JPH02219777A - Semiconductor receiving container - Google Patents

Semiconductor receiving container

Info

Publication number
JPH02219777A
JPH02219777A JP1038011A JP3801189A JPH02219777A JP H02219777 A JPH02219777 A JP H02219777A JP 1038011 A JP1038011 A JP 1038011A JP 3801189 A JP3801189 A JP 3801189A JP H02219777 A JPH02219777 A JP H02219777A
Authority
JP
Japan
Prior art keywords
frame
container
containers
semiconductor
stacked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1038011A
Other languages
Japanese (ja)
Inventor
Hiroshi Sekikawa
関川 博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1038011A priority Critical patent/JPH02219777A/en
Publication of JPH02219777A publication Critical patent/JPH02219777A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To permit common usage for two kinds of semiconductors different only in heights by providing a container with supporting recess parts for stacking on an outer peripheral frame shaped like picture frame in asymmetrical positions. CONSTITUTION:A semiconductor receiving container 1 is composed of plurality of semiconductor receiving recess parts 4 formed of a plurality of dividing walls 2 and an outer peripheral frame 3 shaped like picture frame. The frame 3 is provided with a plurality of supporting recess parts 5 for stacking formed in asymmetrical positions. In this structure, when the containers 1 are stacked in a regular direction, the height H1 of the receiving part 4 becomes equal to value H1 determined by the wall thickness (t) of the container and a slope alphaand, when stacked angularly 180 deg. from the direction, the height H2 of the receiving part 4 becomes equal to the forming position H2 of a supporting stepped part 51. The supporting stepped part 41 is so shaped as to overlap the shoulder 31 of the frame 3, thereby preventing the occurrence of shift between the containers when stacked.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体収納容器に関し、特にフラットパラゲー
ジ型半導体素子を収納する容器に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a semiconductor storage container, and more particularly to a container for storing a flat parallelage type semiconductor element.

〔従来の技術〕[Conventional technology]

従来、この種の容器は第5図に示すように半導体素子の
外形寸法に応じた凹状収納部4を設けた容器1及び蓋6
で構成された専用容器のものであり、製品の保護、精度
維持を図るのが一般的である。
Conventionally, this type of container has a container 1 and a lid 6 provided with a concave storage portion 4 corresponding to the external dimensions of the semiconductor element, as shown in FIG.
It is generally a special container made of

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

容器を専用化した場合、半導体素子の外形寸法の種類だ
け容器を用意することになるが、多品種少量生産で類似
形状の半導体素子を製造する場合、容器の製作費用が重
複するという欠点がある。この対策として、大径半導体
素子の容器を小径半導体素子のものに流用することも考
えられるが、容器と半導体素子の寸法余裕が大きくなり
、輸送時の振動、1!i1等で半導体素子の外形を損う
という欠点が生ずる。
If containers are specialized, containers will be prepared for each type of external dimension of the semiconductor element, but when manufacturing semiconductor elements of similar shapes in high-mix, low-volume production, the disadvantage is that the cost of manufacturing the containers will be duplicated. . As a countermeasure to this problem, it may be possible to use the container for large-diameter semiconductor devices for small-diameter semiconductor devices, but this increases the dimensional margin between the container and the semiconductor device, and reduces vibration during transportation. A drawback arises that the external shape of the semiconductor element is damaged due to i1 and the like.

本発明の目的は類似形状の半導体の中で特に高さ寸法の
み異なる2種類の半導水に対し共用可能な容器を提供す
ることにある。
An object of the present invention is to provide a container that can be used commonly for two types of semiconducting water that differ only in height among semiconductors having similar shapes.

〔課題を解決するための手段〕[Means to solve the problem]

前記目的を達成するため、本発明に係る半導体収納容器
は半導体素子を収納する凹部を格子状に配列した容器本
体の最外周部の枠部を額縁状とし、該額縁状枠部に容器
の積重ね支持用凹部を非対称な位置に設けたものである
In order to achieve the above object, the semiconductor storage container according to the present invention has a container body in which concave portions for storing semiconductor elements are arranged in a grid pattern, and a frame portion at the outermost periphery of the container body is shaped like a frame, and containers are stacked on the frame-shaped frame portion. The support recesses are provided at asymmetric positions.

〔実施例〕〔Example〕

次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第1図は一実施例を示す斜視図である。FIG. 1 is a perspective view showing one embodiment.

図において、半導体収納容器1は複数の仕切枠2及び最
外周の額縁状枠3で凹状の半導体収納部4を構成する。
In the figure, a semiconductor storage container 1 constitutes a concave semiconductor storage section 4 with a plurality of partition frames 2 and a frame-shaped frame 3 at the outermost periphery.

額縁状枠3には互に非対称な位置に積重ね支持部5が複
数個所凹型に形成されている。第3図は容器1を順方向
に積重ねた場合の断面図を示す、第2図に示すように収
納部4の高さHlは容器の板厚を及び勾配αで定まる値
H1と同一である。また第4図は容器1を互に180°
回転した方向に積重ねた場合を示し、収納部4の高さH
2は第2図で示す支持段部51の形成位置H2に相当す
る。支持段部51は額縁状枠の肩31に重なるように設
けられており、積重ね時のズレ防止を兼ねている。
A plurality of concave stacking support portions 5 are formed in the frame-like frame 3 at asymmetrical positions. FIG. 3 shows a cross-sectional view when the containers 1 are stacked in the forward direction. As shown in FIG. 2, the height Hl of the storage section 4 is the same as the value H1 determined by the thickness of the container and the slope α. . In addition, Figure 4 shows containers 1 at 180° to each other.
This shows the case where they are stacked in the rotated direction, and the height H of the storage section 4 is
2 corresponds to the formation position H2 of the support step portion 51 shown in FIG. The support stepped portion 51 is provided so as to overlap the shoulder 31 of the picture frame, and also serves to prevent displacement during stacking.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は直交する複数の仕切枠及び
最外周の額縁状枠で構成された凹部を有する半導体収納
容器において、額縁状枠に互に非対称となる位置へ容器
の積重ね支持部を設けることにより、容器と順方向又は
180°回転方向に積重ねたとき、各々異なる収納空間
を得ることができる。これは高さ寸法のみ異なる2種類
の半導体を同一収納容器で収納可能であることを示し、
収納容器の種類削減、投資抑制の効果がある。
As explained above, the present invention provides a semiconductor storage container having a concave portion constituted by a plurality of orthogonal partition frames and a frame-shaped frame on the outermost periphery, and in which the stacking support portion of the container is positioned asymmetrically with respect to the frame-shaped frame. By providing the containers, different storage spaces can be obtained when the containers are stacked in the forward direction or in the 180° rotation direction. This shows that two types of semiconductors that differ only in height can be stored in the same storage container.
This has the effect of reducing the types of storage containers and reducing investment.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の半導体収納容器の一実施例を示す斜視
図、第2図は積重ね支持部の断面図、第3図及び第4図
は半導体収納容器をそれぞれ順方向、180°回転方向
で積重ねた状態を示す断面図、第5図は従来例を示す半
導体収納容器の断面図である。 1・・・半導体収納容器  2・・・仕切枠3・・・額
縁状枠     4・・・半導体収納部5・・・容器の
積重ね支持部 6・・・容器の蓋31・・・額縁状枠の肩51・・・積
重ね支持段部 Hl、H2・・・半導体収納部高さ t・・・容器の板厚    α・・・勾配第1図 第2図 第3図 第5図
FIG. 1 is a perspective view showing one embodiment of the semiconductor storage container of the present invention, FIG. 2 is a sectional view of the stacking support part, and FIGS. 3 and 4 show the semiconductor storage container in the forward direction and in the 180° rotation direction, respectively. FIG. 5 is a sectional view of a conventional semiconductor storage container. 1... Semiconductor storage container 2... Partition frame 3... Picture frame-shaped frame 4... Semiconductor storage section 5... Container stacking support section 6... Container lid 31... Picture frame-shaped frame Shoulder 51...Stacking support steps Hl, H2...Semiconductor housing height t...Thickness of container α...Gradient Fig. 1 Fig. 2 Fig. 3 Fig. 5

Claims (1)

【特許請求の範囲】[Claims] (1)半導体素子を収納する凹部を格子状に配列した容
器本体の最外周部の枠部を額縁状とし、該額縁状枠部に
容器の積重ね支持用凹部を非対称な位置に設けたことを
特徴とする半導体収納容器。
(1) The frame at the outermost periphery of the container body in which recesses for storing semiconductor devices are arranged in a grid pattern is shaped like a frame, and the recesses for supporting stacking of containers are provided at asymmetrical positions in the frame-like frame. Features: Semiconductor storage container.
JP1038011A 1989-02-17 1989-02-17 Semiconductor receiving container Pending JPH02219777A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1038011A JPH02219777A (en) 1989-02-17 1989-02-17 Semiconductor receiving container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1038011A JPH02219777A (en) 1989-02-17 1989-02-17 Semiconductor receiving container

Publications (1)

Publication Number Publication Date
JPH02219777A true JPH02219777A (en) 1990-09-03

Family

ID=12513638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1038011A Pending JPH02219777A (en) 1989-02-17 1989-02-17 Semiconductor receiving container

Country Status (1)

Country Link
JP (1) JPH02219777A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002002695A (en) * 2000-06-15 2002-01-09 Kyocera Corp Substrate storage tray and substrate packaging body using the same
CN102553874A (en) * 2012-02-23 2012-07-11 高佳太阳能股份有限公司 Transfer box for cleaning of silicon wafers
JP2019147587A (en) * 2018-02-27 2019-09-05 三甲株式会社 Lid body

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002002695A (en) * 2000-06-15 2002-01-09 Kyocera Corp Substrate storage tray and substrate packaging body using the same
CN102553874A (en) * 2012-02-23 2012-07-11 高佳太阳能股份有限公司 Transfer box for cleaning of silicon wafers
JP2019147587A (en) * 2018-02-27 2019-09-05 三甲株式会社 Lid body

Similar Documents

Publication Publication Date Title
KR100390324B1 (en) Tray for semiconductor integrated circuit device
US3771646A (en) Shipping holder for spark plugs or the like
JPH11157595A (en) Packaging structure for liquid crystal panel module
JPH02219777A (en) Semiconductor receiving container
JPS6196741A (en) Lead frame housing container
CN217893614U (en) Sensor packing box
KR200250919Y1 (en) Structure to support photomask in photomask keeping box
KR200157451Y1 (en) Tray for storing semiconductor chip
JP4591679B2 (en) Semiconductor chip storage tray, semiconductor chip storage method, and semiconductor chip carrier
JPH10273145A (en) Semiconductor device-storing container
JP2606760Y2 (en) Glass substrate storage tools
JP6855984B2 (en) Optical element trays and packaging containers
JP3013842B1 (en) Tray for semiconductor device and method for holding semiconductor device
JPH11220015A (en) Tray for semiconductor device chip and method for storing and conveying semiconductor device chip
JPH0964584A (en) Containing tray
JPH0617301Y2 (en) Waha cassette
JP2003221036A (en) Dunnage system
JPS62202555A (en) Semiconductor memory device
JPH0245381A (en) Packaging container for semiconductor device
JPH0853077A (en) Spare tire accommodation device
JPH0648511A (en) Printed circuit board storage box
JP2023084156A (en) container
JPH05254584A (en) Storage container for semiconductor device
JPS637079Y2 (en)
JP3299578B2 (en) Transport container