JPH0221755U - - Google Patents
Info
- Publication number
- JPH0221755U JPH0221755U JP10050688U JP10050688U JPH0221755U JP H0221755 U JPH0221755 U JP H0221755U JP 10050688 U JP10050688 U JP 10050688U JP 10050688 U JP10050688 U JP 10050688U JP H0221755 U JPH0221755 U JP H0221755U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- external lead
- discernible
- protrusion
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10050688U JPH0221755U (en18) | 1988-07-28 | 1988-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10050688U JPH0221755U (en18) | 1988-07-28 | 1988-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221755U true JPH0221755U (en18) | 1990-02-14 |
Family
ID=31328641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10050688U Pending JPH0221755U (en18) | 1988-07-28 | 1988-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221755U (en18) |
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1988
- 1988-07-28 JP JP10050688U patent/JPH0221755U/ja active Pending