JPH02218711A - Aromatic polyamide oligomer having thermal unsaturated group and production thereof - Google Patents
Aromatic polyamide oligomer having thermal unsaturated group and production thereofInfo
- Publication number
- JPH02218711A JPH02218711A JP3951889A JP3951889A JPH02218711A JP H02218711 A JPH02218711 A JP H02218711A JP 3951889 A JP3951889 A JP 3951889A JP 3951889 A JP3951889 A JP 3951889A JP H02218711 A JPH02218711 A JP H02218711A
- Authority
- JP
- Japan
- Prior art keywords
- aromatic
- unsaturated group
- aromatic polyamide
- polyamide oligomer
- oligomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004760 aramid Substances 0.000 title claims abstract description 30
- 229920003235 aromatic polyamide Polymers 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 125000003118 aryl group Chemical group 0.000 claims abstract description 10
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims abstract description 7
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 6
- 150000004984 aromatic diamines Chemical class 0.000 claims abstract description 6
- 229910000039 hydrogen halide Inorganic materials 0.000 claims abstract description 4
- 239000012433 hydrogen halide Substances 0.000 claims abstract description 4
- 125000000217 alkyl group Chemical group 0.000 claims abstract 2
- 239000000126 substance Substances 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- VVJKKWFAADXIJK-UHFFFAOYSA-N Allylamine Chemical compound NCC=C VVJKKWFAADXIJK-UHFFFAOYSA-N 0.000 abstract description 10
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 5
- FDQSRULYDNDXQB-UHFFFAOYSA-N benzene-1,3-dicarbonyl chloride Chemical compound ClC(=O)C1=CC=CC(C(Cl)=O)=C1 FDQSRULYDNDXQB-UHFFFAOYSA-N 0.000 abstract description 4
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 abstract description 2
- 239000002994 raw material Substances 0.000 abstract description 2
- 230000001588 bifunctional effect Effects 0.000 abstract 1
- 229940018564 m-phenylenediamine Drugs 0.000 abstract 1
- 239000000057 synthetic resin Substances 0.000 description 7
- 229920003002 synthetic resin Polymers 0.000 description 7
- 239000004952 Polyamide Substances 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 229920002647 polyamide Polymers 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- -1 polyparaphenylene terephthalamide Polymers 0.000 description 4
- 229920001169 thermoplastic Polymers 0.000 description 4
- 239000004416 thermosoftening plastic Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000000862 absorption spectrum Methods 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000011541 reaction mixture Substances 0.000 description 3
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- FYXKZNLBZKRYSS-UHFFFAOYSA-N benzene-1,2-dicarbonyl chloride Chemical compound ClC(=O)C1=CC=CC=C1C(Cl)=O FYXKZNLBZKRYSS-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000012770 industrial material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 2
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical compound C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 238000012696 Interfacial polycondensation Methods 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- 229920000784 Nomex Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000008346 aqueous phase Substances 0.000 description 1
- 238000009412 basement excavation Methods 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- IOXXVNYDGIXMIP-UHFFFAOYSA-N n-methylprop-2-en-1-amine Chemical compound CNCC=C IOXXVNYDGIXMIP-UHFFFAOYSA-N 0.000 description 1
- DYUWTXWIYMHBQS-UHFFFAOYSA-N n-prop-2-enylprop-2-en-1-amine Chemical compound C=CCNCC=C DYUWTXWIYMHBQS-UHFFFAOYSA-N 0.000 description 1
- 239000004763 nomex Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Landscapes
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Polyamides (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
【発明の詳細な説明】
[σ業上の利用分野]
本発°明は耐熱性合成樹脂、特に熱硬化性をイ・1すし
た耐熱性芳香族ポリアミドとして有用なオリゴマー及び
その製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of use in the industry] The present invention relates to an oligomer useful as a heat-resistant synthetic resin, particularly a heat-resistant aromatic polyamide with improved thermosetting properties, and a method for producing the same.
[従来の技術]
プラスチック工業の需要が高度化するにつれて、特殊な
性質を持つ工業素材が必要とされるようになり、この傾
向は産業部門の高度化と相まって急速に展開しつつある
。[Prior Art] As the demands of the plastics industry become more sophisticated, industrial materials with special properties are required, and this trend is rapidly developing as the industrial sector becomes more sophisticated.
耐熱性向上の要求は、プラスチック、フィルム、繊維、
ラミネート、積層板、接着剤等耐熱性を要求される分野
の工業材料に耐熱性を付与し、市場を拡大すること及び
新しい機能をもって広iな新しい分野への進出を計るた
めでもある。The demand for improved heat resistance is felt in plastics, films, fibers,
The aim is to add heat resistance to industrial materials used in fields that require heat resistance, such as laminates, laminates, and adhesives, to expand the market, and to expand into broad new fields with new functions.
このような要求に対し、芳香族ポリアミド、ポリイミド
、ポリスルホン、ポリフェニレンオキサイド等エンジニ
ャリングプラスチックスと呼ばれる一群の合成樹脂が既
に開発され、従来の合成樹脂とは異なった新規な機能を
有するプラスチックとして工業生産され、新しい需要分
野を開拓しつつあり、アラミドの名称で知られている芳
香族ポリアミドはその中の一つである。In response to these demands, a group of synthetic resins called engineering plastics, such as aromatic polyamides, polyimides, polysulfones, and polyphenylene oxides, have already been developed and are now being industrialized as plastics with new functions different from conventional synthetic resins. Aromatic polyamides, known under the name aramid, are one of them, and are now being produced and opening up new areas of demand.
芳香族ポリアミドとしては、デュ・ボン社で開発された
ポリパラフェニレンテレフタルアミド(商品名・ケブラ
ー)、ポリメタフェニレンイソフタルアミド(商品名:
ノーメックス又はHT −1)はその代表的なタイプで
ある。Examples of aromatic polyamides include polyparaphenylene terephthalamide (product name: Kevlar) and polymetaphenylene isophthalamide (product name:
Nomex or HT-1) is a typical type.
これらのポリアミド類は、そのすべてが熱可塑性合成樹
脂に分(nされるもので、オリゴマーを熱硬化させるタ
イプのポリアミド類は未だ見出されていなか−)だ。All of these polyamides are classified as thermoplastic synthetic resins, and polyamides that thermoset oligomers have not yet been found.
このため1通常の熱可塑性合成樹脂に比して高融点を有
するとは言え、温度の上昇に伴い、硬度、強度等の低下
は避けられず、軟化点以上での使用は事実上不可能であ
った。For this reason, 1. Although it has a higher melting point than ordinary thermoplastic synthetic resins, as the temperature rises, hardness, strength, etc. inevitably decrease, and it is virtually impossible to use it above the softening point. there were.
熱硬化性の芳香族ポリアミドがなかった理由としては、
−射的に融点が従来の熱可塑性合成樹脂に比して充分高
かったこと、また不飽和結合の導入は成形工程中に好ま
しからざるゲル化を惹起する危険が多いと判断されてい
たためと考える。The reason why there was no thermosetting aromatic polyamide was as follows.
- This is thought to be because the melting point of the thermoplastic synthetic resin was sufficiently higher than that of conventional thermoplastic synthetic resins, and the introduction of unsaturated bonds was considered to have a high risk of causing undesirable gelation during the molding process.
[発明が解決しようとする課題]
芳香族ポリアミドは、かなりの高温においても比較的安
定であり、電気特性、機械的強度も優れており、化学的
安定性も高く優れた耐熱性高分子である。[Problem to be solved by the invention] Aromatic polyamide is an excellent heat-resistant polymer that is relatively stable even at considerably high temperatures, has excellent electrical properties and mechanical strength, and has high chemical stability. .
本発明はこれらの性質を失わずに、更に高温における機
械的強度、化学的安定性を高めることを目的としたもの
である。The present invention aims to further improve mechanical strength and chemical stability at high temperatures without losing these properties.
[課題を解決するための手段]
本発明者らは成形材料として、あるいは積層板として成
形加工する場合に、比較的融点が低く、加熱、加圧下で
所望の形状に成形可能であり、しかも比較的緩和な条件
で硬化でき、硬化後充分な耐熱性、機械的強度および化
学的安定性等を何する芳香族ポリアミドを得るために、
芳香族ジアミン、末端不飽和基を有する脂肪族モノアミ
ン及び芳香族ジカルボン酸ジハライドをハロゲン化水(
;受容体の存在下で反応させて、一般式
で表わされる末端不飽和基を有する不飽和ポリアミドオ
リゴマーを書、このものはラジカル発生触媒の(r在下
で硬化可能であり、この硬化した芳香族ポリアミドは前
記の優れた性質を有することを見出し、本発明を完成す
るに至った。[Means for Solving the Problems] The present inventors found that when molding the material as a molding material or as a laminate, it has a relatively low melting point and can be molded into a desired shape under heat and pressure. In order to obtain an aromatic polyamide that can be cured under moderate conditions and has sufficient heat resistance, mechanical strength, chemical stability, etc. after curing,
Aromatic diamines, aliphatic monoamines with terminal unsaturated groups, and aromatic dicarboxylic acid dihalides are mixed with halogenated water (
is reacted in the presence of a receptor to form an unsaturated polyamide oligomer having a terminal unsaturated group represented by the general formula, which can be cured in the presence of a radical generating catalyst ( It was discovered that polyamide has the above-mentioned excellent properties, and the present invention was completed.
本発明の末端不飽和基を有する芳香族ポリアミドオリゴ
マーは、−例として次の反応式によって示すことができ
る。The aromatic polyamide oligomer having a terminal unsaturated group according to the present invention can be illustrated by the following reaction formula.
(以下余白)
(77香族ジカルボン酸ジハライド)
■
(芳香族ポリアミドオリゴマー)
反応を円滑に進行させるために、削土ずる塩化水素の受
容体が必愛であって、−射的には第3級アミン又は苛性
アルカリの使用が便利である。(Left below) (77 Aromatic dicarboxylic acid dihalide) ■ (Aromatic polyamide oligomer) In order for the reaction to proceed smoothly, a receptor for hydrogen chloride during excavation is essential. It is convenient to use grade amines or caustic.
この場合のnは1から15、好ましくは3ないし7程度
の値が成形性の容易さから有利であり、この段階での高
分子化は特に必要でない、この反応は一般にアミンKn
を水相に、酸クロライドを水に溶解しない不活性有機溶
媒に混合して、界面重縮合反応を行なうか、あるいは両
者を不活性有機溶媒に溶解し、低温で縮合させる低温温
液重縮合反応により行なうことができる。In this case, a value of n from 1 to 15, preferably from 3 to 7, is advantageous from the viewpoint of ease of moldability, and polymerization at this stage is not particularly necessary.
into the aqueous phase and acid chloride into an inert organic solvent that does not dissolve in water to perform an interfacial polycondensation reaction, or dissolve both in an inert organic solvent and condense at a low temperature to perform a low-temperature liquid polycondensation reaction. This can be done by
本発明に使用できる芳香族ジアミンとしては。Aromatic diamines that can be used in the present invention include:
例えばメタフェニレンジアミン、4.4’/3.373
.4’−ジアミノジフェニルメタン、4.4°−ジアミ
ノジフェニルプロパン、 3.3’−ジメチル−4,4
゛−ジアミノジフェニルメタン、4,4°−ジアミノジ
フェニルエーテル、3.4′−ジアミノジフェニルエー
テル、3.3′−ジアミノジフェニルスルホン、4.4
’−ジアミノジフェニルスルホン、ジアニシジン、2.
4−トルイレンジアミン、2.4/2.6−1−ルイレ
ンジアミン混合物などが利用可能であり、二種類又はそ
れ以上の混合使用も可能である。For example, metaphenylenediamine, 4.4'/3.373
.. 4'-diaminodiphenylmethane, 4.4°-diaminodiphenylpropane, 3.3'-dimethyl-4,4
゛-Diaminodiphenylmethane, 4,4°-diaminodiphenyl ether, 3.4'-diaminodiphenyl ether, 3.3'-diaminodiphenyl sulfone, 4.4
'-diaminodiphenylsulfone, dianisidine, 2.
4-toluylene diamine, a 2.4/2.6-1-ylene diamine mixture, etc. can be used, and two or more types can also be used as a mixture.
末端不飽和基を有する脂肪族モノアミンとじては、アリ
ルアミン、ジアリルアミン、メタアリルアミン、アリル
メチルアミン、l−アミノ−4−ペンテンなどが挙げら
れるが、末端不飽和ポリアミドオリゴマーを低温で合成
可能なこと、生成ポリアミドオリゴマーの安定性、入手
性、価格等の点がらアリルアミンが最も庁通に用いられ
る。なお、このアミンは遊離のアミンであっても、また
ハロゲン化水素酸塩であっても良いが、ハロゲン化水素
酸塩の場合は同時にハロゲン化水素と結合する第3級ア
ミン等の併用が必要となる。Examples of aliphatic monoamines having a terminal unsaturated group include allylamine, diallylamine, methalylamine, allylmethylamine, l-amino-4-pentene, etc., and the ability to synthesize terminally unsaturated polyamide oligomers at low temperatures; Allylamine is most commonly used in terms of stability, availability, price, etc. of the polyamide oligomer produced. Note that this amine may be a free amine or a hydrohalide salt, but in the case of a hydrohalide salt, it is necessary to use a tertiary amine or the like that binds to the hydrogen halide at the same time. becomes.
以下、末端不飽和基を有する脂肪族アミンはアリルアミ
ンをもって代表させて説明する。Hereinafter, the aliphatic amine having a terminal unsaturated group will be explained using allylamine as a representative.
また1本発明に使用できる芳香族ジカルボン酸ジハライ
ドとしては、芳香族二塩基酸のジクロライドが便利であ
り、例えばテレフタル酸ジクロライド、イソフタル酸ジ
クロライド、フタル酸ジクロライドなどが代表的である
。Further, as the aromatic dicarboxylic acid dihalide that can be used in the present invention, dichlorides of aromatic dibasic acids are convenient, and representative examples thereof include terephthalic acid dichloride, isophthalic acid dichloride, and phthalic acid dichloride.
実用性から言えば、フタル酸ジクロライドは生成芳香族
ポリアミドの耐熱性が不充分であり、テレフタル酸ジク
ロライドを使用するときは耐熱性は充分であるが、(り
られる芳香族ポリアミドの融点が高くなって取板性が困
難になる傾向があり、イソフタル酸ジクロライドが最も
良く本発明の目的に合致する。From a practical point of view, phthalic acid dichloride produces aromatic polyamides with insufficient heat resistance, and when terephthalic acid dichloride is used, the heat resistance is sufficient, but (the melting point of the resulting aromatic polyamide is high). Therefore, isophthalic acid dichloride best meets the purpose of the present invention.
この合成反応は比較的に化学量論的に反応は進17する
ので、前記[I ]式のrlを計算した」二、必要量の
脂肪族モノアミン、芳香族ジアミンおよび芳香族ジカル
ボン酸ジハライドを反応させればよく、もし精密な調整
を必要とするときは部用なテストによりそのモル比は決
定できるに
の反応によって得られる芳香族ポリアミビオlゴマ−は
既に説明した如く、その組成を容易に選ぶことができ、
200℃以下の温度で成形可能である。Since this synthesis reaction proceeds relatively stoichiometrically, rl in the above formula [I] was calculated.2. Required amounts of aliphatic monoamine, aromatic diamine, and aromatic dicarboxylic acid dihalide were reacted. If precise adjustment is required, the molar ratio can be determined by repeated tests. It is possible,
It can be molded at temperatures below 200°C.
本発明により合成された不飽和末端基を有する芳香族ポ
リアミドオリゴマーは、ラジカル発生触媒の併用により
硬化させることができ、耐熱性を格段に向上させること
が可能となる。The aromatic polyamide oligomer having unsaturated end groups synthesized according to the present invention can be cured in combination with a radical generating catalyst, making it possible to significantly improve heat resistance.
ラジカル発生触媒は制限を加える必要はないが、工文的
にはバーオヤサイドタイプが適しており、成形温度が1
00℃以上になる場合はいわゆる高温分解型の、例えば
ジクミルパーオキサイドタイプが用いられる。There is no need to limit the radical generation catalyst, but from an engineering point of view, the bar oyaside type is suitable, and the molding temperature is 1.
When the temperature is 00° C. or higher, a so-called high-temperature decomposition type, for example a dicumyl peroxide type, is used.
使用看は1〜3phrが適当である。The appropriate dosage is 1 to 3 phr.
また、不飽和結合と共重合可能な千ツマ−の併用は、モ
ノマーが芳香族ポリアミドオリゴマーを溶解する場合に
可能であり、特に前記[I1式中のnが小さい値の場合
その適用範囲が広い、モノマーの併用は、縮合系全体の
軟化を促進し、成形性、作業性を良好にする反面、硬化
した芳香族ポリアミドの耐熱性を低下さゼる傾向がある
ので、目的に応じた添加1とすることが必要である。In addition, the combined use of an unsaturated bond and a copolymerizable monomer is possible when the monomer dissolves an aromatic polyamide oligomer, and the range of application is particularly wide when n in formula I1 is small. Although the combined use of monomers promotes the softening of the entire condensation system and improves moldability and workability, it tends to reduce the heat resistance of the cured aromatic polyamide. It is necessary to do so.
本発明による不飽和末端基塙をイイする芳香族ポリアミ
ドオリゴマーは、補強剤、フィラー、+1t=q剤、着
色剤、低収縮剤としての他のポリマー等を必要に応じ併
用できることはもちろんである。It goes without saying that the aromatic polyamide oligomer having unsaturated terminal groups according to the present invention can be used in combination with reinforcing agents, fillers, +1t=q agents, colorants, other polymers as low-shrinkage agents, etc., as necessary.
次に本発明の理解を助けるために、以下に実施例を示す
。Next, examples will be shown below to help understand the present invention.
[実施例]
(実施例1)
還流冷却器、滴下濾斗、温度計、撹拌機を備えた1βの
四ツ口のセパラブルフラスコにイソフタル酸ジクロライ
ド20.3g (0,1モル)、ジメチルフォルムアミ
ド(DMF)100gを仕込み、10℃以下に冷却する
。[Example] (Example 1) 20.3 g (0.1 mol) of isophthalic acid dichloride and dimethylform were placed in a 1β four-neck separable flask equipped with a reflux condenser, dropping funnel, thermometer, and stirrer. Charge 100 g of amide (DMF) and cool to below 10°C.
次にメクフエニレンジアミン8.1g(0゜075モル
)、トリエチルアミン15.15g(0,[5モル)、
DMF75gを秤fil R合!、 。Next, 8.1 g (0°075 mol) of mekufuenylenediamine, 15.15 g (0.075 mol) of triethylamine,
Weigh 75g of DMF fil R! , .
セパラブルフラスコに滴下する。続いてアリルアミン2
.85g (0,05モル)、トリエチルアミン5.0
5g(0,05モル)、DMF25gを秤量混合し、セ
パラブルフラスコに滴下する。Pour into a separable flask. Next, allylamine 2
.. 85g (0.05 mol), triethylamine 5.0
5 g (0.05 mol) and 25 g of DMF were weighed and mixed and added dropwise to a separable flask.
その間、反応混合物の温度は10℃以下に保つ。During this time, the temperature of the reaction mixture is kept below 10°C.
滴下終了後、反応混合物の温度を10℃以下に保ち、2
hr、撹拌を#1続する。After the dropwise addition was completed, the temperature of the reaction mixture was kept below 10°C, and
hr, continue stirring #1.
次に激しく撹拌している大量の水中に反応混合物を徐々
に加え、結晶を析出させる。析出した結晶を吸引濾過し
、水で洗浄後乾燥する。The reaction mixture is then gradually added to a large amount of water with vigorous stirring to precipitate crystals. The precipitated crystals are suction filtered, washed with water, and then dried.
m、p、260℃以上、このものの赤外吸収スペクトル
を図1に示す。m, p, 260° C. or higher, the infrared absorption spectrum of this product is shown in FIG.
元素分析値は。What is the elemental analysis value?
C,70,:12%、 [1,4,67%、 N、 1
1.67%で理論値は。C, 70,: 12%, [1, 4, 67%, N, 1
The theoretical value is 1.67%.
C,70,15%、 H、4,8t1%、 N、 11
.69%と良好な一値を示した。C, 70, 15%, H, 4, 8t1%, N, 11
.. It showed a good value of 69%.
(実施例2〜8)
一般式11.N−R−NH!で表わした芳香族ジアミン
化合物のRの[i’l及びnを変えた以外は実施例Iと
同じ操作で不飽和末端基を有する芳香族ポリアミドオリ
ゴマーの合成を行なった。(Examples 2 to 8) General formula 11. N-R-NH! An aromatic polyamide oligomer having an unsaturated terminal group was synthesized by the same procedure as in Example I except that [i'l and n of R of the aromatic diamine compound represented by were changed.
第2表:を酸物
合成した不飽和末端基を有する芳香族ポリアミドオリゴ
マーの鴫、p、及び元素分析値は次に示す表の通りであ
る。また、それらの赤外線吸収スペクトルを実施例番号
に対応して図2〜8に示す。Table 2: The aromatic polyamide oligomer having an unsaturated end group synthesized with an acid compound has the following table. Moreover, those infrared absorption spectra are shown in FIGS. 2 to 8 in correspondence with the example numbers.
(参考例)
実施例7で(また芳香族ポリアミドオリゴマー1ffl
m部、ジクミルパーオキサイド(2%アセトン溶液)
lffi量部を試験管に加え、徐々に界温し。(Reference example) In Example 7 (also aromatic polyamide oligomer 1ffl
m parts, dicumyl peroxide (2% acetone solution)
Add a portion of lffi to a test tube and gradually warm to ambient temperature.
アセトンを飛ばし、乾燥した0次に200℃に界温し、
7時間硬化を行なったところ、琥珀色をした丈夫な不溶
不融の塊状の重合体が得られた。得られた重合体を乳鉢
で粉砕して、空気中でIO℃/分の界温速度で熱重量分
析を行なったところ、350℃までは全く変化が起こら
ず、450℃において8%程度の重量損失が認められた
。Remove the acetone, dry and heat to 200℃,
After curing for 7 hours, an amber-colored, durable, insoluble and infusible bulk polymer was obtained. When the obtained polymer was crushed in a mortar and thermogravimetrically analyzed in air at a boundary temperature rate of IO℃/min, no change occurred at all up to 350℃, and at 450℃ the weight decreased by about 8%. The loss was recognized.
[効 果]
従来の芳香族ポリアミドは熱可塑性樹脂であったため、
耐薬品性、電気的特性などに優れた性質を備えていたに
もかかわらず、高温における強度が著しく低下して使用
分野に制限を受けていた。[Effects] Conventional aromatic polyamides were thermoplastic resins, so
Although it had excellent properties such as chemical resistance and electrical properties, its strength at high temperatures decreased significantly, limiting its field of use.
本発明はこれらの欠点を改良し、同じ芳香族ボJアミド
でありながら加工性の優れた熱硬化性の芳香族ポリアミ
ドの原料として使用可能な新規な末端不飽和基を有する
芳香族ポリアミドオリゴマーを開発することに成功した
。The present invention improves these drawbacks and creates an aromatic polyamide oligomer having a novel terminal unsaturated group that can be used as a raw material for thermosetting aromatic polyamide with excellent processability, although it is the same aromatic polyamide. succeeded in developing it.
このオリゴマーは低温で合成でき、また重合可能な二重
結合を有するにもかかわらず、比較的安定であって成形
工程中でのゲル化もなく且つラジカル発生触媒の作用に
より簡単に硬化できる優れた性質を有するものである。This oligomer can be synthesized at low temperatures, and although it has a polymerizable double bond, it is relatively stable, does not gel during the molding process, and can be easily cured by the action of a radical-generating catalyst. It is something that has properties.
このオリゴマーを硬化した芳香族ポリアミドは、高温で
あっても強度の低下を起こさない耐熱性に優れた芳香族
ポリアミドである。The aromatic polyamide obtained by curing this oligomer is an aromatic polyamide with excellent heat resistance that does not cause a decrease in strength even at high temperatures.
図1〜8は本発明の実施例1〜8で得られた芳香族ポリ
アミドオリゴマー
の実施例番号に対応した赤外線吸収スペクトル図である
。
三ト続ネ1書l正書
平成元年3月30日1 to 8 are infrared absorption spectra diagrams corresponding to the example numbers of the aromatic polyamide oligomers obtained in Examples 1 to 8 of the present invention. Santo Tsunen Book 1 I Orthographic version March 30, 1989
Claims (2)
素原子又は低級アルキル基、R_1、R_2は2価の芳
香族基、nは1〜15の任意の数値である。〕 で表わされる末端不飽和基を有する芳香族ポリアミドオ
リゴマー。(1) General formula ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ [However, in the formula, A is a radically polymerizable unsaturated group, R is a hydrogen atom or a lower alkyl group, R_1 and R_2 are divalent aromatic groups, n is any numerical value from 1 to 15. ] An aromatic polyamide oligomer having a terminal unsaturated group represented by:
ノアミン及び芳香族ジカルボン酸ジハライドをハロゲン
化水素受容体の存在下で反応することよりなる末端不飽
和基を有する芳香族ポリアミドオリゴマーの製造方法。(2) A method for producing an aromatic polyamide oligomer having a terminal unsaturated group, which comprises reacting an aromatic diamine, an aliphatic monoamine having a terminal unsaturated group, and an aromatic dicarboxylic acid dihalide in the presence of a hydrogen halide acceptor. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1039518A JPH0725880B2 (en) | 1989-02-20 | 1989-02-20 | Aromatic polyamide oligomer having terminal unsaturated group and method for producing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1039518A JPH0725880B2 (en) | 1989-02-20 | 1989-02-20 | Aromatic polyamide oligomer having terminal unsaturated group and method for producing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02218711A true JPH02218711A (en) | 1990-08-31 |
JPH0725880B2 JPH0725880B2 (en) | 1995-03-22 |
Family
ID=12555264
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JP1039518A Expired - Lifetime JPH0725880B2 (en) | 1989-02-20 | 1989-02-20 | Aromatic polyamide oligomer having terminal unsaturated group and method for producing the same |
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Country | Link |
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JP (1) | JPH0725880B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003087193A1 (en) * | 2002-04-18 | 2003-10-23 | Basf Aktiengesellschaft | Inherently cross-linkable polyamides |
CN109942810A (en) * | 2019-04-18 | 2019-06-28 | 四川大学 | A kind of heteroaromatic polyamide laminated film and preparation method with high breakdown strength |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS649967A (en) * | 1987-06-12 | 1989-01-13 | Boeing Co | Polyamide oligomer and manufacture |
-
1989
- 1989-02-20 JP JP1039518A patent/JPH0725880B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS649967A (en) * | 1987-06-12 | 1989-01-13 | Boeing Co | Polyamide oligomer and manufacture |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003087193A1 (en) * | 2002-04-18 | 2003-10-23 | Basf Aktiengesellschaft | Inherently cross-linkable polyamides |
CN109942810A (en) * | 2019-04-18 | 2019-06-28 | 四川大学 | A kind of heteroaromatic polyamide laminated film and preparation method with high breakdown strength |
Also Published As
Publication number | Publication date |
---|---|
JPH0725880B2 (en) | 1995-03-22 |
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