JPH0220367U - - Google Patents
Info
- Publication number
- JPH0220367U JPH0220367U JP9862888U JP9862888U JPH0220367U JP H0220367 U JPH0220367 U JP H0220367U JP 9862888 U JP9862888 U JP 9862888U JP 9862888 U JP9862888 U JP 9862888U JP H0220367 U JPH0220367 U JP H0220367U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- thermal conductivity
- high thermal
- hollowed out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9862888U JPH0220367U (uk) | 1988-07-25 | 1988-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9862888U JPH0220367U (uk) | 1988-07-25 | 1988-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0220367U true JPH0220367U (uk) | 1990-02-09 |
Family
ID=31325072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9862888U Pending JPH0220367U (uk) | 1988-07-25 | 1988-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0220367U (uk) |
-
1988
- 1988-07-25 JP JP9862888U patent/JPH0220367U/ja active Pending