JPH02228365A - Two-component hardenable composition with improved storage stability - Google Patents
Two-component hardenable composition with improved storage stabilityInfo
- Publication number
- JPH02228365A JPH02228365A JP4908889A JP4908889A JPH02228365A JP H02228365 A JPH02228365 A JP H02228365A JP 4908889 A JP4908889 A JP 4908889A JP 4908889 A JP4908889 A JP 4908889A JP H02228365 A JPH02228365 A JP H02228365A
- Authority
- JP
- Japan
- Prior art keywords
- group
- component
- epoxy resin
- silicon
- rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims description 28
- 238000003860 storage Methods 0.000 title abstract description 16
- 239000003822 epoxy resin Substances 0.000 claims abstract description 38
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 38
- 229920001971 elastomer Polymers 0.000 claims abstract description 35
- 239000005060 rubber Substances 0.000 claims abstract description 35
- 239000003054 catalyst Substances 0.000 claims abstract description 15
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 59
- 229910052710 silicon Inorganic materials 0.000 claims description 24
- 229920000620 organic polymer Polymers 0.000 claims description 21
- 150000003377 silicon compounds Chemical class 0.000 claims description 20
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 abstract description 33
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 abstract description 3
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004848 polyfunctional curative Substances 0.000 abstract 3
- 229920001296 polysiloxane Polymers 0.000 abstract 2
- 238000013329 compounding Methods 0.000 abstract 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 35
- -1 acrylic ester Chemical class 0.000 description 14
- 125000000524 functional group Chemical group 0.000 description 14
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 150000004756 silanes Chemical class 0.000 description 12
- 229920001451 polypropylene glycol Polymers 0.000 description 11
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 10
- 239000000047 product Substances 0.000 description 10
- 229920001577 copolymer Polymers 0.000 description 9
- 125000003700 epoxy group Chemical group 0.000 description 9
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 8
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
- 229920005862 polyol Polymers 0.000 description 8
- 150000003077 polyols Chemical class 0.000 description 8
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000000945 filler Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 125000003396 thiol group Chemical group [H]S* 0.000 description 7
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000009833 condensation Methods 0.000 description 6
- 230000005494 condensation Effects 0.000 description 6
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 6
- 229920000570 polyether Polymers 0.000 description 6
- 239000004721 Polyphenylene oxide Substances 0.000 description 5
- 239000011256 inorganic filler Substances 0.000 description 5
- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 239000005062 Polybutadiene Substances 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 238000006482 condensation reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229920002857 polybutadiene Polymers 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 3
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical group C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 229920001195 polyisoprene Polymers 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2,2'-azo-bis-isobutyronitrile Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- NFVPEIKDMMISQO-UHFFFAOYSA-N 4-[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC=C(O)C=C1 NFVPEIKDMMISQO-UHFFFAOYSA-N 0.000 description 2
- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical compound ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- 229920002367 Polyisobutene Polymers 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 2
- 125000004423 acyloxy group Chemical group 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 125000003302 alkenyloxy group Chemical group 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 125000002344 aminooxy group Chemical group [H]N([H])O[*] 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 239000012975 dibutyltin dilaurate Substances 0.000 description 2
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical class C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 150000002596 lactones Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 2
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 125000001302 tertiary amino group Chemical group 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- YOBOXHGSEJBUPB-MTOQALJVSA-N (z)-4-hydroxypent-3-en-2-one;zirconium Chemical compound [Zr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O YOBOXHGSEJBUPB-MTOQALJVSA-N 0.000 description 1
- TYKCBTYOMAUNLH-MTOQALJVSA-J (z)-4-oxopent-2-en-2-olate;titanium(4+) Chemical compound [Ti+4].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O TYKCBTYOMAUNLH-MTOQALJVSA-J 0.000 description 1
- ZBBLRPRYYSJUCZ-GRHBHMESSA-L (z)-but-2-enedioate;dibutyltin(2+) Chemical compound [O-]C(=O)\C=C/C([O-])=O.CCCC[Sn+2]CCCC ZBBLRPRYYSJUCZ-GRHBHMESSA-L 0.000 description 1
- QGLWBTPVKHMVHM-KTKRTIGZSA-N (z)-octadec-9-en-1-amine Chemical compound CCCCCCCC\C=C/CCCCCCCCN QGLWBTPVKHMVHM-KTKRTIGZSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- OWRCNXZUPFZXOS-UHFFFAOYSA-N 1,3-diphenylguanidine Chemical compound C=1C=CC=CC=1NC(=N)NC1=CC=CC=C1 OWRCNXZUPFZXOS-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- VWSWIUTWLQJWQH-UHFFFAOYSA-N 2-butyl-6-[(3-butyl-2-hydroxy-5-methylphenyl)methyl]-4-methylphenol Chemical compound CCCCC1=CC(C)=CC(CC=2C(=C(CCCC)C=C(C)C=2)O)=C1O VWSWIUTWLQJWQH-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- REWYMBAFAAYCAR-UHFFFAOYSA-N 3-[bis(2-methoxyethoxy)-phenylsilyl]propanoic acid Chemical compound COCCO[Si](CCC(O)=O)(OCCOC)C1=CC=CC=C1 REWYMBAFAAYCAR-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- MCDBEBOBROAQSH-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C=C MCDBEBOBROAQSH-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- AERZMMNNWVZSNB-UHFFFAOYSA-N 3-dodec-1-ynyloxolane-2,5-dione Chemical compound CCCCCCCCCCC#CC1CC(=O)OC1=O AERZMMNNWVZSNB-UHFFFAOYSA-N 0.000 description 1
- AXEFESAPMLYPEF-UHFFFAOYSA-N 3-triethoxysilylpropanoic acid Chemical compound CCO[Si](OCC)(OCC)CCC(O)=O AXEFESAPMLYPEF-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical class C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- JGVDUAWRPJUPLC-UHFFFAOYSA-N N=C=O.CCC[Si](C)(OC)OC Chemical compound N=C=O.CCC[Si](C)(OC)OC JGVDUAWRPJUPLC-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical class [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- IKHOZNOYZQPPCK-UHFFFAOYSA-K aluminum;4,4-diethyl-3-oxohexanoate Chemical compound [Al+3].CCC(CC)(CC)C(=O)CC([O-])=O.CCC(CC)(CC)C(=O)CC([O-])=O.CCC(CC)(CC)C(=O)CC([O-])=O IKHOZNOYZQPPCK-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 125000002228 disulfide group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011094 fiberboard Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000006261 foam material Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 150000004658 ketimines Chemical class 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000002899 organoaluminium compounds Chemical class 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- HKJYVRJHDIPMQB-UHFFFAOYSA-N propan-1-olate;titanium(4+) Chemical compound CCCO[Ti](OCCC)(OCCC)OCCC HKJYVRJHDIPMQB-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
- ACECBHHKGNTVPB-UHFFFAOYSA-N silylformic acid Chemical class OC([SiH3])=O ACECBHHKGNTVPB-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000006276 transfer reaction Methods 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、保存安定性の改良された2液型硬化性組成物
、とくにエポキシ樹脂および特定のゴム系有機重合体を
用いた保存安定性の改良された2液型硬化性組成物に関
する。Detailed Description of the Invention [Industrial Field of Application] The present invention provides a two-component curable composition with improved storage stability, particularly a two-component curable composition with improved storage stability using an epoxy resin and a specific rubber-based organic polymer. The present invention relates to an improved two-component curable composition.
[従来の技術]
従来より、ケイ素原子に結合した水酸基および(または
)加水分解性基を有し、シロキサン結合を形成すること
により架橋しうるケイ素原子含を基を存するゴム系有機
重合体とエポキシ樹脂とを含有する組成物が知られてお
り、接着性がすぐれるなどの特性を有するため接着剤な
どに用いられている。[Prior Art] Conventionally, epoxy and rubber-based organic polymers have been used which have a hydroxyl group and/or a hydrolyzable group bonded to a silicon atom, and which have a silicon atom-containing group that can be crosslinked by forming a siloxane bond. Compositions containing resin are known, and are used in adhesives due to their excellent adhesive properties.
[発明が解決しようとする課題]
しかしながら、この組成物を2液型硬化性組成物として
使用するために前記ケイ素原子含釘基を有するゴム系有
機重合体およびエポキシ樹脂硬化剤の混合物を2液型硬
化性組成物の一方の液とすると、保存安定性が良好でな
く、保存中にも増粘したり、ゲル化するという問題があ
る。この問題はより多くの水分を含有しやすいフィラー
を混合した液のばあいにとくに著しい。[Problems to be Solved by the Invention] However, in order to use this composition as a two-component curable composition, a mixture of the rubber-based organic polymer having a silicon atom-containing nail group and an epoxy resin curing agent is used as a two-component curable composition. If it is used as one liquid of the mold-curing composition, there is a problem that the storage stability is not good, and the viscosity increases or gels during storage. This problem is particularly severe in the case of a liquid mixed with a filler that tends to contain a large amount of water.
[課題を解決するための手段]
本発明は前記のごとき問題を解決するためになされたも
のであり、
囚■ケイ素原子に結合した水酸基および(または)加水
分解性基を有し、シロキサン結合を形成することにより
架橋しうるケイ素原子含有基を有するゴム系有機重合体
、
■エポキシ樹脂硬化剤および
■1つのケイ素原子に3個以上の加水分解性基が結合し
た基を有するシリコン化合物を含むA液ならびに
(B)(1)エポキシ樹脂および
■前記ゴム系有機重合体の硬化触媒を含むB液よりなる
保存安定性の改良された2酸型硬化性組成物
に関する。[Means for Solving the Problems] The present invention has been made to solve the above-mentioned problems. A rubber-based organic polymer having a silicon atom-containing group that can be crosslinked by forming an epoxy resin curing agent; and ■ a silicon compound having a group in which three or more hydrolyzable groups are bonded to one silicon atom. The present invention relates to a 2-acid type curable composition having improved storage stability, comprising (B) (1) an epoxy resin and (1) a curing catalyst for the rubber-based organic polymer.
[実施例]
本発明に使用されるA液の成分の1つであるケイ素原子
に結合した水酸基および(または)加水分解性基を有し
、シロキサン結合を形成することにより架橋しうるケイ
素原子含有基(以下、反応性ケイ素基という)を宵する
ゴム系有機重合体((A)(1)成分)の骨格をなす重
合体としては、たとえばプロピレンオキシド、エチレン
オキシド、テトラヒドロフランなどの環状エーテルの重
合でえられるポリエーテル系;アジピン酸などの2塩基
酸とグリコールとの縮合またはラクトン類の開環重合で
えられるポリエステル系;エチレン−プロピレン共重合
体系;ポリイソブチレンまたはイソブチレンとイソプレ
ンなどとの共重合体系;ポリクロロプレン;ポリイソプ
レンまたはイソプレンとブタジェン、スチレン、アクリ
ロニトリルなどとの共重合体系;ポリブタジェンまたは
ブタジェンとスチレン、アクリロニトリルなどとの共重
合体系;ポリイソプレン、ポリブタジェンまたはイソプ
レンとブタジェンとの共重合体を水素添加してえられる
ポリオレフィン系;エチルアクリレート、ブチルアクリ
レートなどのモノマーをラジカル重合ビてえられるポリ
アクリル酸エステルまたは前記アクリル酸エステルと酢
酸ビニル、アクリロニトリル、スチレン、エチレンなど
との共重合体系;本発明に用いるゴム系9機重合体中で
ビニルモノマーを重合してえられるグラフト重合体系;
ポリサルファイド系などの重合体があげられる。これら
のうちではポリプロピレンオキシド系ポリエーテルなど
の一般式: −R1−0−(式中、R1は炭素数2〜4
の2価のアルキレン基を表わす)で示される繰り返し単
位を有するポリエーテル、ポリプロピレンオキシドなど
のポリエーテルの存在下でアクリル酸エステル、スチレ
ン、アクリロニトリル、酢酸ビニルなどのとニルモノマ
ーを重合させてえられるグラフト重合体などの重合体ま
たは共重合体、ポリアクリル酸アルキルエステルまたは
アクリル酸アルキルエステルを50%以上含有するアク
リル酸アルキルエステルと酢酸ビニル、アクリロニトリ
ル、スチレン、エチレンなどとの共重合体が、反応性ケ
イ素基を分子端末に導入させやすく、また無溶剤で液状
重合体を製造しやすいなどの点から好ましい。耐水性が
よく、安価であり、また液状物として取扱いやすいとい
う点からとくにポリプロピレンオキシドが好ましい。[Example] A silicon atom-containing compound that has a hydroxyl group and/or a hydrolyzable group bonded to a silicon atom, which is one of the components of liquid A used in the present invention, and can be crosslinked by forming a siloxane bond. As the polymer forming the skeleton of the rubber-based organic polymer (component (A) (1)) containing groups (hereinafter referred to as reactive silicon groups), for example, polymers formed by polymerization of cyclic ethers such as propylene oxide, ethylene oxide, and tetrahydrofuran are used. Polyether systems obtained by condensation of dibasic acids such as adipic acid with glycol or ring-opening polymerization of lactones; Ethylene-propylene copolymer systems; Copolymer systems of polyisobutylene or isobutylene and isoprene, etc. ;Polychloroprene;Copolymer system of polyisoprene or isoprene and butadiene, styrene, acrylonitrile, etc.;Copolymer system of polybutadiene or butadiene and styrene, acrylonitrile, etc.;Polyisoprene, polybutadiene, or copolymer of isoprene and butadiene with hydrogen Polyolefin system obtained by addition; polyacrylic ester obtained by radical polymerization of monomers such as ethyl acrylate and butyl acrylate, or copolymer system of the acrylic ester and vinyl acetate, acrylonitrile, styrene, ethylene, etc.; the present invention A graft polymer system obtained by polymerizing a vinyl monomer in a rubber-based polymer used for;
Examples include polymers such as polysulfide. Among these, polypropylene oxide polyethers have a general formula: -R1-0- (wherein R1 has 2 to 4 carbon atoms)
A graft obtained by polymerizing a monomer such as acrylic acid ester, styrene, acrylonitrile, or vinyl acetate in the presence of a polyether such as polyether or polypropylene oxide, which has a repeating unit represented by (representing a divalent alkylene group) Polymers or copolymers such as polyacrylic acid alkyl esters or copolymers of acrylic acid alkyl esters containing 50% or more of acrylic acid alkyl esters and vinyl acetate, acrylonitrile, styrene, ethylene, etc. are reactive. This method is preferable because silicon groups can be easily introduced into the terminals of molecules, and liquid polymers can be easily produced without using a solvent. Polypropylene oxide is particularly preferred because it has good water resistance, is inexpensive, and is easy to handle as a liquid.
本発明にいう反応性ケイ素基とは、加水分解性基や水酸
基が結合しているケイ素原子を含有するシラノール縮合
反応により架橋可能な基であり、代表的には
(式中、Xはヒドロキシル基あるいは加水分解性基、R
2は炭素数1〜2oの1価の炭化水素基あるいは弓5t
−0−(R3は炭素数1〜2oの1価の炭化水素基)で
示されるトリオルガノシロキシ基、aは0.1.2また
は3、bは0.1または2で、1≦(aとbの総和)、
mは0または1〜18の整数を示す)で示される基であ
る。Xが加水分解性基であるばあいには、該反応性ケイ
素基はシラノール縮合触媒の存在下または非存在下で水
分により加水分解反応およびシラノール縮合反応をおこ
して架橋する。Xが水酸基であるばあいには、該反応性
ケイ素基はシラノール縮合触媒の存在下あるいは非存在
下でシラノール縮合反応をおこして架橋する。The reactive silicon group referred to in the present invention is a group that can be crosslinked by a silanol condensation reaction containing a silicon atom to which a hydrolyzable group or a hydroxyl group is bonded. Or a hydrolyzable group, R
2 is a monovalent hydrocarbon group having 1 to 2 carbon atoms or a bow 5t
A triorganosiloxy group represented by -0- (R3 is a monovalent hydrocarbon group having 1 to 2 carbon atoms), a is 0.1.2 or 3, b is 0.1 or 2, and 1≦(a and b),
m is a group represented by 0 or an integer of 1 to 18). When X is a hydrolyzable group, the reactive silicon group is crosslinked by causing a hydrolysis reaction and a silanol condensation reaction with moisture in the presence or absence of a silanol condensation catalyst. When X is a hydroxyl group, the reactive silicon group undergoes a silanol condensation reaction in the presence or absence of a silanol condensation catalyst and is crosslinked.
加水分解性基の具体例としては、水素原子、ハロゲン原
子、アルコキシ基、アシルオキシ基、ケトキシメート基
、アミノ基、アミド基、アミノオキシ基、メルカプト基
、アルケニルオキシ基などの一般に使用されている基が
あげられる。Specific examples of hydrolyzable groups include commonly used groups such as a hydrogen atom, a halogen atom, an alkoxy group, an acyloxy group, a ketoximate group, an amino group, an amide group, an aminooxy group, a mercapto group, and an alkenyloxy group. can give.
これらのうちでは、加水分解性がマイルドであり、取扱
いやすいという点からアルコキシ基がとくに好ましい。Among these, alkoxy groups are particularly preferred because they are mildly hydrolyzable and easy to handle.
該加水分解性基は、1個のケイ素原子に1〜3個の範囲
で結合しつる。One to three hydrolyzable groups are bonded to one silicon atom.
前記反応性ケイ素基を形成するケイ素原子は1個でもよ
く、2個以上あってもよいが、シロキサン結合などによ
り連結されたケイ素原子のばあいには、20個のものま
でであれば自由に使用しうる。The number of silicon atoms forming the reactive silicon group may be one or two or more, but in the case of silicon atoms connected by siloxane bonds etc., up to 20 silicon atoms may be used. Can be used.
反応性ケイ素基の中では
t−Xc
(式中、X、R2i;を前記と同じ、ci、tl、2ま
たは3)で表わされる基が経済的な理由から好ましい。Among the reactive silicon groups, a group represented by t-Xc (wherein X, R2i; are the same as above, ci, tl, 2 or 3) is preferred for economical reasons.
反応性ケイ素基はゴム系有機重合体主鎖と化学的に結合
している。反応性ケイ素基とゴム系重合体主鎖間の結合
において、)s+−o−c6結合のような結合があるこ
とは水分による結合の開裂がありうるため望ましくはな
い。反応性ケイ素基中、ゴム系重合体主鎖に最も近いケ
イ素原子は’3 s+−c:;結合で結合されているこ
とが好ましい。The reactive silicon group is chemically bonded to the rubber-based organic polymer main chain. In the bond between the reactive silicon group and the main chain of the rubber-based polymer, the presence of a bond such as an s+-o-c6 bond is not desirable because the bond may be cleaved by moisture. In the reactive silicon group, the silicon atom closest to the main chain of the rubber-based polymer is preferably bonded with a '3 s+-c:; bond.
反応性ケイ素基をゴム系有機重合体内に導入する方法と
しては、たとえば以下の方法があげられる。Examples of methods for introducing reactive silicon groups into rubber-based organic polymers include the following methods.
(1) ビニルトリアルコキシシラン、メタクリロイ
ルオキシプロピルメチルジアルコキシシラン、メタクリ
ロイルオキシプロピルトリアルコキシシランなどのよう
な共重合可能な不飽和基と反応性ケイ素基とを分子中に
有するモノマーをエチレン、プロピレン、イソブチレン
、クロロブレン、イソプレン、ブタジェン、アクリル酸
エステルなどの重合性モノマーと共重合させたり、γ
−グリシドキシプロピルトリメトキシシラン、γ −グ
リシドキシプロピルメチルジメトキシシランなどのよう
な共重合可能なエポキシ基および反応性ケイ素基を分子
中に有するモノマーをプロピレンオキシドまたはエチレ
ンオキシドなどと共重合させる方法。(1) A monomer having a copolymerizable unsaturated group and a reactive silicon group in the molecule, such as vinyltrialkoxysilane, methacryloyloxypropylmethyldialkoxysilane, methacryloyloxypropyltrialkoxysilane, etc., in ethylene, propylene, By copolymerizing with polymerizable monomers such as isobutylene, chlorobrene, isoprene, butadiene, and acrylic esters,
- A method of copolymerizing a monomer having a copolymerizable epoxy group and a reactive silicon group in the molecule, such as glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, etc., with propylene oxide or ethylene oxide, etc. .
これらの方法により、分子側鎖に反応性ケイ素基を導入
することができる。These methods allow the introduction of reactive silicon groups into molecular side chains.
(2) ラジカル重合において連鎖移動反応をおこし
うるメルカプトプロピルトリアルコキシシラン、メルカ
プトプロピルメチルジアルコキシシランなどのようなメ
ルカプト基やジスルフィド基などと反応性ケイ素基とを
分子中に存する化合物を連鎖移動剤として使用してラジ
カル重合性モノマーを重合させる方法。(2) A chain transfer agent is a compound that has a mercapto group, a disulfide group, etc. and a reactive silicon group in its molecule, such as mercaptopropyltrialkoxysilane and mercaptopropylmethyldialkoxysilane, which can cause a chain transfer reaction in radical polymerization. A method of polymerizing radically polymerizable monomers using
(3) アゾビス−2−(6−メチルジェトキシシリ
ル2−シアノヘキサン)などのような反応性ケイ素基を
含有するアゾ系または過酸化物系重合開始剤を使用して
ラジカル重合性・モノマーを重合させる方法。(3) Using an azo or peroxide polymerization initiator containing a reactive silicon group such as azobis-2-(6-methyljethoxysilyl-2-cyanohexane) to generate a radically polymerizable monomer. How to polymerize.
(′2J、(3)の方法では反応性ケイ素基が重合体分
子末端に導入される。('2J, In method (3), a reactive silicon group is introduced at the end of the polymer molecule.
(4)重合体の側鎖および(または)末端に水酸基、カ
ルボキシル基、メルカプト基、エポキシ基、イソシアネ
ート基などの官能基(以下、Y官能基という)を有する
重合体を使用し、該Y官能基と反応しうるY゛官能基を
分子中に含有し、かつ反応性ケイ素基を有する化合物を
Y官能基と反応させる方法。(4) Using a polymer having a functional group (hereinafter referred to as a Y functional group) such as a hydroxyl group, a carboxyl group, a mercapto group, an epoxy group, or an isocyanate group in the side chain and/or the terminal of the polymer, the Y functional group is used. A method in which a compound containing a Y functional group capable of reacting with the group in its molecule and having a reactive silicon group is reacted with the Y functional group.
具体的な反応例を下記表に示すが、これらに限定される
ものではない。Specific reaction examples are shown in the table below, but are not limited thereto.
〔以下余白]
とくに、表において出発原料および中間原料として使用
されるY官能基を有する重合体としては、ポリプロピレ
ンポリオール、ポリエチレンポリオール、ポリテトラメ
チレンジオールなどのような主鎖が本質的に−R1−0
−(式中、R1は炭素数2〜4の2価のアルキレン基を
表わす)で示される繰返し単位からなるポリエーテルポ
リオール類;アジピン酸などの2塩基酸とグリコールと
の縮合またはラクトン類の開環重合でえられるポリエス
テルポリオール類:ポリイソブチレンのポリオールまた
はポリカルボン酸類;ポリブタジェンまたはブタジェン
とスチレン、アクリロニトリルなどとの共重合体のポリ
オールまたはポリカルボン酸類;ポリイソプレンまたは
ポリブタジェンを水素添加してえられるポリオレフィン
のポリオール類;前記ポリオールまたはポリカルボン酸
とポリイソシアネートとを反応させてえられるイソシア
ネート官能基含有前記重合体類;前記ポリオール類をビ
ニル型不飽和基含有ハロゲン化合物などと反応させてえ
られるビニル型不飽和基含有前記重合体類などがとくに
好ましく、さらにY官能基が■合体分子末端にあるのが
より好ましい。[White space below] In particular, as the polymers having a Y functional group used as starting materials and intermediate materials in the table, the main chain is essentially -R1- such as polypropylene polyol, polyethylene polyol, polytetramethylene diol, etc. 0
- (in the formula, R1 represents a divalent alkylene group having 2 to 4 carbon atoms) polyether polyols consisting of a repeating unit; condensation of a dibasic acid such as adipic acid with glycol or opening of lactones; Polyester polyols obtained by ring polymerization: Polyols of polyisobutylene or polycarboxylic acids; Polyols or polycarboxylic acids of polybutadiene or copolymers of butadiene and styrene, acrylonitrile, etc.; Polyolefins obtained by hydrogenating polyisoprene or polybutadiene. Polyols; Polymers containing isocyanate functional groups obtained by reacting the polyols or polycarboxylic acids with polyisocyanates; Vinyl-type polymers obtained by reacting the polyols with halogen compounds containing vinyl-type unsaturated groups, etc. The above-mentioned polymers containing unsaturated groups are particularly preferred, and it is more preferred that the Y functional group is located at the terminal of the polymerized molecule.
前記Y′官能基を有するケイ素化合物としては、γ−(
2−アミノエチル)アミノプロピルトリメトキシシラン
、γ−(2−アミノエチル)アミノプロピルメチルジメ
トキシシラン、γ −アミノプロピルトリエトキシシラ
ンなどのようなアミノ基含有シラン類;γ −メルカプ
トプロピルトリメトキシシラン、γ −メルカプトプロ
ピルメチルジメトキシシランなどのようなメルカプト試
食をシラン類;γ −グリシドキシプロビルトリメトキ
シシラン、β−(3,4−エポキシシクロヘキシル)エ
チルトリメトキシシランなどのようなエポキシシラン類
;ビニルトリエトキシシラン、γ −メタクリロイルオ
キシプロピルトリメトキシシラン、γ −アクリロイル
オキシプロピルメチルジメトキシシランなどのようなビ
ニル型不飽和基含有シラン類;γ −クロロプロピルト
リメトキシシランなどのような塩素原子含何シラン類;
γ−イソシアネートプロピルトリエトキシシラン、γ−
イソシアネートプロピルメチルジメトキシシランなどの
ようなイソシアネート含有シラン類;メチルジメトキシ
シラン、トリメトキシシラン、メチルジェトキシシラン
などのようなハイドロシラン類などが具体的に例示され
うるが、これらに限定されるものではない。As the silicon compound having the Y' functional group, γ-(
Amino group-containing silanes such as 2-aminoethyl)aminopropyltrimethoxysilane, γ-(2-aminoethyl)aminopropylmethyldimethoxysilane, γ-aminopropyltriethoxysilane; γ-mercaptopropyltrimethoxysilane, Mercapto-tasting silanes such as γ-mercaptopropylmethyldimethoxysilane; epoxysilanes such as γ-glycidoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane; Vinyl-type unsaturated group-containing silanes such as vinyltriethoxysilane, γ-methacryloyloxypropyltrimethoxysilane, γ-acryloyloxypropylmethyldimethoxysilane, etc.; Chlorine atom-containing silanes such as γ-chloropropyltrimethoxysilane, etc. Silanes;
γ-Isocyanatepropyltriethoxysilane, γ-
Specific examples include isocyanate-containing silanes such as isocyanate propylmethyldimethoxysilane; hydrosilanes such as methyldimethoxysilane, trimethoxysilane, methyljethoxysilane, etc., but are not limited to these. do not have.
Y官能基を含有する重合体とY゛官能基を含有するケイ
素化合物との組合わせにおいては、とくに(1)インシ
アネート基を有する重合体とアミノ基台をシラン類また
はメルカプト基含有シラン類との組合わせ、(II)ビ
ニル型不飽和基含有重合体とハイドロシラン類との組合
わせが好ましい。さらに(II)において、アリルエー
テル基を分子末端に有するポリプロピレンオキシドとハ
イドロシラン類との組合わせがとくに好ましい。(11
)においては白金系化合物などを触媒に使用してヒドロ
シリル化反応させることにより、ビニル基とハイドロシ
リル基とを反応させ、シリル基を重合体中に導入するこ
とができる。In the combination of a polymer containing a Y functional group and a silicon compound containing a Y functional group, in particular (1) the polymer having an incyanate group and the amino base are combined with silanes or mercapto group-containing silanes. and (II) a combination of a vinyl-type unsaturated group-containing polymer and a hydrosilane. Furthermore, in (II), a combination of polypropylene oxide having an allyl ether group at the molecular end and hydrosilanes is particularly preferred. (11
), a platinum-based compound or the like is used as a catalyst to carry out a hydrosilylation reaction, whereby a vinyl group and a hydrosilyl group are reacted, and a silyl group can be introduced into the polymer.
本発明におけるA液の一成分として用いる分子中に少な
くとも1個、好ましくは1.2〜6個の反応性ケイ素基
を有するゴム系何機重合体((A)(1)成分)の分子
量としては、500〜50000程度、とくに1000
〜20000程度の液状物が取扱いやすいという面から
好ましい。前記分子中に含まれる反応性ケイ素基の数が
1個未満になると、硬化物の架橋密度が減少し、ゴム弾
性が不充分となり改質効果がはっきりとでない。The molecular weight of the rubber-based polymer (component (A) (1)) having at least 1, preferably 1.2 to 6 reactive silicon groups in the molecule used as a component of liquid A in the present invention. is about 500 to 50,000, especially 1,000
A liquid material of about 20,000 to 20,000 is preferred from the viewpoint of ease of handling. When the number of reactive silicon groups contained in the molecule is less than one, the crosslinking density of the cured product decreases, the rubber elasticity becomes insufficient, and the modification effect is not clear.
水酸基がついたケイ素原子を宵する反応性ケイ素基含有
重合体は、加水分解性基がついたケイ素原子を有する反
応性ケイ素基台a重合体を加水分解してうろこともでき
る。A reactive silicon group-containing polymer having silicon atoms attached with a hydroxyl group can also be obtained by hydrolyzing a reactive silicon-based polymer having silicon atoms attached with a hydrolyzable group.
本発明に用いる分子中に少なくとも1個の反応性ケイ素
基を有するゴム系有機重合体((A)(1)成分)にお
いて、反応性ケイ素基は分子末端に存在することが好ま
しい。分子末端に反応性ケイ素基が存在するばあいには
、形成される硬化物において架橋点間の分子鎖長が長く
なるため、ゴム弾性特性が効果的にあられれやすく、し
たがってエポキシ樹脂の脆さが改善されやすくなり、高
強度物かえられやすくなる。In the rubber-based organic polymer having at least one reactive silicon group in the molecule used in the present invention (component (A) (1)), the reactive silicon group is preferably present at the end of the molecule. When a reactive silicon group is present at the end of the molecule, the length of the molecular chain between crosslinking points becomes longer in the cured product that is formed, making it easier to effectively exhibit rubber elastic properties, thus reducing the brittleness of the epoxy resin. This makes it easier to improve and replace with high-strength products.
前記のごとき反応性ケイ素基を有するゴム系有機重合体
の具体例としては、たとえば特公昭45−36319号
、同4G−12154号、同49−32673号、特開
昭50−158599号、同51−73561号、同5
4−609fi号、同55−13787号、同54−1
37H号、同55−82123号、同55−12382
0号、同55−125121号、同55−131021
号、同55−131022号、同55−135135号
、同55−137129号、同57−179210号、
同58−191703号、同59−78220号、同5
9−78221号、同59−78222号、同59−7
8223号、同59−168014号などの公報に開示
されているものがあげられ、これらはを効に使用される
が、これらに限定されるものではない。Specific examples of rubber-based organic polymers having reactive silicon groups as described above include, for example, Japanese Patent Publications Nos. 45-36319, 4G-12154, 49-32673, 50-158599, 51 -73561, same 5
No. 4-609fi, No. 55-13787, No. 54-1
No. 37H, No. 55-82123, No. 55-12382
No. 0, No. 55-125121, No. 55-131021
No. 55-131022, No. 55-135135, No. 55-137129, No. 57-179210,
No. 58-191703, No. 59-78220, No. 5
No. 9-78221, No. 59-78222, No. 59-7
Examples include those disclosed in publications such as No. 8223 and No. 59-168014, and these are effectively used, but are not limited thereto.
本発明に使用されるA液の他の成分であるエポキシ樹脂
硬化剤((A)■成分)としては、一般に使用されてい
るエポキシ樹脂用の硬化剤が使用されうる。このような
硬化剤としては、たとえばトリエチレンテトラミン、テ
トラエチレンペンタミン、ジエチルアミノプロピルアミ
ン、N−アミノエチルピペラジン、−キシリレンジアミ
ン、■−フ二二レしジアミン、ジアミノジフェニルメタ
ン、ジアミノジフェニルスルホン、インホロンジアミン
、2.4.8−)リス(ジメチルアミノメチル)フェノ
ールなどのごときアミン類;3級アミン塩類;ポリアミ
ド樹脂類;イミダゾール類;ケチミン類;ジシアンジア
ミド類;三フッ化ホウ素錯化合物類;無水フタル酸、ヘ
キサヒドロ無水フタル酸、テトラヒドロ無水フタル酸、
エンドメチレンテトラヒドロ無水フタル酸、ドデシニル
無水コハク酸、無水ピロメリット酸、無水クロレン酸な
どのごとき無水カルボン酸類;アルコール類;フェノー
ル類;カルボン酸類などのごとき化合物が例示されるが
、これらに限定されるものでない。As the epoxy resin curing agent (component (A) (ii)), which is another component of liquid A used in the present invention, commonly used curing agents for epoxy resins can be used. Examples of such curing agents include triethylenetetramine, tetraethylenepentamine, diethylaminopropylamine, N-aminoethylpiperazine, -xylylenediamine, -fluorinated diamine, diaminodiphenylmethane, diaminodiphenylsulfone, and Amines such as phorondiamine, 2.4.8-)lis(dimethylaminomethyl)phenol; tertiary amine salts; polyamide resins; imidazoles; ketimines; dicyandiamides; boron trifluoride complex compounds; anhydrous Phthalic acid, hexahydrophthalic anhydride, tetrahydrophthalic anhydride,
Examples include, but are not limited to, carboxylic acid anhydrides such as endomethylenetetrahydrophthalic anhydride, dodecynylsuccinic anhydride, pyromellitic anhydride, chlorenic anhydride; alcohols; phenols; carboxylic acids, etc. It's not something.
前記硬化剤の使用量はエポキシ樹脂および硬化剤の種類
により異なるが、エポキシ樹脂100部(重量部、以下
同様)に対し、硬化剤を0.1〜300部の範囲で目的
に応じて適宜使用すればよい。The amount of the curing agent used varies depending on the type of epoxy resin and curing agent, but the curing agent is used as appropriate depending on the purpose in the range of 0.1 to 300 parts per 100 parts (parts by weight, same hereinafter) of the epoxy resin. do it.
本発明に用いるA液には、前記反応性ケイ素基を有する
ゴム系有機重合体((A)(1)成分)とエポキシ樹脂
硬化剤((A)■成分)との他に1つのケイ素原子に3
個以上の加水分解性基が結合した基を有するシリコン化
合物((A)■成分)が含有される。Liquid A used in the present invention contains one silicon atom in addition to the rubber-based organic polymer having reactive silicon groups (component (A) (1)) and the epoxy resin curing agent (component (A) ■). to 3
Contains a silicon compound (component (A) (ii)) having a group to which two or more hydrolyzable groups are bonded.
該シリコン化合物は、(A)(1)成分と(A)■成分
との混合物を保存すると、保存中に増粘したりゲル化し
て2波型硬化性組成物の一成分として充分な特性を有さ
なくなるという問題を解消するために使用される成分で
ある。該シリコン化合物を使用すると(A)(1)成分
に存在する反応性ケイ素基の反応性と比較して同等以上
の反応性を示す基である1つのケイ素原子に結合する加
水分解性基が3個以上の基が存在するため、(A)(1
)成分と反応して増粘したりゲル化したりなどして保存
安定性を低下させる系中の水分などと優先的に反応する
ので、A液の保存安定性が改善される。とくにより多く
の水分を含有しやすいフィラーが混合されているばあい
には、この効果が著しい。When the mixture of components (A) (1) and (A) This is a component used to solve the problem of depletion. When the silicon compound is used, the hydrolyzable group bonded to one silicon atom, which is a group exhibiting reactivity equal to or higher than that of the reactive silicon group present in component (A) (1), is Since there are more than 1 groups, (A) (1
) The storage stability of Solution A is improved because it preferentially reacts with moisture in the system, which reduces storage stability by reacting with components such as thickening or gelling. This effect is particularly significant when a filler that tends to contain a large amount of water is mixed.
このような(A)■成分としては、水素原子、ハロゲン
原子、アルコキシ基、アシルオキシ基、ケトキシメート
基、アミノ基、アミド基、アミノオキシ基、メルカプト
基、アルケニルオキシ基などの加水分解性基が1つのケ
イ素原子に3個以上結合した基を有するシリコン化合物
があげられ、その具体例としては、たとえばCH3Si
(OCH3) 3
81(QC2H5)4、Cs Hs 81(OCRl)
s、CH2=CH9l(OCOCH3)3、CH35
I(ON −C(CH3) (C2Hs) )3、C)
(381(N(C)Is )2 )s、CH391(O
N(CHx) (C2Hs) )3、CHs 31(N
(CH3)(OCCH3) )3、CH391(QC(
CHx) −CH2) s、82 NG)(2CH2C
H2Sl (OCh) 3 .82 NC)12 CH
2C82S I (OC2Is )3、H2NCH2C
H2NHCH2CH2CH25t(OCHりs 、8
2 NC82CH2N)ICH2C)12 CH281
(OC2H5)3、C)+2− C(CH3) C00
C82C)+2c 82 Sl (OCH3) s
、γ−ウレイドプロピルトリエトキシシラン、N−β−
(N−ビニルベンジルアミノエチル)−γ−アミノプロ
ピルトリメトキシシラン、γ−アニリノプロピルトリメ
トキシシラン、
H3CH2CH2CH281(OCH3) s、H3C
H2CH2CH2St (OC2H5)3、β−カルボ
キシエチルトリエトキシシラン、N−β−(N−カルボ
キシメチルアミノエチル)−γ −アミノプロピルトリ
メトキシシランなどがあげられる。As such component (A), a hydrolyzable group such as a hydrogen atom, a halogen atom, an alkoxy group, an acyloxy group, a ketoximate group, an amino group, an amide group, an aminooxy group, a mercapto group, or an alkenyloxy group is used. Examples include silicon compounds having three or more groups bonded to one silicon atom, such as CH3Si
(OCH3) 3 81 (QC2H5) 4, Cs Hs 81 (OCRl)
s, CH2=CH9l(OCOCH3)3, CH35
I(ON -C(CH3) (C2Hs) )3,C)
(381(N(C)Is)2)s, CH391(O
N(CHx) (C2Hs) )3, CHs 31(N
(CH3) (OCCH3) )3, CH391(QC(
CHx) -CH2) s, 82 NG) (2CH2C
H2Sl (OCh) 3. 82 NC) 12 CH
2C82S I (OC2Is)3, H2NCH2C
H2NHCH2CH2CH25t(OCHris, 8
2 NC82CH2N)ICH2C)12 CH281
(OC2H5)3,C)+2- C(CH3) C00
C82C)+2c 82 Sl (OCH3) s
, γ-ureidopropyltriethoxysilane, N-β-
(N-vinylbenzylaminoethyl)-γ-aminopropyltrimethoxysilane, γ-anilinopropyltrimethoxysilane, H3CH2CH2CH281(OCH3) s, H3C
Examples include H2CH2CH2St (OC2H5)3, β-carboxyethyltriethoxysilane, N-β-(N-carboxymethylaminoethyl)-γ-aminopropyltrimethoxysilane, and the like.
前記シリコン化合物として、エポキシ基と反応しつる官
能基(たとえば1級、2級、3級のアミノ基、メルカプ
ト基、エポキシ基、カルボキシル基など)を有するシリ
コン化合物を使用すると、(^)(1)成分であるゴム
系有機重合体と後述する(B)(1)成分であるエポキ
シ樹脂との混和性が改善され、均質な硬化物かえられ、
硬化物の特性が改善されうるため好ましい。When a silicon compound having a functional group that reacts with an epoxy group (for example, a primary, secondary, or tertiary amino group, mercapto group, epoxy group, carboxyl group, etc.) is used as the silicon compound, (^) (1 The miscibility of the rubber-based organic polymer which is component ) with the epoxy resin which is component (B) (1) described below is improved, and a homogeneous cured product is obtained.
This is preferable because the properties of the cured product can be improved.
前記シリコン化合物の使用量は、A液にフィラーが含ま
れているか否かによっても異なるが、通常A液100部
中に0.1〜20部程度含まれているのが好ましく、0
.5〜10部程度であるのがさらに好ましい。また、(
A)(1)成分のゴム系有機重合体と(B)(1)成分
のエポキシ樹脂との合計量100部に対して0.06〜
12部程度、さらには0.3〜6部程度であるのが好ま
しい。The amount of the silicon compound to be used varies depending on whether the A liquid contains a filler or not, but it is usually preferably contained in about 0.1 to 20 parts in 100 parts of A liquid.
.. More preferably, the amount is about 5 to 10 parts. Also,(
A) 0.06 to 100 parts of the total amount of the rubber-based organic polymer as the component (1) and the epoxy resin as the component (B) (1)
It is preferably about 12 parts, more preferably about 0.3 to 6 parts.
本発明に用いる(B) Gの成分の1つであるエポキシ
樹脂((B)(1)成分)としては、たとえばエピクロ
ルヒドリン−ビスフェノールA型エポキシ樹脂、エピク
ロルヒドリン−ビスフェノールF型エポキシ樹脂、テト
ラブロモビスフェノールAのグリシジルエーテルなどの
難燃型エポキシ樹脂、ノボラック型エポキシ樹脂、水添
ビスフェノールA型エポキシ樹脂、ビスフェノールAプ
ロピレンオキシド付加物のグリシジルエーテル型エポキ
シ樹脂、p−オキシ安息香酸グリシジルエーテルエステ
ル型エポキシ樹脂、橿−アミノフェノール系エポキシ樹
脂、ジアミノジフェニルメタン系エポキシ樹脂、ウレタ
ン変性エポキシ樹脂、各種脂環式エポキシ樹脂、N、N
−ジグリシジルアニリン、 N、N−ジグリシジル−o
−トルイジン、トリグリシジルイソシアヌレート、ポリ
アルキレングリコールジグリシジルエーテル、グリセリ
ンなどのごとき多価アルコールのグリシジルエーテル、
ヒダントイン型エポキシ樹脂、石油樹脂などのごとき不
飽和重合体のエポキシ化物などが例示されるが、これら
に限定されるものではなく、一般に使用されているエポ
キシ樹脂が使用されうる。これらエポキシ樹脂のうちで
は、とくに式:
%式%
で示されるエポキシ基を少なくとも分子中に2個含有す
るものが、硬化に際し反応性が高く、また硬化物が3次
元的網目をつくりやすいなどの点から好ましい。さらに
好ましいものとしてはビスフェノールA型エポキシ樹脂
類またはノボラック型エポキシ樹脂類があげられる。Examples of the epoxy resin (B) (component (1)) used in the present invention, which is one of the components of (B) G, include epichlorohydrin-bisphenol A type epoxy resin, epichlorohydrin-bisphenol F type epoxy resin, and tetrabromobisphenol A. Flame-retardant epoxy resins such as glycidyl ether of -Aminophenol epoxy resin, diaminodiphenylmethane epoxy resin, urethane-modified epoxy resin, various alicyclic epoxy resins, N, N
-diglycidylaniline, N,N-diglycidyl-o
- glycidyl ethers of polyhydric alcohols such as toluidine, triglycidyl isocyanurate, polyalkylene glycol diglycidyl ether, glycerin, etc.
Examples include hydantoin type epoxy resins and epoxidized products of unsaturated polymers such as petroleum resins, but are not limited thereto, and commonly used epoxy resins may be used. Among these epoxy resins, those containing at least two epoxy groups represented by the formula: % formula % in the molecule have high reactivity during curing, and the cured product tends to form a three-dimensional network. Preferable from this point of view. More preferred are bisphenol A type epoxy resins and novolac type epoxy resins.
エポキシ樹脂の使用量は、A液の一成分である反応性ケ
イ素基ををするゴム系有機重合体/エポキシ樹脂が重量
比で1/100〜10011、とくに10/100〜1
00710の範囲があるのが好ましい。The amount of epoxy resin used is 1/100 to 10011, especially 10/100 to 1 in weight ratio of rubber-based organic polymer with reactive silicon groups/epoxy resin, which is one component of liquid A.
Preferably there is a range of 0.00710.
本発明に用いるB液の他の成分である硬化触媒((B)
■成分)は、前記ゴム系有機重合体が硬化する際のシラ
ノール縮合反応を促進する触媒である。Curing catalyst ((B) which is another component of liquid B used in the present invention)
Component (1) is a catalyst that promotes the silanol condensation reaction when the rubber-based organic polymer is cured.
前記硬化触媒の具体例としては、たとえばテトラブチル
チタネート、テトラプロピルチタネートなどのチタン酸
エステル類;ジブチルスズジラウレート、ジブチルスズ
マレエート、ジブチルスズジアセテート、オクチル酸ス
ズ、ナフテン酸スズなどのスズカルボン酸塩類;ジブチ
ルスズオキサイドとフタル酸エステルとの反応物;ジブ
チルスズジアセチルアセトナート;アルミニウムトリス
アセチルアセトナート、アルミニウムトリスエチルアセ
トアセテート、ジイソプロポキシアルミニウムエチルア
セトアセテートなどの有機アルミニウム化合物類;ジル
コニウムテトラアセチルアセトナート、チタンテトラア
セチルアセトナートなどのキレート化合物類:オクチル
酸鉛ニブチルアミン、オクチルアミン、ジブチルアミン
、モノエタノールアミン、ジェタノールアミン、トリエ
タノールアミン、ジエチレントリアミン、トリエチレン
テトラミン、オレイルアミン、シクロヘキシルアミン、
ベンジルアミン、ジエチルアミノプロビルアミン、キシ
リレンジアミン、トリエチレンジアミン、グアニジン、
ジフェニルグアニジン、2.4.6−トリス(ジメチル
アミノメチル)フェノール、モルホリン、N−メチルモ
ルホリン、2−エチル−4−メチルイミダゾール、1.
8−ジアザビシクロ(5,4,0)ウンデセン−7(D
BU)などのアミン系化合物あるいはそれらのカルボン
酸などとの塩;過剰のポリアミンと多塩基酸とからえら
れる低分子量ポリアミド樹脂;過剰のポリアミンとエポ
キシ化合物との反応生成物;アミノ基を有するシランカ
ップリング剤、たとえばγ−アミノプロピルトリメトキ
シシラン、N−(β −アミノエチル)アミノプロピル
メチルジメトキシシランなどのシラノール縮合触媒、さ
らには他の酸性触媒、塩基性触媒などの公知のシラノー
ル縮合触媒などがあげられる。これらの触媒は単独で使
用してもよく、2種以上併用してもよい。硬化触媒の使
用量としては、(A)(1)成分のゴム系有機重合体お
よび(A)■成分のシリコン化合物100部に対して0
.1〜20部が好ましく、1〜lO部がさらに好ましい
。Specific examples of the curing catalyst include titanate esters such as tetrabutyl titanate and tetrapropyl titanate; tin carboxylates such as dibutyltin dilaurate, dibutyltin maleate, dibutyltin diacetate, tin octylate, and tin naphthenate; dibutyltin oxide. and phthalate ester; dibutyltin diacetylacetonate; organoaluminium compounds such as aluminum trisacetylacetonate, aluminum trisethylacetoacetate, diisopropoxyaluminum ethylacetoacetate; zirconium tetraacetylacetonate, titanium tetraacetylacetonate Chelate compounds such as lead octylate, nibutylamine, octylamine, dibutylamine, monoethanolamine, jetanolamine, triethanolamine, diethylenetriamine, triethylenetetramine, oleylamine, cyclohexylamine,
Benzylamine, diethylaminopropylamine, xylylenediamine, triethylenediamine, guanidine,
Diphenylguanidine, 2.4.6-tris(dimethylaminomethyl)phenol, morpholine, N-methylmorpholine, 2-ethyl-4-methylimidazole, 1.
8-Diazabicyclo(5,4,0)undecene-7(D
Amine compounds such as BU) or their salts with carboxylic acids; low molecular weight polyamide resins obtained from excess polyamines and polybasic acids; reaction products between excess polyamines and epoxy compounds; silanes having amino groups Coupling agents, such as silanol condensation catalysts such as γ-aminopropyltrimethoxysilane, N-(β-aminoethyl)aminopropylmethyldimethoxysilane, and other known silanol condensation catalysts such as other acidic catalysts and basic catalysts. can be given. These catalysts may be used alone or in combination of two or more. The amount of curing catalyst used is 0 parts per 100 parts of the rubber-based organic polymer (A) (1) component and the silicon compound (A) (2) component.
.. 1 to 20 parts is preferable, and 1 to 10 parts is more preferable.
本発明においてはA液および(または)B液に他の添加
物を添加してもよい。好ましい添加物の例としては、ゴ
ム系重合体とエポキシ樹脂との混和性を改善する働きを
有するエポキシ基と反応しうる官能基と1つのケイ素原
子に1〜2個の加水分解性基が結合した基とを分子中に
含有するシリコン化合物があげられる。In the present invention, other additives may be added to liquid A and/or liquid B. Examples of preferable additives include a functional group capable of reacting with an epoxy group that improves the miscibility of the rubber polymer and the epoxy resin, and one or two hydrolyzable groups bonded to one silicon atom. Examples include silicon compounds containing a group in the molecule.
該シリコン化合物におけるエポキシ基と反応しうる官能
基としては、(A)■成分の部分でも説明したような基
、具体的には1級、2級、3級のアミノ基:メルカブト
基;エポキシ基:カルボキシル基などがあげられる。ま
た、1つのケイ素原子に1〜2個の加水分解性基が結合
した基としては、前記A液に用いるゴム系有機重合体に
存在している反応性ケイ素基のうち1つのケイ素原子に
1〜2個の加水分解性基が結合した基が使用されうるが
、とくに取扱いの容易さなどの点からアルコキシシリル
基が好ましい。The functional groups that can react with the epoxy group in the silicon compound include the groups as explained in the component part (A), specifically, primary, secondary, and tertiary amino groups: mercabuto groups; epoxy groups. : Examples include carboxyl group. In addition, as a group in which 1 to 2 hydrolyzable groups are bonded to one silicon atom, one silicon atom is bonded to one silicon atom among the reactive silicon groups present in the rubber-based organic polymer used for the liquid A. Although a group in which ~2 hydrolyzable groups are bonded may be used, an alkoxysilyl group is particularly preferred from the viewpoint of ease of handling.
このようなシリコン化合物の具体例としては、たとえば
γ−アミノプロピルメチルジメトキシシラン、γ−(2
−アミノエチル)アミノプロピルメチルジメトキシシラ
ンなどのアミノ基含有シラン類;γ−メルカプトプロピ
ルメチルジメトキシシラン、γ−メルカプトプロピルメ
チルジェトキシシランなどのメルカプト基含有シラン類
;γ−グリシドキシプロビルメチルジメトキシシランな
どのエポキシ結合含有シラン類;β−カルボキシエチル
フェニルビス(2−メトキシエトキシ)シランなどのカ
ルボキシシラン類などがあげられる。これらのシリコン
化合物は単独で使用してもよく、2種以上併用してもよ
い。Specific examples of such silicon compounds include γ-aminopropylmethyldimethoxysilane, γ-(2
Silanes containing amino groups such as -aminoethyl)aminopropylmethyldimethoxysilane; Silanes containing mercapto groups such as γ-mercaptopropylmethyldimethoxysilane and γ-mercaptopropylmethyljethoxysilane; γ-glycidoxypropylmethyldimethoxy Epoxy bond-containing silanes such as silane; carboxysilanes such as β-carboxyethyl phenylbis(2-methoxyethoxy)silane; and the like. These silicon compounds may be used alone or in combination of two or more.
このようなシリコン化合物を使用するばあい、その使用
量は(A)(1)成分であるゴム系有機重合体とエポキ
シ樹脂の合計’Q l 00部に対し、1〜20部、と
くには0.2〜10部の範囲が好ましい。When such a silicon compound is used, the amount used is 1 to 20 parts, especially 0 parts, based on the total of the rubber-based organic polymer and epoxy resin that are components (A) and (1). A range of .2 to 10 parts is preferred.
このようなシリコン化合物はA液に添加してもB液に添
加してもよいが、A液に添加するのが好ましい。なお(
A)■成分としてエポキシ基と反応しうる官能基を有す
る化合物を用いるばあい、この9少なく使用しうる。Although such a silicon compound may be added to the A liquid or the B liquid, it is preferable to add it to the A liquid. In addition(
A) If a compound having a functional group capable of reacting with an epoxy group is used as the component (2), less than 9 can be used.
この他の添加剤としては無機フィラーや無機フィラー以
外のフィラー、老化防止剤、紫外線吸収剤、滑剤、顔料
、発泡剤、カルボン酸類、溶剤などが必要に応じて添加
されうる。As other additives, inorganic fillers, fillers other than inorganic fillers, anti-aging agents, ultraviolet absorbers, lubricants, pigments, blowing agents, carboxylic acids, solvents, etc. may be added as necessary.
前記無機フィラーの具体例としては、たとえばアスベス
ト、ガラス繊維、炭素繊維、マイカ、グラファイト、ケ
イソウ土、白土、ヒユームシリカ、沈降性シリカ、無水
ケイ酸、カーボンブラック、炭酸カルシウム、クレー
タルク、酸化チタン、炭酸マグネシウム、石英、アルミ
ニウム微粉末、フリント粉末、亜鉛末などが使用されう
る。これらのフィラーは単独で用いてもよく、2種以上
併用してもよい。Specific examples of the inorganic filler include asbestos, glass fiber, carbon fiber, mica, graphite, diatomaceous earth, clay, hume silica, precipitated silica, silicic anhydride, carbon black, calcium carbonate, and clay.
Talc, titanium oxide, magnesium carbonate, quartz, fine aluminum powder, flint powder, zinc powder, etc. can be used. These fillers may be used alone or in combination of two or more.
無機フィラーはA液に混合してもよく、B液に混合して
もよく、またA液とB液に分けて混合してもよい。なお
、A液中にフィラーが含有されているばあいには、フィ
ラーに付着している水分により保存安定性が低下するた
め、(A)■成分の使用による保存安定性改善効果が著
しくなる。The inorganic filler may be mixed with the A liquid, the B liquid, or the A liquid and the B liquid separately. In addition, when a filler is contained in liquid A, storage stability is reduced due to water adhering to the filler, so the effect of improving storage stability by using component (A) (2) becomes significant.
無機フィラーの全使用量は(A)(1)成分であるゴム
系有機重合体とエポキシ樹脂との合計量100部に対し
て通常1〜500部、とくに10〜300部の範囲で用
いられうる。The total amount of the inorganic filler used is usually 1 to 500 parts, particularly 10 to 300 parts, based on 100 parts of the total amount of the rubber-based organic polymer and epoxy resin that are components (A) and (1). .
本発明の硬化性組成物は、種々のものに用いられる。た
とえば圧縮成形法、トランスファー成形法、射出成形法
などのエポキシ樹脂の成形法として一般的に用いられて
いる方法で成形し、耐衝撃性、可撓性、強靭性などの改
善された成形品、銅張積層板や強化水などのような積層
成形加工品などかえられる。また剥離強度の改善された
接着剤、可撓性の改善された発泡材料、ファイバーボー
ドまたはパーティクルボード用ノ結合剤、塗料、シェル
モールド用粘結剤、ブレーキライニング用結合剤、砥石
用結合剤、ガラス繊維や炭素繊維との組合わせからなる
複合材料などとしても好適に使用しうる。さらに天然ゴ
ムなどの固形ゴムまたはポリウレタンのようなゴム系液
状ポリマーの成形で通常使用されている方法などで成形
し、強度などの改善されたゴム成形品、ゴム状発泡体な
どかえられる。The curable composition of the present invention can be used for various purposes. For example, molded products with improved impact resistance, flexibility, toughness, etc. are molded using commonly used epoxy resin molding methods such as compression molding, transfer molding, and injection molding. Laminated molded products such as copper-clad laminates and reinforced water can be replaced. Also adhesives with improved peel strength, foam materials with improved flexibility, binders for fiberboard or particleboard, paints, binders for shell molds, binders for brake linings, binders for grinding wheels, It can also be suitably used as a composite material made of a combination with glass fiber or carbon fiber. Furthermore, it can be molded by methods commonly used for molding solid rubber such as natural rubber or rubber-based liquid polymers such as polyurethane, to produce rubber molded products and rubber-like foams with improved strength.
シール剤、粘着剤などとしても好適に使用しうる。It can also be suitably used as a sealant, adhesive, etc.
これらのうち接着剤あるいは結合剤としての用途にとく
に好適に用いることができる。Among these, it can be particularly preferably used as an adhesive or a binder.
つぎに本発明の組成物を実施例に基づき説明する。Next, the composition of the present invention will be explained based on Examples.
製造例1
ポリプロピレングリコール(数平均分子量2500)9
0部とポリプロピレントリオール(数平均分子ffl
3000) 10部を出発原料とし、塩化メチレンを使
用して分子量ジャンプ反応を行なったのち、アリルクロ
ライドで分子鎖末端をキャッピングしてえられるアリル
エーテル基が全末端の99%に導入された数平均分子量
5oooのポリプロピレンオキシド800gを撹拌機付
耐圧反応容器に入れ、メチルジメトキシシラン20gを
加えた。ついで塩化白金酸触媒溶液(82PtC1a6
1120の8.9gをイソプロピルアルコール18m1
およびテトラヒドロフラン160m1に溶解させた溶液
) 0 、40 mlを加えたのち、80℃で6時間反
応させた。Production example 1 Polypropylene glycol (number average molecular weight 2500) 9
0 parts and polypropylene triol (number average molecule ffl
3000) Using 10 parts as a starting material, perform a molecular weight jump reaction using methylene chloride, and then cap the molecular chain ends with allyl chloride. Allyl ether groups are introduced into 99% of all ends. 800 g of polypropylene oxide having a molecular weight of 500 was placed in a pressure-resistant reaction vessel equipped with a stirrer, and 20 g of methyldimethoxysilane was added thereto. Then, a chloroplatinic acid catalyst solution (82PtC1a6
8.9g of 1120 and 18ml of isopropyl alcohol
After adding 0.40 ml of a solution dissolved in 160 ml of tetrahydrofuran, the mixture was reacted at 80° C. for 6 hours.
反応溶液中の残存水素化ケイ素基の量をIRスペクトル
分析法により定量したところ、はとんど残存していなか
った。またNMR法によりケイ素基の定量をしたところ
、分子末端に
C)+3
(C)+30 )2 SI CH2CH2CH20−基
を1分子当り約1゜75個有するポリプロピレンオキシ
ドかえられた。When the amount of silicon hydride groups remaining in the reaction solution was determined by IR spectroscopy, it was found that almost no silicon hydride groups remained. Further, when silicon groups were quantified by NMR method, it was found that the polypropylene oxide had approximately 1.75 C)+3 (C)+30 )2 SI CH2CH2CH2CH20- groups per molecule at the molecular terminals.
製造例2
ポリプロピレングリコール(数平均分子量2000)を
出発原料とし、塩化メチレンを使用して分子はジャンプ
反応を行なったのち、アリルクロライドで分子鎖末端を
キャッピングしてえられるアリルエーテル基が全末端の
95%に導入された数平均分子ffl 5000のポリ
プロピレンオキシド500gを撹拌機付耐圧反応容器に
入れ、トリエトキシシラン32gを加えた。ついで塩化
白金酸触媒溶液(製造例1と同様組成) 0.40m1
を加えたのち、90℃で3時間反応させた。減圧下で過
剰のシランを除去したのち、NMR法によりケイ素の定
量をしたところ、分子末端に(CH3CI+20 )3
SI C)12 C82CH20−基を1分子当り約
1.8個有するポリプロピレンオキシドかえられた。Production Example 2 Using polypropylene glycol (number average molecular weight 2000) as a starting material, the molecule undergoes a jump reaction using methylene chloride, and then the allyl ether group obtained by capping the molecular chain ends with allyl chloride 500 g of polypropylene oxide having a number average molecular weight ffl 5000 which had been introduced at 95% was placed in a pressure-resistant reaction vessel equipped with a stirrer, and 32 g of triethoxysilane was added thereto. Next, 0.40ml of chloroplatinic acid catalyst solution (same composition as Production Example 1)
was added, and then reacted at 90°C for 3 hours. After removing excess silane under reduced pressure, silicon was quantified by NMR method, and it was found that (CH3CI+20)3 was present at the molecular end.
SI C)12 Polypropylene oxide having about 1.8 C82CH20- groups per molecule was converted.
製造例3
数平均分子ffi 300Gのポリプロピレングリコー
ル300gを撹拌機付フラスコに仕込み、ついでトリレ
ンジイソシアネート28gとジブチルスズジラウレート
0.2gとを加え、100℃で5時間チッ素ガス気流下
にて撹拌しながら反応させた。Production Example 3 300 g of polypropylene glycol with a number average molecular ffi of 300 G was charged into a flask equipped with a stirrer, and then 28 g of tolylene diisocyanate and 0.2 g of dibutyltin dilaurate were added, and the mixture was stirred at 100° C. for 5 hours under a nitrogen gas flow. Made it react.
そののちγ−アミノプロピルトリエトキシシラン22.
1g−を加え、100℃で3時間撹拌しながら反応させ
、平均分子量約6600、末端にトリエトキシシリル基
を有し、分子中に約2個の反応性ケイ素基を有するポリ
エーテルをえた。Then γ-aminopropyltriethoxysilane 22.
1 g of the solution was added and reacted with stirring at 100° C. for 3 hours to obtain a polyether having an average molecular weight of about 6,600, a triethoxysilyl group at the end, and about 2 reactive silicon groups in the molecule.
製造例4
ブチルアクリレ−)80g、ステアリルメタクリレ−)
20g、γ−メタクリロイルオキシプロピルメチルジメ
トキシシラン2.2g、γ−メルカプトプロピルメチル
ジメトキシシラン1.8 gおよび2.2゛−アゾビス
イソブチロニトリル0.5gを混合・撹拌し、均一に溶
解させた。該混合物25g:を撹拌機および冷却骨付の
200 ml 4つロフラスコに入れ、チッ素ガスを通
じなから油浴で80℃に加熱した。数分後重合が始まり
発熱したが、その発熱が穏やかになってから残りの混合
液を滴下ロートを用いて、3時間かけて徐々に滴下して
重合させた。滴下終了後、15分後および30分後にそ
れぞれAIBN 0.15 gずつを追加した。追加終
了後、30分間撹拌を続は重合反応を終了させた。Production Example 4 Butyl acrylate) 80g, stearyl methacrylate)
20g of γ-methacryloyloxypropylmethyldimethoxysilane, 1.8g of γ-mercaptopropylmethyldimethoxysilane, and 0.5g of 2.2゛-azobisisobutyronitrile were mixed and stirred to uniformly dissolve them. Ta. 25 g of the mixture was placed in four 200 ml flasks equipped with a stirrer and a chilled bone, and heated to 80° C. in an oil bath under nitrogen gas. After several minutes, polymerization started and generated heat, but after the heat generation became mild, the remaining mixed solution was gradually added dropwise using a dropping funnel over a period of 3 hours to cause polymerization. After completion of the dropwise addition, 0.15 g of AIBN was added 15 minutes and 30 minutes later, respectively. After the addition was completed, stirring was continued for 30 minutes to complete the polymerization reaction.
えられた液状ポリマーをゲルパーミエイションクロマト
グラフ(GPC)で分析したところ、数平均分子量が約
10.000であった。When the obtained liquid polymer was analyzed by gel permeation chromatography (GPC), the number average molecular weight was about 10.000.
実施例1〜2および比較例1〜2
(A液の作製)
製造例1でえられたポリマー100部、2.2’−メチ
レン−ビス−(4−メチル−6−1−ブチルフェノール
)1部、N−β−(アミノエチル)−7−アミノプロピ
ルトリメトキシシラン(NBAEγAPTMS) 1部
、ビニルトリメトキシシラン(VTMS) 3部、重質
炭酸カルシウム50部、2.4.8−)リス−(ジメチ
ルアミノメチル)フェノール5部を三本ペイントzロー
ルを用いてよく混合して配合物をえた。Examples 1 to 2 and Comparative Examples 1 to 2 (Preparation of Liquid A) 100 parts of the polymer obtained in Production Example 1, 1 part of 2,2'-methylene-bis-(4-methyl-6-1-butylphenol) , N-β-(aminoethyl)-7-aminopropyltrimethoxysilane (NBAEγAPTMS) 1 part, vinyltrimethoxysilane (VTMS) 3 parts, heavy calcium carbonate 50 parts, 2.4.8-)Lis-( 5 parts of (dimethylaminomethyl)phenol were mixed well using a three-roll Paint Z roll to obtain a formulation.
(B液の作製)
エピコート828(油化シェルエポキシ■製のビスフェ
ノールA型エポキシ樹脂)50部、重質炭酸カルシウム
25部、# 5B−85(三共有機化学■製の有機スズ
化合)1部、ラウリル酸1部を三本ペイントロールでよ
く混合して配合物をえた。(Preparation of Solution B) 50 parts of Epicoat 828 (bisphenol A type epoxy resin manufactured by Yuka Shell Epoxy ■), 25 parts of heavy calcium carbonate, 1 part of #5B-85 (organotin compound manufactured by Sankyoki Kagaku ■) , 1 part of lauric acid was mixed well with three paint rolls to obtain a formulation.
A液およびB液をそれぞれガラス製の密封容器に入れ、
50℃で1力月間貯蔵したのちのA液の粘度を、■東京
計器製のBM型粘度計により23℃恒温として測定した
。Put liquid A and liquid B into sealed glass containers,
The viscosity of liquid A after being stored at 50°C for one month was measured using a BM type viscometer manufactured by Tokyo Keiki at a constant temperature of 23°C.
なお、実施例2はA液におけるシリコン化合物をN−β
−(アミノエチル)−γ −アミノプロピルトリメトキ
シシラン(NBAEγAPTMS) 1部およびビニル
トリメトキシシラン(VTMS) 2部としたものであ
る。比較例1はシリコン化合物を添加しないばあい、比
較例2は、NBAEγ^PTMSおよびVTMSの代わ
りにジメチルジメトキシシラン(DMDNS) 4部を
用いたばあいである。それらの結果を第1表に示す。In addition, in Example 2, the silicon compound in liquid A was N-β.
1 part of -(aminoethyl)-γ-aminopropyltrimethoxysilane (NBAEγAPTMS) and 2 parts of vinyltrimethoxysilane (VTMS). Comparative Example 1 is a case in which no silicon compound is added, and Comparative Example 2 is a case in which 4 parts of dimethyldimethoxysilane (DMDNS) is used in place of NBAEγ^PTMS and VTMS. The results are shown in Table 1.
[以下余白]
引張速度は、引張剪断のばあいは5ms/m1nT字剥
離のばあいは200aa+/mlnで行なったが、貯蔵
前のA液/B液混合物系では引張剪断強度51kg/c
jST字剥離強度4.7kg/ 25asであり、50
℃で1力月間貯蔵後のA液/B液混合系では引張剪断強
度45kg/ cd、T字剥離強度4.5kg/25a
+aであり、貯蔵前後での接着物性に差はなかった。[Margins below] The tensile speed was 5 ms/ml in the case of tensile shear, and 200 aa+/ml in the case of T-shaped peeling, but the tensile shear strength was 51 kg/c in the A/B mixture system before storage.
jST-shaped peel strength is 4.7kg/25as, 50
After storage for one month at °C, the A/B mixed system has a tensile shear strength of 45 kg/cd and a T-peel strength of 4.5 kg/25a.
+a, and there was no difference in adhesive properties before and after storage.
実施例4〜10
A液中のポリマーとして製造例1〜4のポリマーを使用
し、A液中のNBAEγAPTMSおよびVTMSのか
わりに各種シリコン化合物を4〜IO部用いたほかは実
施例1と同様にしてA液を作製し、その粘度を測定した
。結果を第2表に示す[以下余白]
第1表から、(A)■成分を含有°するAMの貯蔵安定
性が優れることがわかる。Examples 4 to 10 Same as Example 1 except that the polymers of Production Examples 1 to 4 were used as the polymer in Liquid A, and 4 to IO parts of various silicon compounds were used instead of NBAEγAPTMS and VTMS in Liquid A. A liquid A was prepared and its viscosity was measured. The results are shown in Table 2 [blank below] From Table 1, it can be seen that AM containing component (A) (2) has excellent storage stability.
実施例3
実施例1において作製した、A液40gとB液20gと
の混合物を用い、JIS K 0850および月SK
8854にしたがって接着剤としての評価を行なった。Example 3 Using the mixture of 40 g of liquid A and 20 g of liquid B prepared in Example 1, JIS K 0850 and Moon SK were used.
Evaluation as an adhesive was conducted according to 8854.
引張剪断強さ測定用には、月S I+ 4000のアル
ミニウム板A−1050P(100mmX 25mI+
lX 2IIIIO試験片)を用い、上記混合物をヘ
ラで塗布して貼合わせ、手で圧着し試験サンプルを作製
した。For tensile shear strength measurement, an aluminum plate A-1050P (100 mm x 25 m I+
A test sample was prepared by applying the above mixture using a spatula, pasting the mixture together, and pressing it together by hand.
T字剥離接着強さは、JIS I+ 4000のアルミ
ニウム板A−1050P (200avX 25m+n
X O,1mm試験片)を用いて」二足混合物をヘラ
で約0.5aa+の厚さに塗布して貼合わせ、5kgの
ハンドローラーを用いて長さ方向に往復しないように5
回圧着して試験サンプルを作製した。The T-peel adhesive strength is JIS I+ 4000 aluminum plate A-1050P (200avX 25m+n
Using a 5kg hand roller, apply the mixture to a thickness of about 0.5aa+ using a spatula, and then roll it back and forth in the length direction using a 5kg hand roller.
A test sample was prepared by crimping twice.
これら接着試験サンプルを23℃で20間、さらに50
℃で3日間硬化養生し、引張試験に供した。These adhesion test samples were heated at 23°C for 20 minutes and then for 50 minutes.
It was cured for 3 days at ℃ and then subjected to a tensile test.
[発明の効果]
本発明の2液型硬化性組成物は、長期間の保存安定性に
すぐれた組成物であり、耐衝撃性、可撓性、強靭性など
の改善された成形用材料、接着強度の改善された接着剤
、結合剤などとして有用である。[Effects of the Invention] The two-component curable composition of the present invention is a composition with excellent long-term storage stability, and is a molding material with improved impact resistance, flexibility, toughness, etc. It is useful as an adhesive, a binder, etc. with improved adhesive strength.
特 許 出 願 人 鐘淵化学工業株式会社Special permission Out wish Man Kanebuchi Chemical Industry Co., Ltd.
Claims (1)
または)加水分解性基を有し、シロキサン結合を形成す
ることにより架橋しうるケイ素原子含有基を有するゴム
系有機重合体、 (2)エポキシ樹脂硬化剤および (3)1つのケイ素原子に3個以上の加水分解性基が結
合した基を有するシリコン化合物 を含むA液ならびに (B)(1)エポキシ樹脂および (2)前記ゴム系有機重合体の硬化触媒 を含むB液 よりなる保存安定性の改良された2液型硬化性組成物。[Scope of Claims] 1 (A) (1) A hydroxyl group bonded to a silicon atom and (
or) a rubber-based organic polymer having a hydrolyzable group and a silicon atom-containing group that can be crosslinked by forming a siloxane bond, (2) an epoxy resin curing agent, and (3) three silicon atoms per silicon atom. A storage-stable solution consisting of a solution A containing a silicon compound having a group to which the above hydrolyzable group is bonded, and a solution B containing (1) an epoxy resin and (2) a curing catalyst for the rubber-based organic polymer. Improved two-part curable composition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4908889A JP2694995B2 (en) | 1989-03-01 | 1989-03-01 | Two-part curable composition with improved storage stability |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4908889A JP2694995B2 (en) | 1989-03-01 | 1989-03-01 | Two-part curable composition with improved storage stability |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02228365A true JPH02228365A (en) | 1990-09-11 |
JP2694995B2 JP2694995B2 (en) | 1997-12-24 |
Family
ID=12821342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4908889A Expired - Fee Related JP2694995B2 (en) | 1989-03-01 | 1989-03-01 | Two-part curable composition with improved storage stability |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2694995B2 (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH036255A (en) * | 1989-05-31 | 1991-01-11 | Sunstar Eng Inc | Two-component epoxy resin composition |
JPH04348159A (en) * | 1991-02-12 | 1992-12-03 | Nippon Paint Co Ltd | Modified polyoxyalkylenepolyamine composition for producing plastics |
JPH04359018A (en) * | 1991-06-03 | 1992-12-11 | Shin Etsu Chem Co Ltd | Production of silane-crosslinkable alkylene oxide polymer |
JPH04359019A (en) * | 1991-06-03 | 1992-12-11 | Shin Etsu Chem Co Ltd | Production of silane-crosslinkable alkylene oxide polymer |
JPH0848964A (en) * | 1994-04-15 | 1996-02-20 | Sika Ag | Two-component adhesive,sealant and coating composition and method of using same |
JP2000072973A (en) * | 1998-08-27 | 2000-03-07 | Yokohama Rubber Co Ltd:The | Curable composition |
JP2003128907A (en) * | 2001-10-17 | 2003-05-08 | Konishi Co Ltd | One pack moisture-curing flexible resin composition |
WO2006006512A1 (en) * | 2004-07-14 | 2006-01-19 | Kaneka Corporation | Curable composition and sealing material, coating material, and adhesive each comprising the composition |
WO2020170908A1 (en) * | 2019-02-18 | 2020-08-27 | 株式会社カネカ | Curable composition |
JP2021024958A (en) * | 2019-08-06 | 2021-02-22 | 株式会社カネカ | Curable composition |
CN117327398A (en) * | 2023-09-22 | 2024-01-02 | 深圳市康利邦科技有限公司 | Bi-component quick-setting neutral dealcoholization RTV silicone rubber and preparation method thereof |
-
1989
- 1989-03-01 JP JP4908889A patent/JP2694995B2/en not_active Expired - Fee Related
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH036255A (en) * | 1989-05-31 | 1991-01-11 | Sunstar Eng Inc | Two-component epoxy resin composition |
JPH04348159A (en) * | 1991-02-12 | 1992-12-03 | Nippon Paint Co Ltd | Modified polyoxyalkylenepolyamine composition for producing plastics |
JPH04359018A (en) * | 1991-06-03 | 1992-12-11 | Shin Etsu Chem Co Ltd | Production of silane-crosslinkable alkylene oxide polymer |
JPH04359019A (en) * | 1991-06-03 | 1992-12-11 | Shin Etsu Chem Co Ltd | Production of silane-crosslinkable alkylene oxide polymer |
JPH0848964A (en) * | 1994-04-15 | 1996-02-20 | Sika Ag | Two-component adhesive,sealant and coating composition and method of using same |
JP2000072973A (en) * | 1998-08-27 | 2000-03-07 | Yokohama Rubber Co Ltd:The | Curable composition |
JP2003128907A (en) * | 2001-10-17 | 2003-05-08 | Konishi Co Ltd | One pack moisture-curing flexible resin composition |
WO2006006512A1 (en) * | 2004-07-14 | 2006-01-19 | Kaneka Corporation | Curable composition and sealing material, coating material, and adhesive each comprising the composition |
JPWO2006006512A1 (en) * | 2004-07-14 | 2008-04-24 | 株式会社カネカ | Curable composition |
WO2020170908A1 (en) * | 2019-02-18 | 2020-08-27 | 株式会社カネカ | Curable composition |
JP2021024958A (en) * | 2019-08-06 | 2021-02-22 | 株式会社カネカ | Curable composition |
CN117327398A (en) * | 2023-09-22 | 2024-01-02 | 深圳市康利邦科技有限公司 | Bi-component quick-setting neutral dealcoholization RTV silicone rubber and preparation method thereof |
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