JPH0221160B2 - - Google Patents
Info
- Publication number
- JPH0221160B2 JPH0221160B2 JP21086284A JP21086284A JPH0221160B2 JP H0221160 B2 JPH0221160 B2 JP H0221160B2 JP 21086284 A JP21086284 A JP 21086284A JP 21086284 A JP21086284 A JP 21086284A JP H0221160 B2 JPH0221160 B2 JP H0221160B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- circuit board
- printed circuit
- electronic component
- outside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000011889 copper foil Substances 0.000 claims description 11
- 230000010355 oscillation Effects 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F6/00—Air-humidification, e.g. cooling by humidification
- F24F6/12—Air-humidification, e.g. cooling by humidification by forming water dispersions in the air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Air Humidification (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21086284A JPS6189430A (ja) | 1984-10-08 | 1984-10-08 | 超音波加湿機 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21086284A JPS6189430A (ja) | 1984-10-08 | 1984-10-08 | 超音波加湿機 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6189430A JPS6189430A (ja) | 1986-05-07 |
JPH0221160B2 true JPH0221160B2 (enrdf_load_stackoverflow) | 1990-05-11 |
Family
ID=16596330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21086284A Granted JPS6189430A (ja) | 1984-10-08 | 1984-10-08 | 超音波加湿機 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6189430A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020240928A1 (ja) * | 2019-05-27 | 2020-12-03 | 千住金属工業株式会社 | はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手 |
WO2020240927A1 (ja) * | 2019-05-27 | 2020-12-03 | 千住金属工業株式会社 | はんだ合金、はんだ粉末、およびはんだ継手 |
-
1984
- 1984-10-08 JP JP21086284A patent/JPS6189430A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020240928A1 (ja) * | 2019-05-27 | 2020-12-03 | 千住金属工業株式会社 | はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手 |
WO2020240927A1 (ja) * | 2019-05-27 | 2020-12-03 | 千住金属工業株式会社 | はんだ合金、はんだ粉末、およびはんだ継手 |
Also Published As
Publication number | Publication date |
---|---|
JPS6189430A (ja) | 1986-05-07 |