JPH02217188A - Laser beam machining head - Google Patents

Laser beam machining head

Info

Publication number
JPH02217188A
JPH02217188A JP1037616A JP3761689A JPH02217188A JP H02217188 A JPH02217188 A JP H02217188A JP 1037616 A JP1037616 A JP 1037616A JP 3761689 A JP3761689 A JP 3761689A JP H02217188 A JPH02217188 A JP H02217188A
Authority
JP
Japan
Prior art keywords
laser beam
nozzle
processing
lens
condensed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1037616A
Other languages
Japanese (ja)
Other versions
JPH07115220B2 (en
Inventor
Eikichi Hayashi
林 栄吉
Mitsunobu Oshimura
押村 光信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1037616A priority Critical patent/JPH07115220B2/en
Publication of JPH02217188A publication Critical patent/JPH02217188A/en
Publication of JPH07115220B2 publication Critical patent/JPH07115220B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To enhance the accuracy of laser beam machining by detecting the emitting position of a condensed laser beam through a sensor at the opening part of a nozzle and automatically moving a machining lens in the direction rectangular to the emitting direction of the laser beam. CONSTITUTION:The laser beam 1 is condensed by a working lens to bring the surface of a material 8 to be worked into focus 9. Thermosensitive sensors 15a, 15b set on the nozzle 7 sense the inclination of the laser beam 1, send a signal to an arithmetic controller 16 and the signal elongates or contracts voltage driving elements 13a, 13b. The lens holder 3 supporting the working lens 4 moves against the spring pressure of coil springs 14a, 14b and the emitting place in the opening part 7 of the condensed laser beam can be adjusted to a prescribed position. Adjusting operations for the laser beam axis and the nozzle part are not required and the place of the condensing laser beam is always fixed and, as a result, the working accuracy is improved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、レーザ加工機の加工ヘッド先端にかけるレ
ーザビームの集光位置を、一定に制御するレーザ加工ヘ
ッドに関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a laser processing head that constantly controls the focusing position of a laser beam applied to the tip of the processing head of a laser processing machine.

〔従来の技術〕[Conventional technology]

第8図は従来のレーザ加工ヘッドの構成を示す断面図で
あり、図において、(1)は加工ヘッド本体(2)に入
射するレーぜビーム、(3)は加工レンズ(4)を−f
持するレンズホルダー、(5)は加工ガスボンベ、(6
)は加工へ・ソド本体(2)に設けられた加工ガス入口
、(7)は集光レーザビームと同軸的に加工ガスを加工
ヘッド本体(2)の先端のノズルQOよりワーク(8)
へ射出するための開口部、(9)はレーザビーム(1)
の集光され1こワーク(8)上の焦点である。
FIG. 8 is a cross-sectional view showing the configuration of a conventional laser processing head.
(5) is a processing gas cylinder, (6)
) is the processing gas inlet provided in the main body (2), and (7) is the processing gas inlet coaxially with the focused laser beam from the nozzle QO at the tip of the processing head main body (2) to the workpiece (8).
(9) is the opening for emitting the laser beam to (1)
This is the focal point on the workpiece (8).

次に動作について説明する。レーザビーム(1ンは加工
レンズ(4)により集光されてワーク(8)に照射され
ろと共に、レーザ切断等では加工ガスボンベ(5)に0
2 ガスを用い、ノズル部α1の開口部(7)よりレー
ザビーム(1)と同軸的に02ガスをワーク(8)に出
射して加工する。このときのノズルαQの開口部(7)
の径φαは、加工性能の向上と加工ガス量削減のため、
一般に、切断加工で(X)2レーザの場合φ1.5〜8
ff稈度が適用されている。
Next, the operation will be explained. The laser beam (1) is focused by the processing lens (4) and irradiated onto the workpiece (8), and in laser cutting, etc., the processing gas cylinder (5) is
Using 02 gas, the workpiece (8) is processed by emitting 02 gas coaxially with the laser beam (1) from the opening (7) of the nozzle portion α1. Opening of nozzle αQ at this time (7)
The diameter φα is set to improve machining performance and reduce the amount of machining gas.
Generally, in the case of (X)2 laser cutting, φ1.5 to 8
ff culmness is applied.

この種のレーザ加工ヘッドでは、集光レーザビ−ムの開
口部(7)における出射位置が開口部の中心にあること
が重要で、これが偏心した状態では加工性能及び加工品
質に態形1を及ぼすことが良く知られている。このため
、レーザビーム(1)又ハノズル部分を動かしてレーザ
ビーム(1)とノズルOQの同軸度の調整が行える様構
成されているのが通常である。
In this type of laser processing head, it is important that the emission position of the focused laser beam at the aperture (7) is at the center of the aperture, and if this is eccentric, it will affect the processing performance and quality. It is well known that For this reason, the configuration is usually such that the coaxiality between the laser beam (1) and the nozzle OQ can be adjusted by moving the laser beam (1) or the nozzle portion.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかしながら、調整後も加工ヘッド本体(2)に進入す
るレーザビーム(1)の光軸は、図示してないレーザ発
撮器や、伝送光路の途中にある偏向ミラーの周囲環境温
度変化又はレーザ光吸収による熱歪のため僅かな変動が
あり、この1こめ、前述し1こレーザビーム(1)とノ
ズルα0の同軸度が狂い加工が不良となるケースが時々
発牛する。
However, even after adjustment, the optical axis of the laser beam (1) that enters the processing head body (2) may be affected by changes in the surrounding environment temperature of a laser transmitter (not shown) or a deflection mirror in the middle of the transmission optical path, or by the laser beam. There is a slight fluctuation due to thermal distortion due to absorption, and as mentioned above, the coaxiality of the laser beam (1) and the nozzle α0 is out of order, which sometimes results in defective machining.

ここで、第4図は、加工レンズ(4)と偏向ミラーαB
が回転軸@の回りに回転動作する形式の回転式加工ヘッ
ドの概念図を示し、第5図は第4図で示す姿勢より18
0°回転した姿勢を示している。この様な形式のレーザ
加工ヘッドは、回転軸を複数連結してレーザビームを三
次元的に走査して加工する三次元レーザ加工機に最近用
いられている。
Here, FIG. 4 shows the processing lens (4) and the deflection mirror αB.
shows a conceptual diagram of a rotary processing head of the type that rotates around the rotation axis @, and Fig. 5 shows the 18
It shows an attitude rotated by 0°. Such a type of laser processing head has recently been used in a three-dimensional laser processing machine that connects a plurality of rotating shafts and performs processing by three-dimensionally scanning a laser beam.

しかし、上記のようなレーザ加工ヘッドにおいては、例
えば、回転軸(2)に対して入射レーザビーム(1)が
θran傾いていると、180°回転した場合加工レン
ズ(4)の焦点距離をfとすれば、焦点(9)は2、h
=2fθ移動することになる。
However, in the laser processing head as described above, for example, if the incident laser beam (1) is tilted by θran with respect to the rotation axis (2), the focal length of the processing lens (4) will be f when rotated by 180°. Then, the focal point (9) is 2, h
= 2fθ movement.

これは即ち、前述し1こように集光レーザビームのノズ
ル開口部(7)での同軸度が変化することとなり、当然
加工性能や加工品質が不良となるケースがしばしば発生
する要因となるのである。
This means that the coaxiality of the focused laser beam at the nozzle opening (7) changes as described above, which of course often causes poor processing performance and processing quality. be.

し1こがって、これを防止するためには、ノズル部等の
レーザ塗の光軸廻りをいく度も調整しなければならず、
調整作業に手間がかかるなどの問題点があつ1こ。
However, in order to prevent this, the optical axis of the laser coating such as the nozzle must be adjusted many times.
There is one problem, such as the amount of time it takes to make adjustments.

この発明は上記のような問題点を解消するtコめになさ
れ1こもので、レーザ光軸やノズル部の調整作業を排除
し、かつ、加工精度や加工品質を大巾に向上させること
ができるレーザ加工ヘッドを得ることを目的としている
This invention has been made to solve the above-mentioned problems, and can eliminate the adjustment work of the laser optical axis and nozzle part, and can greatly improve processing accuracy and processing quality. The purpose is to obtain a laser processing head.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係るレーザ加工ヘッドは、レーザビームを集
光する加工レンズと、この加工レンズを移動自在に支持
する加工へ・ンド本体と、先端部に上記集光レーザビー
ムおよび加工ガスを射出する開口部を有したノズルと、
このノズルの先端部に設けられ、上記集光レーザビーム
のノズル開口部における射出位置を検出するセンサーと
、このセンサーから出力されtこ信号に応じて上記加工
レンズの移動社を決定する制御器と、この制御器の出力
信号により加工レンズを集光レーザビームの射出方向と
直角方向に移動する駆動手段とを備えたものである。
The laser processing head according to the present invention includes a processing lens that focuses a laser beam, a processing head body that movably supports the processing lens, and an opening at the tip that injects the focused laser beam and processing gas. a nozzle having a part;
a sensor provided at the tip of the nozzle to detect the injection position of the focused laser beam at the nozzle opening; and a controller that determines the movement position of the processing lens in accordance with a signal output from the sensor. , and a driving means for moving the processing lens in a direction perpendicular to the emission direction of the condensed laser beam in response to an output signal from the controller.

〔作 用〕[For production]

この発明においては、加工レンズをビーム射出方向と直
角方向に移動させる駆動手段が、ノズル開口部に設けた
集光レーザビームのノズル開口部における出射位置を検
出するセンサーの信号により駆動制御される。
In this invention, the drive means for moving the processing lens in a direction perpendicular to the beam emission direction is driven and controlled by a signal from a sensor provided at the nozzle opening and detecting the emission position of the condensed laser beam at the nozzle opening.

〔発明の実施例〕[Embodiments of the invention]

以下、この発明の一実施例を図について説明する。第1
図はレーザ加工ヘッドの断面図、第2図は第1図のA−
A線断面図であり、第1図および第2図において、符号
(1)〜01は第8図に示した従来のものと同一、又は
相当部分を示シ、訳1明を省略する。(18a)、 (
18b)は一方がレンズホルダー(3)の外側に当接し
、他方が加工ヘッド本体(2)に埋設された第1および
第2の圧電駆動素子であり、電圧により伸縮する特性を
有している。n4a)、(14b)は圧電駆動素子(1
8a)、(18b)のそれぞれと対向する位置に設けら
れ1こ第1および第2の圧縮コイルバネ、(15a)、
(15b)ハ加工ヘット本体(2)ツノスルα0に設け
られた開口部(7)内にその先端部が突出して設けられ
た第1および第2の感熱センサーであり、ノズルαQの
開口部(7)における集光レーザビームの射出位置を熱
として検出し、それに応じた電圧信号を出力する熱電対
が用いられている。、C1Gはそれぞれの感熱センサー
(15a)、 (15b)から出力された電圧信号の差
に相応する電圧駆動素子(18a)。
An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a cross-sectional view of the laser processing head, and Figure 2 is A--A in Figure 1.
This is a cross-sectional view taken along the line A, and in FIGS. 1 and 2, reference numerals (1) to 01 indicate the same or equivalent parts as those of the conventional device shown in FIG. 8, and explanations are omitted. (18a), (
18b) are first and second piezoelectric driving elements, one of which is in contact with the outside of the lens holder (3) and the other is embedded in the processing head body (2), and has the characteristic of expanding and contracting by voltage. . n4a) and (14b) are piezoelectric drive elements (1
8a), (18b), and one first and second compression coil spring, (15a),
(15b) C processing head main body (2) First and second thermal sensors whose tips protrude into the opening (7) provided in the nozzle α0, and the opening (7) of the nozzle αQ. ) A thermocouple is used that detects the emission position of the focused laser beam as heat and outputs a corresponding voltage signal. , C1G is a voltage drive element (18a) corresponding to the difference in voltage signals output from the respective heat sensitive sensors (15a) and (15b).

(18b)の伸縮量を決定するプログラムが入力された
演算制御器である。
(18b) is an arithmetic controller into which a program for determining the amount of expansion/contraction is input.

次に動作について説明する。集光レーザビームがノズル
00の開口部(7)中心から射出している場合は、対向
配置されている第1および第2の感熱センサー(15a
−)、 (151))から集光レーザビームまでの距離
はいずれも等しい1こめ、各1当熱センサー(15’3
.)。
Next, the operation will be explained. When the focused laser beam is emitted from the center of the opening (7) of the nozzle 00, the first and second thermal sensors (15a
The distances from -) and (151)) to the focused laser beam are all the same, and each heat sensor (15'3) is the same.
.. ).

(151))はいずれも同じ1遅圧信号を演算制御器(
1119に出力する。演算制御器Qυは、入力されTコ
ミ圧信号に差がなく同じ値である1こめ、圧電駆動素子
f18’L)。
(151)), the same one delayed pressure signal is input to the arithmetic controller (
Output to 1119. The arithmetic controller Qυ is inputted to the piezoelectric drive element f18'L, where there is no difference in the input Tcomical pressure signal and the same value.

(18b”lに伸縮量1茎′の信号を出力する。これに
より、圧電駆動素子(I(a)、flak))は、感熱
センサー (15a)、(15b)の出力電圧の差に応
じて伸縮するように構成されているので、上記信号では
当然伸縮作用をしない。し1こがって、レンズホルダー
(3)も移動せず、加工レンズ(4)は当初の位置に釆
持されることになるのである。なお、演算制御器αυは
、感熱センサー(15a、)、(15b)からの電圧信
号に差がない場合は、圧電駆動素子(18alH8b)
に信号を出力しないように構成してもよい。
(18b"l outputs a signal for the amount of expansion/contraction of 1 stem'. As a result, the piezoelectric drive element (I(a), flak)) Since it is configured to expand and contract, the above signal naturally does not cause expansion and contraction.However, the lens holder (3) also does not move, and the processed lens (4) is held in its original position. Note that if there is no difference in the voltage signals from the thermal sensors (15a,) and (15b), the arithmetic controller αυ
It may also be configured so that no signal is output.

つぎζこ、集光レーザビームがノズルαOの開口部(7
)中心からズした場合の射出位置調整について説明する
Next, the focused laser beam is directed to the opening (7) of the nozzle αO.
) The injection position adjustment in the case of deviation from the center will be explained.

今、例えば集光レーザビームが第1の感熱センサー(1
5’3.)の方向に何らかの外乱によって移動し1こと
き、各感熱センサー(15a)、(15b’)から集光
レーザビーム着での距時はそれぞれが相違するので、当
然各感熱センサー(15a)、(15b)が出力する電
圧信号にも差が生じてくる。演算制御器αQは、入力さ
れた電圧信号の差に応じて、予め圧電駆動素子(18a
)、(18b)の伸縮量が設定されているプログラムを
実行し、その信号を第1の圧電駆動素子(1阻)に出力
する。これにより第1の圧電駆動素子(L3a、)が伸
長して、加工レンズ(4)を支持し1こレンズホルダー
(3)を第1の圧縮コイルバネ(14a )のバネ圧に
抗して移動する。ζ、の結果、集光レーザビームの開口
部(7)における射出位置が所定の位置tこ調整される
ことになる。
Now, for example, a focused laser beam is applied to the first thermal sensor (1
5'3. ) due to some disturbance, the distance and time at which the focused laser beam arrives from each thermal sensor (15a), (15b') will be different, so of course each thermal sensor (15a), (15b') will move in the direction of A difference also arises in the voltage signal output by 15b). The arithmetic controller αQ activates the piezoelectric drive element (18a) in advance according to the difference between the input voltage signals.
), (18b) in which the expansion/contraction amount is set is executed, and the signal thereof is output to the first piezoelectric drive element (1 block). As a result, the first piezoelectric driving element (L3a,) is extended to support the processed lens (4) and move the single lens holder (3) against the spring pressure of the first compression coil spring (14a). . As a result of ζ, the emission position of the focused laser beam at the aperture (7) is adjusted by a predetermined position t.

なお、上記は、開ループ制御の場合を示し1こが、閉ル
ープ制御(フィードバック制#J)でもよく、この場合
は感熱センサー(L6a)、 (15b)の信号電圧差
が1零′となる様、演算制御器(16で圧電駆動素子+
18a)を制御駆動すればよい。
Note that the above shows the case of open-loop control, but closed-loop control (feedback system #J) may also be used. , arithmetic controller (16 piezoelectric drive element +
18a) may be controlled and driven.

ところで、図示していないが、感熱センサーは第1図の
紙面と平角な方向9ζも一対設けられており、この信号
では前記と同様をこして第2の圧電駆動素子(]、8b
)が制御駆動され、この結果、開口平面内lこ訃ける集
光レーザビーム出射位置が、ノズルQO開口部(7)の
中心となる槌制御動作される。
By the way, although not shown, the thermal sensor is also provided with a pair of directions 9ζ perpendicular to the plane of the paper in FIG.
) is controlled and driven, and as a result, the focused laser beam emission position within the aperture plane is controlled to become the center of the nozzle QO opening (7).

まTこ、上記実施例ではレーザビームハcoy+v−ザ
で示したがYAGレーザ等他のレーザでもよく、切断加
工時だけでなく溶接、熱処理等のレーザ加工の場合でも
良い、、まTこ、集光レーザビームの出射位置を検出す
るセンサーは、使用レーザの波長tこ応じたビー1、セ
ンサー1例1えば(I)2の場合赤外線検出センサー)
でも良く、さらに、加工レンズ(4)を駆動する圧電駆
動素子は一般のそ一タ等のアクチュエータ)こようでも
同様の効果を奏する。
In the above embodiment, the laser beam is shown as a coy+v-laser, but other lasers such as a YAG laser may be used, and it may be used not only for cutting processing but also for laser processing such as welding and heat treatment. The sensor that detects the emission position of the laser beam is the beam 1 depending on the wavelength of the laser used (for example, in the case of (I) 2, an infrared detection sensor)
Furthermore, the piezoelectric drive element for driving the processing lens (4) may be a general actuator such as an actuator.

開口部における射出位置を検出して加工レンズを移動制
御する様に構成したので、レーザ光軸やノズル部の調整
作業が不要になるとともに、集光レーザビーム位置が常
に一定となる1こめ、加工精度が向上し、また、加工不
良も生じることなくレーザ加工が施工できるレーザ加工
ヘッドが得られる効果がある。
Since the processing lens is configured to detect the injection position at the aperture and control the movement of the processing lens, there is no need to adjust the laser optical axis or nozzle part, and the position of the focused laser beam is always constant, allowing for easy processing. This has the effect of providing a laser processing head that can perform laser processing with improved accuracy and without causing processing defects.

【図面の簡単な説明】[Brief explanation of the drawing]

@1図はこの発明の一実施例ζζよるレーザ加工ヘッド
の構成図、第2図は第1閣のA−A線断面図、第8図は
従来のレーザ加工ヘッドの断面図、第4図および第5図
は従来の回転式加工ヘッドにおける光軸偏心の説明図で
ある。 図ニオいて、(1)はレーザビーム、(2)は加工ヘッ
ド本体、(3)はレンズホルダー、(4)は加工レンズ
、(6)は加工ガス入口、(7)は開口部、Qlはノズ
ル、(18a) ハ第1 c7)圧電駆動素子、(18
b) i、を第2(7)圧電駆動素子、(15a=)ハ
K 1 (D感熱センサー 、(15b)は@2の感熱
センサー、αGは演算制御器であろうなお、図中、同一
符号は同一、又は相当部分を示す。
@ Figure 1 is a configuration diagram of a laser processing head according to an embodiment of the present invention ζζ, Figure 2 is a sectional view taken along line A-A of the first cabinet, Figure 8 is a sectional view of a conventional laser processing head, and Figure 4. and FIG. 5 is an explanatory diagram of optical axis eccentricity in a conventional rotary processing head. In the figure, (1) is the laser beam, (2) is the processing head body, (3) is the lens holder, (4) is the processing lens, (6) is the processing gas inlet, (7) is the opening, and Ql is Nozzle, (18a) c1 c7) Piezoelectric drive element, (18
b) i is the second (7) piezoelectric drive element, (15a =) K 1 (D thermal sensor, (15b) is the @2 thermal sensor, and αG is the arithmetic controller. In the figure, the same Codes indicate the same or corresponding parts.

Claims (1)

【特許請求の範囲】[Claims] レーザビームを集光する加工レンズと、この加工レンズ
を移動自在に支持する加工ヘッド本体と、先端部に上記
集光レーザビームおよび加工ガスを射出する開口部を有
したノズルと、このノズルの先端部に設けられ、上記集
光レーザビームのノズル開口部における射出位置を検出
するセンサーと、このセンサーから出力された信号に応
じて上記加工レンズの移動量を決定する制御器と、この
制御器の出力信号により加工レンズを集光レーザビーム
の射出方向と直角方向に移動する駆動手段とを備えたこ
とを特徴とするレーザ加工ヘッド。
A processing lens that focuses a laser beam, a processing head body that movably supports this processing lens, a nozzle having an opening at its tip for ejecting the focused laser beam and processing gas, and the tip of this nozzle. a sensor for detecting the injection position of the condensed laser beam at the nozzle opening; a controller for determining the amount of movement of the processing lens according to a signal output from the sensor; A laser processing head characterized by comprising a drive means for moving a processing lens in a direction perpendicular to the emission direction of a condensed laser beam in response to an output signal.
JP1037616A 1989-02-17 1989-02-17 Laser processing head Expired - Lifetime JPH07115220B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1037616A JPH07115220B2 (en) 1989-02-17 1989-02-17 Laser processing head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1037616A JPH07115220B2 (en) 1989-02-17 1989-02-17 Laser processing head

Publications (2)

Publication Number Publication Date
JPH02217188A true JPH02217188A (en) 1990-08-29
JPH07115220B2 JPH07115220B2 (en) 1995-12-13

Family

ID=12502557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1037616A Expired - Lifetime JPH07115220B2 (en) 1989-02-17 1989-02-17 Laser processing head

Country Status (1)

Country Link
JP (1) JPH07115220B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH079178A (en) * 1993-06-29 1995-01-13 Sumitomo Heavy Ind Ltd Trepanning head
US5837965A (en) * 1995-12-14 1998-11-17 Salvagnini Italia S.P.A. Focusing head of a laser beam provided with a focusing lens for a machine for working metal and non-metal parts
US5910260A (en) * 1995-04-19 1999-06-08 Gerber Garment Technology, Inc. Laser cutter and method for cutting sheet material
JP2008302385A (en) * 2007-06-07 2008-12-18 Amada Co Ltd Laser machining head, and method for producing lens unit and assist gas nozzle used for laser machining head
JP2010023088A (en) * 2008-07-22 2010-02-04 Nippon Sharyo Seizo Kaisha Ltd Laser cutting apparatus
DE102007063627B4 (en) * 2007-10-02 2010-08-12 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Method for determining the position of a laser beam relative to an opening, and laser processing machine
JP2012000619A (en) * 2010-06-14 2012-01-05 Mitsubishi Electric Corp Laser processing apparatus
EP3456459A1 (en) * 2017-09-19 2019-03-20 United Technologies Corporation Method and apparatus for auto-aligning of a process gas jet nozzle and laser machining beam

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008296266A (en) * 2007-06-01 2008-12-11 Nippon Sharyo Seizo Kaisha Ltd Laser cutting apparatus
CN108161218A (en) * 2017-11-30 2018-06-15 沈阳工业大学 focus adjustable mechanism laser cutting head

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57139489A (en) * 1981-02-24 1982-08-28 Amada Eng & Service Working head in laser working device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57139489A (en) * 1981-02-24 1982-08-28 Amada Eng & Service Working head in laser working device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH079178A (en) * 1993-06-29 1995-01-13 Sumitomo Heavy Ind Ltd Trepanning head
US5910260A (en) * 1995-04-19 1999-06-08 Gerber Garment Technology, Inc. Laser cutter and method for cutting sheet material
US5837965A (en) * 1995-12-14 1998-11-17 Salvagnini Italia S.P.A. Focusing head of a laser beam provided with a focusing lens for a machine for working metal and non-metal parts
JP2008302385A (en) * 2007-06-07 2008-12-18 Amada Co Ltd Laser machining head, and method for producing lens unit and assist gas nozzle used for laser machining head
DE102007063627B4 (en) * 2007-10-02 2010-08-12 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Method for determining the position of a laser beam relative to an opening, and laser processing machine
US8410395B2 (en) 2007-10-02 2013-04-02 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Method for determining focal position
JP2010023088A (en) * 2008-07-22 2010-02-04 Nippon Sharyo Seizo Kaisha Ltd Laser cutting apparatus
JP2012000619A (en) * 2010-06-14 2012-01-05 Mitsubishi Electric Corp Laser processing apparatus
EP3456459A1 (en) * 2017-09-19 2019-03-20 United Technologies Corporation Method and apparatus for auto-aligning of a process gas jet nozzle and laser machining beam
US10953492B2 (en) 2017-09-19 2021-03-23 Raytheon Technologies Corporation Method and apparatus for auto-aligning of a process gas jet nozzle and laser machining beam
US11660703B2 (en) 2017-09-19 2023-05-30 Raytheon Technologies Corporation Method and apparatus for auto-aligning of a process gas jet nozzle and laser machining beam

Also Published As

Publication number Publication date
JPH07115220B2 (en) 1995-12-13

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