JPH0222340A - Molded body having transparent coating layer - Google Patents
Molded body having transparent coating layerInfo
- Publication number
- JPH0222340A JPH0222340A JP1136544A JP13654489A JPH0222340A JP H0222340 A JPH0222340 A JP H0222340A JP 1136544 A JP1136544 A JP 1136544A JP 13654489 A JP13654489 A JP 13654489A JP H0222340 A JPH0222340 A JP H0222340A
- Authority
- JP
- Japan
- Prior art keywords
- transparent
- coating layer
- molded article
- coating
- molded body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011247 coating layer Substances 0.000 title claims abstract description 23
- 239000000126 substance Substances 0.000 claims abstract description 18
- 150000001875 compounds Chemical class 0.000 claims abstract description 12
- 229920003023 plastic Polymers 0.000 claims abstract description 12
- 239000002245 particle Substances 0.000 claims abstract description 10
- 239000011521 glass Substances 0.000 claims abstract description 6
- 229920001558 organosilicon polymer Polymers 0.000 claims abstract 2
- 239000000463 material Substances 0.000 claims description 25
- 239000010410 layer Substances 0.000 claims description 13
- 238000002834 transmittance Methods 0.000 claims description 7
- 229910001887 tin oxide Inorganic materials 0.000 claims description 4
- 229920000620 organic polymer Polymers 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 22
- 238000000576 coating method Methods 0.000 abstract description 21
- 239000012780 transparent material Substances 0.000 abstract description 11
- 239000004033 plastic Substances 0.000 abstract description 10
- 229920000642 polymer Polymers 0.000 abstract description 8
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 3
- 150000004706 metal oxides Chemical class 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 27
- 229910010272 inorganic material Inorganic materials 0.000 description 15
- 239000011147 inorganic material Substances 0.000 description 15
- 239000000758 substrate Substances 0.000 description 14
- 239000002585 base Substances 0.000 description 9
- 238000001723 curing Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000002344 surface layer Substances 0.000 description 6
- 239000002612 dispersion medium Substances 0.000 description 5
- -1 etc.) Polymers 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 150000003961 organosilicon compounds Chemical class 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- WRMNZCZEMHIOCP-UHFFFAOYSA-N 2-phenylethanol Chemical compound OCCC1=CC=CC=C1 WRMNZCZEMHIOCP-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- ZMZDMBWJUHKJPS-UHFFFAOYSA-N thiocyanic acid Chemical compound SC#N ZMZDMBWJUHKJPS-UHFFFAOYSA-N 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- XBIUWALDKXACEA-UHFFFAOYSA-N 3-[bis(2,4-dioxopentan-3-yl)alumanyl]pentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)[Al](C(C(C)=O)C(C)=O)C(C(C)=O)C(C)=O XBIUWALDKXACEA-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- KSCAZPYHLGGNPZ-UHFFFAOYSA-N 3-chloropropyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)CCCCl KSCAZPYHLGGNPZ-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- PLXLQGPXPXIVKM-UHFFFAOYSA-N 3-chloropropyl(tripropoxy)silane Chemical compound CCCO[Si](CCCCl)(OCCC)OCCC PLXLQGPXPXIVKM-UHFFFAOYSA-N 0.000 description 1
- KNTKCYKJRSMRMZ-UHFFFAOYSA-N 3-chloropropyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCCl KNTKCYKJRSMRMZ-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- GBQYMXVQHATSCC-UHFFFAOYSA-N 3-triethoxysilylpropanenitrile Chemical compound CCO[Si](OCC)(OCC)CCC#N GBQYMXVQHATSCC-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- OTCOSAMIXUWQOA-UHFFFAOYSA-N COC(OC)(OC)CO[SiH2]C Chemical compound COC(OC)(OC)CO[SiH2]C OTCOSAMIXUWQOA-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 239000002879 Lewis base Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- RQVFGTYFBUVGOP-UHFFFAOYSA-N [acetyloxy(dimethyl)silyl] acetate Chemical compound CC(=O)O[Si](C)(C)OC(C)=O RQVFGTYFBUVGOP-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- TVJPBVNWVPUZBM-UHFFFAOYSA-N [diacetyloxy(methyl)silyl] acetate Chemical compound CC(=O)O[Si](C)(OC(C)=O)OC(C)=O TVJPBVNWVPUZBM-UHFFFAOYSA-N 0.000 description 1
- VLFKGWCMFMCFRM-UHFFFAOYSA-N [diacetyloxy(phenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C1=CC=CC=C1 VLFKGWCMFMCFRM-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 208000003464 asthenopia Diseases 0.000 description 1
- SYFOAKAXGNMQAX-UHFFFAOYSA-N bis(prop-2-enyl) carbonate;2-(2-hydroxyethoxy)ethanol Chemical compound OCCOCCO.C=CCOC(=O)OCC=C SYFOAKAXGNMQAX-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- SXDBWCPKPHAZSM-UHFFFAOYSA-N bromic acid Chemical compound OBr(=O)=O SXDBWCPKPHAZSM-UHFFFAOYSA-N 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- GENZKBJGWAAVIE-UHFFFAOYSA-N diethoxy-[3-(oxiran-2-ylmethoxy)propyl]-phenylsilane Chemical compound C=1C=CC=CC=1[Si](OCC)(OCC)CCCOCC1CO1 GENZKBJGWAAVIE-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- VDCSZEZNBODVRT-UHFFFAOYSA-N dimethoxy-[3-(oxiran-2-ylmethoxy)propyl]-phenylsilane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)CCCOCC1CO1 VDCSZEZNBODVRT-UHFFFAOYSA-N 0.000 description 1
- CVQVSVBUMVSJES-UHFFFAOYSA-N dimethoxy-methyl-phenylsilane Chemical compound CO[Si](C)(OC)C1=CC=CC=C1 CVQVSVBUMVSJES-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- GYLXWHLPLTVIOP-UHFFFAOYSA-N ethenyl(2,2,2-trimethoxyethoxy)silane Chemical compound COC(OC)(OC)CO[SiH2]C=C GYLXWHLPLTVIOP-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- ZLNAFSPCNATQPQ-UHFFFAOYSA-N ethenyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C=C ZLNAFSPCNATQPQ-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 150000007527 lewis bases Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- RJMRIDVWCWSWFR-UHFFFAOYSA-N methyl(tripropoxy)silane Chemical compound CCCO[Si](C)(OCCC)OCCC RJMRIDVWCWSWFR-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229940082569 selenite Drugs 0.000 description 1
- MCAHWIHFGHIESP-UHFFFAOYSA-L selenite(2-) Chemical compound [O-][Se]([O-])=O MCAHWIHFGHIESP-UHFFFAOYSA-L 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- DHCDFWKWKRSZHF-UHFFFAOYSA-N sulfurothioic S-acid Chemical compound OS(O)(=O)=S DHCDFWKWKRSZHF-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- ZUEKXCXHTXJYAR-UHFFFAOYSA-N tetrapropan-2-yl silicate Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)OC(C)C ZUEKXCXHTXJYAR-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- GYZQBXUDWTVJDF-UHFFFAOYSA-N tributoxy(methyl)silane Chemical compound CCCCO[Si](C)(OCCCC)OCCCC GYZQBXUDWTVJDF-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、高い屈折率を有する透明被覆層を有する成形
体に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a molded article having a transparent coating layer with a high refractive index.
さらには、低い光線反射率と高い光線透過率、かつ導電
性を有する、表面硬度の高い成形体の製造に適した透明
被覆層を有する成形体に関する。Furthermore, the present invention relates to a molded article having a transparent coating layer suitable for producing a molded article having low light reflectance, high light transmittance, and electrical conductivity and high surface hardness.
[従来の技術]
各種透明材料の光線反射率の低下ひいては光線透過率の
向上は、光線の有効利用、反射像による映像の不鮮明化
の解消など、きわめて重要な問題であり、これまで多く
の方法が提案されている。[Prior Art] Reducing the light reflectance of various transparent materials and improving the light transmittance is an extremely important problem, such as effective use of light and eliminating blurring of images due to reflected images, and many methods have been used to date. is proposed.
その概要は基材と屈折率の異なる、主として無機物から
なる光学的薄層を基材の表面に形成することにより、光
線反射率の低下および光線透過率の向上を実現しようと
するものであり、この際効果を大にするために異なる屈
折率の薄い層の多層コートを行なったり、それぞれの薄
層の厚みを、相当する光線の波長レベルに合せてコント
ロールしたり、連続的に屈折率の異なるいわゆる不均質
膜を形成したりすることが行なわれているー。The idea is to reduce the light reflectance and improve the light transmittance by forming an optical thin layer, mainly made of inorganic material, on the surface of the base material, which has a refractive index different from that of the base material. At this time, in order to maximize the effect, it is possible to coat multiple thin layers with different refractive indexes, control the thickness of each thin layer to match the wavelength level of the corresponding light beam, or continuously apply different refractive indexes. Formation of so-called heterogeneous films is being carried out.
これらのうちで基材表面に単層の反射防止薄膜を形成す
る場合を例にとると、基材表面に設ける反射防止薄膜は
なるべく屈折率の小さい無機質成分(例えば、フッ化マ
グネシウムなど)からなり、かつ反射防止薄膜の光学的
厚さを対象となる光線の波長の1/4に調整することが
望ましいといわれている。Taking the case of forming a single-layer antireflection thin film on the surface of a substrate as an example, the antireflection thin film provided on the surface of the substrate is made of an inorganic component with a refractive index as low as possible (for example, magnesium fluoride, etc.). , and it is said to be desirable to adjust the optical thickness of the antireflection thin film to 1/4 of the wavelength of the target light beam.
このような光学的薄膜は、その形成プロセスによって適
用する基材については制限をうける。Such optical thin films are subject to limitations regarding the substrates to which they can be applied, depending on the formation process.
これまで反射防止薄層生成が最も広く適用されたのは透
明材料のうちでも主としてガラス基材である。この場合
しばしば用いられる該基材表面への無機物薄層コーティ
ング技術は、他の技術に適用するには極めて制限が多い
。To date, antireflection thin layer formation has been most widely applied to transparent materials, mainly glass substrates. The technique of coating a thin inorganic layer on the surface of the substrate, which is often used in this case, has extremely limited application to other techniques.
」二記技術に就いて例示すると真空蒸着法、さらには付
着性を向上するためのスパッタリング法、イオンビーム
法などが用いられる。しかしながらこれらの技術では近
年透明材料のうちでもとくに眼鏡レンズ分野で伸長して
きたプラスチック材料、あるいは反射防止層を形成する
ことが有利なプラスチックフィルムやプラスチックシー
トには適用が困難である。特に耐すり偏性を改良するた
めに高硬度被覆材料を有するプラスチック材料に適用す
るにあたっては多くの問題が存在する。Examples of the techniques mentioned above include vacuum evaporation, sputtering, and ion beam methods to improve adhesion. However, these techniques are difficult to apply to plastic materials, which have recently become popular among transparent materials, particularly in the field of eyeglass lenses, or to plastic films and sheets, for which it is advantageous to form an antireflection layer. In particular, there are many problems when applied to plastic materials with high hardness coating materials to improve their abrasion resistance.
すなわち、プラスチック材料は一般に耐熱性が不充分で
あるため上記のコーティングプロセスに耐えず、場合に
よってはプラスチック材料(基材)が分解、溶融、熱的
変形、光学歪などを生ずることがある。また付着性も一
般に不良である。これは主としてプラスチック材料(基
材)とその表面にコーティングされる無機質との膨張係
数の違いによるもので、加熱時もしくは加湿時の付着性
の低下が著しく極端な場合には無機物層に亀裂、クラッ
クなどを生ずることがある。That is, plastic materials generally have insufficient heat resistance and cannot withstand the above coating process, and in some cases, the plastic material (substrate) may undergo decomposition, melting, thermal deformation, optical distortion, etc. Adhesion is also generally poor. This is mainly due to the difference in expansion coefficient between the plastic material (base material) and the inorganic material coated on its surface, and if the adhesion decreases significantly during heating or humidification, the inorganic material layer may crack or crack. etc. may occur.
さ、らに重大な問題点は、かかる無機物層のコーティン
グのために生ずるプラスチック材料(基材)の耐衝撃性
および可撓性の著しい低下である。これは主として表層
の無機物のクラック発生によるノツチ効果に起因すると
考えられる。An even more serious problem is the significant reduction in impact resistance and flexibility of the plastic material (substrate) that occurs due to the coating with such an inorganic layer. This is thought to be mainly due to the notch effect caused by cracks in the inorganic material on the surface layer.
すなわちこのことは、ガラス材料に対するプラスチック
材料の優位性が損われることを示すものであり、重要な
問題である。In other words, this indicates that the superiority of plastic materials over glass materials is lost, and is an important problem.
また、従来、高屈折率を有する矯正レンズ等において、
干渉縞による外観不良を有するといった問題点があった
。In addition, conventionally, in corrective lenses etc. with a high refractive index,
There was a problem in that it had poor appearance due to interference fringes.
特開昭54−87735号公報、特開昭54−8773
6号公報、特開昭53−130732号公報では、シリ
カコロイドからなる被覆層を形成する技術が開示されて
いるが、屈折率に関しては、記載されていなかった。さ
らに、米国特許第2゜601.123号明細書において
も、無機粒子のみを被覆する技術が記載されているが、
屈折率に関しての記載はないといった状態であった。JP-A-54-87735, JP-A-54-8773
6 and JP-A-53-130732 disclose a technique for forming a coating layer made of silica colloid, but do not describe the refractive index. Furthermore, U.S. Patent No. 2601.123 also describes a technique for coating only inorganic particles;
There was no description regarding refractive index.
[発明が解決しようとする課題]
本発明者らはこれらの問題点を解決して、高い屈折率と
高い表面硬度、および導電性を有する透明被覆層を有す
る成形体を開発すべく鋭意検討した結果本発明に到達し
た。[Problems to be Solved by the Invention] The present inventors have made extensive studies to solve these problems and develop a molded product having a transparent coating layer that has a high refractive index, high surface hardness, and conductivity. As a result, the present invention was achieved.
すなわち本発明は、干渉縞による外観不良を有するとい
った問題点のない、高い屈折率を有する、導電性透明被
覆層を有する成形体を提供することを目的とする。That is, an object of the present invention is to provide a molded article having a conductive transparent coating layer, which has a high refractive index, and is free from problems such as poor appearance due to interference fringes.
[課題を解決するための手段] 上記目的を達成するため、本発明は次の構成からなる。[Means to solve the problem] In order to achieve the above object, the present invention consists of the following configuration.
「透明被覆層を有する成形体において、透明な層は平均
粒子径が1〜300mμのSnの酸化物からなる微粒子
状無機物を5〜80重量%含有することを特徴とする透
明被覆層を有する成形体。」本発明に用いられる微粒子
状無機物とは、平均粒子径が約1〜300mμ、好まし
くは約5〜200mμのものである。"In a molded article having a transparent coating layer, the transparent layer contains 5 to 80% by weight of a fine particulate inorganic substance made of an oxide of Sn with an average particle size of 1 to 300 mμ. The particulate inorganic material used in the present invention has an average particle diameter of about 1 to 300 mμ, preferably about 5 to 200 mμ.
粒子径のあまり小さいものは作成が困難であり、コスト
が高くて実用的でなく、またあまり大きなものは一般に
透明感が低下するので上記範囲内のものが主として用い
られる。If the particle size is too small, it is difficult to produce, expensive and impractical, and if the particle size is too large, the transparency generally decreases, so particles within the above range are mainly used.
これらの微粒子状無機物として、本発明においては、酸
化スズの微粒子状物が用いられる。透明性、導電性およ
び表面硬度に優れ、さらに高い屈折率を与えるという点
で特に好ましい。すなわち屈折率が高いと、高い屈折率
を有する矯正レンズ等においてはコーティング被覆層に
干渉縞による外観不良を発生させないからである。In the present invention, fine particulates of tin oxide are used as these particulate inorganic substances. It is particularly preferred because it has excellent transparency, conductivity, and surface hardness, and also provides a high refractive index. That is, if the refractive index is high, a corrective lens or the like having a high refractive index will not cause poor appearance due to interference fringes in the coating layer.
また、これらの微粒子状無機物は単独のみならず、・他
の金属酸化物との併用も可能である。さらにはケイ素、
アンチモン、インジウムなどを含む混合酸化物であって
もよい。Furthermore, these particulate inorganic substances can be used not only alone, but also in combination with other metal oxides. Furthermore, silicon,
A mixed oxide containing antimony, indium, etc. may also be used.
微粒子状無機物は透明基材の少なくともその表層部に含
有せしめられていることが必要である。It is necessary that the particulate inorganic substance be contained in at least the surface layer of the transparent substrate.
基材の表層に硬度を与えて、耐摩耗性、耐すり偏性を向
」ニすることが前提となるからである。This is because the premise is to impart hardness to the surface layer of the base material to improve wear resistance and abrasion resistance.
表層部に無機物を含有せしめる手段としては、基材とな
る透明材料中にその成型工程で無機物を均一に分散させ
たり、表層部分だけに分散させる方法などがある。さら
に他の手段としては、透明な被覆材料中に無機物を分散
させ、これを透明材料表面に塗布するという方法がある
。Methods for incorporating inorganic substances into the surface layer include methods such as uniformly dispersing the inorganic substance in the transparent material serving as the base material during the molding process, and methods in which the inorganic substance is dispersed only in the surface layer. Yet another method is to disperse the inorganic material in a transparent coating material and apply it to the surface of the transparent material.
上記の微粒子状無機物の分散に関しては公知の各種方法
、例えば
(a)微粒子状無機物と他の基材(透明材料)とを加熱
または室温下で溶剤その他の成分の存在あるいは非存在
下で混ねりする方法。Various known methods can be used to disperse the above-mentioned particulate inorganic material, such as (a) mixing the particulate inorganic material and another base material (transparent material) by heating or at room temperature in the presence or absence of a solvent or other components; how to.
(b)揮発性分散媒中で分散体(微粒子状無機物)と基
質になる物質(以下ビヒクル成分という)とを混合した
後、前記揮発性分散媒を蒸発させる方法。(b) A method in which a dispersion (fine particulate inorganic substance) and a substance serving as a substrate (hereinafter referred to as a vehicle component) are mixed in a volatile dispersion medium, and then the volatile dispersion medium is evaporated.
(C)微粒子状無機物をモノマー成分に分散させた後重
合する方法などが用いられる。(C) A method is used in which fine particulate inorganic material is dispersed in a monomer component and then polymerized.
上記のうちで被覆材料に関して本発明を適用する場合は
、(b)項の方法が好ましい。この場合揮発性分散媒の
蒸発によって生成する塗膜が硬化することもある。When the present invention is applied to the coating material among the above methods, the method in item (b) is preferred. In this case, the coating film formed by evaporation of the volatile dispersion medium may be cured.
揮発性分散媒として用いられるものは、例えば水、炭化
水素、塩素化炭化水素、エステル類、ケトン類、アルコ
ール類、有機カルボン酸類などを挙げることができる。Examples of volatile dispersion media that can be used include water, hydrocarbons, chlorinated hydrocarbons, esters, ketones, alcohols, and organic carboxylic acids.
またこれらは単独のみならず2種以上の混合物として用
いることも可能である。Moreover, these can be used not only alone but also as a mixture of two or more.
本発明の微粒子状無機物が透明材料に含有される量は、
少なくとも、好ましくは1μm以下の表層部分に、5〜
80重量%、好ましくは10〜70重里%である。5重
量%未満では添加の効果が小さく、また80重量%を越
える量ではクラックの発生、透明性の低下などの欠陥を
生ずる。The amount of the particulate inorganic substance of the present invention contained in the transparent material is
At least, preferably in the surface layer part of 1 μm or less, 5 to 5
It is 80% by weight, preferably 10 to 70% by weight. If the amount is less than 5% by weight, the effect of addition will be small, and if the amount exceeds 80% by weight, defects such as cracking and decreased transparency will occur.
無機物を透明材料中に分散させる方法として、上述のよ
うに直接基材(透明材料)中に分散させる方法、または
被覆材中に分散させこれを透明材料に塗布する方法(以
下コーティング法という)のいずれによるかは特に重要
ではないが、コーティング法によった場合は次の利点を
有する。Methods for dispersing inorganic substances in transparent materials include the above-mentioned method of directly dispersing them in the base material (transparent material), or the method of dispersing them in a coating material and applying this to the transparent material (hereinafter referred to as coating method). Although it is not particularly important which method is used, the coating method has the following advantages.
すなわわち該基材に該当する微粒子状無機物を容易に分
散することができない場合、もしくは分散できても該基
材の性状に著しい変化を生ずる場合には、コーティング
法が該基材の性状に大きな変化を生ずることがない。In other words, if the fine particulate inorganic substance cannot be easily dispersed in the substrate, or if it can be dispersed but would cause a significant change in the properties of the substrate, the coating method may be used to improve the properties of the substrate. No major changes will occur.
前記の微粒子状無機物の分散にあたり、その分散前の形
態としては、微細粉末状のものを使用することも出来る
が、本発明の目的を達成するためには液状の分散媒中に
コロイド状に分散されているものがとくに有効である。When dispersing the above-mentioned fine particulate inorganic material, it is possible to use a fine powder form before dispersion, but in order to achieve the purpose of the present invention, it is necessary to disperse the fine particulate inorganic material in a colloidal form in a liquid dispersion medium. The ones listed above are particularly effective.
本発明の微粒子状無機物を分散させている基質すなわち
ビヒクル成分は、とくに制限はないが、得られた微粒子
状無機物を含有する透明被覆層の表面を更に活性化ガス
で処理することによって、反射防止薄膜を設けることを
考慮すると、活性化ガス処理によって部分的もしくはそ
の全部が揮散、消滅することにより、前記無機物の微細
空孔含有表面を形成するものであることが好ましい。通
常は有機化合物および/または有機ケイ素化合物など有
機基を有する各種の元素を含有する化合物を使用するこ
とができ、とくにこれらの高分子化合物が有用である。The substrate or vehicle component in which the particulate inorganic material of the present invention is dispersed is not particularly limited. Considering the provision of a thin film, it is preferable that the surface of the inorganic substance is formed by partially or completely volatilizing or disappearing by activated gas treatment, thereby forming a surface containing micropores of the inorganic substance. Compounds containing various elements having organic groups, such as organic compounds and/or organosilicon compounds, can usually be used, and these polymer compounds are particularly useful.
これらの例としてはエポキシ樹脂、アクリル酸エステル
および/またはメタクリル酸エステルの共重合体(この
中には他のビニルモノマとの共重合体も含む)、ポリア
ミド、ポリエステル(いわゆるアルキド樹脂、不飽和ポ
リエステル樹脂を含む)、各種アミノ樹脂(メラミン樹
脂、尿素樹脂などを含む)、ウレタン樹脂、ポリカーボ
ネート、ポリ酢酸ビニル、ポリビニルアルコール、スチ
レン樹脂、透明塩化ビニル樹脂、ケイ素系樹脂、繊維素
系樹脂およびジエチレングリコールビスアリルカーボネ
ート重合体(CR−39)を挙げることができる。Examples of these are epoxy resins, copolymers of acrylic esters and/or methacrylic esters (including copolymers with other vinyl monomers), polyamides, polyesters (so-called alkyd resins, unsaturated polyester resins). ), various amino resins (including melamine resins, urea resins, etc.), urethane resins, polycarbonates, polyvinyl acetate, polyvinyl alcohol, styrene resins, transparent vinyl chloride resins, silicon resins, cellulose resins, and diethylene glycol bisallyl. Carbonate polymer (CR-39) can be mentioned.
さらにこれらの樹脂は併用も可能であり、また適当な硬
化剤を併用することにより得られるこれらの硬化物も使
用することができる。Furthermore, these resins can be used in combination, and cured products obtained by using an appropriate curing agent in combination can also be used.
上記ビヒクル成分には、さらに可塑剤、各種硬化剤、硬
化触媒などの他、表面調整剤、紫外線吸収剤、酸化防止
剤などの各種添加剤を含ませることができる。In addition to plasticizers, various curing agents, curing catalysts, etc., the vehicle component may further contain various additives such as surface conditioners, ultraviolet absorbers, and antioxidants.
本発明の透明被覆層を有する成形体は、下式によって求
められる曇価(パーセント)が80パーセント以下のも
のであることが好ましい。The molded article having a transparent coating layer of the present invention preferably has a haze value (percentage) of 80% or less as determined by the following formula.
曇価(%)=(拡散光線透過率/全光線透過率)×10
0
とくにプラスチック物品の表面硬度向上のための被覆剤
として用いられるケイ素系高分子化合物ないしはこれを
含む高分子化合物との併存は、表面硬度の向上を与える
ものとして効果的に使用することができる。Haze value (%) = (diffuse light transmittance/total light transmittance) x 10
0 In particular, the coexistence with a silicon-based polymer compound or a polymer compound containing the silicon-based polymer compound used as a coating agent for improving the surface hardness of plastic articles can be effectively used to improve the surface hardness.
また本発明の透明被覆層を有する成形体は、無色のもの
でも染顔料等で着色されたものであってもよい。Further, the molded article having a transparent coating layer of the present invention may be colorless or colored with dyes and pigments.
ケイ素系高分子被覆層を与える方法は種々提案されてい
るが、下記の一般式を有する化合物群および/またはこ
れらの加水分解物からなる群から選ばれた化合物を硬化
させて得られたものを用いる方法が特に有効である。Various methods have been proposed for providing a silicon-based polymer coating layer, but a method obtained by curing a compound selected from the group consisting of compounds having the following general formula and/or their hydrolysates is proposed. The method used is particularly effective.
すなわち、−最大
%式%()
からなる化合物であって、ここでR1、R2はC,%C
,oのアルキル、アリール、ハロゲン化アルキル、ハロ
ゲン化アリール、アルケニル、またはエポキシ基、(メ
タ)アクリルオキシ基、メルカプト基、アミノ基、もし
くはシアノ基を有する有機基で 5i−C結合によりケ
イ素と結合されているものであり R3はC1−〜C6
のアルキル基、アルコキシアルキル基またはアシル基で
あり、aおよびbは0.1、または2であり、a+bが
1または2である。That is, a compound consisting of the formula %() where R1 and R2 are C, %C
, o alkyl, aryl, halogenated alkyl, halogenated aryl, alkenyl, or an organic group having an epoxy group, (meth)acryloxy group, mercapto group, amino group, or cyano group, bonded to silicon through a 5i-C bond R3 is C1- to C6
is an alkyl group, alkoxyalkyl group or acyl group, a and b are 0.1 or 2, and a+b is 1 or 2.
これらの化合物の例としては、メチルトリメトキシシラ
ン、メチルトリエトキシシラン、メチルトリメトキシエ
トキシシラン、メチルトリアセトキシシラン、メチルト
リプロポキシシラン、メチルトリブトキシシラン、エチ
ルトリメトキシシラン、エチルトリエトキシシラン、ビ
ニルトリメトキシシラン、ビニルトリエトキシシラン、
ビニルトリアセトキシシラン、ビニルトリメトキシエト
キシシラン、フェニルトリメトキシシラン、フェニルト
リエトキシシラン、フェニルトリアセトキシシラン、γ
−クロロプロピルトリメトキシシラン、γ−クロロプロ
ピルトリエトキシシラン、γ−クロロプロピルトリプロ
ポキシシラン、3. 3゜3−トリフロロプロピルトリ
メトキシシラン、γ−グリシドキシプロピルトリメトキ
シシラン、γ−グリシドキシプロピルトリエトキシシラ
ン、γ−(β−グリシドキシエトキシ)プロピルトリッ
トキシシラン、β−(3,4−エポキシシクロヘキシル
)エチルトリメトキシシラン、β−(3゜4−エポキシ
シクロヘキシル)エチルトリエトキシシラン、γ−メタ
クリルオキシプロピルトリメトキシシラン、γ−アミノ
プロピルトリメトキシシラン、γ−アミノプロピルトリ
エトキシシラン、γ−メルカプトプロピルトリメトキシ
シラン、γ−メルカプトプロピルトリエトキシシラン、
N−(β−アミノエチル)−γ−アミノプロピルトリメ
トキシシラン、β−シアノエチルトリエトキシシランな
どトリアルコキシまたはトリアジルオキシシラン類およ
びジメチルジメトキシシラン、フェニルメチルジメトキ
シシラン、ジメチルジェトキシシラン、フェニルメチル
ジェトキシシラン、γ−グリシドキシプロピルメチルジ
メトキシシラン、γ−グリシドキシプロピルメチルジメ
トキシシラン、γ−グリシドキシプロピルメチルジェト
キシシラン、γ−グリシドキシプロピルフエニルジメト
キシシラン、γ−グリシドキシプロピルフエニルジエト
キシシラン、γ−クロロプロピルメチルジメトキシシラ
ン、γ−クロロプロピルメチルジェトキシシラン、ジメ
チルジアセトキシシラン、γ−メタクリルオキシプロピ
ルメチルジメトキシシラン、γ−メタクリルオキシプロ
ピルメチルジェトキシシラン、γ−メルカプトプロピル
メチルジメトキシシラン、γ−メルカプトプロピルメチ
ルジェトキシシラン、γ−アミノプロピルメチルジメト
キシシラン、γ−アミノプロピルメチルジェトキシシラ
ン、メチルビニルジメトキシシラン、メチルビニルジェ
トキシシランなどジアルコキシシランまたはジアシルオ
キシシラン類がその例である。Examples of these compounds include methyltrimethoxysilane, methyltriethoxysilane, methyltrimethoxyethoxysilane, methyltriacetoxysilane, methyltripropoxysilane, methyltributoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, vinyl trimethoxysilane, vinyltriethoxysilane,
Vinyltriacetoxysilane, vinyltrimethoxyethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, phenyltriacetoxysilane, γ
-Chloropropyltrimethoxysilane, γ-chloropropyltriethoxysilane, γ-chloropropyltripropoxysilane, 3. 3゜3-Trifluoropropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-(β-glycidoxyethoxy)propyltritoxysilane, β-(3 , 4-epoxycyclohexyl)ethyltriethoxysilane, β-(3゜4-epoxycyclohexyl)ethyltriethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane , γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane,
Trialkoxy or triazyloxysilanes such as N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane, β-cyanoethyltriethoxysilane, dimethyldimethoxysilane, phenylmethyldimethoxysilane, dimethyljethoxysilane, phenylmethyljetoxysilane, etc. Toxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-glycidoxypropylmethyljethoxysilane, γ-glycidoxypropylphenyldimethoxysilane, γ-glycidoxy Propylphenyldiethoxysilane, γ-chloropropylmethyldimethoxysilane, γ-chloropropylmethyljethoxysilane, dimethyldiacetoxysilane, γ-methacryloxypropylmethyldimethoxysilane, γ-methacryloxypropylmethyljethoxysilane, γ- Dialkoxysilane or diacyloxysilane such as mercaptopropylmethyldimethoxysilane, γ-mercaptopropylmethyljethoxysilane, γ-aminopropylmethyldimethoxysilane, γ-aminopropylmethyljethoxysilane, methylvinyldimethoxysilane, methylvinyljethoxysilane An example is
これらの有機ケイ素化合物は単独または2種以上組合せ
ることも可能である。These organosilicon compounds can be used alone or in combination of two or more.
さらに単独では用いられないが上記のシラン化合物と併
用できるものとして各種のテトラアルコキシシラン類も
しくはその加水分解物がある。Furthermore, there are various tetraalkoxysilanes or their hydrolysates that can be used in combination with the above-mentioned silane compounds, although they cannot be used alone.
テトラアルコキシシラン類の例としてはメチルシリケー
ト、エチルシリケート、n−プロピルシリケート、イソ
プロピルシリケート、n−ブチルシリケート、5ec−
ブチルシリケートおよびtブチルシリケートなどがある
。Examples of tetraalkoxysilanes include methyl silicate, ethyl silicate, n-propyl silicate, isopropyl silicate, n-butyl silicate, 5ec-
Examples include butyl silicate and t-butyl silicate.
またこれらの有機ケイ素化合物は触媒が存在しなくても
硬化が可能であるが、さらに硬化を促進するために各種
の硬化触媒を用いることが可能である。たとえばルイス
酸、ルイス塩基を含む各種酸もしくは塩基、たとえは有
機カルボン酸、クロム酸、次亜塩素酸、ホウ酸、臭素酸
、亜セレン酸、チオ硫酸、オルトケイ酸、チオシアン酸
、亜硝酸、アルミン酸、炭酸の金属塩とくにアルカリ金
属塩またはアンモニウム塩、さらにアルミニウム、ジル
コニウム、チタニウムのアルコキシドまたはこれらの錯
化合物などが使用できる。当然のことながらこれうと他
の有機物質との併用が可能であり、これらの中にはエポ
キシ樹脂、アクリル系共重合体とくに水酸基を有するも
の、例えは、ポリビニルアルコールなどが有用である。Although these organosilicon compounds can be cured even in the absence of a catalyst, various curing catalysts can be used to further accelerate curing. Various acids or bases including Lewis acids, Lewis bases, such as organic carboxylic acids, chromic acid, hypochlorous acid, boric acid, bromic acid, selenite, thiosulfuric acid, orthosilicic acid, thiocyanic acid, nitrite, aluminium. Metal salts of acids and carbonates, particularly alkali metal salts or ammonium salts, as well as alkoxides of aluminum, zirconium, titanium, or complex compounds thereof, can be used. Naturally, this material can be used in combination with other organic substances, and among these, epoxy resins and acrylic copolymers, especially those having hydroxyl groups, such as polyvinyl alcohol, are useful.
さらにコーテイング材として用いる場合にはコーティン
グ作業を容易にするためのまたは保存安定性を良好に保
つための溶剤類および各種添加剤の使用が可能である。Furthermore, when used as a coating material, it is possible to use solvents and various additives to facilitate coating work or maintain good storage stability.
基材としては何でも良いのであるが、透明性の観点から
は、ガラス、透明プラスチック材料がとくに有効な結果
を与える。上記のプラスチック材料としては、ポリメチ
ルメタクリレートおよびその共重合体、ポリカーボネー
ト、ジエチレングリコールビスアリルカーボネートポリ
マ(CR−39)、ポリエステルとくにポリエチレンテ
゛レフタレート、および不飽和ポリエステル、エポキシ
樹脂、ポリエーテルスルホンなどが好ましい。塗布方法
、乾燥および/または硬化方法は通常コーティング分野
で行なわれているものを適宜選択して行なう。Any base material may be used, but from the viewpoint of transparency, glass and transparent plastic materials give particularly effective results. Preferred examples of the above-mentioned plastic materials include polymethyl methacrylate and copolymers thereof, polycarbonate, diethylene glycol bisallyl carbonate polymer (CR-39), polyester, especially polyethylene terephthalate, unsaturated polyester, epoxy resin, polyether sulfone, and the like. The coating method, drying and/or curing method is appropriately selected from those commonly used in the coating field.
本発明においては、上記のようにして得られた微粒子状
無機物を含有する透明被覆層の表面を、前述したように
更に活性化ガスによって処理し、反射防止薄層を設けて
もよい。さらには微粒子状無機物を含有する透明被覆層
の上に無機物からなる単層または多層の反射防止膜を真
空蒸着やスパッタリング方法で設けてもよい。In the present invention, the surface of the transparent coating layer containing the particulate inorganic material obtained as described above may be further treated with an activated gas as described above to provide an antireflection thin layer. Furthermore, a single-layer or multilayer anti-reflection film made of an inorganic material may be provided on the transparent coating layer containing a particulate inorganic material by vacuum deposition or sputtering.
[実施例]
実施例1
(1) シラン加水分解物の調製
γ−グリシドキシプロビルトリメトキシシラン23.6
gを10℃に冷却し、攪拌しながら0゜01規定塩酸水
溶液5.4gを徐々に滴下し、滴下終了後、室温にてさ
らに1時間攪拌をつづけてシラン加水分解物を得た。[Example] Example 1 (1) Preparation of silane hydrolyzate γ-glycidoxyprobyltrimethoxysilane 23.6
g was cooled to 10° C., 5.4 g of a 0°01 N aqueous hydrochloric acid solution was gradually added dropwise with stirring, and after the dropwise addition was completed, stirring was continued for an additional hour at room temperature to obtain a silane hydrolyzate.
(2) コーティング剤の調製
前記シラン加水分解物に、エチルアルコール18.7g
、フェネチルアルコール100.3g。(2) Preparation of coating agent Add 18.7 g of ethyl alcohol to the silane hydrolyzate.
, phenethyl alcohol 100.3g.
シリコーン系界面活性剤0.08gを添加混合し、アル
ミニウムアセチルアセトネート0.5gを添加し、充分
に攪拌した後、さらに金属酸化物微粒子として平均粒子
径が100mμの酸化インジウム/酸化スズ系混合無機
酸化物を39.5gを添加し、ペイントコンディショナ
ーで充分に分散させた。該組成物中にさらに平均粒子径
が55mμのコロイド状五酸化アンチモンの50重量%
水分散液33.4をさらに添加し、再度ペイントコンデ
ィショナーで分散混合して、コーティング剤とした。After adding and mixing 0.08 g of silicone surfactant and 0.5 g of aluminum acetylacetonate and stirring thoroughly, further indium oxide/tin oxide mixed inorganic metal oxide fine particles with an average particle size of 100 mμ are added. 39.5 g of oxide was added and thoroughly dispersed with paint conditioner. The composition further contains 50% by weight of colloidal antimony pentoxide having an average particle size of 55 mμ.
Aqueous dispersion 33.4 was further added and dispersed and mixed again with a paint conditioner to obtain a coating agent.
(3) コーティング剤の塗布、キュア前項のコーテ
ィング剤を厚み3.0mmの平板状無機ガラス基板に#
1−6のバーコーターを使用して塗布した。塗布後、5
分間室内にてセツティングを行い、その後、80℃、1
2分間、さらに130℃で2時間、加熱キュアさせた。(3) Applying the coating agent and curing. Apply the coating agent described in the previous section to a flat inorganic glass substrate with a thickness of 3.0 mm.
Coating was performed using a bar coater No. 1-6. After application, 5
Set the temperature indoors for 1 minute, then heat at 80℃ for 1 minute.
It was heated and cured for 2 minutes and then at 130° C. for 2 hours.
(4)評価方法 (イ) 塗膜厚み JIS BO651に従って行った。(4) Evaluation method (a) Coating film thickness It was carried out in accordance with JIS BO651.
(ロ) 比抵抗値
4探針法による表面抵抗値(シート抵抗値)を求め、塗
膜厚みを乗することによって比抵抗値とした。(b) Specific resistance value The surface resistance value (sheet resistance value) was determined by the four-probe method, and the specific resistance value was obtained by multiplying the surface resistance value by the coating film thickness.
(ハ) ヘイズ
直読ヘーズコンピューター(スガ試験機(株)製)を使
用して測定した。(c) Haze was measured using a direct reading haze computer (manufactured by Suga Test Instruments Co., Ltd.).
(ニ) 表面硬度
JIS K5400にて鉛筆硬度を測定して表面硬度
とした。(d) Surface hardness Pencil hardness was measured according to JIS K5400 and defined as surface hardness.
(5)評価結果
塗膜厚みは6.5μm1比抵抗値が228Ω/口、ヘイ
ズは、5.3%をそれぞれ示した。また、鉛筆硬度は9
Hであり、表面硬度に優れるものであった。(5) Evaluation results The coating thickness was 6.5 μm, the specific resistance value was 228 Ω/mouth, and the haze was 5.3%. Also, the pencil hardness is 9
H, and the surface hardness was excellent.
[発明の効果]
本発明の透明被覆層を有する成形体は硬度が高く透明性
が良好なうえ、コーティング層の干渉縞の欠点がな(、
極めて高品位な成形物とすることができる。そして反射
防止効果の付与特性に優れ、レンズ等に適用すると、目
の疲れがなく、着用感に優れたものとすることができる
。さらには、導電性を有するため、帯電防止性に優れ、
はこりやゴミが付着しないなどといった特徴をも有する
ものである。[Effects of the Invention] The molded product having the transparent coating layer of the present invention has high hardness and good transparency, and does not have the disadvantage of interference fringes of the coating layer (
An extremely high-quality molded product can be obtained. It also has excellent antireflection properties, and when applied to lenses, etc., it can provide an excellent feeling of wearing without causing eye fatigue. Furthermore, because it has conductivity, it has excellent antistatic properties,
It also has features such as not attracting dust or dirt.
Claims (5)
平均粒子径が1〜300mμのSnの酸化物からなる微
粒子状無機物を5〜80重量%含有することを特徴とす
る透明被覆層を有する成形体。(1) A molded article having a transparent coating layer, characterized in that the transparent layer contains 5 to 80% by weight of a fine particulate inorganic substance made of an oxide of Sn with an average particle diameter of 1 to 300 mμ. A molded body having
で80%以下であることを特徴とする請求項(1)記載
の透明被覆層を有する成形体。 曇価(%)=(拡散光線透過率/全光線透過率)×10
0(2) The molded article having a transparent coating layer according to claim (1), wherein the transparency of the molded article is 80% or less in haze value determined by the following formula. Haze value (%) = (diffuse light transmittance/total light transmittance) x 10
0
とする請求項(1)記載の透明被覆層を有する成形体。(3) The molded article having a transparent coating layer according to claim (1), wherein the transparent layer contains an organosilicon polymer.
を含むことを特徴とする請求項(1)記載の透明被覆層
を有する成形体。(4) The molded article having a transparent coating layer according to claim (1), wherein the transparent layer contains an organic polymer compound having a crosslinked structure.
ックであることを特徴とする請求項(1)記載の透明被
覆層を有する成形体。(5) The molded article having a transparent coating layer according to claim (1), wherein the base material of the molded article is transparent glass or transparent plastic.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1136544A JPH0222340A (en) | 1989-05-29 | 1989-05-29 | Molded body having transparent coating layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1136544A JPH0222340A (en) | 1989-05-29 | 1989-05-29 | Molded body having transparent coating layer |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60009247A Division JPS60221702A (en) | 1985-01-23 | 1985-01-23 | Molding having transparent coating layer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0222340A true JPH0222340A (en) | 1990-01-25 |
JPH0351733B2 JPH0351733B2 (en) | 1991-08-07 |
Family
ID=15177683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1136544A Granted JPH0222340A (en) | 1989-05-29 | 1989-05-29 | Molded body having transparent coating layer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0222340A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992009665A1 (en) * | 1990-11-21 | 1992-06-11 | Catalysts & Chemicals Industries Co., Ltd. | Coating solution for forming transparent electrically conductive film, method of preparation thereof, electrically conductive substrate, method of preparation thereof, and display device having transparent electrically conductive substrate |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5848502B2 (en) | 2010-11-10 | 2016-01-27 | 株式会社リブドゥコーポレーション | Absorbent article and method for manufacturing absorbent article |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51126222A (en) * | 1975-03-07 | 1976-11-04 | Minnesota Mining & Mfg | Abrasionnresisting coated material |
JPS5785866A (en) * | 1980-11-18 | 1982-05-28 | Mitsubishi Metal Corp | Antistatic transparent paint |
JPS57159645A (en) * | 1981-03-27 | 1982-10-01 | Teijin Ltd | Conductive laminate |
JPS609247A (en) * | 1983-06-28 | 1985-01-18 | Fujitsu Ltd | Confirmation system for multiple address communication of token ring |
JPS60221702A (en) * | 1985-01-23 | 1985-11-06 | Toray Ind Inc | Molding having transparent coating layer |
-
1989
- 1989-05-29 JP JP1136544A patent/JPH0222340A/en active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51126222A (en) * | 1975-03-07 | 1976-11-04 | Minnesota Mining & Mfg | Abrasionnresisting coated material |
JPS5785866A (en) * | 1980-11-18 | 1982-05-28 | Mitsubishi Metal Corp | Antistatic transparent paint |
JPS57159645A (en) * | 1981-03-27 | 1982-10-01 | Teijin Ltd | Conductive laminate |
JPS609247A (en) * | 1983-06-28 | 1985-01-18 | Fujitsu Ltd | Confirmation system for multiple address communication of token ring |
JPS60221702A (en) * | 1985-01-23 | 1985-11-06 | Toray Ind Inc | Molding having transparent coating layer |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992009665A1 (en) * | 1990-11-21 | 1992-06-11 | Catalysts & Chemicals Industries Co., Ltd. | Coating solution for forming transparent electrically conductive film, method of preparation thereof, electrically conductive substrate, method of preparation thereof, and display device having transparent electrically conductive substrate |
US5376308A (en) * | 1990-11-21 | 1994-12-27 | Catalysts & Chemicals Industries Co., Ltd. | Coating solution for forming transparent conductive coating and process for preparing same |
US5492762A (en) * | 1990-11-21 | 1996-02-20 | Catalysts & Chemicals Industries Co., Ltd. | Conductive substrate and display device provided with transparent conductive substrate |
Also Published As
Publication number | Publication date |
---|---|
JPH0351733B2 (en) | 1991-08-07 |
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