron,
Metal plates such as copper, plastic films, paper or plastic films plated, laminated or vapor-deposited with the above-mentioned metals are known.
しかしながら、これらの従来よりある支持体は、下記に
示す欠点の何れかを有している。However, these conventional supports have any of the following drawbacks.
(1) 支持体表面の硬度が不十分な場合には多数枚
の印刷により非画線部表面或いは画線部表面が損傷し、
その結果として印刷中に非画線部に汚れを生ずるか、画
線部にインキ著肉不良を生ずる。(1) If the hardness of the support surface is insufficient, the surface of the non-image area or the image area may be damaged by printing a large number of sheets.
As a result, stains occur in non-image areas during printing, or ink buildup defects occur in image areas.
(2)支持体表面の親水性、保水性が不十分な場合には
印刷中に汚れを生ずるか、湿し水の巾の狭い刷り難い印
刷となる。(2) If the hydrophilicity and water retention of the support surface are insufficient, stains may occur during printing, or the width of the dampening solution may be narrow, resulting in printing that is difficult to print.
(3)支持体表面にインキ受容性物質との接着性が不十
分な場合には印刷中の画像部の損傷が大きく、多数枚の
印刷に耐えられない。(3) If the adhesion of the ink-receptive material to the surface of the support is insufficient, the image area during printing will be severely damaged and cannot withstand printing on a large number of sheets.
(4)支持体の折り曲げ強度或いは引張り強度が不十分
な場合には印刷中にくわえ切れ、或いは版切れを生ずる
。(4) If the bending strength or tensile strength of the support is insufficient, gripping or plate breakage may occur during printing.
例えば、この領域で最も有効に用いられているアルミニ
ウム板においては、十分な親水性、保水性及び接着性を
与えるために砂目室て処理及び陽極酸化処理を必要とし
、製造工程が複雑であると共に、極めてコストが高く、
不利であるのが現状である。For example, aluminum plates, which are most effectively used in this area, require grain treatment and anodization to provide sufficient hydrophilicity, water retention, and adhesion, making the manufacturing process complicated. At the same time, it is extremely costly,
The current situation is disadvantageous.
感光性平版印刷版の支持体として、安価であること、機
械的強度が大であること、磁性体である等の特徴を有す
る鉄材が開発されている。例えば、特開昭55・145
193号、同58−220796号及び同59−311
92号公報等に記載されているごとく、クロム電着層を
有する鉄支持体、特開昭56・130395号、同56
−130396号、同56−150592号及び同57
−64597号公報等に記載されているごとく、電気鋳
造によって粗面化された鉄支持体が知られている。又、
一般に平版印刷版は、水と親油性インキを用いて印刷す
るものであり、良好な印刷物を多数枚得るためには、画
像部の新油性及び非画像部の親水性(支持体の親水性)
が充分でなければならない。鉄支持体の親水性を向上さ
せるために、特開昭58−220797号及び同59−
11294号公報に記載されているごとく、水溶性高分
子と水溶性金属塩との混合水溶液や過マンガン酸カリ水
溶液で処理する親水化処理方法が知られている。Iron materials have been developed as supports for photosensitive planographic printing plates, which have characteristics such as being inexpensive, having high mechanical strength, and being magnetic. For example, JP-A-55-145
No. 193, No. 58-220796 and No. 59-311
As described in JP-A No. 92, etc., an iron support having a chromium electrodeposition layer, JP-A-56-130395 and JP-A-56
-130396, 56-150592 and 57
As described in Japanese Patent Application No. -64597, iron supports whose surfaces are roughened by electroforming are known. or,
In general, lithographic printing plates are printed using water and lipophilic ink, and in order to obtain a large number of good prints, it is necessary to improve the oiliness of the image area and the hydrophilicity of the non-image area (hydrophilicity of the support).
must be sufficient. In order to improve the hydrophilicity of the iron support, JP-A Nos. 58-220797 and 59-
As described in Japanese Patent No. 11294, a hydrophilic treatment method is known in which treatment is performed with a mixed aqueous solution of a water-soluble polymer and a water-soluble metal salt or an aqueous potassium permanganate solution.
しかしながら、これらの支持体を使用した感光性平版印
刷版は、現像時、非画像部における感光性層の抜は性が
悪く、即ち現像性の許容度が狭いという問題及び非画像
部における親水性が不十分なため、印刷時に地汚れが起
き易く、印刷作業性が悪いという問題を有している。However, photosensitive lithographic printing plates using these supports have the problem of poor removal of the photosensitive layer in non-image areas during development, that is, narrow tolerance of developability, and problems with hydrophilicity in non-image areas. As a result, background smudges tend to occur during printing, resulting in poor printing workability.
したがって本発明の目的は、現像性の許容度が広くかつ
非画像部における親水性が大であり、印刷時地汚れの起
きにくい鉄材を支持体とする感光性平版印刷版を提供す
ることにある。Therefore, it is an object of the present invention to provide a photosensitive lithographic printing plate that has a wide developability tolerance, is highly hydrophilic in non-image areas, and uses an iron material as a support that is less prone to background staining during printing. .
本発明の上記目的は、金属の化合物のゾルで表面処理し
た支持体上に、0−キノンジアジド化合物を含有する感
光性層を有する感光性平版印刷版によって達成される。The above object of the present invention is achieved by a photosensitive lithographic printing plate having a photosensitive layer containing an 0-quinonediazide compound on a support whose surface has been treated with a sol of a metal compound.
以下、本発明について詳細に説明する。The present invention will be explained in detail below.
本発明の鉄支持体は鉄材の表面を粗面化した後、めっき
、又はめっき後化成処理を施し、更に金属の化合物のゾ
ルで表面処理を施すことによって得られる。The iron support of the present invention can be obtained by roughening the surface of an iron material, subjecting it to plating or post-plating chemical conversion treatment, and further surface treatment with a sol of a metal compound.
本発明における鉄材は、純鉄の他、鉄と他の元素との合
金を包含する。鉄と合金をつくる他の元素としては炭素
、マンガン、ニッケル等が挙げられる。合金としては、
具体的には炭素鋼(炭素(0,04〜1.7%)と鉄の
合金)、炭素鋼より炭素含有率の高い鋳鉄、更に他の元
素(例えばマンガン。The iron material in the present invention includes not only pure iron but also alloys of iron and other elements. Other elements that form alloys with iron include carbon, manganese, and nickel. As an alloy,
Specifically, carbon steel (an alloy of carbon (0.04-1.7%) and iron), cast iron with a higher carbon content than carbon steel, and also other elements (for example manganese).
ニッケル、クロム、コバルト、タングステン、モリブデ
ン)を加えた特殊鋼(例えば、マンガン鋼、ニッケル鋼
、クロム鋼、ニッケルークロム鋼)等が挙げられる。上
記炭素鋼としては、極軟鋼(炭素0.25%以下)、軟
鋼(0,25〜0.5%)、硬鋼(炭素0.5〜1.0
%)、極硬鋼(炭素1.0%以上)が包含される。Examples include special steels containing (nickel, chromium, cobalt, tungsten, molybdenum) (for example, manganese steel, nickel steel, chromium steel, nickel-chromium steel). The above-mentioned carbon steels include extremely mild steel (carbon 0.25% or less), mild steel (0.25 to 0.5%), hard steel (carbon 0.5 to 1.0%),
%), extremely hard steel (carbon 1.0% or more).
鉄材の表面の粗面化方法としては、従来知られた種々の
方法が使用でき、例えば、機械的方法、化学的方法、電
解による方法が挙げられる。機械的方法としては例えば
研磨法、ブラシ研磨法、液体ホーニングによる研磨法等
が挙げられる。化学的方法としては硫酸、リン酸、硝酸
、塩酸、シュウ酸、ピロリン酸、塩化第2鉄等を含む溶
液でエツチングする方法が挙げられる。電解による方法
としては電解によるエツチングする方法及び電解により
めっきする方法が挙げられる。Various conventionally known methods can be used to roughen the surface of the iron material, including mechanical methods, chemical methods, and electrolytic methods. Examples of mechanical methods include polishing methods, brush polishing methods, and polishing methods using liquid honing. Chemical methods include etching with a solution containing sulfuric acid, phosphoric acid, nitric acid, hydrochloric acid, oxalic acid, pyrophosphoric acid, ferric chloride, etc. The electrolytic method includes an electrolytic etching method and an electrolytic plating method.
粗面化しt:後のめっき処理は、鉄材に対して防錆効果
をもつN i 、 Cr 、 Cu又はSnを用いる。Roughening t: The subsequent plating treatment uses Ni, Cr, Cu, or Sn, which has a rust-preventing effect on iron materials.
なお、めっき金属は、前記の金属単体に限らず、これら
の1種以上を含む合金、或いはこれらの2種以上の複合
めっきも含まれる。Note that the plating metal is not limited to the above-described single metal, but also includes an alloy containing one or more of these metals, or a composite plating of two or more of these metals.
めっき後、必要に応じて行われる化成処理は、クロム酸
塩、重クロム酸塩、リン酸塩、モリブデン酸塩、ホウ酸
塩、過ホウ酸塩などを含む溶液への浸漬、或いは該溶液
中での電解による化成処理法がある。After plating, the chemical conversion treatment that is performed as necessary is immersion in a solution containing chromate, dichromate, phosphate, molybdate, borate, perborate, etc., or in the solution. There is a chemical conversion treatment method using electrolysis.
上記のようにして処理されて得られた支持体表面の中心
線平均粗さ(DIN4768に示されている)は、0.
1〜3μ■であり、好ましくは0.3〜15μ臘である
。The center line average roughness (as indicated in DIN 4768) of the surface of the support obtained by the above treatment is 0.
The thickness is 1 to 3μ, preferably 0.3 to 15μ.
めっき処理後行われる金属の化合物のゾルで処理を施す
表面処理は親水化処理であり、この処理は支持体の表裏
両面であってもよい。The surface treatment performed after plating with a sol of a metal compound is a hydrophilic treatment, and this treatment may be applied to both the front and back surfaces of the support.
金属の化合物のゾルとは、酸化物、或いは水和物よりな
り、このようなゾルを形成する金属としては例えばAl
1.Ti、Zr、Cr、Ni 、Zn、Sn、Mn、C
u、Co、Fe。A sol of a metal compound is composed of an oxide or a hydrate, and examples of metals forming such a sol include Al.
1. Ti, Zr, Cr, Ni, Zn, Sn, Mn, C
u, Co, Fe.
Pb、Cd、Mg、Ca等があり、本発明においてはこ
れらの金属の化合物のゾルの少なくとも1種が用いられ
、八〇、Cr、Ni、Znが好ましく用いられる。There are Pb, Cd, Mg, Ca, etc., and in the present invention, at least one kind of sols of compounds of these metals is used, and 80, Cr, Ni, and Zn are preferably used.
前記親水化処理方法としては、上記金属の化合物のゾル
を含む水溶液中で陰極電解又は浸漬処理を行うのが好ま
しい。水溶液中の金属の化合物のゾルの濃度はl−10
0g/Qが好ましい。又、水溶液中でのゾルの安定性を
良くするt;めに処理液中にクロム酸、リン酸、硫酸な
どの無機塩、クエン酸。As the hydrophilic treatment method, cathodic electrolysis or immersion treatment is preferably performed in an aqueous solution containing a sol of the metal compound. The concentration of a sol of a metal compound in an aqueous solution is l-10
0 g/Q is preferred. In addition, inorganic salts such as chromic acid, phosphoric acid, and sulfuric acid, and citric acid are added to the treatment solution to improve the stability of the sol in an aqueous solution.
酢酸などの有機酸、或いは界面活性剤を添加することが
できる。An organic acid such as acetic acid or a surfactant can be added.
陰極電解条件としては、使用するゾルの種類によって異
なるが、電流密度は0.5〜IOA/ds”、処理温度
は、5〜50℃、処理時間は1〜60秒である。The cathode electrolysis conditions vary depending on the type of sol used, but the current density is 0.5 to IOA/ds'', the treatment temperature is 5 to 50°C, and the treatment time is 1 to 60 seconds.
本発明の感光性平版印刷版は、上記により得られた鉄支
持体に0−キノンジアジド化合物を含有する感光性組成
物を例えば有機溶媒を用いて塗設することにより製造す
ることができる。The photosensitive lithographic printing plate of the present invention can be produced by coating the iron support obtained above with a photosensitive composition containing an 0-quinonediazide compound using, for example, an organic solvent.
本発明の0−キノンジアジド化合物を含有する感光性組
成物においては、0−キノンシア・シト化合物とアルカ
リ可溶性樹脂を併用することが好ましい。In the photosensitive composition containing the 0-quinonediazide compound of the present invention, it is preferable to use the 0-quinonesia-cyto compound and an alkali-soluble resin together.
本発明における0−キノンジアジド化合物としては、例
えばO−す7トキノンジアジドスルホン酸と、フェノー
ル類及びアルデヒド又はケトンの重縮合樹脂とのエステ
ル化合物が挙げられる。Examples of the O-quinonediazide compound in the present invention include ester compounds of O-su7toquinonediazide sulfonic acid and polycondensation resins of phenols and aldehydes or ketones.
前記フェノール類としては、例えば、フェノール、0−
クレゾール、鳳−クレゾール、p−クレゾール、3.5
・キシレノール、カルバクロール、チモール等の一価フ
エノール、カテコール、レゾルシン、ヒドロキノン等の
二価フェノール、ピロガロール、70ログルシン等の三
価フェノール等が挙げられる。前記アルデヒドとしては
ホルムアルデヒド、ベンズアルデヒド、アセトアルデヒ
ド、クロトンアルデヒド、フルフラール等が挙げられる
。これらのうち好ましいものはホルムアルデヒド及びベ
ンズアルデヒドである。又、前記ケトンとしてはアセト
ン、メチルエチルケトン等が挙げられる。Examples of the phenols include phenol, 0-
Cresol, Otori-cresol, p-cresol, 3.5
- Monohydric phenols such as xylenol, carvacrol, and thymol, dihydric phenols such as catechol, resorcinol, and hydroquinone, and trihydric phenols such as pyrogallol and 70 loglucin. Examples of the aldehyde include formaldehyde, benzaldehyde, acetaldehyde, crotonaldehyde, and furfural. Preferred among these are formaldehyde and benzaldehyde. Further, examples of the ketone include acetone and methyl ethyl ketone.
前記重縮合樹脂の具体的な例としては、フェノール・ホ
ルムアルデヒド樹脂、■−クレゾール・ホルムアルデヒ
ド樹脂、m−、p−混合クレゾール・ホルムアルデヒド
樹脂、レゾルシン畢ベンズアルデヒド樹脂、ピロガロー
ル・アセトン樹脂等が挙げられる。Specific examples of the polycondensation resin include phenol/formaldehyde resin, -cresol/formaldehyde resin, m-, p-mixed cresol/formaldehyde resin, resorcinol benzaldehyde resin, pyrogallol/acetone resin, and the like.
前記0−ナフトキノンジアジド化合物のフェノール類の
O)!基に対する0−ナフトキノンジアジドスルホン酸
の縮合率(OH基1個に対する反応率)は、15〜80
%が好ましく、より好ましくは20〜45%である。O) of the phenols of the 0-naphthoquinonediazide compound! The condensation rate of 0-naphthoquinonediazide sulfonic acid with respect to groups (reaction rate with respect to one OH group) is 15 to 80
%, more preferably 20 to 45%.
更に本発明に用いられる0−キノンジアジド化合物とし
ては特開昭58−43451号公報に記載のある以下の
化合物も使用できる。即ち例えば1.2−ベンゾキノン
ジアジドスルホン酸エステル、l、2−ナフトキノンジ
アジドスルホン酸エステル、1.2−ベンゾキノンジア
ジドスルホン酸アミド、1.2・す7トキノンジアジド
スルホン酸アミドなどの公知の1,2−キノンジアジド
化合物、更に具体的にはジェイ・コサール(J、Kos
ar)著「ライト・センシティブ システム」(“Li
ght−Sensitive 5yste++s”)第
339〜352N (1965年)、ジョン・ウィリー
アンド サンズ(John 1lliley & 5
ons)社にュ〒ヨーク)やダブリュー I ニスーデ
(−”7オレスト(11,S、De Forest)著
「7オトレジスト」(“Photoresist″)第
50巻。Further, as the O-quinonediazide compound used in the present invention, the following compounds described in JP-A-58-43451 can also be used. That is, for example, known 1,2-benzoquinonediazide sulfonic acid ester, 1,2-naphthoquinonediazide sulfonic acid ester, 1,2-benzoquinonediazide sulfonic acid amide, 1,2-7-toquinonediazide sulfonic acid amide, etc. - quinonediazide compounds, more specifically J. Kossar
“Light Sensitive System” (“Li
ght-Sensitive 5yste++s”) No. 339-352N (1965), John Willey & Sons
ons) (New York) and W. I. Nissude (-"7 Orest (11, S, De Forest), "Photoresist", Vol. 50.
(1975年)、マグロ−ヒル(Mc Gray−旧1
1)社にューヨーク)に記載されている1、2−ベンゾ
キノンジアジド−4−スルホン酸フェニルエステル、1
.2.1’2’−シーCベンゾキノンジアジド−4・ス
ルホニル)−ジヒドロキシビフェニル、1.2・ベンゾ
キノンジアジド−4−(N−エチルートβ−ナフチル)
−スルホンアミド、1.2−ナフトキノンジアジド−5
−スルホン酸シクロヘキシルエステル、1−(1,2−
す7トキノンジアジドー5−スルホニル)−3,5・ジ
メチルピラゾール、1.2−ナフトキノンジアジド−5
−スルホン酸−4′・ヒドロキシジフェニル−4′・ア
ゾ−β−す7トールエステル、N、N−ジー(l、2−
す7トキノンジアジドー5−スルホニル)−アニリン、
2’−(1,2−ナフトキノンジアジド−5−スルホニ
ルオキシ)・l−ヒドロキシ・アントラキノン、1.2
−ナフトキノンジアジド・5・スルホン酸−2゜4−ジ
ヒドロキシベンゾフェノンエステル、1.2・すフトキ
ノンジアジド−5・スルホン酸−2,3,4−トリヒド
ロキシベンゾフェノンエステル、1.2−ナフトキノン
ジアジド・5−スルホン酸クロリド2モルと4.4 ’
−ジアミノベンゾフェノン1モルの縮合物、1.2・ナ
フトキノンジアジドー5−スルホン酸クロリド2モルと
4.4′・ジヒドロキシ−1,1’−ジフェニルスルホ
ン1モルの縮合物、l、2−す7トキノンジアジド・5
−スルホン酸クロリド1モルとプルプロ5921モルの
縮合物、l、2−ナフトキノンジアジド・5−(N−ジ
ヒドロアビエチル)−スルホンアミドなどの1.2−キ
ノンジアジド化合物を例示することができる。又、特公
昭37・1953号、同37−3627号、同37−1
3109号、同40−26126号、同40−3801
号、同45−5604号、同45・27345号、同5
1−13013号、特開昭48−96575号、同48
−63802号、同48−63802号各公報に記載さ
れた1、2・キノンジアジド化合物をも挙げることがで
きる。(1975), McGraw-Hill (McGray-Old 1
1) 1,2-benzoquinonediazide-4-sulfonic acid phenyl ester, 1
.. 2.1'2'-C benzoquinonediazide-4.sulfonyl)-dihydroxybiphenyl, 1.2.benzoquinonediazide-4-(N-ethyroot β-naphthyl)
-Sulfonamide, 1,2-naphthoquinonediazide-5
-sulfonic acid cyclohexyl ester, 1-(1,2-
7-toquinonediazide-5-sulfonyl)-3,5-dimethylpyrazole, 1,2-naphthoquinonediazide-5
-Sulfonic acid-4'.hydroxydiphenyl-4'.azo-β-7tol ester, N,N-di(l,2-
7-toquinone diazido-5-sulfonyl)-aniline,
2'-(1,2-naphthoquinonediazide-5-sulfonyloxy)/l-hydroxy anthraquinone, 1.2
-Naphthoquinonediazide 5-sulfonic acid-2゜4-dihydroxybenzophenone ester, 1.2-naphthoquinonediazide-5-sulfonic acid-2,3,4-trihydroxybenzophenone ester, 1.2-naphthoquinonediazide 5- 2 moles of sulfonic acid chloride and 4.4'
- condensate of 1 mole of diaminobenzophenone, condensate of 2 moles of 1.2.naphthoquinone diazido-5-sulfonic acid chloride and 1 mole of 4.4'-dihydroxy-1,1'-diphenylsulfone, l, 2-su7 Toquinone diazide 5
Examples include a condensate of 1 mol of -sulfonic acid chloride and 5921 mol of purpuro, and 1,2-quinonediazide compounds such as 1,2-naphthoquinonediazide.5-(N-dihydroabiethyl)-sulfonamide. Also, Special Publication No. 37/1953, No. 37-3627, No. 37-1
No. 3109, No. 40-26126, No. 40-3801
No. 45-5604, No. 45.27345, No. 5
1-13013, JP-A-48-96575, JP-A No. 48
The 1,2-quinonediazide compounds described in Japanese Patent No. 63802 and No. 48-63802 can also be mentioned.
上記0−キノンジアジド化合物のうち、1.2−ベンゾ
キノンジアジドスルホニルクロリド又は1.2−ナフト
キノンジアジドスルホニルクロリドとピロガロール・ア
セトン縮合樹脂又は2.3.4−トリヒドロキシベンゾ
フェノンを反応させて得られる0−キノンジアジドエス
テル化合物が特に好ましい。Among the above 0-quinonediazide compounds, 0-quinonediazide is obtained by reacting 1.2-benzoquinonediazide sulfonyl chloride or 1.2-naphthoquinonediazide sulfonyl chloride with pyrogallol acetone condensation resin or 2.3.4-trihydroxybenzophenone. Ester compounds are particularly preferred.
本発明に用いられる0−キノンジアジド化合物としては
上記化合物を各々単独で用いてもよいし、2種以上組合
せて用いてもよい。As the O-quinonediazide compound used in the present invention, each of the above compounds may be used alone, or two or more thereof may be used in combination.
本発明に用いられる0・キノンジアジド化合物の感光性
組成物中に占める割合は、5〜60重量%が好ましく、
特に好ましくは、10〜50重量%である。The proportion of the O-quinonediazide compound used in the present invention in the photosensitive composition is preferably 5 to 60% by weight,
Particularly preferably, it is 10 to 50% by weight.
本発明の感光性組成物の中に用いられるアルカリ可溶性
樹脂としては、ノボラック樹脂、フェノール性水酸基を
有するビニル系重合体、特開昭55−57841号公報
に記載されている多価フェノールとアルデヒド又はケト
ンとの縮合樹脂等が挙げられる。Examples of the alkali-soluble resin used in the photosensitive composition of the present invention include a novolak resin, a vinyl polymer having a phenolic hydroxyl group, a polyhydric phenol and an aldehyde described in JP-A-55-57841, or Examples include condensation resins with ketones.
本発明に使用されるノボラック樹脂としては、例えばフ
ェノール・ホルムアルデヒド樹脂、クレゾール・ホルム
アルデヒド樹脂、特開昭55−57841号公報に記載
されているようなフェノール・クレゾール・ホルムアル
デヒド共重縮合体樹脂、特開昭55−127553号公
報に記載されているようなp−置換フェノールをフェノ
ールもしくは、クレゾールとホルムアルデヒドとの共重
縮合体樹脂等が挙げられる。Examples of the novolak resin used in the present invention include phenol-formaldehyde resin, cresol-formaldehyde resin, phenol-cresol-formaldehyde copolycondensate resin as described in JP-A-55-57841, JP-A-55-57841; Examples include a copolycondensate resin of p-substituted phenol, phenol, and cresol and formaldehyde as described in Japanese Patent Publication No. 55-127553.
前記ノボラック樹脂の分子量(ポリスチレン標準)は、
好ましくは数平均分子量Mnが3.00X 10”〜7
.50X 103、重量平均公刊1wが1.00X 1
0’〜3.00×10′、より好ましくはMnが5.O
OX 10”〜4.00X10”、Myが3.00X
10”〜2.00X 10’である。The molecular weight (polystyrene standard) of the novolak resin is:
Preferably, the number average molecular weight Mn is 3.00X 10” to 7
.. 50X 103, weight average published 1w is 1.00X 1
0' to 3.00×10', more preferably Mn is 5. O
OX 10"~4.00X10", My is 3.00X
10" to 2.00X 10'.
上記ノボラック樹脂は単独で用いてもよいし、2種以上
組合せて用いてもよい。The above novolak resins may be used alone or in combination of two or more.
上記ノボラック樹脂の本発明の感光性組成物中に占める
割合は5〜95重量%である。The proportion of the novolak resin in the photosensitive composition of the present invention is 5 to 95% by weight.
又、本発明に用いられるフェノール性水酸基を有するビ
ニル系重合体としては、該フェノール性水酸基を有する
単位を分子構造中に有する重合体であり、下記−綴代C
I)〜(V)の少なくとも1つの構造単位を含む重合体
が好ましい。Further, the vinyl polymer having a phenolic hydroxyl group used in the present invention is a polymer having a unit having the phenolic hydroxyl group in its molecular structure, and the following - binding margin C
Polymers containing at least one structural unit of I) to (V) are preferred.
−綴代(1)
一般式〔■〕
一般式(I[I)
一般式(IV)
H
一般式〔v〕
式中、R1及びR2はそれぞれ水素原子、アルキル基又
はカルボキシル基を表し、好ましくは水素原子である。-Tsuri allowance (1) General formula [■] General formula (I [I) General formula (IV) H General formula [v] In the formula, R1 and R2 each represent a hydrogen atom, an alkyl group, or a carboxyl group, preferably It is a hydrogen atom.
R1は水素原子、ノ蔦ロゲン厚子又はアルキル基を表し
、好ましくは水素原子又はメチル基、エチル基等のアル
キル基である。R4は水素原子、アルキル基、アリール
基又はアラルキル基を表し、好ましくは水素原子である
。Aは窒素原子又は酸″素原子と芳香族炭素原子とを連
結する、置換基を有してもよいアルキレン基を表し、i
f!O”IOの整数を表し、Bは置換基を有してもよい
フェニレン基又は置換基を有してもよいナフチレン基を
表す。R1 represents a hydrogen atom, a hydrogen atom, or an alkyl group, preferably a hydrogen atom or an alkyl group such as a methyl group or an ethyl group. R4 represents a hydrogen atom, an alkyl group, an aryl group or an aralkyl group, preferably a hydrogen atom. A represents an alkylene group which may have a substituent and which connects a nitrogen atom or an oxygen atom and an aromatic carbon atom, and i
f! represents an integer of O"IO, and B represents a phenylene group which may have a substituent or a naphthylene group which may have a substituent.
本発明の感光性組成物に用いられる重合体としては共重
合体型の構造を有するものが好ましく、前記−綴代〔■
〕〜〔v〕でそれぞれ示される構造単位と組合せて用い
ることができる単量体単位としては、例えばエチレン、
プロピレン、イソブチレン、ブタジェン、イソプレン等
のエチレン系不飽和オレフィン類、例工lfスチレン、
α−メチルスチレン、p−メチルスチレン、p−クロロ
スチレン等のスチレン類、例えばアクリル酸、メタクリ
ル酸等のアクリル酸類、例えばイタコン酸、マレイン酸
、無水マレイン酸等の不飽和脂肪族ジカルボン酸類、例
えばアクリル酸メチル、アクリル酸エチル、アクリル酸
n−ブチル、アクリル酸イソブチル、アクリル酸ドデシ
ル、アクリル酸2−クロロエチル、アクリル酸フェニル
、a−クロロアクリル酸メチル、メタクリル酸メチル、
メタクリル酸エチル、エタクリル酸エチル等のび一メチ
レン脂肪族モノカルボン酸のエステル類、例えばアクリ
ロニトリル、メタアクリロニトリル等のニトリル類、例
えばアクリルアミド等のアミド類、例えばアクリルアニ
リド、p−クロロアクリルアニリド、m−二トロアクリ
ルアニリド、踵−メトキシアクリルアニリド等のアニリ
ド類、例えば酢酸ビニル、プロピオン酸ビニル、ベンジ
ェ酸ビニル、酪酸ビニル等のビニルエステル類、例えば
メチルビニルエーテル、エチルビニルエーテル、インブ
チルビニルエーテル、β−クロロエチルビニルエーテル
等のビニルエーテル類、塩化ビニル、ビニリデンクロラ
イド、ビニリデンシアナイド、例えばl−メチル−1−
メトキシエチレン、l、1−ジメトキシエチレン、■、
2−ジメトキシエチレン、1.1−ジメトキシカルボニ
ルエチレン、l−メチルートニトロエチレン等のエチレ
ン誘導体類、例えばN−ビニルビロール、N・ビニルカ
ルバゾール、N−ビニルインドール、N−ビニルビロー
ルン、N−ビニルピロリドン等のN−ビニル化合物、等
のビニル系単量体がある。これらのビニル系単量体は不
飽和二重結合が開裂した構造で高分子化合物中に存在す
る。The polymer used in the photosensitive composition of the present invention preferably has a copolymer type structure, and the above-mentioned binding margin [■
Examples of monomer units that can be used in combination with the structural units represented by [v]] to [v] include, for example, ethylene,
Ethylenically unsaturated olefins such as propylene, isobutylene, butadiene, isoprene, etc., lf styrene,
Styrenes such as α-methylstyrene, p-methylstyrene, and p-chlorostyrene; acrylic acids such as acrylic acid and methacrylic acid; unsaturated aliphatic dicarboxylic acids such as itaconic acid, maleic acid, and maleic anhydride; Methyl acrylate, ethyl acrylate, n-butyl acrylate, isobutyl acrylate, dodecyl acrylate, 2-chloroethyl acrylate, phenyl acrylate, methyl a-chloroacrylate, methyl methacrylate,
Esters of monomethylene aliphatic monocarboxylic acids such as ethyl methacrylate and ethyl ethacrylate, nitriles such as acrylonitrile and methacrylonitrile, amides such as acrylamide, such as acrylanilide, p-chloroacrylanilide, m-di Anilides such as troacrylanilide and heel-methoxyacrylanilide, vinyl esters such as vinyl acetate, vinyl propionate, vinyl benzoate, vinyl butyrate, such as methyl vinyl ether, ethyl vinyl ether, inbutyl vinyl ether, β-chloroethyl vinyl ether vinyl ethers such as vinyl chloride, vinylidene chloride, vinylidene cyanide, such as l-methyl-1-
Methoxyethylene, l,1-dimethoxyethylene, ■,
Ethylene derivatives such as 2-dimethoxyethylene, 1,1-dimethoxycarbonylethylene, l-methyltonitroethylene, such as N-vinylpyrrole, N-vinylcarbazole, N-vinylindole, N-vinylvirolone, N-vinylpyrrolidone There are N-vinyl compounds such as, and vinyl monomers such as. These vinyl monomers exist in polymer compounds with a structure in which unsaturated double bonds are cleaved.
上記の単量体のうち、脂肪族モノカルボン酸のエステル
類、ニトリル類が本発明の目的に対して浸れた性能を示
し、好ましい。Among the above-mentioned monomers, esters of aliphatic monocarboxylic acids and nitriles are preferred because they exhibit excellent performance for the purpose of the present invention.
これらの単量体は本発明の重合体中にブロック又はラン
ダムのいずれの状態で結合していてもよい。These monomers may be bound in the polymer of the present invention in either a block or random manner.
本発明に用いられるビニル系重合体の感光性組成物中に
占める割合は0.5〜70重量%である。The proportion of the vinyl polymer used in the present invention in the photosensitive composition is 0.5 to 70% by weight.
本発明に用いられるビニル系重合体は上記重合体を単独
で用いてもよいし、又2種以上組合せて用いてもよい。As the vinyl polymer used in the present invention, the above-mentioned polymers may be used alone or in combination of two or more.
又、他の高分子化合物等と組合せて用いることもできる
。Moreover, it can also be used in combination with other polymer compounds.
本発明の感光性組成物の中には、上記の素材の他、必要
に応じて更に染料、顔料等の色素、可塑剤、界面活性剤
、フン素糸界面活性剤、有機酸、酸無水物、露光により
酸を発生し得る化合物などを添加することができる。In addition to the above-mentioned materials, the photosensitive composition of the present invention may optionally contain pigments such as dyes and pigments, plasticizers, surfactants, fluorocarbon surfactants, organic acids, and acid anhydrides. , a compound that can generate an acid upon exposure to light, etc. can be added.
更に本発明の感光性組成物には、該感光性組成物の感脂
性を向上するために例えば、p−tert−ブチルフェ
ノールホルムアルデヒド樹脂やp−n−オクチル7ニノ
ールホルムアルデヒド樹脂や、これらが0−キノンジア
ジド化合物で部分的にエステル化された樹脂などを添加
することもできる。Furthermore, the photosensitive composition of the present invention may contain, for example, p-tert-butylphenol formaldehyde resin, p-n-octyl 7-ninol formaldehyde resin, or 0- It is also possible to add resins partially esterified with quinonediazide compounds.
これらの各成分を下記の溶媒に溶解させ、本発明の支持
体表面に塗布乾燥させることにより、感光性層を設けて
、本発明の感光性平版印刷版を製造することができる。The photosensitive lithographic printing plate of the present invention can be produced by dissolving each of these components in the following solvent and applying and drying the solution on the surface of the support of the present invention to provide a photosensitive layer.
本発明の感光性組成物の各成分を溶解する際に使用し得
る溶媒としては、メチルセロソルブ、メチルセロソルブ
アセテート、エチルセロソルブ、エチルセロソルブアセ
テート、ジエチレングリコール七ツメチルエーテル、ジ
エチレングリコール七ノエチルエーテル、ジエチレング
リコールジメチルエーテル、ジエチレングリコールメチ
ルエチルエーテル、ジエチレングリコールジエチルエ−
テル
テル、プロピレングリコール、プロピレングリコール七
ツメチルエーテルアセテート、プロピレングリコールモ
ノエチルエーテルアセテート、プロピレングリコールモ
ノブチルエーテル、ジプロピレングリコールモノメチル
エーテル、ジプロピレングリコールジメチルエーテル、
ジプロピレングリコールメチルエチルエーテル、ギ酸エ
チル、ギ酸プロピル、ギ酸ブチル、ギ酸アミル、酢酸メ
チル、酢酸エチル、酢酸プロピル、酢酸ブチル、プロピ
オン酸メチル、プロピオン酸エチル、酪酸メチル、酪酸
エチル、ジメチルホルムアミド、ジメチルスルホキシド
ルエチルケトン、シクロヘキサノン、メチルシクロヘキ
サノン、ジアセトンアルコール、アセチルアセトン、γ
ーブチロラクトン等が挙げられる。Solvents that can be used to dissolve each component of the photosensitive composition of the present invention include methyl cellosolve, methyl cellosolve acetate, ethyl cellosolve, ethyl cellosolve acetate, diethylene glycol 7-methyl ether, diethylene glycol 7-ethyl ether, diethylene glycol dimethyl ether, Diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether
Tertel, propylene glycol, propylene glycol 7-methyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether, dipropylene glycol monomethyl ether, dipropylene glycol dimethyl ether,
Dipropylene glycol methyl ethyl ether, ethyl formate, propyl formate, butyl formate, amyl formate, methyl acetate, ethyl acetate, propyl acetate, butyl acetate, methyl propionate, ethyl propionate, methyl butyrate, ethyl butyrate, dimethyl formamide, dimethyl sulfoxide Ruethyl ketone, cyclohexanone, methylcyclohexanone, diacetone alcohol, acetylacetone, γ
-butyrolactone, etc.
これら溶媒は、単独或いは2種以上混合して使用するこ
とができる。These solvents can be used alone or in combination of two or more.
本発明の感光性組成物を支持体表面に塗布する際に用い
る塗布方法としては、従来公知の方法、例えば、回転塗
布、ワイヤーバー塗布、デイツプ塗布、エアーナイフ塗
布、ロール塗布、ブレード塗布及びカーテン塗布等が可
能である。この際塗布量は用途により異なるが、例えば
固形分として0、05〜5.0g/m″が好ましい。The coating method used for coating the surface of the support with the photosensitive composition of the present invention includes conventionally known methods, such as spin coating, wire bar coating, dip coating, air knife coating, roll coating, blade coating, and curtain coating. Coating etc. are possible. At this time, the coating amount varies depending on the application, but is preferably 0.05 to 5.0 g/m'' in terms of solid content.
こうして得られた感光性平版印刷版の使用に際しては、
従来から常用されている方法が適用され得、例えば線画
像、網点画像などを有する透明原画を感光面に密着して
露光し、次いでこれをアルカリ水溶液にて現像すること
により、原画に対してポジ型のレリーフ像が得られる。When using the photosensitive lithographic printing plate thus obtained,
Conventionally used methods can be applied, for example, by exposing a transparent original image having a line image, halftone image, etc. in close contact with a photosensitive surface, and then developing this with an alkaline aqueous solution. A positive relief image is obtained.
露光に好適な光源としては、水銀灯、メタルハライドラ
ンプ、キセノンランプ、ケミカルランプ、カーボンアー
ク灯などが使用され、現像に使用されるアルカリ水溶液
としては、珪酸ナトリウム、珪酸カリウム、水酸化ナト
リウム、水酸化カリウム、第三リン酸ナトリウム、第ニ
リン酸ナトリウム、炭酸ナトリウム、炭酸カリウムなど
の水溶液のようなアルカリ水溶液がある。このときのア
ルカリ水溶液の濃度は、感光性組成物及びアルカリの種
類により異なるが、概して0.1〜10重量%の範囲が
適当であり、又酸アルカリ水溶液には必要に応じ界面活
性剤やアルコールなどのような有機溶媒を加えることも
できる。Suitable light sources for exposure include mercury lamps, metal halide lamps, xenon lamps, chemical lamps, and carbon arc lamps, and alkaline aqueous solutions used for development include sodium silicate, potassium silicate, sodium hydroxide, and potassium hydroxide. There are alkaline aqueous solutions such as aqueous solutions of tribasic sodium phosphate, dibasic sodium phosphate, sodium carbonate, potassium carbonate, etc. The concentration of the alkaline aqueous solution at this time varies depending on the photosensitive composition and the type of alkali, but is generally in the range of 0.1 to 10% by weight. It is also possible to add organic solvents such as.
以下に本発明を実施例により具体的に説明するが、本発
明はその要旨を超えない限りこれら実施例に限定される
ものではない。EXAMPLES The present invention will be specifically explained below using Examples, but the present invention is not limited to these Examples unless the gist of the invention is exceeded.
支持体=1の作製
厚み0 、15mmの鋼板の平面をボーメ40′の塩化
第二鉄溶液でエツチングして、粗面化し、これに硫酸塩
浴を用い、温度50°C1電流密度5A/da2の条件
で、Znを4μmメツキした後、親木処理として粒径1
00mmのCrゾル20gIQ, リン酸lOgIQ
を含む溶液で、鋼板を陰極として2A/d+11”の電
流密度で30秒電解を行い、水洗後乾燥して支持体−1
を得た。Preparation of support = 1 A flat surface of a steel plate with a thickness of 0 and 15 mm was roughened by etching with a Baume 40' ferric chloride solution, and a sulfate bath was used for this, at a temperature of 50° C. and a current density of 5 A/da2. After plating Zn with a thickness of 4 μm under the following conditions, a particle size of 1
00mm Cr sol 20gIQ, phosphoric acid lOgIQ
Electrolysis was performed for 30 seconds at a current density of 2A/d+11'' using a steel plate as a cathode with a solution containing
I got it.
感光性平版印刷版試料−1の作製
上記のように作製した支持体−lに下記組成の感光性組
成物塗布液(1)を回転塗布機を用いて塗布し、90°
Cで4分間乾燥し、感光性平版印刷版試料−1を作製し
た。Preparation of Photosensitive Lithographic Printing Plate Sample-1 A photosensitive composition coating liquid (1) having the following composition was coated on the support-1 prepared as described above using a rotary coating machine, and the coating solution was coated at 90°.
The sample was dried at C for 4 minutes to prepare photosensitive lithographic printing plate sample-1.
(感光性組成物塗布液(1)組成)
・ノボラック樹脂A※’ 6.7 g
・0−キノンジアジド化合物 1.5 g
※2
(QD−1)
・界面活性剤−1830.2 g
・ビクトリアピュアブルーB O H 0.0
8g(保止ケ谷化学(株)製)
・ハロゲン遊離基を生成する化合物 0.15g(r
ad 1※4)
・メチルセロソルブ 100mQ感
光性平版印刷版試料−2の作製
前記により作製した支持体−1上に下記組成の感光性組
成物塗布液(2)を用いて前記と同様にして塗布し、感
光性平版印刷版試料−2を作製した。(Photosensitive composition coating liquid (1) composition) ・Novolac resin A*' 6.7 g
・0-quinonediazide compound 1.5 g
*2 (QD-1) ・Surfactant-1830.2 g ・Victoria Pure Blue B O H 0.0
8g (manufactured by Hodogaya Chemical Co., Ltd.) ・Compound that generates halogen free radicals 0.15g (r
ad 1*4) Methyl cellosolve 100mQ Preparation of photosensitive lithographic printing plate sample-2 Coating the photosensitive composition coating liquid (2) having the following composition onto the support 1 prepared above in the same manner as above. A photosensitive lithographic printing plate sample-2 was prepared.
(感光性組成物塗布液(2)組成)
・ノボラック樹脂A※16.3 g
・0−キノンジアジド化合物 1.9 g
※2
(QD−2)
・界面活性剤−21¥43 0.3g
・ビクトリアピュアブルーB OH0,07g(深土ケ
谷化学(株)製)
・ハロゲン遊離基を生成する化合物 0.13g(r
ad 2※4)
・メチルセロソルブ 100mff
感光性平版印刷版試料−3の作製
支持体−1上に下記組成の感光性組成物塗布液(3)を
前記と同様にして塗布し、感光性平版印刷版試料−3を
作製した。(Photosensitive composition coating liquid (2) composition) - Novolac resin A*16.3 g - 0-quinonediazide compound 1.9 g
*2 (QD-2) ・Surfactant-21¥43 0.3g
・Victoria Pure Blue B OH0.07g (manufactured by Fukadogaya Chemical Co., Ltd.) ・Compound that generates halogen free radicals 0.13g (r
ad 2*4) ・Methyl cellosolve 100mff
Preparation of Photosensitive Planographic Printing Plate Sample-3 A photosensitive composition coating liquid (3) having the following composition was coated on Support -1 in the same manner as described above to prepare Photosensitive Planographic Printing Plate Sample-3.
(感光性組成物塗布液(3)組成)
・ノボラック樹脂A 6.3 g
・ポリマーA※5 0.3 g・
0−キノンジアジド化合物 1.9 g※
2
(QD−3)
・界面活性剤−3′30.3 g
・ビクトリアピュアーブルーB OHO,07g(深土
ケ谷化学(株)製)
・ハロゲン遊離基を生成する化合物 0.13g(r
ad−3※4)
・メチルセロソルブ 100m12
支持体−2の作製
厚み0.0h++oの圧延鋼箔表面に5μmのFeメツ
キを施して、表面粗さ0.4μlとし、更にサージェン
ト浴を用いて、温度45℃、電流密度40A/dl12
の条件で、厚み0.1μmのCrメツキを行い、親水化
処理をして粒径50μlのアルミナゾル(アルミナゾル
−200゜日産化学製)30g/ Q、クロム酸5g/
12を含む水溶液中に浸漬し、乾燥して支持体−2を得
た。(Photosensitive composition coating liquid (3) composition) - Novolac resin A 6.3 g
・Polymer A*5 0.3 g・
0-quinonediazide compound 1.9 g*
2 (QD-3) ・Surfactant-3'30.3 g ・Victoria Pure Blue B OHO, 07 g (manufactured by Fukatogaya Chemical Co., Ltd.) ・Compound that generates halogen free radicals 0.13 g (r
ad-3*4) ・Methyl cellosolve 100m12
Preparation of Support-2 The surface of a rolled steel foil with a thickness of 0.0 h++o was plated with 5 μm of Fe to give a surface roughness of 0.4 μl, and then heated in a Sargent bath at a temperature of 45° C. and a current density of 40 A/dl12.
Cr plating with a thickness of 0.1 μm was performed under the following conditions, and alumina sol with a particle size of 50 μl (alumina sol-200° manufactured by Nissan Chemical) was applied with hydrophilic treatment, 30 g/Q, chromic acid 5 g/
Support 2 was obtained by immersing it in an aqueous solution containing 12 and drying it.
感光性平版印刷版試料−4の作製
上記のように作製した支持体−2上に感光性組成物塗布
液(1)を用いて前記と同様にして塗布し、感光性平版
印刷版試料−4を作製した。Preparation of Photosensitive Planographic Printing Plate Sample-4 The photosensitive composition coating liquid (1) was coated on the support 2 prepared as above in the same manner as described above to obtain Photosensitive Planographic Printing Plate Sample-4. was created.
支持体−3の作製
支持体−1の作製において、親水化処理として、カルボ
キシメチルセルロースナトリウム塩と酢酸カルシウムの
水溶液(各々0.07重量%)に室温にて約1分間浸漬
し、水洗・乾燥を行った以外はすべて支持体−1の作製
と同様にして支持体−3を得jこ 。Preparation of Support-3 In the preparation of Support-1, as a hydrophilic treatment, it was immersed in an aqueous solution of carboxymethyl cellulose sodium salt and calcium acetate (0.07% by weight each) at room temperature for about 1 minute, washed with water, and dried. Support-3 was obtained in the same manner as in the preparation of Support-1 except for the following steps.
感光性平版印刷版試料−5の作製
上記のように作製した支持体−3上に感光性【酸物塗布
液(1)を前記と同様にして塗布し、感光性平版印刷版
試料−5を作製した。Preparation of Photosensitive Planographic Printing Plate Sample-5 A photosensitive [acid coating solution (1)] was coated on the support 3 prepared as above in the same manner as above, and photosensitive planographic printing plate sample-5 was prepared. Created.
支持体−4の作製
支持体−2の作製において、親水化処理として、4重量
%が過マンガン酸カリ水溶液に40°Cにて1分間浸漬
し、水洗・乾燥を行った以外はすべて支持体−1の作製
と同様にして、支持体−4を得た。Preparation of Support-4 In the preparation of Support-2, all supports were used, except that 4% by weight was immersed in an aqueous potassium permanganate solution for 1 minute at 40°C, washed with water, and dried. Support-4 was obtained in the same manner as in the preparation of Support-1.
感光性平版印刷版試料−6の作製
上記のように作製した支持体−4に感光性組成物塗布液
(1)を用いて前記と同様にして塗布し、感光性平版印
刷版試料−6を作製した。Preparation of Photosensitive Planographic Printing Plate Sample-6 The photosensitive composition coating liquid (1) was coated on the support-4 prepared as above in the same manner as described above to obtain Photosensitive Planographic Printing Plate Sample-6. Created.
※l ノボラック樹脂A
フェノールとm−クレゾールとp−クレゾールとホルム
アルデヒドとの共重縮合樹脂(フェノール、m−クレゾ
ール及びp−クレゾールの各々のモル比が2.0:、4
.8 : 3.2、Mv−6,500、My/ Mn−
5,4)※2o−キノンジアジド化合物
QD−1;
QD−2;
n
x/y=1/3
QDを反応させる前の樹脂のMy” 1,900QD−
3;
QDを反応させる前の樹脂のMy−1,600※3 界
面活性剤
界面活性剤−1
エマルゲン120(花王(株)製);
ポリオキシエチレンラウリルエーテル
界面活性剤−2
エマルゲン91O(花王(株)製);
ポリオキシジエチレンノニルフェニル
エーテル
界面活性剤−3
レオドールTW−S120(花王(株)製);ポリオキ
シエチレンソルビタンモノ
ステアレート
※4 ハロゲン遊離基を生成する化合物radl;2−
トリクロロメチル・5−(p−メトキシスチリル)−1
,3,4−オキサジアゾール(特開昭54−74728
号公報実施例1に記載の化合物)
rad−2;2,4−ビス(トリクロロメチル)−6−
p−メトキシスチリル−8−トリアジン(特開昭48−
36281号公報実施例1に記載の化金物)
rad 3;2−)リクロロメチル−5−[β−(2
−ベンゾフリル)ビニル11,3.4−オキサジアゾー
ル(特開昭60・138539号公報に記載の例示化合
物(1))
※5 ポリマーA
JH
実施例1〜4
上記のごとくして、得られた感光性平版印刷版試料No
、1−No、4上に感度測定用ステップタブレ・ント(
イーストマン・コダック社製No、2.濃度差0.15
ずつで21段階のグレイスケール)を密着して、2kW
メタルハライドランプ(岩崎電気社製アイドルフィン2
000)を光源として8.Omv/c+a2の条件で露
光した。*l Novolac resin A Copolycondensation resin of phenol, m-cresol, p-cresol, and formaldehyde (the molar ratio of phenol, m-cresol, and p-cresol is 2.0:, 4
.. 8: 3.2, Mv-6,500, My/Mn-
5,4) *2o-quinonediazide compound QD-1; QD-2; n x/y=1/3 My" of resin before reacting with QD 1,900QD-
3; My-1,600*3 of the resin before reacting with QD Surfactant Surfactant-1 Emulgen 120 (manufactured by Kao Corporation); Polyoxyethylene lauryl ether surfactant-2 Emulgen 91O (manufactured by Kao Polyoxydiethylene nonylphenyl ether surfactant-3 Rheodol TW-S120 (manufactured by Kao Corporation); Polyoxyethylene sorbitan monostearate*4 Compound radl that generates halogen free radicals; 2-
Trichloromethyl 5-(p-methoxystyryl)-1
,3,4-oxadiazole (JP-A-54-74728
Compound described in Example 1 of the publication) rad-2; 2,4-bis(trichloromethyl)-6-
p-methoxystyryl-8-triazine (Unexamined Japanese Patent Publication No. 1973-
36281 Publication Example 1) rad 3;2-)lichloromethyl-5-[β-(2
-benzofuryl) vinyl 11,3,4-oxadiazole (exemplified compound (1) described in JP-A-60-138539) *5 Polymer A JH Examples 1 to 4 Obtained as described above Photosensitive planographic printing plate sample No.
, 1-No., and step tablet for sensitivity measurement on 4 (
Eastman Kodak No. 2. Density difference 0.15
(21 levels of gray scale) in close contact with each other, 2kW
Metal halide lamp (idle fin 2 manufactured by Iwasaki Electric Co., Ltd.)
000) as a light source8. Exposure was carried out under the condition of Omv/c+a2.
現像の許容度を評価するために、上記露光済みの試料を
5DR−1(コニカ(株)社製を水で6倍、9倍。In order to evaluate the development tolerance, the above-exposed sample was exposed to 5DR-1 (manufactured by Konica Corporation) with water at a magnification of 6 times and 9 times.
11倍、 13倍希釈した現像液で25℃、 40秒間
現像した後、現像インキ(spo−1コニカ(株)社製
)にてインキ盛りを行って非画像部の現像性(抜は性)
を観察した。After developing for 40 seconds at 25°C with a developer diluted 11 times or 13 times, ink was applied with developing ink (spo-1 manufactured by Konica, Inc.) to check the developability (removability) of the non-image area.
observed.
次に、印刷時の汚れにくさを評価するために、ハイデル
印刷機を用いて印刷テストを行った。Next, in order to evaluate the resistance to staining during printing, a printing test was conducted using a Heidel printing machine.
試料は感光性平版印刷版試料No、1=No、4に網点
及び線画を有するポジ原稿を密着して、2kwメタルハ
ライドランプ(岩崎電気社製アイドルフィン2000)
を光源として8.On+w/co+”の条件で露光した
後、5DR−1(コニカ(株)社製)を水で6倍に希釈
しt;現像液で25℃、40秒間現像して得た。The sample was a photosensitive planographic printing plate sample No. 1 = No. 4, with a positive original having halftone dots and line drawings in close contact with it, and a 2 kW metal halide lamp (idle fin 2000 manufactured by Iwasaki Electric Co., Ltd.).
8. as a light source. After exposure under the condition of "On+w/co+", 5DR-1 (manufactured by Konica Corporation) was diluted 6 times with water and developed with a developer at 25 DEG C. for 40 seconds.
かくして得られた試料をハイデル印刷機にかけ、先ず印
刷版全面にインキ(東洋インキ製造(株)社製ニューブ
ライトG紅)を付着させ、そのまま10分間放置後、浸
し水(SEU −3,25%コニカ(株)社製)を供給
して正常な印刷物が得られるまでの刷り枚数(印刷用紙
は上質紙を使用)を数えた。The sample thus obtained was applied to a Heidel printing machine, and ink (New Bright G Red, manufactured by Toyo Ink Manufacturing Co., Ltd.) was applied to the entire surface of the printing plate, and after being left as it was for 10 minutes, soaking water (SEU -3. The number of prints (high-quality paper was used as the printing paper) was counted until normal prints were obtained.
以上の評価結果を表1に示す。The above evaluation results are shown in Table 1.
比較例1〜2
前記により得られた感光性平版印刷版試料No、5〜N
o、6を用いて実施例1〜4と全く同様に処理し評価し
た。評価結果を表1に示す。Comparative Examples 1-2 Photosensitive lithographic printing plate samples No. 5-N obtained above
The samples were treated and evaluated in exactly the same manner as in Examples 1 to 4 using No. 0 and No. 6. The evaluation results are shown in Table 1.
表1 ※ ※※ 0:非画像部にインキが着肉しない。Table 1 * ※※ 0: Ink does not adhere to non-image areas.
×;非画像部にインキが着肉する。×: Ink adheres to non-image areas.
50枚以上では、印刷作業性が悪く、実用上問題となる
。If the number of sheets exceeds 50, the printing workability will be poor and this will pose a practical problem.
本発明による感光性平版印刷版は、現像許容性が広く、
従来の感光性平版印刷版と比較して、低濃度のアルカリ
現像液で現像可能となり、現像液の寿命を延ばすことが
できる。又、現像して得られた本発明の平版印刷版は印
刷時汚れにくく、印刷し易く、印刷の作業性が向上した
。The photosensitive lithographic printing plate according to the present invention has wide development latitude,
Compared to conventional photosensitive lithographic printing plates, it can be developed with a low-concentration alkaline developer, and the life of the developer can be extended. Furthermore, the lithographic printing plate of the present invention obtained by development was resistant to staining during printing, was easy to print, and had improved printing workability.
Claims (1)
ノンジアジド化合物を含有する感光性層を有することを
特徴とする感光性平版印刷版。A photosensitive lithographic printing plate comprising a photosensitive layer containing an o-quinonediazide compound on a support whose surface has been treated with a sol of a metal compound.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17468788A JPH0223348A (en) | 1988-07-12 | 1988-07-12 | Photosensitive planographic printing plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17468788A JPH0223348A (en) | 1988-07-12 | 1988-07-12 | Photosensitive planographic printing plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0223348A true JPH0223348A (en) | 1990-01-25 |
Family
ID=15982929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17468788A Pending JPH0223348A (en) | 1988-07-12 | 1988-07-12 | Photosensitive planographic printing plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0223348A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0443359A (en) * | 1990-06-11 | 1992-02-13 | Fuji Photo Film Co Ltd | Production of planographic printing plate |
-
1988
- 1988-07-12 JP JP17468788A patent/JPH0223348A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0443359A (en) * | 1990-06-11 | 1992-02-13 | Fuji Photo Film Co Ltd | Production of planographic printing plate |
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