JPH0221728U - - Google Patents

Info

Publication number
JPH0221728U
JPH0221728U JP10074088U JP10074088U JPH0221728U JP H0221728 U JPH0221728 U JP H0221728U JP 10074088 U JP10074088 U JP 10074088U JP 10074088 U JP10074088 U JP 10074088U JP H0221728 U JPH0221728 U JP H0221728U
Authority
JP
Japan
Prior art keywords
cavity
taper
tantalum
mold
chip capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10074088U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10074088U priority Critical patent/JPH0221728U/ja
Publication of JPH0221728U publication Critical patent/JPH0221728U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP10074088U 1988-07-28 1988-07-28 Pending JPH0221728U (pt-PT)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10074088U JPH0221728U (pt-PT) 1988-07-28 1988-07-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10074088U JPH0221728U (pt-PT) 1988-07-28 1988-07-28

Publications (1)

Publication Number Publication Date
JPH0221728U true JPH0221728U (pt-PT) 1990-02-14

Family

ID=31329090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10074088U Pending JPH0221728U (pt-PT) 1988-07-28 1988-07-28

Country Status (1)

Country Link
JP (1) JPH0221728U (pt-PT)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004247594A (ja) * 2003-02-14 2004-09-02 Nec Tokin Corp チップ型コンデンサ及びその製造方法並びにモールド金型

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61269338A (ja) * 1985-05-24 1986-11-28 Hitachi Ltd 樹脂封止半導体装置およびその製造に用いるモ−ルド型

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61269338A (ja) * 1985-05-24 1986-11-28 Hitachi Ltd 樹脂封止半導体装置およびその製造に用いるモ−ルド型

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004247594A (ja) * 2003-02-14 2004-09-02 Nec Tokin Corp チップ型コンデンサ及びその製造方法並びにモールド金型

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