JPH0221752U - - Google Patents
Info
- Publication number
- JPH0221752U JPH0221752U JP10094588U JP10094588U JPH0221752U JP H0221752 U JPH0221752 U JP H0221752U JP 10094588 U JP10094588 U JP 10094588U JP 10094588 U JP10094588 U JP 10094588U JP H0221752 U JPH0221752 U JP H0221752U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor device
- view
- output side
- input side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10094588U JPH0221752U (bs) | 1988-07-28 | 1988-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10094588U JPH0221752U (bs) | 1988-07-28 | 1988-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221752U true JPH0221752U (bs) | 1990-02-14 |
Family
ID=31329486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10094588U Pending JPH0221752U (bs) | 1988-07-28 | 1988-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221752U (bs) |
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1988
- 1988-07-28 JP JP10094588U patent/JPH0221752U/ja active Pending