JPH02222599A - Electronic equipment case - Google Patents
Electronic equipment caseInfo
- Publication number
- JPH02222599A JPH02222599A JP4396189A JP4396189A JPH02222599A JP H02222599 A JPH02222599 A JP H02222599A JP 4396189 A JP4396189 A JP 4396189A JP 4396189 A JP4396189 A JP 4396189A JP H02222599 A JPH02222599 A JP H02222599A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- circuit board
- electronic circuit
- electronic equipment
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
Abstract
Description
【発明の詳細な説明】 〔発明の目的〕 (産業上の利用分野) 本発明は、電話機等の電子機器に用いる筐体に関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a housing used for electronic equipment such as a telephone.
(従来の技術)
第4図は、電話闘の筐体内に配置される電子回路基板を
例示している。(Prior Art) FIG. 4 illustrates an example of an electronic circuit board disposed within a housing of a telephone.
この電子回路基板1には、アナログ回路ブロック2とデ
ジタル回路ブロック3が組込まれ、かつ両回路ブロック
2.3間にコネクタ4が配設されている。This electronic circuit board 1 incorporates an analog circuit block 2 and a digital circuit block 3, and a connector 4 is disposed between both circuit blocks 2.3.
なお、コネクタ4は図示されていないサブ基板を連結支
持するために設けられている。Note that the connector 4 is provided to connect and support a sub-board (not shown).
(発明が解決しようとする課題)
回路ブロック2.3間にコネクタ4が位置された上記基
板1においては、該回路ブロック2゜3を相互に接続す
る印刷配線パターン5a〜5dを基板1の側端部に形成
せざるを得す、これは基板1の大型化ならびにこの基板
1を収納する筐体の大型化、ひいては電話機全体の大型
化を招来する。(Problem to be Solved by the Invention) In the board 1 in which the connector 4 is located between the circuit blocks 2 and 3, the printed wiring patterns 5a to 5d that interconnect the circuit blocks 2 and 3 are placed on the side of the board 1. This results in an increase in the size of the board 1, the casing that houses the board 1, and the overall size of the telephone.
なお、電話機以外の電子は器においても同様の不具合を
生じている。Incidentally, similar problems occur in electronic equipment other than telephones.
本発明の目的は、かかる状況に2み、電子回路基板の小
型化を図ることができる電子機器の筐体を提供すること
にある。In view of this situation, it is an object of the present invention to provide a casing for an electronic device that can reduce the size of an electronic circuit board.
〔発明の構成]
(課題を解決するための手段)
本発明に係る電子m器の筐体は、内面に印刷配線パター
ンを形成している。[Structure of the Invention] (Means for Solving the Problems) The casing of the electronic device according to the present invention has a printed wiring pattern formed on its inner surface.
(作用)
この筐体では、上記印刷配線パターンが配線手段として
活用される。(Function) In this case, the printed wiring pattern is utilized as a wiring means.
(実施例)
以下、図面を参照しながら本発明の実施例について説明
する。(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.
第1図は、本発明に係る筐体を適用した電話機を示して
いる。FIG. 1 shows a telephone to which a housing according to the present invention is applied.
この電話係の筐体10は、ベース10aにカバー10b
をV!着した構成をもち、合成樹脂等の電気絶縁性材料
で形成されている。This phone clerk housing 10 has a base 10a and a cover 10b.
V! It has a fixed structure and is made of electrically insulating material such as synthetic resin.
第2図に示すように、ベース10aの底部内面には、該
ベース10aの長手方向に沿った直線状の印刷配線パタ
ーン118〜11dが形成され、更にこのパターン11
8〜11dの一端部および他端部の近傍に、コネクタ支
持片12の対およびコネクタ支持片13の対がそれぞれ
突設されている。As shown in FIG. 2, linear printed wiring patterns 118 to 11d are formed along the longitudinal direction of the base 10a on the inner surface of the bottom part of the base 10a.
A pair of connector support pieces 12 and a pair of connector support pieces 13 are protruded near one end and the other end of the connectors 8 to 11d, respectively.
筐体10内には、電子回路基板14が配置されており、
該基板14)よりラー15を介して上記カバー10bに
固定されている。An electronic circuit board 14 is arranged inside the casing 10,
The substrate 14) is fixed to the cover 10b via a collar 15.
第3図に示すように上記電子回路基板14には、アナロ
グ回路ブロック16とデジタル回路ブロック17が実装
され、かつ第1図に示したサブ基板18を固定支持する
ためのコネクタ19が両回路ブロック:16.17間に
配設されている。As shown in FIG. 3, an analog circuit block 16 and a digital circuit block 17 are mounted on the electronic circuit board 14, and a connector 19 for fixedly supporting the sub-board 18 shown in FIG. : It is located between 16 and 17.
上記回路ブロック16および17の端部には、後述する
インタコネクタ20および21の上面が接触される接点
部16aおよび17aが形成されている。Contact portions 16a and 17a are formed at the ends of the circuit blocks 16 and 17, with which the upper surfaces of interconnectors 20 and 21, which will be described later, come into contact.
インタコネクタ20は、第2図に示す如く、ゴムからな
る本体部20aと導電ゴムからなる複数本の導体部20
bとからなっている。各導体部20t)は、互いに平行
する態楊で本体部20bを上下に貫通しており、その配
列ピッチは前記印刷配線パターン11a〜11dの配列
ピッチと一致している。As shown in FIG. 2, the interconnector 20 includes a main body portion 20a made of rubber and a plurality of conductor portions 20 made of conductive rubber.
It consists of b. The conductor parts 20t) vertically pass through the main body part 20b in parallel to each other, and the arrangement pitch thereof matches the arrangement pitch of the printed wiring patterns 11a to 11d.
なお、他方のインタコネクタ21も、本体部21aに複
数本の導体部21bを貫通させた構成をもつ。Note that the other interconnector 21 also has a configuration in which a plurality of conductor portions 21b are passed through the main body portion 21a.
インタコネクタ20および21は、それぞれ前記一対の
コネクタ支持片12問および一対のコネクタ支持片13
間に嵌合され、これによって前記ベース10aに立設支
持される。The interconnectors 20 and 21 include the pair of connector support pieces 12 and the pair of connector support pieces 13, respectively.
The base 10a is fitted into the base 10a, thereby being supported upright on the base 10a.
この状態で、ベース10aにカバー10k)を嵌着する
と、前記基板11の各回路ブロック16および17に形
成された接点部16aおよび17aによってインタコネ
クタ20および21がそれぞれ押圧される。その結果、
インタコネクタ20の各導体部20aを介して、接点部
16aと前記印刷配線パターン11a〜11dの一端部
とが電気的に接続され、またインタコネクタ21の各導
体部21aを介して接点部17aと前記印刷配線板パタ
ーン11a〜11dの他端部とが電気的に接続される。When the cover 10k) is fitted onto the base 10a in this state, the interconnectors 20 and 21 are pressed by the contact portions 16a and 17a formed on each circuit block 16 and 17 of the board 11, respectively. the result,
The contact portion 16a and one end of the printed wiring patterns 11a to 11d are electrically connected via each conductor portion 20a of the interconnector 20, and the contact portion 17a is electrically connected via each conductor portion 21a of the interconnector 21. The other ends of the printed wiring board patterns 11a to 11d are electrically connected.
かくして、電子回路基板14のアナログ回路ブロック1
6とデジタル回路ブロック17は、インタコネクタ20
.21および印刷[Jパターン118〜11dを介して
電気的に接続されることになる。Thus, the analog circuit block 1 of the electronic circuit board 14
6 and digital circuit block 17 are connected to interconnector 20
.. 21 and printing [will be electrically connected via J patterns 118 to 11d.
第3図と第4図の対比から明らかなように、この実施例
によれば、第4図に示した基板1上の印刷配線パターン
5a〜5dが不要となり、その結果、基板14の幅を基
板1よりも小さくすることができる。As is clear from the comparison between FIG. 3 and FIG. 4, according to this embodiment, the printed wiring patterns 5a to 5d on the substrate 1 shown in FIG. It can be made smaller than the substrate 1.
なお、印刷配線パターンは、筺体10のベース10aの
底部上面だけでなく、必要に応じて該ベース10aの側
部内面やカバー10bの内面にも形成することができる
。Note that the printed wiring pattern can be formed not only on the bottom top surface of the base 10a of the housing 10, but also on the side inner surface of the base 10a and the inner surface of the cover 10b, if necessary.
また、この印刷配線パターンは、電子回路基板上の回路
ブロック間の接続だけでなく、筐体内に取付けられる電
気部品間の接続にも適用することができる。Furthermore, this printed wiring pattern can be applied not only to connections between circuit blocks on an electronic circuit board, but also to connections between electrical components installed within a housing.
そして、筺体内面に印刷配線パターンを形成するという
本発明の技術は、電話機以外の電子別器にも有効に適用
することができる。The technique of the present invention of forming a printed wiring pattern on the inner surface of the housing can be effectively applied to electronic devices other than telephones.
本発明に係る筐体は、その内面に印刷配線パターンを形
成しであるので、この印刷配線パターンを例えば電子回
路基板における各電子回路ブロック間の接続に利用する
ことにより、該回路基板の小型化、ひいては電子別器全
体の小型化を図ることができる。したがって、小型化を
要求される電話顆笠の電子機器に採用して好適である。Since the casing according to the present invention has a printed wiring pattern formed on its inner surface, the printed wiring pattern can be used, for example, to connect each electronic circuit block on an electronic circuit board, thereby reducing the size of the circuit board. Therefore, it is possible to downsize the electronic separate device as a whole. Therefore, it is suitable for use in electronic equipment such as telephone caps that require miniaturization.
第1図は、本発明に係る筐体の電話機への適用例を概念
的に示した縦断面図、第2図は印刷配線パターンの構成
およびインタコネクタの構成を概念的に示した斜視図、
第3図は第1図に示した電話機の電子回路基板の構成を
例示した概念図、第4図は従来の電話機の電子回路基板
の構成を例示した概念図である。
10・・・筺体、10a・・・ベース、10b・・・カ
バー11a〜11d・・・印刷配線パターン、14・・
・電子回路基板、20.21・・・インタコネクタ。
第1図
第2図FIG. 1 is a vertical cross-sectional view conceptually showing an example of application of the casing according to the present invention to a telephone; FIG. 2 is a perspective view conceptually showing the configuration of a printed wiring pattern and the configuration of an interconnector;
FIG. 3 is a conceptual diagram illustrating the configuration of the electronic circuit board of the telephone shown in FIG. 1, and FIG. 4 is a conceptual diagram illustrating the configuration of the electronic circuit board of the conventional telephone. DESCRIPTION OF SYMBOLS 10... Housing, 10a... Base, 10b... Covers 11a-11d... Printed wiring pattern, 14...
・Electronic circuit board, 20.21...interconnector. Figure 1 Figure 2
Claims (1)
子機器の筐体。A casing for an electronic device characterized by having a printed wiring pattern formed on the inside surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4396189A JPH02222599A (en) | 1989-02-23 | 1989-02-23 | Electronic equipment case |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4396189A JPH02222599A (en) | 1989-02-23 | 1989-02-23 | Electronic equipment case |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02222599A true JPH02222599A (en) | 1990-09-05 |
Family
ID=12678305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4396189A Pending JPH02222599A (en) | 1989-02-23 | 1989-02-23 | Electronic equipment case |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02222599A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011129706A (en) * | 2009-12-17 | 2011-06-30 | Toshiba Corp | Electronic apparatus |
JP2011159081A (en) * | 2010-01-29 | 2011-08-18 | Toshiba Corp | Electronic device |
JP2012033765A (en) * | 2010-07-30 | 2012-02-16 | Toshiba Corp | Electronic apparatus |
JP2012033566A (en) * | 2010-07-28 | 2012-02-16 | Toshiba Corp | Electronic device |
JP2012054514A (en) * | 2010-09-03 | 2012-03-15 | Toshiba Corp | Electronic apparatus |
-
1989
- 1989-02-23 JP JP4396189A patent/JPH02222599A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011129706A (en) * | 2009-12-17 | 2011-06-30 | Toshiba Corp | Electronic apparatus |
US8525046B2 (en) | 2009-12-17 | 2013-09-03 | Kabushiki Kaisha Toshiba | Electronic apparatus |
JP2011159081A (en) * | 2010-01-29 | 2011-08-18 | Toshiba Corp | Electronic device |
JP2012033566A (en) * | 2010-07-28 | 2012-02-16 | Toshiba Corp | Electronic device |
JP2012033765A (en) * | 2010-07-30 | 2012-02-16 | Toshiba Corp | Electronic apparatus |
US8305765B2 (en) | 2010-07-30 | 2012-11-06 | Kabushiki Kaisha Toshiba | Electronic apparatus |
JP2012054514A (en) * | 2010-09-03 | 2012-03-15 | Toshiba Corp | Electronic apparatus |
US8451616B2 (en) | 2010-09-03 | 2013-05-28 | Kabushiki Kaisha Toshiba | Electronic apparatus |
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