JPH02222191A - Electroplating device for printed board - Google Patents
Electroplating device for printed boardInfo
- Publication number
- JPH02222191A JPH02222191A JP4486389A JP4486389A JPH02222191A JP H02222191 A JPH02222191 A JP H02222191A JP 4486389 A JP4486389 A JP 4486389A JP 4486389 A JP4486389 A JP 4486389A JP H02222191 A JPH02222191 A JP H02222191A
- Authority
- JP
- Japan
- Prior art keywords
- anode
- auxiliary cathode
- printed circuit
- circuit board
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 18
- 239000008151 electrolyte solution Substances 0.000 claims description 11
- 238000007747 plating Methods 0.000 abstract description 19
- 239000003792 electrolyte Substances 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 1
- -1 prepreg Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要］
プリント基板の電解メッキ装置に関し、電解液に浸漬し
たアノードとプリント基板の間を流れる電流と、前記ア
ノードと、該アノードとプリント基板の間に設けた補助
カソード間を流れる電流との比が、電解液の抵抗の変化
にかかわらず所定の値になるような電解メッキ装置を目
的とし、
電解液中にアノードと、メッキ処理すべき被メッキ処理
物とを、補助カソードを介在させた状態で対向配置し、
前記アノードと被メッキ処理物間、および前記アノード
と補助カソード間にそれぞれ別個の定電流電源を設けて
構成する。[Detailed Description of the Invention] [Summary] Regarding an electrolytic plating apparatus for a printed circuit board, a current flows between an anode immersed in an electrolytic solution and a printed circuit board, and an auxiliary current is provided between the anode and the printed circuit board. The purpose is to create an electrolytic plating apparatus in which the ratio of the current flowing between the cathodes and the current flowing between the cathodes and the current flowing through the electrolyte is a predetermined value regardless of changes in the resistance of the electrolyte. , arranged facing each other with an auxiliary cathode interposed between them,
Separate constant current power supplies are provided between the anode and the object to be plated, and between the anode and the auxiliary cathode.
本発明はプリント基板の電解メッキ装置に関する。 The present invention relates to an electrolytic plating apparatus for printed circuit boards.
プリント基板を製造する際、エポキシ樹脂のような基材
の両面に所定の銅箔パターンを形成した中間層と、基材
の片面に所定の銅箔パターンを形成した表面層との間に
半硬化性のエポキシ樹脂より成るプリプレグを挟んで、
上記中間層、プリプレグおよび表面層を加圧積層して多
層基板とした後、該多層基板にスルーホールを設け、該
スルーホール内に無電解銅メッキ層、および電解銅メッ
キ層を形成する工程が採られている。When manufacturing printed circuit boards, semi-curing is applied between the intermediate layer, which has a predetermined copper foil pattern formed on both sides of a base material such as epoxy resin, and the surface layer, which has a predetermined copper foil pattern formed on one side of the base material. Sandwiching prepreg made of synthetic epoxy resin,
After the intermediate layer, prepreg, and surface layer are laminated under pressure to form a multilayer board, a step of providing a through hole in the multilayer board and forming an electroless copper plating layer and an electrolytic copper plating layer in the through hole is performed. It is taken.
ｒ従来の技術〕
このようにスルーポールを設けて、該スルーポール内に
無電解銅メッキ層を形成したプリント基板のスルーポー
ルに電解銅メンキ層を形成する従来の電解メッキ装置に
ついて第２図を用いて説明する。rPrior art] Figure 2 shows a conventional electrolytic plating apparatus that forms an electrolytic copper plating layer on the through pole of a printed circuit board in which a through pole is provided in this way and an electroless copper plating layer is formed inside the through pole. I will explain using
第２図に示すように、硫酸銅等より成る電解液１を収容
したメッキ槽２内には、銅よりなるアノード３と、電解
メッキを施ずべき前記プリンＩ−基板４が所定の間隔を
隔てて対向配置されており、該プリント基板４とアノ−
１” ３間は定電流電源７で接続されている。そしてプ
リント基板４とアノード３間に所定の定電流を流ずごと
で基板４上に所定の電解銅メッキ層を形成している。As shown in FIG. 2, in a plating bath 2 containing an electrolytic solution 1 made of copper sulfate or the like, an anode 3 made of copper and the printed circuit board 4 to be electrolytically plated are placed at a predetermined distance. The printed circuit board 4 and the anode
1" 3 are connected by a constant current power supply 7. A predetermined electrolytic copper plating layer is formed on the substrate 4 by passing a predetermined constant current between the printed circuit board 4 and the anode 3.
然し、このような装置であるとプリント基板の周辺部に
被着される電解メッキ層の厚さが、プリント基板の中央
部にイ」着される電解銅メッキ層の厚さに比較して厚く
形成され、プリント基板の全面に均一な厚さの電解銅メ
ッキ層が形成されない不都合がある。However, with such a device, the thickness of the electrolytic plating layer deposited on the periphery of the printed circuit board is thicker than the thickness of the electrolytic copper plating layer deposited on the center of the printed circuit board. However, there is a problem in that an electrolytic copper plating layer with a uniform thickness cannot be formed over the entire surface of the printed circuit board.
そこで−■−二記リント基板の全面に均一な厚さの電解
メッキ層を形成するために、第３図に示すように、前記
アノ−１′３とプリント基板４間に所定の間隔を隔てて
補助カソード５を介在させた状態で対向配置し、上記ア
ノード３と補助カソード５間は可変抵抗６を介して直流
の定電流電ｒＸ７に接続し、に記アノー）・′３とプリ
ント基板４を可変抵抗６を介して前記補助カソード５と
並列に定電流電源７に接続する。Therefore, in order to form an electrolytic plating layer with a uniform thickness over the entire surface of the lint board described in Section 2, a predetermined interval is placed between the anode 1'3 and the printed circuit board 4, as shown in FIG. The anode 3 and the auxiliary cathode 5 are connected to a DC constant current voltage rX7 via a variable resistor 6, and the anode 3 and the printed circuit board 4 are is connected to a constant current power source 7 in parallel with the auxiliary cathode 5 via a variable resistor 6.
この補助カソード５は第４図（ａ）および第４図（ａ）
のＩＶ−ＩＶ’線の断面図の第４［Ｆ（ｂ）に示すよう
に枠状のステンレス板に銅メッキ処理を施されて形成さ
れており、この補助カソード５を第３図に示すようにプ
リン１〜基板４とアノード３の間に、所定の間隔を隔て
て介在させることで、プリント基板４の周辺部の電流密
度が補助カソードに依って周囲の面積を増加させて高く
成らなくなり、該プリンｌ−Ｊ５板４の周辺部に形成さ
れる電解メッキ層の厚さが、該プリンＩ−基板の中央部
に形成される電解メッキ層の厚さに仕して厚く形成され
る問題を解消し、プリント基板全体にわたって均一な厚
さで電解メッキ層が形成されるようにしている。This auxiliary cathode 5 is shown in FIGS. 4(a) and 4(a).
The auxiliary cathode 5 is formed by copper plating on a frame-shaped stainless steel plate, as shown in No. 4 [F(b) in the cross-sectional view taken along the IV-IV' line in FIG. By interposing the anode 3 between the printed circuit board 1 to the substrate 4 and the anode 3 at a predetermined distance, the current density around the printed circuit board 4 will not increase due to the increase in the surrounding area due to the auxiliary cathode. The problem is that the thickness of the electrolytic plating layer formed on the periphery of the Print I-J5 board 4 is thicker than the thickness of the electrolytic plating layer formed in the center of the Print I-board. This ensures that the electrolytic plating layer is formed with a uniform thickness over the entire printed circuit board.
そしてこの可変抵抗６の値を所定の値に変化させること
で、アノード３と補助カソード５間の電流値、およびア
ノード３とプリント基板４間の電流値の比を所定の値に
制御することで、プリンＩ・基板上に均一な厚さの電解
メッキ層が形成されるようにしている。By changing the value of this variable resistor 6 to a predetermined value, the ratio of the current value between the anode 3 and the auxiliary cathode 5 and the current value between the anode 3 and the printed circuit board 4 can be controlled to a predetermined value. , an electrolytic plating layer of uniform thickness is formed on the printed circuit board.
［発明が解決しようとする課題］
ところで、」１記メッキ装置に於いては、プリン１一基
板４に新鮮な電解液が供給されるようにするため、高圧
ガス等を補助カソード電極５とプリント基板４０間の電
解液中に導入し、該ガスの気泡８によって電解液を攪拌
する操作が採られている。[Problems to be Solved by the Invention] By the way, in the plating apparatus described in 1., in order to supply fresh electrolyte to the print 1 and the substrate 4, high pressure gas etc. are connected to the auxiliary cathode electrode 5. The gas is introduced into the electrolytic solution between the substrates 40, and the electrolytic solution is stirred by the gas bubbles 8.
従って、補助カソード電極５と、プリント基板４との間
に導入された高圧ガスの気泡８により、該気泡が導入さ
れた領域の電解液の抵抗が変化するため、」１記した可
変抵抗６を用いて、アノ−）３とプリント基板４に流れ
る電流、およびアット３と補助カソード電極５間に流れ
る電流の比を所定の値に設定していても、この電流比が
設定値から変動し、プリント基板の所定位置に所定の厚
さの電解銅メッキ層か形成されない問題が生じる。Therefore, the high-pressure gas bubbles 8 introduced between the auxiliary cathode electrode 5 and the printed circuit board 4 change the resistance of the electrolytic solution in the region where the bubbles are introduced, so that the variable resistor 6 described in "1" Even if the ratio of the current flowing between the anode 3 and the printed circuit board 4 and the current flowing between the at 3 and the auxiliary cathode electrode 5 is set to a predetermined value, this current ratio may fluctuate from the set value. A problem arises in that an electrolytic copper plating layer of a predetermined thickness is not formed at a predetermined position on a printed circuit board.
つまり、気泡の出方により補助カソード電極５側ばかり
に電流が流れてプリント基板４が僅かしかメッキされな
かったり、またこの逆の現象が生じ、メッキ厚が一定し
なかったため、実用に供することができなかった。In other words, due to the appearance of air bubbles, current flows only toward the auxiliary cathode electrode 5 side, resulting in only a small amount of the printed circuit board 4 being plated, or vice versa, resulting in inconsistent plating thickness, making it impossible to put it to practical use. could not.
本発明は上記した問題点を解決し、気泡による電解液の
抵抗値の変動が生しても、上記したアノードとプリント
基板間に流れる電流値と、前記アノードと補助カソード
電極間に流れる電流値との比が一定の値になるようにし
たプリント基板の電解メッキ装置の提供を目的とする。The present invention solves the above problems, and even if the resistance value of the electrolyte varies due to bubbles, the current value flowing between the anode and the printed circuit board and the current flowing between the anode and the auxiliary cathode electrode can be reduced. The purpose of the present invention is to provide an electrolytic plating apparatus for printed circuit boards in which the ratio of
（課題を解決するための手段〕
上記目的を達成する本発明の電解メッキ装置は、第１図
に示すように電解液１中にアノード３と、メッキ処理す
べき被メッキ処理物４よを、該アノド３と被メンキ処理
物４間に補助カソード５を所定の間隔を隔てて介在さゼ
た状態で対向配置し、前記アノード３と被メッキ処理物
４、および前記アノード３と補助カソード５間にそれぞ
れ別個に定電流電ｉａｎ、１２を設けて構成する。(Means for Solving the Problems) As shown in FIG. 1, the electrolytic plating apparatus of the present invention that achieves the above object includes an anode 3 and a workpiece 4 to be plated in an electrolytic solution 1. An auxiliary cathode 5 is interposed between the anode 3 and the object to be plated 4 facing each other at a predetermined interval, and between the anode 3 and the object to be plated 4 and between the anode 3 and the auxiliary cathode 5. A constant current electric current (12) is provided separately for each of the two.
本発明の装置は、アノードと被メッキ処理物のプリント
基板間、アノードと補助カソード間を、それぞれ別個の
定電流電源で接続しており、そのため電解液の抵抗値の
変動に関わらず、アノードとプリント基板間、アノード
と補助カソード間に定電流が流れる。そのため、アノー
ドとプリント基板間に流れる電流と、アノードと補助カ
ソード間に流れる電流との比は所定の値を保つようにな
り、電解液の抵抗値の変動に関わらず、プリン１〜基板
の所定位置に所定の電流が流れるようになるので、プリ
ント基板の所定位置に所定の厚さの電解メッキ層が形成
される。The apparatus of the present invention connects the anode and the printed circuit board of the object to be plated, and the anode and the auxiliary cathode using separate constant current power supplies. A constant current flows between the printed circuit board and between the anode and the auxiliary cathode. Therefore, the ratio of the current flowing between the anode and the printed circuit board and the current flowing between the anode and the auxiliary cathode maintains a predetermined value, and regardless of fluctuations in the resistance value of the electrolyte, Since a predetermined current flows through the position, an electrolytic plating layer of a predetermined thickness is formed at a predetermined position on the printed circuit board.
第１図は本発明の装置の一実施例の説明図である。 FIG. 1 is an explanatory diagram of one embodiment of the apparatus of the present invention.
口承するように、硫酸銅を含む電解液１を収容したメン
キ２には、銅板より成るアノード３が設置され、該アノ
ード３と電解メッキ処理を施すべきプリント基板４が、
所定の間隔を隔てて第４図に示した補助カソード５を間
に介在させた状態で対向配置されている。As is said orally, an anode 3 made of a copper plate is installed in a plate 2 containing an electrolytic solution 1 containing copper sulfate, and the anode 3 and a printed circuit board 4 to be subjected to electrolytic plating treatment are
They are placed facing each other at a predetermined distance with an auxiliary cathode 5 shown in FIG. 4 interposed therebetween.
また上記アノード３とプリント基板４の間、およびアノ
ード３に補助カソード５の間には、それぞれ別個の直流
の定電流電源ｌＬ１２が設置されている。Further, separate DC constant current power supplies LL12 are installed between the anode 3 and the printed circuit board 4 and between the anode 3 and the auxiliary cathode 5, respectively.
このようにすることで、気泡８によって前記電解液１を
攪拌し、該攪拌箇所の電解液の抵抗が変動しても、上記
アノード３とプリント基板４間、およびアノード３と補
助カソード５間には所定の電流が流れ、この両者を流れ
る電流比も一定であるため、補助カソード５形状や、表
面積を調節することで、プリント基板の所定位置に所定
の厚さの電解メッキ層が得られる。By doing this, even if the electrolytic solution 1 is stirred by the bubbles 8 and the resistance of the electrolytic solution at the stirring point changes, there will be no interference between the anode 3 and the printed circuit board 4 and between the anode 3 and the auxiliary cathode 5. A predetermined current flows through them, and the current ratio flowing between them is also constant. Therefore, by adjusting the shape and surface area of the auxiliary cathode 5, an electrolytic plating layer of a predetermined thickness can be obtained at a predetermined position on the printed circuit board.
第 １ 表 表に示す。Chapter 1 Table Shown in the table.
ここでメッキ厚のバラツキのデータは、メッキを施した
プリント基板の所定箇所を測定した値の平均値をＸとし
、その標準偏差３σとした時の３σ／Ｘの値で示す。Here, the data on the variation in plating thickness is expressed as a value of 3σ/X, where X is the average value of values measured at predetermined locations on a plated printed circuit board, and its standard deviation is 3σ.
上記の表より本発明の補助カソードを用いた場合は、補
助カソードを用いない場合に比して、メッキのバラツキ
が少なく成っていることが判る。From the table above, it can be seen that when the auxiliary cathode of the present invention is used, the variation in plating is smaller than when no auxiliary cathode is used.
このような装置に於いて、例えばプリント基板の面積を
１．８７ｄｍ” とし、補助カソードの面積を３゜２４
ｄｍ２とした場合、前記補助カソードを設けた場合と、
補助カソードを設けない場合に於いて、電解銅メッキ層
を形成した場合と電解ニンケルメッキ層を形成した場合
について実験した結果を第１〔発明の効果〕
以−ヒ説明したように、本発明によれば、プリント基板
とアノード間、および補助カソードとアノード間にそれ
ぞれ別個に定電流電源を設けているので、上記基板とア
ノード間、および補助カッドとアノード間の流れる電流
値が電解液の抵抗変動に関わらす一定で、またその電流
比も一定であるので、補助カソードの形状、その表面積
、印加電流値を調節することで、いかなる面積を有する
プリント基板でも均一なメッキ層が得られる効果がある
。In such a device, for example, the area of the printed circuit board is 1.87 dm" and the area of the auxiliary cathode is 3°24
dm2, a case where the auxiliary cathode is provided,
In the case where an auxiliary cathode is not provided, the results of experiments were conducted on the case where an electrolytic copper plating layer was formed and the case where an electrolytic nickel plating layer was formed. For example, separate constant current power supplies are provided between the printed circuit board and the anode, and between the auxiliary cathode and the anode, so that the current flowing between the board and the anode, and between the auxiliary cathode and the anode, depends on the resistance fluctuation of the electrolyte. Since the current ratio is also constant, by adjusting the shape of the auxiliary cathode, its surface area, and the applied current value, it is possible to obtain a uniform plating layer on a printed circuit board of any area.
第１図は本発明の装置の一実施例の説明図、第２図は従
来の装置の説明図、
第３図は従来の装置の説明図、
第４図は補助カソードの平面図とその断面図、図におい
て、
１は電解液、２はメッキ槽、３はアノード、４はプリン
ト基板（被メッキ処理物）、５は補助カソード、８は気
泡、１１．１２は定電流電源を示す。Fig. 1 is an explanatory diagram of an embodiment of the device of the present invention, Fig. 2 is an explanatory diagram of a conventional device, Fig. 3 is an explanatory diagram of a conventional device, and Fig. 4 is a plan view and a cross section of the auxiliary cathode. In the figures, 1 is an electrolytic solution, 2 is a plating tank, 3 is an anode, 4 is a printed circuit board (object to be plated), 5 is an auxiliary cathode, 8 is a bubble, and 11.12 is a constant current power source.
Claims (1)
き被メッキ処理物（４）とを、補助カソード（５）を介
在させた状態で対向配置し、前記アノード（３）と被メ
ッキ処理物（４）間、および前記アノード（３）と補助
カソード（５）間にそれぞれ別個の定電流電源（１１，
１２）を設けたことを特徴とするプリント基板の電解メ
ッキ装置。An anode (3) and an object to be plated (4) are placed facing each other in an electrolytic solution (1) with an auxiliary cathode (5) interposed therebetween. A separate constant current power source (11,
12) An electrolytic plating apparatus for printed circuit boards, characterized in that it is provided with:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4486389A JPH02222191A (en) | 1989-02-22 | 1989-02-22 | Electroplating device for printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4486389A JPH02222191A (en) | 1989-02-22 | 1989-02-22 | Electroplating device for printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02222191A true JPH02222191A (en) | 1990-09-04 |
Family
ID=12703331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4486389A Pending JPH02222191A (en) | 1989-02-22 | 1989-02-22 | Electroplating device for printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02222191A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0766535A (en) * | 1993-08-26 | 1995-03-10 | Nec Corp | Method and device for plating printed board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5827027U (en) * | 1981-08-14 | 1983-02-21 | 日産車体株式会社 | Sliding work setting device |
| JPS60187700A (en) * | 1984-03-07 | 1985-09-25 | Fujitsu Ltd | Power source system for plating |
-
1989
- 1989-02-22 JP JP4486389A patent/JPH02222191A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5827027U (en) * | 1981-08-14 | 1983-02-21 | 日産車体株式会社 | Sliding work setting device |
| JPS60187700A (en) * | 1984-03-07 | 1985-09-25 | Fujitsu Ltd | Power source system for plating |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0766535A (en) * | 1993-08-26 | 1995-03-10 | Nec Corp | Method and device for plating printed board |
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