JPH02209965A - Resin composition for sealing semiconductor - Google Patents

Abstract

PURPOSE:To obtain a composition suitable for sealing electronic parts such as semiconductors having high heat resistance, low water absorption ratio, small stress, excellent thermal shock resistance and heat resistance of soldering by compounding a specific bismaleimide with a specific diamine compound, etc., as essential components. CONSTITUTION:(A) A bismaleimide compound [e.g. N,N'-4,4'-bis(3-aminophenoxy) biphenylbismaleimide] shown by formula I (R1 is group shown by formula II or formula III; X is straight bond or 1-10C bifunctional hydrocarbon, etc.) is blended with (B) a diamine compound (e.g. 4,4'-diaminodicyclohexylmethane) shown by formula IV (R is >=2C bifunctional organic group), (C) an inorganic filler (e.g. crystalline silica or fused silica) and further preferably (D) a modified epoxy resin wherein a silicone polymer having <=1mu average particle diameter is uniformly dispersed into a graft polymer of epoxy resin and vinyl polymer. The components A and B are previously made into a prepolymer and used.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is directed to a resin composition that is excellent in high heat resistance and low water absorption, and is also a resin composition that is excellent in thermal shock resistance and is required to have high reliability. The present invention relates to a semiconductor encapsulating resin composition suitable for encapsulating electronic components such as semiconductors.

[Conventional technology]

BACKGROUND ART Conventionally, epoxy resins have been widely put into practical use as resin compositions for encapsulating semiconductors such as ICs and LSIs, taking advantage of their economical advantages such as low raw materials and suitability for mass production.

[Problem to be solved by the invention]

On the other hand, with the recent trend toward high-density packaging of electronic components, semiconductor packages are changing to surface-mount packages.Unlike conventional insertion-type packages, the entire package is soldered at temperatures above 200°C. Due to exposure to high temperatures, sealing resins have come to be required to have high heat resistance. Conventionally, bismaleimide has been widely used to obtain such high heat resistance, but the cured product of bismaleimide alone has the disadvantage of being brittle, and to improve this, it has been combined with diamine. A method of imparting delimitability as a copolymer was adopted. However, - Bismaleimide-based cured products have a high water absorption rate for boat fishing, and are disadvantageous, especially when considering soldering heat resistance, because this water expands rapidly due to the high temperature of the actual image and causes a crank in the package. It was thought that.

In addition, due to the remarkable innovation in semiconductor technology, the size of elements is becoming thicker (and the width of aluminum wiring is becoming thinner. Therefore, the level of stress caused by the difference in thermal expansion between the sealing resin and the element is required to be even lower. In this respect, there has been a need to reduce stress in addition to the high heat resistance of bismaleimide-based sealing resins.

[! Means to solve problem I]

As a result of various studies, the present inventors have found that a cured product of a bismaleimide compound having a specific structure and a diamine exhibits a high glass transition temperature (hereinafter referred to as Tg) and a low water absorption rate,
The inventors have discovered that it is possible to impart excellent impact resistance by using a modified epoxy resin that has excellent solder heat resistance and in addition has fine particles of silicone polymer dispersed therein, and has thus arrived at the present invention.

That is, the present invention represents a divalent group consisting essentially of (1) (a)-ritual (1), where X is a direct bond, a divalent hydrocarbon group having 1 to 10 carbon atoms, a hexafluorine a bismaleimide compound represented by (b) - a group selected from the group consisting of a converted isopropylidene group, a carbonyl group, a thio group, a sulfinyl group, a sulfonyl group, or an oxide; A diamine compound represented by HJ R1NHI (11) (R3 represents a divalent organic group having at least 2 carbon atoms), (c) an inorganic filler, and, depending on the purpose, (d) an epoxy A semiconductor encapsulation characterized by containing a modified epoxy resin (hereinafter referred to as modified epoxy resin) in which a silicone polymer is uniformly dispersed in a graft polymer of a resin and a vinyl polymer with an average particle diameter of 1.0 μ or less. Resin composition for stopping.

(2) A resin composition for semiconductor encapsulation characterized in that a bismaleimide compound represented by the -linear formula (1) and a diamine compound represented by the general formula (II) are prepolymerized and used. thing.

(3) Semiconductor encapsulation resin which is a silicone rubber obtained by reacting a silicone polymer dispersed in an epoxy resin with an addition reaction type silicone polymer and/or a soft vinyl polymer mainly composed of a vinyl-modified silicone polymer. Composition.

The bismaleimide compound represented by the linear formula (1) in (a) used in the present invention is produced by a condensation/dehydration reaction between a cyamine compound represented by the general formula (III) and maleic anhydride by a commonly known method. It can be easily manufactured.

(In the formula, R1 represents the same meaning as above) General formula (II
Specifically, the diamine compound I) is 1,3-bis(3
-aminophenoxy)benzene, bis(3-aminophenoxy)methane, 1.1-bis(4-(3-aminophenoxy)phenyl)ethane, 1.2-bis(4-(3-
Aminophenoxy)phenyl)ethane, 2,2-bis(
4-(3-aminophenoxy)phenyl]propane, 2
．． 2-bis(4-(3-aminophenoxy)phenylcobutane, 2.2-bis(4-(3-aminophenoxy)
phenyl) -1,1,1,3,3,3-hexafluorohaf, 4+4°-his(3-aminophenoxy)
Biphenyl, bis(4-(3-aminophenoxy)phenylkoketone, bis(4-(3-aminophenoxy)phenyl)sulfide, bis(4-(3-aminophenoxy)phenyl)sulfoxide, bis(4-(3-aminophenoxy)phenyl)sulfoxide, bis(4-(3-aminophenoxy)phenyl)sulfoxide, Examples include phenoxy)phenyl]sulfone, bis(4-(3-aminophenoxy)phenyl ether), and the like.

- Specifically, the bismaleimide compound obtained by condensing and dehydrating a diamine compound of the linear formula ([[) and maleic anhydride is N,N'-1,3-bis(3-aminophenoxy)benzene bis maleimide, N, N″], 3-bis[
4-(3-aminophenoxy)phenylcomethane bismaleimide, N, N'-1,1-bis(4-(3-aminophenoxy)phenyl)ethane bismaleimide, N,
N'-1,2-bis[4-(3-aminophenoxy)phenyl]ethane bismaleimide, N, N''-2,2-bis(4-(3-aminophenoxy)phenyl)propane bismaleimide, N, N'-2,2-bis(4-(3-
aminophenoxy) phenylcobutane bismaleimide,
N,N'-2,2-bis(4-(3-aminophenoxy)phenyl)-1,1,1,3,3,3-hexafluoropropane bismaleimide, N,N'-4,4'
-bis(3-aminophenoxy)biphenylbismaleimide, N,N'-bis(4-(3-aminophenoxy)
Phenylkoketone bismaleimide, N, N'-bis(
4-(3-aminophenoxy)phenyl sulfide bismaleimide, N,N''-bis(4-(3-7minophenoxy)phenyl]sulfoxide bismaleimide, N,
N'-bis(4-(3-aminophenoxy)phenyl)sulfone bismaleimide, N,N'-bis[4-(3
-aminophenoxy) phenyl phether and the like.

In addition, in the present invention, N, N'-4,4°-bis(3
-aminophenoxy)biphenyl bismaleimide, N,
N'-2,2-bis(4-(3-aminophenoxy)phenyl)propane bismaleimide, N,N'bis(4-
(3-Aminophenoxy) phenyl sulfide bismaleimide is preferably used among these.

Further, the bismaleimides mentioned above may be used alone or in combination of two or more kinds, and if necessary, maleimide compounds other than the general formula (1) may be used in combination.

As for the diamine compound represented by the general formula (■) used for zero-gan suction, all the diamines represented by the above-mentioned -tsuzuriyo (Ill) can be used, and furthermore, compounds other than this can also be used, For example, 4.4°-diaminodicyclohexylmethane, 1.4-diaminodicyclohexane, 2.6-diamitubiridine, m-phenylenediamine, p-phenylenediamine, 4.4°-diaminodiphenylmethane, 2,
2°-bis(3-aminophenyl)propane, benzidine, 4.4"-diaminophenyl oxide, 4.4"-
Diaminodiphenylsulfone, bis(4-aminophenyl)methylphosphine oxide, bis(4-aminophenyl)phenylphosphine oxide, bis(4-aminophenyl)methylamine, 1,5-diaminonaphthalene, m-xylylenediamine, 1.1-bis(P-aminophenyl)furatane, p-xylylenediamine, hexamethylenediamine, 6.6'-diamine-2,2'-dipyridyl, 4.4'-diaminobenzophenone, 4.4
'-Diaminoazobenzene, bis(4-aminophenyl)phenylmethane, 1.1-bis(4-7minophenyl)cyclohexane, 1. l-bis(4-amino-3-methylphenyl)cyclohexane, 2.5-(m-
aminophenyl)-1,3,4-oxadiazole, 2
．． 5-bis(p-aminophenyl)-1,3,4-oxadiazole, 2,5-bis(m-aminophenyl)
Thiazolo(4,5-d)thiazole, 5,5゛-di(
m-aminophenyl)-2,2'-bis(1,3,4-
oxadiazole), 4,4°-diaminodiphenyl ether, 4,41-bis(p-7minophenyl)-2,
2°-Dithiazole, m-bis(4-p-aminophenyl-2-thiazolyl)benzene, 4,4″-diaminobenzanilide, 4,4′-diaminophenylbenzoate, N,N′-bis(4-amino benzyl)-p-phenylenediamine, 4.4°-methylenebis(2-chloroaniline), etc., and at least one of these or a mixture of 211 or more of them is used.

In the present invention, the bismaleimide represented by formula (1) and the diamine compound represented by general formula (II) are preferably used as reactants.0 If they are not used as reactants, the softening point of bismaleimide is high. Therefore, good kneading properties cannot be obtained, and the resin composition becomes non-uniform, which causes problems in terms of moldability.

By using it as a reactant, the softening point of bismaleimide can be lowered and good kneading properties can be obtained.

Bismaleimide represented by general formula 2 (1) and general formula (I
The diamine compound reactant represented by f) can be obtained by the method shown below.

(1) Bismaleimide and diamine are pulverized and mixed in solid form, heat treated to form a prepolymer, and then pulverized to form pellets or powder. In this case, the heating conditions should be such that the prepolymer stage is partially cured.
o to 2oo'c) It is appropriate to set the temperature to 180 minutes.

(2) Bismaleimide and diamine are dissolved in an organic solvent, then discharged into a poor solvent, and the precipitated crystals are filtered and dried to form pellets or powder, or dissolved in an organic solvent and then heated to preform. After partially curing to the polymer stage, it is discharged into a poor solvent, and the precipitated crystals are filtered and dried to form a pellet or powder. The conditions in this case are also (
Conforms to 1). The organic solvents that can be used are limited by the fact that they do not substantially react with both components, but it is also desirable that they are good solvents for the re-reacted components.Usually, the reaction solvents used are methylene chloride and dichloroethane. , halogenated hydrocarbons such as trichloroethylcine, ketones such as acetone, methyl ethyl ketone, cyclohexanone, and diisofuropyl ketone, ethers such as tetrahydrofuran, dioxane, and methylcellosolve, aromatic compounds such as benzene, toluene, and chlorobenzene, acetonitrile, N , N-dimethylformamide, N,N-dimethylacetamide, dimethylsulfoxide, N-methyl-2-pyrrolidone, 1,3-dimethyl-2-imidacyline, and other aprotic polar solvents.

The usage ratio of bismaleimide compound and diamine compound is
Usually, the molar ratio of the bismaleimide compound of general formula (1) to the diamine compound of knee binding (If) is in the range of 10=1 to 1:3.

In addition, the amount of the reactant of bismaleimide and diamine is
When used in conjunction with a modified epoxy resin in which a silicone polymer is dispersed, it is preferably 10% by weight or more and 811% or less based on the total amount of the epoxy resin and reactants, including the modified epoxy resin. If it is less than 10% by weight, good soldering heat resistance cannot be obtained, and if it is used in excess of 80% by weight, the elastic modulus becomes high and stress cannot be sufficiently reduced.

Examples of the inorganic filler (c) used in the present invention include powders such as crystalline silica, fused silica, alumina, talc, calcium silicate, calcium carbonate, mica, clay, and titanium white, or glass fibers and carbon fibers. From the viewpoint of thermal expansion coefficient, thermal conductivity, etc., crushed and/or spherical silica powders that are crystalline or meltable are usually used. The blending amount is preferably 150 to 900 parts by weight based on 100 parts by weight of the total amount of epoxy resin containing the reaction product of bismaleimide and diamine or the reaction product of bismaleimide and diamine and modified epoxy resin. The expansion rate is large,
Good thermal shock resistance cannot be obtained.

Moreover, when it exceeds 900 parts by weight, the fluidity of the resin decreases and moldability deteriorates.

As the epoxy resin used in (d) of the present invention, commonly used epoxy resins can be used as long as they are polyhydric epoxy resins, and glycidylated compounds such as phenol novolac and cresol novolac can be used in view of their heat resistance and electrical properties. Preferred are novolak epoxy resins such as, but other compounds having two or more active hydrogens in one molecule, such as polyhydric phenols such as bisphenol A, bishydroxydiphenylmethane, resorcinol, bishydroxydiphenyl ether, and tetrabromobisphenol A, and ethylene. Glycol, neopentyl glycol, chrycerin, trimethylolpropane, pentaerythritol, diethylene glycol, polypropylene glycol, bisphenol A-ethylene oxide adduct, polyhydric alcohols such as trishydroxyethyl isocyanurate, ethylenediamine, polyamino compounds such as aniline, adipic acid,
Glycidyl-type epoxy resins obtained by reacting polyhydric carboxy compounds such as phthalic acid and isophthalic acid with epichlorohydrin or 2-methylepichlorohydrin, aliphatic (alicyclic It is possible to use one or more epoxy resins selected from epoxy resins of the following groups.

The modified epoxy resin in (d) of the present invention can be produced by the method disclosed by the applicant.

(JP 62-270617 and JP 62-273
222, etc.) That is, a typical method for producing a graft polymer of an epoxy resin and a vinyl polymer is by U-merging the vinyl polymer to produce the vinyl polymer in the presence of the epoxy resin. Examples of vinyl polymers used for forming the vinyl polymer include styrene, alkenyl aromatics such as vinyltoluene, methyl methacrylate, dodecyl methacrylate, butoxyethyl mequaacrylate, glycidyl methacrylate, methyl acrylate, butyl acrylate, etc. , acrylic esters such as 2-ethylhexyl acrylate-1, hydroxyethyl acrylate, and trimethylolpropane triacrylate, acrylic compounds without ester groups such as acrylonitrile, acrylic acid, butoxymethylacrylamide, and methacrylamide, vinyl acetate, Representative examples include non-conjugated vinyl compounds such as vinyl laurate, vinyl persatate, vinyl chloride, vinyldene chloride, ethylene and allyl acetate, and conjugated diene compounds such as butane diene, isoprene and chloroprene. It is also possible to use polymerizable vinyl compounds such as fluorine compounds of methacrylic acid and acrylic acid, such as monomethyl malate, diethyl itaconate, trifluoroethyl methacrylate, and tetrafluoropropyl methacrylate.

In order to polymerize the vinyl monomers described above to obtain a vinyl polymer, a radical initiator such as lauroyl peroxide, benzoyl peroxide, tert-butyl perbenzoate, dimethyl dibenzoyl peroxyhexane, tert-butyl pervivalate, diter Chaributyl peroxide, 1.1-bistarcharybutyl peroxy3.3.5-)limethylcyclohexane, dimethyl ditertiarybutyl peroxyhexane,
Tertiary butyl cumyl peroxide, methyl ethyl ketone peroxide, cyclohexanone peroxide, quemene hydroperoxide, tertiary butyl peroxyallyl carbonate, dioctyl peroxydicarbonate, kusha butyl peroxymaleic acid, succinic acid peroxide, kushali Typically, radical polymerization is carried out using peroxides such as butylperoxyisopropyl carbonate and hydrogen peroxide, and azo compounds such as azobisisobutyronitrile and azobisdimethylvaleronitrile.

In addition, so-called redox polymerization may be carried out by using a reducing agent in combination as necessary, and a polymerization inhibitor such as hydroquinone,
A chain transfer agent such as dodecyl mercaptan may also be used.

In addition, it is effective to introduce a graftable chemical bond such as a polymerizable double bond into the epoxy resin in order to promote grafting. , methylol acrylamide,
Butoxymethylacrylamide, hydroxyethyl methacrylate, glycidyl methacrylate, maleic anhydride, monoethyl itaconate, monobutyl fumarate, chloromethylstyrene, phosphoxyethyl methacrylate, chlorohydroxypropyl methacrylate, parahydroxystyrene, dimethylaminoethyl A typical method is to react a compound having a functional group and a polymerizable double bond, such as methacrylate, with an epoxy resin in advance.

In the present invention, the epoxy resin or the vinyl polymer may remain free in the graft polymer without being grafted.

The modified epoxy resin (d) can be obtained by addition-reacting an addition-reactive silicone polymer in the presence of the graft polymer of the above-mentioned epoxy resin and nil polymer, or by adding a monomer that forms a soft vinyl polymer. Obtained by polymerization using conventional methods.

In other words, addition reaction silicone rubber is a rubber produced by an addition reaction between a vinyl-modified silicone polymer having a vinyl group in the molecule and a hydrogen-modified silicone polymer having active hydrogen in the molecule through a silylation reaction. A polymer has at least one Si CI Clh bond at the end or inside the molecule.
A hydrogen-modified silicone polymer refers to a polysiloxane having at least two or more SiH bonds at the end or inside of the molecule.The two are usually commercially available in combination; For example, Toray Silicone Co., Ltd.'s SI! -1821, KE-120 of Shin-Etsu Chemical Co., Ltd.
4th prize is given.

Further, the soft vinyl polymer can be obtained by polymerizing a hexamer forming a soft vinyl polymer by a conventional method.

The soft vinyl polymer used in the present invention must be a polymer mainly composed of vinyl-modified silicone. The polymer mainly composed of vinyl-modified silicone means a homopolymer or copolymer of vinyl-modified silicone. The vinyl-modified silicone refers to a copolymer of a vinyl-modified silicone and another vinyl monomer. Examples of the vinyl-modified silicone include methacryloxypropylsiloxane, methacryloxypropyl alkoxysilane, vinyl alkoxysilane, and other vinyl monomers. All the monomers used in preparing the graft polymers mentioned above can be used. The proportion of other vinyl monomers used is such that the obtained copolymer is soft, that is, liquid or rubber-like, and has a particle size of 1.0μ or less, and usually all seven vinyl monomers are used, depending on the type of monomer. It is 80% by weight or less of the total weight.

In order to achieve the purpose of the present invention of reducing stress and improving impact resistance, the average particle diameter of the addition reaction silicone and soft vinyl polymer is 1.0μ or less, preferably 0.5μ or less, and more preferably 0.5μ or less. It is 0.01μ or more and 2.0μ or less. If the average particle diameter of the addition-reactive silicone and soft vinyl polymer exceeds 1.0 μm, stress reduction cannot be achieved and thermal shock resistance cannot be improved.

The particle size of the addition reaction type silicone and soft vinyl polymer can be controlled by selecting the type and amount of the vinyl polymer that forms the graft polymer with the epoxy resin, and the polymer or monomer composition that forms the addition reaction type silicone and the soft vinyl polymer. However, it can be controlled by the amount of double bonds introduced into the epoxy resin.

It is difficult to disperse a silicone polymer into uniform particles in an epoxy resin that does not contain a graft polymer of an epoxy resin and a vinyl polymer, even if a silane coupling agent, modified silicone oil, etc. are used, for example.

The amount of the polymer or monomer used to form the addition reaction type silicone rubber and the soft vinyl polymer is 1 to 100 parts by weight per 100 parts by weight of the epoxy resin.

The composition of the present invention contains the modified epoxy resin (d) as an essential component, and the addition reaction type silicone rubber and/or soft vinyl polymer are added in desired amounts! As the unmodified polyfunctional epoxy that may contain an unmodified polyfunctional epoxy to adjust rI, all the epoxy resins used in (d) above can be used, and both may be the same (or different There is no problem.

The amount of modified epoxy resin to be used can be determined based on the desired amount of addition reaction type silicone rubber and/or soft vinyl polymer and the amount of addition reaction type silicone rubber and/or soft vinyl polymer contained in the modified epoxy resin. can.

In addition, the amount of silicone rubber and/or soft vinyl polymer obtained by addition reaction is required to be 0.51% or more based on the total amount of epoxy resin containing bismaleimide, diamine, and modified epoxy resin, particularly 1 to 30%. % by weight is preferred; if it is less than 0.5% by weight, low stress will not be achieved.

The resin composition for semiconductor encapsulation of the present invention includes the above (a) and (b).
, (c) or (a) , (b) , (c) , (
d) as an essential component, but in practical use, it is used for phenols such as novolac type phenolic resins and aralkyl phenolic resins, and maleimide resins such as diallyl phthalate, triallyl isocyanurate, o, o'-diallyl bisphenol A, etc. Commonly used reactive diluents, imidazoles, tertiary amines, quaternary ammonium salts, organometallic compounds, organic phosphines, organic peroxides, curing accelerators such as azo compounds, fatty acid amides,
Fatty acid salts, mold release agents such as wax, bromine compounds, antimony, flame retardants such as phosphorus, colorants such as carbon black,
It is also possible to add a silane coupling agent or the like as appropriate.

The resin composition for semiconductor encapsulation of the present invention can be easily obtained as a molding material by sufficiently premixing with a mixer or the like, kneading with a melt mixer such as a hot roll or kneader, and then cooling and pulverizing. I can do it.

[Example] The present invention will be specifically explained with reference to Examples, but the present invention is not limited to the Examples. In the following, parts mean parts by weight unless otherwise specified.

Production Example 1 (Production of prepolymer of bismaleimide and diamine) N,N'-4,4°-bis(3-aminophenoxy)biphenylbismaleimide powder 100 parts by weight, 4.4'-
35 parts by weight of bis(3-aminophenoxy)biphenyl powder was reacted with a heated roll at 190'C for 10 minutes, then cooled and further ground to obtain a prepolymer (hereinafter referred to as a-1) with a softening point of 102'C. Obtained.

Production Example 2 (Production of prepolymer of bismaleimide and diamine) 100 parts by weight of N,N″-2,2-bis(4-(3-aminophenoxy)phenyl)propane bismaleimide powder, 2.2-bis[4 -(3-Aminophenoxy)phenyl]propane powder 35 The valuable part was reacted with a hot roll at 160°C for 10 minutes, then cooled and further crushed to obtain a softening point of 95.
℃ prepolymer (hereinafter referred to as a-2) was obtained.

Production Example 3 (Production of prepolymer of bismaleimide and diamine) 100 parts by weight of N,N'-bis(4-(3-aminophenoxy)phenyl)sulfide bismaleimide powder,
18 parts by weight of 4,4'-diaminodiphenylmethane powder was reacted with a heated roll at 150'C for 10 minutes, then cooled and further ground to obtain a prepolymer (hereinafter referred to as a) with a softening point of 78°C.
−3).

Comparative Production Example 4 (Production of prepolymer of bismaleimide and diamine) 100 parts by weight of N,N″-4,4″-diphenylmethane bismaleimide powder and 28 parts by weight of 4,4′-diaminodiphenylmethane powder were heated at 150°C. After reacting with a roll for 20 minutes, the mixture was cooled and further pulverized to obtain a prepolymer (hereinafter referred to as a-4) with a softening point of 150°C.

Production Example 5 (Production of modified epoxy resin) 100 parts of orthocresol novolac epoxy resin (1200 parts per epoxy), 10 parts of toluene, and 1.2 parts of methacrylic acid were heated at 120 to 125°C in the presence of a tertiary amine.
After reacting for 2 hours with
React at 0°C for 4 hours. Furthermore, 27.5 parts of vinyl-modified polysiloxane and 27.5 parts of hydrogen-modified polysiloxane (both KE1204 manufactured by Shin-Etsu Chemical Co., Ltd.) were added as addition reaction type silicone polymers, and the mixture was stirred vigorously and allowed to react for 2 hours.

Thereafter, the solvent was further removed under reduced pressure at 130°C, and the modified epoxy resin (hereinafter referred to as b-1) in which silicone rubber with a particle size of 0.2 to 0.5μ was dispersed (epoxy equivalent: 33
7) was obtained.

Production Example 6 (Production of modified epoxy resin) 100 parts of orthocresol novolac epoxy resin (epoxy equivalent: 200), 100 parts of toluene, and 1.2 parts of methacrylic acid were heated at 120 to 125° in the presence of a tertiary amine.
After reacting at C for 2 hours, 4 parts of butyl acrylate, 0.2 part of glycidyl nucleate, and 0.05 part of t-butylperoxy-2-ethylhexanoate were added at 100°C.
The reaction was carried out for 1 hour. Furthermore, 50 parts of methacryloxypropylsiloxane, 1 part of neopentyl glycol diacrylate, 1.1-bis(1-butylperoxy) -
After 4 hours of continuous dropwise addition of 0.15 parts of 3,3,5-)licyclohexane, the reaction was continued for 4 IIS, and then
The solvent was removed under reduced pressure to obtain a modified epoxy resin (hereinafter referred to as b-2) (1313 epoxy resin) in which a soft vinyl polymer having a particle size of 0.2 to 0.5 μm was dispersed.

Example 1-3 and Comparative Example 1 The formulations shown in Table 1 were heated in a heated roll at 90 to 120°C.
After melt-mixing for a minute, a resin composition for molding was obtained by cooling, crushing, and tableting.

Using this composition, transfer molding (185°C1
80kg/c+! After molding test pieces for physical property tests (for 5 minutes) and post-curing at 150°C for 2 hours, 200°C for 2 hours, and further 250°C for 2 hours, each test was conducted. The test results are shown in Table 2.

Example 4.5 and Comparative Example 2.3 The formulations shown in Table 3 were heated in a heated roll at 90-120°C.
After melt-mixing for a minute, a resin composition for molding was obtained by cooling, crushing, and tableting.

Using this composition, transfer molding (180'C,
70kg/cd for 3 minutes) for testing at 100pi
n flat pan cage (20+* seagull x 30IllI x 2
．． 5 mm, 10 mm x 1011 Ils test elements) and test pieces for measuring physical properties were molded and post-cured at 200''C for 6 hours, and then each test was conducted.
Shown in the table.

Table 1: Combination table: 3: Combination table: Table 2: U3: Lucky fruit; Table: 4: Shiraken: 1: Lucky fruit card [Effects of the invention] As explained in the examples and comparative examples, for semiconductor encapsulation according to the present explanation. The resin composition has high heat resistance, low water absorption, low stress, and exhibits excellent thermal shock resistance and soldering heat resistance.
When this resin composition is used to encapsulate highly integrated semiconductors or small and thin semiconductors such as flat packages, excellent reliability can be obtained, making it an extremely useful invention industrially.

Patent applicant: Mitsui Toatsu Chemical Co., Ltd.

Claims (5)

[Claims] (1) Essentially (a) General formula (I) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ ( I ) (In the formula, R_1 is ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ or ▲ Numerical formulas, chemical formulas, tables, etc. ▼ represents a divalent group consisting of a direct bond, a divalent hydrocarbon group with 1 to 10 carbon atoms, a hexafluorinated isopropylidene group, a carbonyl group, a thio group, a sulfinyl group, a sulfonyl group or a group selected from the group consisting of oxides.) (b) General formula (II) ▲There are mathematical formulas, chemical formulas, tables, etc.▼(II) (R_2 is at least two A diamine compound represented by (representing a divalent organic group having a carbon number of ); and (c) an inorganic filler. (2) The bismaleimide compound represented by the general formula (I) in claim (1) and the diamine compound represented by the general formula (II) are prepolymerized and used. The resin composition for semiconductor encapsulation according to claim (1). (3) Essentially (a) General formula (I) in claim (1) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (I) (In the formula, R_1 is ▲ Numerical formulas, chemical formulas, tables, etc. There is▼
Or ▲There are mathematical formulas, chemical formulas, tables, etc.▼ Represents a divalent group consisting of represents a group selected from the group consisting of a sulfinyl group, a sulfonyl group, a sulfonyl group, or an oxide. ) A bismaleimide compound represented by (b) General formula (II) ▲ Numerical formula, chemical formula, table, etc. ▼ (II) (R_2 represents a divalent organic group having at least 2 carbon atoms. ), (c) an inorganic filler, and (d) a modified epoxy in which a silicone polymer is uniformly dispersed in a graft polymer of an epoxy resin and a vinyl polymer with an average particle diameter of 1.0μ or less. A resin composition for semiconductor encapsulation, comprising a resin. (4) Claim (3) is characterized in that the bismaleimide compound represented by the general formula (I) and the diamine compound represented by the general formula (II) are prepolymerized and used. The resin composition for semiconductor encapsulation according to claim (3). (5) In claim (3), the silicone polymer dispersed in the epoxy resin is a silicone rubber formed by reacting an addition reaction type silicone polymer and/or a soft vinyl mainly composed of a vinyl-modified silicone polymer. The resin composition for semiconductor encapsulation according to claim 3, which is a polymer.