JPH02204904A - Conductor paste and ceramics substate - Google Patents
Conductor paste and ceramics substateInfo
- Publication number
- JPH02204904A JPH02204904A JP2393489A JP2393489A JPH02204904A JP H02204904 A JPH02204904 A JP H02204904A JP 2393489 A JP2393489 A JP 2393489A JP 2393489 A JP2393489 A JP 2393489A JP H02204904 A JPH02204904 A JP H02204904A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- conductor paste
- ceramic substrate
- alumina
- percent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 43
- 239000000919 ceramic Substances 0.000 title claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 36
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 15
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000011521 glass Substances 0.000 claims abstract description 10
- 239000007787 solid Substances 0.000 claims abstract description 6
- 230000001070 adhesive effect Effects 0.000 abstract description 11
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 10
- 150000004706 metal oxides Chemical class 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052737 gold Inorganic materials 0.000 abstract description 6
- 239000010931 gold Substances 0.000 abstract description 6
- QPLDLSVMHZLSFG-UHFFFAOYSA-N CuO Inorganic materials [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract description 3
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 abstract description 3
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 abstract description 3
- 238000005336 cracking Methods 0.000 abstract description 2
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Chemical compound O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 abstract 4
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(II) oxide Inorganic materials [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 abstract 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 abstract 2
- 238000005476 soldering Methods 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 8
- 230000007547 defect Effects 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 235000013405 beer Nutrition 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- -1 Cub Chemical compound 0.000 description 2
- 206010016275 Fear Diseases 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000007806 chemical reaction intermediate Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は導体ペーストに関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a conductive paste.
［従来の技術］
従来実用化されているセラミックス基板用金導体ペース
トは、予め焼成されたアルミナ（Ａｌｔｏｎ ）等の基
板を対象としているため、グリーンシート上に印刷し、
同時に焼成すると導体にクラック、剥離を発生したり、
はなはだしい場合にはセラミックス基板に変形、反りな
どが発生すると・いう欠点がある。[Prior art] The gold conductor paste for ceramic substrates that has been put into practical use so far is intended for substrates made of pre-sintered alumina (Alton), etc., so it is printed on a green sheet.
If fired at the same time, the conductor may crack or peel.
In severe cases, the ceramic substrate may become deformed or warped, which is a drawback.
更には、導体のセラミックス基板への接着性が低下する
という欠点を有している。Furthermore, it has the disadvantage that the adhesion of the conductor to the ceramic substrate is reduced.
［発明の解決しようとする課題］
本発明の目的は、従来技術が有していた前述の欠点を解
消しようとするものであり、従来知られていなかった導
体ペースト等を新規に提供することを目的とするもので
ある。[Problems to be Solved by the Invention] The purpose of the present invention is to solve the above-mentioned drawbacks of the prior art, and to provide a new conductive paste etc. that has not been previously known. This is the purpose.
［課題を解決するための手段］
本発明は、前述の課題を解決すべくなされたものであり
、鉛又はアルミナを含有したセラミックス基板に使用さ
れる導体ペーストにおいて、固形分が重量％表示で実質
的に
金粉末 ９２〜９９．９９％ガラス
フリット ０〜５％
Ｔａ＊Ｏｓ＋ Ｎｂ２Ｏｉ、 Ｆｅａｒｓ、 Ｃｏｏ、
ＺｎＯ，Ｃｕｂ、 Ｃｕ２Ｏの内掛なくとも１種
０．旧〜３％
からなることを特徴とする導体ペースト等を提供するも
のである。[Means for Solving the Problems] The present invention has been made to solve the above-mentioned problems, and is directed to a conductor paste used for ceramic substrates containing lead or alumina, in which the solid content is substantially reduced in weight percent. Gold powder 92-99.99% Glass frit 0-5% Ta*Os+ Nb2Oi, Fears, Coo,
At least one type of ZnO, Cub, Cu2O
0. The present invention provides a conductor paste, etc., characterized in that it consists of ~3%
本発明は金導体ペーストにＴａｔＯｓ、Ｎｂ１０ｇ。In the present invention, 10 g of TatOs and Nb are added to the gold conductor paste.
Ｆｅａｒｓ、ＣｏＯ，ＺｎＯ，ＣｕＯ，ＣｕａＯ等の金
属酸化物（以下、接着力向上金属酸化物という。）を添
加することによってアルミナ又は鉛を含有するセラミッ
クス基板との接着性等を改善しようとするものである。Products that attempt to improve adhesion to ceramic substrates containing alumina or lead by adding metal oxides such as Fears, CoO, ZnO, CuO, and CuaO (hereinafter referred to as adhesion-improving metal oxides). It is.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明にかかる導体ペーストの固形分の成分を以下に述
べる。尚、％は特に記載しない限り重量％を意味する。The solid components of the conductive paste according to the present invention will be described below. Note that % means weight % unless otherwise specified.
金粉末 ９２〜９９．９９％ガラ
スフリット Ｏ〜５％接着力向上金属酸化
物 ０．Ｏ１〜３％順次、これらについて説明する
。Gold powder 92-99.99% Glass frit O-5% Adhesion improving metal oxide 0. These will be explained in order from O1 to 3%.
本発明にかかる金粉末は導体を構成する成分であり、必
須の成分であって、本発明の導体ペースト中の金粉末の
割合が９２％より少ないとシート抵抗値が増大するので
好ましくなく、そして、金粉末の割合が９９．９９％よ
り多いと、相対的に接着力向上金属酸化物やガラスフリ
ットの添加量が少なくなり、以下に述べる欠点が生じる
ので好ましくない。The gold powder according to the present invention is a component constituting the conductor and is an essential component, and if the proportion of gold powder in the conductor paste of the present invention is less than 92%, the sheet resistance value increases, which is undesirable. If the proportion of gold powder is more than 99.99%, the amount of adhesion-improving metal oxide or glass frit added becomes relatively small, which is not preferable because the following disadvantages occur.
ガラスフリットは、本発明においては、必須の成分では
ないが、導体の基板への接着力を、多少向上させる作用
があるため、本発明の導体ペーストの総量に対して０〜
５％添加することが好ましい。５％より多いと、導体の
シート抵抗が大きくなると共に半田濡れ性が低下するの
で好ましくない、望ましくは０．１〜３％であり、特に
望ましくは０，２５〜０．７５％である。Glass frit is not an essential component in the present invention, but it has the effect of somewhat improving the adhesive strength of the conductor to the substrate, so it is added in a proportion of 0 to 100% relative to the total amount of the conductive paste of the present invention.
It is preferable to add 5%. If it is more than 5%, the sheet resistance of the conductor increases and the solder wettability decreases, which is undesirable.The content is preferably 0.1 to 3%, and particularly preferably 0.25 to 0.75%.
接着力向上金属酸化物は、ＴａｚＯｉ、ＮｂａＯｓ。The adhesive strength improving metal oxides are TazOi and NbaOs.
Ｆｅｚｅｓ、 Ｃｏｄ、 ＺｎＯ，Ｃｕｂ、 ＣｕｚＯ
等から選ばれた少な（とも１つであり、本発明の導体ペ
ーストの固形分の総量に対して０．０１〜３％添加され
ることにより、導体のセラミックス基板への接着強度を
向上させ、かつ、導体のクラック、剥離等の欠陥を防止
する効果を有する。上記接着力向上金属酸化物の添加量
が０．０１％未満ではその効果は少なく、３％より多い
と、導体にクラック、剥離が発生したり、半田濡れ性が
低下するので好ましくない、望ましい範囲は０．１−１
％であり、特に望ましくは０．２５〜０．７５％である
。Fezes, Cod, ZnO, Cub, CuzO
By adding 0.01 to 3% of the total solid content of the conductor paste of the present invention, the adhesion strength of the conductor to the ceramic substrate is improved. It also has the effect of preventing defects such as cracks and peeling of the conductor.If the amount of the adhesion-improving metal oxide added is less than 0.01%, the effect will be small, and if it is more than 3%, it will cause cracks and peeling of the conductor. This is undesirable as it may cause the occurrence of smudges or reduce solder wettability, but the desirable range is 0.1-1.
%, particularly desirably 0.25 to 0.75%.
本発明に係る接着力向上金属酸化物は、導体のセラミッ
クス基板との接着力を向上させる効果を有し、金属と酸
素の酸化化合物であれば、特には限定されないが、Ｔａ
２Ｏｓ＋ＮｂｔＯｓ、ＦｅＪｓ。The adhesive strength improving metal oxide according to the present invention has the effect of improving the adhesive strength between a conductor and a ceramic substrate, and is not particularly limited as long as it is an oxidized compound of a metal and oxygen.
2Os+NbtOs, FeJs.
Ｃｏｄ、 ＺｎＯ，Ｃｕｂ、 ＣｕａＯ等から選ばれた
少な（とも１つであることが望ましい。At least one (preferably one) selected from Cod, ZnO, Cub, CuaO, etc.
本発明において多層のセラミックス基板は次のようにし
て製造される。アルミナ粉末、ガラスフリット等のセラ
ミックスの原料粉にブチラール樹脂２アクリル樹脂等の
有機バインダー フタル酸ジブチル、フタル酸ジオクチ
ル、フタル酸ブチル−ベンジル等の可塑剤、トルエン、
アルコール等の溶剤を添加し混練してスラリーを作製す
る。そして、該スラリーをシート状に成形し、いわゆる
グリーンシートが作成される。該グリーンシートにヴイ
アホール用等の穴を開け、表面に本発明の導体ペースト
を所定の回路に印刷する。In the present invention, a multilayer ceramic substrate is manufactured as follows. Ceramic raw material powder such as alumina powder and glass frit, organic binder such as butyral resin 2 acrylic resin, plasticizer such as dibutyl phthalate, dioctyl phthalate, butyl-benzyl phthalate, toluene,
A solvent such as alcohol is added and kneaded to prepare a slurry. Then, the slurry is formed into a sheet shape to create a so-called green sheet. Holes such as via holes are made in the green sheet, and the conductive paste of the present invention is printed on the surface in a predetermined circuit.
ヴイアホールには本発明の導体ペーストが満たされる０
次にこれらの印刷されたグリーンシートを所定の枚数重
ね合わせ、熱圧着により積層化し、空気中等の酸化性雰
囲気内で１０００℃以下の温度にて焼成して多層のセラ
ミックス基板となる。このようにして製造された多層の
セラミックス基板は回路が絶縁基板を介して多層に積層
されたものとなる。尚、本発明の金ペーストは、単層の
セラミックス基板の表面にも使用できる。The via hole is filled with the conductive paste of the present invention.
Next, a predetermined number of these printed green sheets are superimposed, laminated by thermocompression bonding, and fired at a temperature of 1000° C. or lower in an oxidizing atmosphere such as air to obtain a multilayer ceramic substrate. The multilayer ceramic substrate manufactured in this manner has circuits laminated in multiple layers with an insulating substrate interposed therebetween. Incidentally, the gold paste of the present invention can also be used on the surface of a single-layer ceramic substrate.
例えば、単層のグリーンシートの表面に印刷等の方法に
よって形成され、当該グリーンシートと同時に焼成でき
る。また焼成後の固化したアルミナやガラスセラミック
ス等の基板上に印刷等の方法によって本発明の導体ペー
ストを形成した後、焼成してもよい。For example, it can be formed on the surface of a single-layer green sheet by a method such as printing, and fired at the same time as the green sheet. Alternatively, the conductive paste of the present invention may be formed on a substrate made of alumina, glass ceramics, or the like that has been solidified after firing by a method such as printing, and then fired.
なお、本発明の導体ペーストはＭｇ、 Ｃａ、 Ｓｒ。Note that the conductive paste of the present invention includes Mg, Ca, and Sr.
Ｂａ、Ｎａ、に、Ｆｅ、Ｃｕ、Ｚｎ、Ｎｉ、Ｚｒ、Ｔｉ
、Ｓｎ、Ｓｂ、Ａｌ、Ｓｔ、Ｇａ。Ba, Na, Fe, Cu, Zn, Ni, Zr, Ti
, Sn, Sb, Al, St, Ga.
Ｃｅ等を少な（とも１つ酸化物換算で０゜２％程度含有
していてもよい。It may contain a small amount of Ce, etc. (approximately 0.2% in terms of oxide).
また前記セラミックス基板に含有されている鉛は、酸化
鉛に換算してセラミックス基板の無機成分に対して０．
５〜６０％含有されていれば本発明にかかる接着力が発
生する。Further, the lead contained in the ceramic substrate is 0.0% in terms of lead oxide relative to the inorganic components of the ceramic substrate.
If the content is 5 to 60%, the adhesive force according to the present invention is generated.
更に前記セラミックス基板に含有されているアルミナは
、セラミックス基板の無機成分に対して１０〜１００％
含有されていれば本発明にかかる接着力が発生する。Furthermore, the alumina contained in the ceramic substrate is 10 to 100% of the inorganic components of the ceramic substrate.
If it is contained, the adhesive force according to the present invention will be generated.
［作用］
本発明にかかる接着力向上金属酸化物の作用は必ずしも
明確ではないが、ＴａａＯｓ、ＮｂｘＯｓの場合はグリ
ーンシート中又は焼成後の固化したセラミックス基板中
の鉛と反応してＰｂＴａｘＯａ。[Function] The function of the adhesion-improving metal oxide according to the present invention is not necessarily clear, but in the case of TaaOs and NbxOs, it reacts with lead in the green sheet or in the ceramic substrate solidified after firing to form PbTaxOa.
ｐｂＮｂｚｏａ等の反応物を生成し、Ｆｅａｒｓ、 Ｃ
ｏｏ、 ＺｎＯ。generating reactants such as pbNbzoa, Fears, C
oo, ZnO.
Ｃｕｂ、 Ｃｕ、０の場合はグリーンシート中又は焼成
後の固化したセラミックス基板中のアルミナと反応して
（Ｆｅ−Ａｌ）２０ｍ、３Ｃ００・Ａ１１０．．３Ｚ
ｎＯ−Ａ１２０！等の反応物を生成して導体とセラミッ
クス基板中に拡散し、導体とセラミックス基板との界面
に強固な反応中間物を生成するため、導体のセラミック
ス基板との接着強度が向上する効果を生ずるものと考え
られる。In the case of Cub, Cu, 0, it reacts with the alumina in the green sheet or the solidified ceramic substrate after firing (Fe-Al) 20m, 3C00/A110. ．． 3Z
nO-A120! This product generates reactants such as, diffuses into the conductor and ceramic substrate, and generates strong reaction intermediates at the interface between the conductor and the ceramic substrate, which has the effect of improving the adhesive strength between the conductor and the ceramic substrate. it is conceivable that.
［実施例１
１）、グリーンシート
アルミナ粉末６０％と、アルミナ７％、 Ｐｂ０４０％
、 ５ｉＯａ ４５ ％、 Ｂａ０ｎ ５％、 ＭｇＯ
＋ＣａＯ＋ＳｒＯ＋ＢａＯ３％からなるガラスフリット
４０％との混合物に有機バインダー、可塑剤、溶剤等
を添加し混練してスラリーを作成した。[Example 1 1) Green sheet alumina powder 60%, alumina 7%, Pb0 40%
, 5iOa 45%, Ba0n 5%, MgO
An organic binder, a plasticizer, a solvent, etc. were added to a mixture with 40% glass frit consisting of +CaO+SrO+3% BaO and kneaded to prepare a slurry.
次いでこのスラリーをシートに成形し、乾燥することに
よりグリーンシートを作成した。Next, this slurry was formed into a sheet and dried to create a green sheet.
ｉｉ）、導体ペースト
金粉末とアルミナｌＯ％、 ＰｂＯ２０％、 ５ｉＯｚ
３５％、 Ｂ、０．１５％、 Ｃａ０２０％からなる
ガラスフリットを［表−１］に示した割合で調合した。ii), Conductor paste gold powder and alumina lO%, PbO20%, 5iOz
A glass frit consisting of 35%, B, 0.15%, and 20% Ca was prepared in the proportions shown in [Table 1].
これに印刷性を付与するためにエチルセルロース樹脂、
ブチルカルピトールからなる有機ビヒクルを添加し、ア
ルミナ磁性乳鉢中で１時間混合した後、三本ロールにて
、分散し、導体ペーストを作製した。Ethyl cellulose resin is used to give printability to this.
An organic vehicle consisting of butyl calpitol was added, mixed for 1 hour in an alumina magnetic mortar, and then dispersed using three rolls to prepare a conductive paste.
Ｌｉｔ）、試料の作製
グリーンシート上に［表−１］に示した組成の導体ペー
ストをスクリーン印刷し、２０％ｍ厚のペースト層を形
成した。(Lit), Sample Preparation A conductor paste having the composition shown in [Table 1] was screen printed on a green sheet to form a paste layer with a thickness of 20% m.
次いでこれを乾燥後、空気雰囲気中で１００’Ｃ／ｈｒ
の速度で昇温し、９００℃で２０分間焼成しセラミック
ス基板上に導体層を形成した。Next, after drying this, it was heated at 100'C/hr in an air atmosphere.
The temperature was raised at a rate of 200° C. and fired at 900° C. for 20 minutes to form a conductor layer on the ceramic substrate.
このセラミックス基板について、導体の半田濡れ性、導
体のセラミックス基板への接着強度を示すビール強度、
導体のシート抵抗、導体の剥離、クラック、変形の有無
について評価し［表−１］の下段に示した。尚、［表−
１］の組成の単位は重量％である。Regarding this ceramic substrate, the solder wettability of the conductor, the beer strength, which indicates the adhesive strength of the conductor to the ceramic substrate,
The sheet resistance of the conductor and the presence or absence of peeling, cracking, and deformation of the conductor were evaluated and shown in the lower row of [Table 1]. Furthermore, [Table-
The composition unit of 1] is weight %.
［表−１］より明らかな如く、本発明の導体ペーストは
、半田濡れ性、ビール強度に優れ、シート抵抗も低く、
導体のクラック、剥離、変形等の欠陥のない優れた導体
ペーストである。As is clear from [Table 1], the conductor paste of the present invention has excellent solder wettability and beer strength, and has low sheet resistance.
This is an excellent conductor paste with no defects such as cracks, peeling, or deformation of the conductor.
なお、各特性の評価方法は次の通りである。The evaluation method for each characteristic is as follows.
［特性評価法］ ｌ）、剥離、クラック、変形等の欠陥 目視による外観検査 ｉｉ）、半田１需れ性 Ｓｎ ７０％、 Ｐｂ １ｇ％、 Ｉｎ １２％半田。[Characteristic evaluation method] l) Defects such as peeling, cracks, deformation, etc. Visual appearance inspection ii), Demand for solder 1 Sn 70%, Pb 1g%, In 12% solder.
２１０℃±５℃、５秒間デイツプ後、半田の濡れた面積
割合を評価した。After dipping at 210°C±5°C for 5 seconds, the wetted area ratio of the solder was evaluated.
１ｉｉ）、ビール強度試験
０．８Φすずメツキ軟銅線を金導体に半田付し、その銅
線を垂直折り曲げ後、引っ張り試験により評価した。1ii) Beer Strength Test A 0.8Φ tin-plated annealed copper wire was soldered to a gold conductor, and the copper wire was bent vertically and evaluated by a tensile test.
ｉｖ）、高温放置後、ビール強度試験
０．８Φすずメツキ銅線を導体に半田付し、１５０℃、
ｔｏｏｏ時間放置後、引っ張り試験にて評価した。iv) After leaving it at high temperature, solder the beer strength test 0.8Φ tin-plated copper wire to the conductor and heat it at 150℃.
After being left for too long, it was evaluated by a tensile test.
■）、シート抵抗
Ｙ、）１．Ｐ １＋７デジタルマルチメーターにより測
定評価した。■), sheet resistance Y,)1. Measurement and evaluation were performed using a P1+7 digital multimeter.
［発明の効果］
本発明の導体ペーストは、セラミック基板上に剥離、ク
ラック、変形等の欠陥のない導体を形成出来るだけでな
く、導体とセラミックス基板との接着力が向上し、さら
には、高温放置後においても接着力が低下しにくいとい
う信頼性に優れた効果を有し、特に多層のセラミックス
基板用導体ペーストとして機能を発揮し、その工業的価
値は多大である。[Effects of the Invention] The conductor paste of the present invention not only can form a conductor free from defects such as peeling, cracks, and deformation on a ceramic substrate, but also improves the adhesive strength between the conductor and the ceramic substrate, and can withstand high temperatures. It has a highly reliable effect in that the adhesive strength does not easily decrease even after being left standing, and it particularly functions as a conductor paste for multilayer ceramic substrates, and its industrial value is great.
Claims (4)
用される導体ペーストにおいて、固形分が重量％表示で
実質的に 金粉末 ９２〜９９．９９％ ガラスフリット ０〜５％ Ｔａ＿２Ｏ＿５，Ｎｂ＿２Ｏ＿５，Ｆｅ＿２Ｏ＿３，Ｃ
ｏＯ，ＺｎＯ，ＣｕＯ，Ｃｕ＿２Ｏの内少なくとも１種
０．０１〜３％からなることを特徴とする導体ペース
ト。(1) In the conductor paste used for ceramic substrates containing lead or alumina, the solid content in weight percent is substantially gold powder 92 to 99.99% Glass frit 0 to 5% Ta_2O_5, Nb_2O_5, Fe_2O_3, C
A conductive paste comprising 0.01 to 3% of at least one of oO, ZnO, CuO, and Cu_2O.
セラミックス基板。(2) A ceramic substrate fired using the conductor paste described in item 1.
用される導体ペーストにおいて、固形分が重量％表示で
実質的に 金粉末 ９２〜９９．９９％ ガラスフリット ０．１〜３％ Ｔａ＿２Ｏ＿５，Ｎｂ＿２Ｏ＿５，Ｆｅ＿２Ｏ＿３，Ｃ
ｏＯ，ＺｎＯ，ＣｕＯ，Ｃｕ＿２Ｏの内少なくとも１種
０．０１〜３％ からなることを特徴とする導体ペースト。(3) In the conductor paste used for ceramic substrates containing lead or alumina, the solid content in weight percent is substantially gold powder 92 to 99.99% Glass frit 0.1 to 3% Ta_2O_5, Nb_2O_5, Fe_2O_3 ,C
A conductive paste comprising 0.01 to 3% of at least one of oO, ZnO, CuO, and Cu_2O.
セラミックス基板。(4) A ceramic substrate fired using the conductor paste described in item 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2393489A JPH02204904A (en) | 1989-02-03 | 1989-02-03 | Conductor paste and ceramics substate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2393489A JPH02204904A (en) | 1989-02-03 | 1989-02-03 | Conductor paste and ceramics substate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02204904A true JPH02204904A (en) | 1990-08-14 |
Family
ID=12124359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2393489A Pending JPH02204904A (en) | 1989-02-03 | 1989-02-03 | Conductor paste and ceramics substate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02204904A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0695724A1 (en) * | 1994-08-01 | 1996-02-07 | E.I. Du Pont De Nemours And Company | Cadmium-free and lead-free thick film conductor composition |
| EP1385204A3 (en) * | 2002-07-17 | 2006-01-25 | Ngk Spark Plug Co., Ltd | Copper paste and wiring board using the same |
| JP2006344582A (en) * | 2005-04-25 | 2006-12-21 | E I Du Pont De Nemours & Co | Thick film conductor paste composition for ltcc tape in microwave application |
| JP2012221765A (en) * | 2011-04-11 | 2012-11-12 | Tdk Corp | Paste for conductor, glass ceramic substrate and electronic component module |
| CN114999703A (en) * | 2022-07-26 | 2022-09-02 | 南通俊丰新材料科技有限公司 | Conductive paste for improving acid resistance and preparation method and application thereof |
-
1989
- 1989-02-03 JP JP2393489A patent/JPH02204904A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0695724A1 (en) * | 1994-08-01 | 1996-02-07 | E.I. Du Pont De Nemours And Company | Cadmium-free and lead-free thick film conductor composition |
| EP1385204A3 (en) * | 2002-07-17 | 2006-01-25 | Ngk Spark Plug Co., Ltd | Copper paste and wiring board using the same |
| US7291789B2 (en) | 2002-07-17 | 2007-11-06 | Ngk Spark Plug Co., Ltd. | Copper paste and wiring board using the same |
| JP2006344582A (en) * | 2005-04-25 | 2006-12-21 | E I Du Pont De Nemours & Co | Thick film conductor paste composition for ltcc tape in microwave application |
| JP2012221765A (en) * | 2011-04-11 | 2012-11-12 | Tdk Corp | Paste for conductor, glass ceramic substrate and electronic component module |
| CN114999703A (en) * | 2022-07-26 | 2022-09-02 | 南通俊丰新材料科技有限公司 | Conductive paste for improving acid resistance and preparation method and application thereof |
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