JPH02201811A - Conductive resin mixture - Google Patents
Conductive resin mixtureInfo
- Publication number
- JPH02201811A JPH02201811A JP1019630A JP1963089A JPH02201811A JP H02201811 A JPH02201811 A JP H02201811A JP 1019630 A JP1019630 A JP 1019630A JP 1963089 A JP1963089 A JP 1963089A JP H02201811 A JPH02201811 A JP H02201811A
- Authority
- JP
- Japan
- Prior art keywords
- polyamide
- carbon black
- polyphenylene ether
- acid
- phase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims description 14
- 239000011347 resin Substances 0.000 title claims description 14
- 239000000203 mixture Substances 0.000 title claims description 13
- 239000004952 Polyamide Substances 0.000 claims abstract description 45
- 229920002647 polyamide Polymers 0.000 claims abstract description 45
- 229920001955 polyphenylene ether Polymers 0.000 claims abstract description 30
- 239000006229 carbon black Substances 0.000 claims abstract description 22
- 238000002156 mixing Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 abstract description 8
- 150000004985 diamines Chemical class 0.000 abstract description 4
- 150000001413 amino acids Chemical class 0.000 abstract description 3
- 150000003951 lactams Chemical class 0.000 abstract description 2
- 229920006122 polyamide resin Polymers 0.000 abstract description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 15
- -1 poly(2,6-dimethyl-1,4-phenylene) Polymers 0.000 description 11
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 9
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 8
- 239000004793 Polystyrene Substances 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- 229920002223 polystyrene Polymers 0.000 description 8
- 239000008188 pellet Substances 0.000 description 7
- 229920002292 Nylon 6 Polymers 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 239000011342 resin composition Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 239000004594 Masterbatch (MB) Substances 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 229920002302 Nylon 6,6 Polymers 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000009503 electrostatic coating Methods 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920003052 natural elastomer Polymers 0.000 description 2
- 229920001194 natural rubber Polymers 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- NJMOHBDCGXJLNJ-UHFFFAOYSA-N trimellitic anhydride chloride Chemical compound ClC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 NJMOHBDCGXJLNJ-UHFFFAOYSA-N 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- GWWBILGABMLVTN-UHFFFAOYSA-N 1-but-1-enyl-2,3-dimethylbenzene Chemical group CCC=CC1=CC=CC(C)=C1C GWWBILGABMLVTN-UHFFFAOYSA-N 0.000 description 1
- WAEOXIOXMKNFLQ-UHFFFAOYSA-N 1-methyl-4-prop-2-enylbenzene Chemical group CC1=CC=C(CC=C)C=C1 WAEOXIOXMKNFLQ-UHFFFAOYSA-N 0.000 description 1
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 1
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- MBRGOFWKNLPACT-UHFFFAOYSA-N 5-methylnonane-1,9-diamine Chemical compound NCCCCC(C)CCCCN MBRGOFWKNLPACT-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 241000238557 Decapoda Species 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229920002633 Kraton (polymer) Polymers 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical group NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 241000282320 Panthera leo Species 0.000 description 1
- 241000872198 Serjania polyphylla Species 0.000 description 1
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- OXIKYYJDTWKERT-UHFFFAOYSA-N [4-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCC(CN)CC1 OXIKYYJDTWKERT-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
- MAYCNCJAIFGQIH-UHFFFAOYSA-N buta-1,3-diene 5-phenylpenta-2,4-dienenitrile Chemical compound C=CC=C.N#CC=CC=CC1=CC=CC=C1 MAYCNCJAIFGQIH-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003262 carboxylic acid ester group Chemical group [H]C([H])([*:2])OC(=O)C([H])([H])[*:1] 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- XENVCRGQTABGKY-ZHACJKMWSA-N chlorohydrin Chemical compound CC#CC#CC#CC#C\C=C\C(Cl)CO XENVCRGQTABGKY-ZHACJKMWSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000003484 crystal nucleating agent Substances 0.000 description 1
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 1
- OYOFUEDXAMRQBB-UHFFFAOYSA-N cyclohexylmethanediamine Chemical compound NC(N)C1CCCCC1 OYOFUEDXAMRQBB-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920005676 ethylene-propylene block copolymer Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000004438 haloalkoxy group Chemical group 0.000 description 1
- 125000001188 haloalkyl group Chemical group 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000005462 imide group Chemical group 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 150000003955 ε-lactams Chemical group 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、カーボンブラックを含有して表面抵抗を低下
されている、ポリフェニレンエーテル及びポリアミドよ
り成る樹脂混合物及びその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a resin mixture comprising polyphenylene ether and polyamide, which contains carbon black to reduce surface resistance, and a method for producing the same.
熱可塑性樹脂の多くは非導電性であり、従って熱可塑性
樹脂の成形品を静電塗装するためには導電性プライマー
を下塗するか、導電性粒子・フレーク、特に導電性カー
ボンブラックを混入している。ポリフェニレンエーテル
とポリアミドとを含む樹脂組成物は、バランスのとれた
物性の故に多用されつつあり、成形品を静電塗装する要
求がある。Many thermoplastic resins are non-conductive, so in order to electrostatically paint molded thermoplastic resin products, they must be primed with a conductive primer or mixed with conductive particles or flakes, especially conductive carbon black. There is. Resin compositions containing polyphenylene ether and polyamide are increasingly being used because of their well-balanced physical properties, and there is a demand for electrostatic coating of molded products.
(発明が解決しようとする課題)
本発明は、ポリフェニレンエーテルとポリアミドを含む
樹脂組成物に導電性粒子を混入して、成形品の表面抵抗
を下げて静電塗装を適するようにするにおいて、より少
い量の導電性粒子で目的を達成しようとするものである
。(Problems to be Solved by the Invention) The present invention provides a method for reducing the surface resistance of a molded article by mixing conductive particles into a resin composition containing polyphenylene ether and polyamide to make it suitable for electrostatic coating. The goal is to achieve this goal with a small amount of conductive particles.
本発明者は、ポリフェニレンエーテルとポリアミドを含
む樹脂組成物にカーボンブラックを混入するにおいて、
カーボンブラックを特定の相、即ちポリアミド相に主に
含有せしめることにより、上記課題が解決されることを
見出した。The present inventor has discovered that in mixing carbon black into a resin composition containing polyphenylene ether and polyamide,
It has been found that the above problem can be solved by mainly containing carbon black in a specific phase, that is, the polyamide phase.
すなわち本発明は、ポリフェニレンエーテル、ポリアミ
ド及びカーボンブラックを含む導電性樹脂混合物におい
て、カーボンブラックが主にポリアミド相中に含有され
ることを特徴とする導電性樹脂混合物である。That is, the present invention is a conductive resin mixture containing polyphenylene ether, polyamide, and carbon black, characterized in that carbon black is mainly contained in the polyamide phase.
また本発明は、ポリフェニレンエーテル、ポリアミド及
びカーボンブラックを含む導電性樹脂混合物を作る方法
において、予めカーボンブラックをポリアミド中へ均一
分散させた後、これとポリフェニレンエーテルとを混合
することを特徴とする方法である。The present invention also provides a method for producing a conductive resin mixture containing polyphenylene ether, polyamide, and carbon black, which is characterized in that carbon black is uniformly dispersed in polyamide in advance, and then this is mixed with polyphenylene ether. It is.
カーボンブラックは、微細粒子が連なっている導電性カ
ーボンブラックが好ましい。The carbon black is preferably a conductive carbon black in which fine particles are connected.
本発明においてポリフェニレンエーテルとは、それ自体
公知であり、たとえば一般式(A)(式中R1,R2,
R3,並びにR4は水素、ハロゲン、アルキル基、アル
コキシ基、ハロゲン原子とフェニル環との間に少くとも
2個の炭素原子を有するハロアルキル基及びハロアルコ
キシ基で第3級α−炭素を含まないものから選んだ一価
置換基を示し、nは重合度を表わす整数である)
で表わされる重合体の総称であって、上記一般式で表わ
される重合体の一種単独であっても、二種以上が組合わ
された共重合体であってもよい。好ましい具体例ではR
1及びR2は炭素原子数1〜4のアルキル基であり、R
3,R4は水素もしくは炭素原子数1〜4のアルキル基
である。例えばポリ(2,6−シメチルー1,4−フェ
ニレン)エーテル、ポリ(2,6−ジエチル−1,4−
フエニレン)エーテル、ポリ(2−メチル−6−エチル
−1,4−フエニレン)エーテル、ポリ(2−メチル−
6プロビルー1,4−フェニレン)エーテル、ポリ(2
,6−ジプロビルー1,4−フェニレン)エーテル、ポ
リ(2−エチル−6−ブロビルー1,4−フェニレン)
エーテル、などが挙げられる。特に好ましいポリフェニ
レンエーテル樹脂はポリ(2,6−シメチルー1,4−
フェニレン)エーテルである。またポリフェニレンエー
テル共重合体としては上記ポリフェニレンエーテル繰返
し単位中にアルキル三置換フェノールたとえば2,3.
6− トリメチルフェノールを一部含有する共重合体を
挙げることができる。またこれらのポリフェニレンエー
テルに、スチレン系化合物がグラフトした共重合体であ
ってもよい。スチレン系化合物グラフト化ポリフェニレ
ンエーテルとしては上記ポリフェニレンエーテルに、ス
チレン系化合物として、例えばスチレン、α−メチルス
チレン、ビニルトルエン、クロルスチレンなどをグラフ
ト重合して得られる共重合体である。In the present invention, polyphenylene ether is known per se, and includes, for example, the general formula (A) (wherein R1, R2,
R3 and R4 are hydrogen, halogen, alkyl group, alkoxy group, haloalkyl group and haloalkoxy group having at least two carbon atoms between the halogen atom and the phenyl ring, and do not contain a tertiary α-carbon (indicates a monovalent substituent selected from It may also be a copolymer in which these are combined. In a preferred embodiment, R
1 and R2 are alkyl groups having 1 to 4 carbon atoms, and R
3, R4 is hydrogen or an alkyl group having 1 to 4 carbon atoms. For example, poly(2,6-dimethyl-1,4-phenylene) ether, poly(2,6-diethyl-1,4-
phenylene) ether, poly(2-methyl-6-ethyl-1,4-phenylene) ether, poly(2-methyl-
6-probyl-1,4-phenylene) ether, poly(2
, 6-diprobyl-1,4-phenylene) ether, poly(2-ethyl-6-brobyl-1,4-phenylene)
Examples include ether. A particularly preferred polyphenylene ether resin is poly(2,6-cymethyl-1,4-
phenylene) ether. Further, as polyphenylene ether copolymers, alkyl trisubstituted phenols such as 2, 3.
A copolymer partially containing 6-trimethylphenol can be mentioned. Alternatively, a copolymer in which a styrene compound is grafted onto these polyphenylene ethers may be used. The styrene-based compound-grafted polyphenylene ether is a copolymer obtained by graft polymerizing a styrene-based compound such as styrene, α-methylstyrene, vinyltoluene, chlorostyrene, etc. to the above-mentioned polyphenylene ether.
本発明で用いるポリアミド樹脂は、アミノ酸、ラクタム
、あるいはジアミンとジカルボン酸を主たる構成成分と
するポリアミドである。構成成分の具体例を挙げるとε
−カプロラクタム、エナントラクタム、ω−ラウロラク
タムなどのラクタム、ε−アミノカプロン酸、11−ア
ミノウンデカン酸、12−アミノドデカン酸などのアミ
ノ酸、テトラメチレンジアミン、ヘキサメチレンジアミ
ン、ウンデカメヂレンジアミン、ドデカメチレンジアミ
ン、2.2.4− / 2,4.4− トリメチルへキ
サメチレンジアミン、5−メチルノナメチレンジアミン
、mキシリレンジアミン、p−キシリレンジアミン、1
.3−ビスアミノメチルシクロヘキサン、1,4−ビス
アミノメチルシクロヘキサン、ビス−p−アミノシクロ
ヘキシルメタン、ビス−p−アミノシクロヘキシルプロ
パン、イソホロンジアミンなどのジアミン、アジピン酸
、スペリン酸、アゼライン酸、セバシン酸、ドデカンニ
酸、1.4−シクロヘキサンジカルボン酸、1.3−シ
クロヘキサンジカルボン酸、テレフタル酸、イソフタル
酸、ナフタレンジカルボン酸、ダイマー酸などのジカル
ボン酸がおる。これらの構成成分は単独あるいは二種以
上の混合物の形で重合に供され、そうして得られるポリ
アミドホモポリマー、コポリマーいずれも本発明で用い
ることができる。特に本発明で有用に用いられるポリア
ミドはポリカプロアミド(ナイロン6)、ポリへキザメ
チレンアジパミド(ナイロン66)、ポリへキサメチレ
ンセバカミド(ナイロン610)、ポリウンデカンアミ
ド(ナイロン11)、ポリドデカンアミド(ナイロン1
2)、そしてこれらポリアミドの共重合体及び混合物で
ある。ここで用いられるポリアミドの重合度については
特に制限がなく、1%濃硫酸溶液の25℃における相対
粘度がたとえば1.5〜5.0の範囲内にあるものを任
意に用いることができる。The polyamide resin used in the present invention is a polyamide whose main components are an amino acid, a lactam, or a diamine and a dicarboxylic acid. A specific example of a constituent component is ε
- Lactams such as caprolactam, enantlactam, ω-laurolactam, amino acids such as ε-aminocaproic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid, tetramethylenediamine, hexamethylenediamine, undecamethylenediamine, dodecamethylene Diamine, 2.2.4-/2,4.4-trimethylhexamethylenediamine, 5-methylnonamethylenediamine, m-xylylenediamine, p-xylylenediamine, 1
.. Diamines such as 3-bisaminomethylcyclohexane, 1,4-bisaminomethylcyclohexane, bis-p-aminocyclohexylmethane, bis-p-aminocyclohexylpropane, isophoronediamine, adipic acid, speric acid, azelaic acid, sebacic acid, There are dicarboxylic acids such as dodecanionic acid, 1,4-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, terephthalic acid, isophthalic acid, naphthalene dicarboxylic acid, and dimer acid. These constituent components may be subjected to polymerization alone or in the form of a mixture of two or more thereof, and both polyamide homopolymers and copolymers thus obtained can be used in the present invention. Polyamides particularly useful in the present invention include polycaproamide (nylon 6), polyhexamethylene adipamide (nylon 66), polyhexamethylene sebaamide (nylon 610), polyundecaneamide (nylon 11), Polydodecanamide (nylon 1
2), and copolymers and mixtures of these polyamides. There is no particular restriction on the degree of polymerization of the polyamide used here, and any polyamide having a relative viscosity of 1% concentrated sulfuric acid solution at 25° C. within the range of, for example, 1.5 to 5.0 can be used.
これらのポリアミドの末端基は、通常、溶融粘度調整、
熱安定性の向上のため、末端封鎖等が行なわれており、
末端アミノ基対末端カルボキシル基のモル比(以下、末
端基比という)は1以下に抑えられている。本発明で用
いるポリアミドとしては、末端基比が1より大きいこと
が好ましい(しかし、これに限定されない)。このよう
なポリアミドは、ポリアミドの重合の際にたとえばカル
ボキシル基と反応する基を持つ化合物たとえばジアミン
を余分に添加することによって得ることができる。ある
いは、ポリアミドの重合の後に、たとえばカルボキシル
基と反応する基を有する化合物と反応させることによっ
ても得ることができる。末端基比が1より大きいポリア
ミドを用いると、末端基比が1以下のポリアミドを用い
た場合に比べて成形品の外観及び機械的強度が飛躍的に
良くなる。末端基比は、好ましくは1.1以上、より好
ましくは1.3以上である。The end groups of these polyamides are typically used for melt viscosity adjustment,
In order to improve thermal stability, terminal blocking etc. are carried out.
The molar ratio of terminal amino groups to terminal carboxyl groups (hereinafter referred to as terminal group ratio) is suppressed to 1 or less. The polyamide used in the present invention preferably has a terminal group ratio of greater than 1 (but is not limited thereto). Such a polyamide can be obtained by adding an extra compound having a group that reacts with a carboxyl group, such as a diamine, during the polymerization of the polyamide. Alternatively, it can also be obtained by polymerizing polyamide and then reacting it with a compound having a group that reacts with a carboxyl group. When a polyamide with an end group ratio of more than 1 is used, the appearance and mechanical strength of the molded article are dramatically improved compared to when a polyamide with an end group ratio of 1 or less is used. The terminal group ratio is preferably 1.1 or more, more preferably 1.3 or more.
本発明において好ましくは、ポリフェニレンエーテルの
量は5〜80重偕部、特に30〜70重量部、ポリアミ
ドの量は95〜20重1部、特に70〜30重量部であ
る。この量範囲から成る成形品中では、ポリフェニレン
エーテルは小さな粒子相としてポリアミドマトリックス
相中に分散している。両樹脂間の相溶性を改善するため
に、公知の相溶化剤たとえばクエン酸、リンゴ酸等のよ
うなポリカルボン酸及びその誘導体、無水マレイン酸の
ような分子内に(a)二重結合又は三重結合及び(b)
カルボン酸基、酸無水物基、酸アミド基、イミド基、カ
ルボン酸エステル基又はエボシキ基を有する化合物、無
水トリメリット酸クロライド等を挙げることができる。Preferably in the present invention, the amount of polyphenylene ether is from 5 to 80 parts by weight, especially from 30 to 70 parts by weight, and the amount of polyamide is from 95 to 20 parts by weight, especially from 70 to 30 parts by weight. In molded articles comprising this amount range, the polyphenylene ether is dispersed as a small particle phase in the polyamide matrix phase. In order to improve the compatibility between both resins, known compatibilizers such as polycarboxylic acids and their derivatives such as citric acid, malic acid, etc., maleic anhydride, etc., can contain (a) double bonds or triple bond and (b)
Examples include compounds having a carboxylic acid group, an acid anhydride group, an acid amide group, an imide group, a carboxylic acid ester group, or an eboxy group, trimellitic anhydride chloride, and the like.
これらの相溶化剤は1種又は2種以上の組合せにおいて
、場合によってはパーオキサイドと共に使用することが
できる。該相溶化剤は、本発明の樹脂組成物中に0.0
1〜10重量部の量で使用することが好ましい。These compatibilizers can be used alone or in combination of two or more, optionally together with peroxide. The compatibilizer is present in the resin composition of the present invention in an amount of 0.0
Preferably, it is used in an amount of 1 to 10 parts by weight.
ポリフェニレンエーテルとポリアミドを相溶化する方法
としては、単に相溶化剤を添加混合する方法あるいは予
じめポリフェニレンエーテルをクエン酸、無水マレイン
酸等と反応させて変性した後にポリアミドと混練する方
法等のいずれの方法を使用リーることもてきる。なお無
水トリメリット酸クロライドを用いてポリフェニレンエ
ーテルを変性する場合には、塩素受容体、例えば金属酸
化物を添加することが好ましい。Methods for making polyphenylene ether and polyamide compatible include a method of simply adding and mixing a compatibilizing agent, or a method of reacting polyphenylene ether with citric acid, maleic anhydride, etc. to modify it in advance, and then kneading it with polyamide. You can also use this method. Note that when polyphenylene ether is modified using trimellitic anhydride chloride, it is preferable to add a chlorine acceptor, such as a metal oxide.
本発明において好ましく用いられる導電性カーボンブラ
ックは、ペイント等に着色目的で加える顔料用カーボン
ブラックとは違って、微細な粒子が連なった形態をして
いるものであり、ケッチエンブラックとして市販されて
いる。The conductive carbon black preferably used in the present invention is different from the pigment carbon black that is added to paints etc. for the purpose of coloring, and has the form of a series of fine particles, and is commercially available as Ketchen Black. There is.
導電性カーボンブラックの量は好ましくは、ポリフェニ
ンエーテル及びポリアミドの合計100重量部に対して
1〜20重吊部、特に2〜10重量部である。The amount of conductive carbon black is preferably from 1 to 20 parts by weight, especially from 2 to 10 parts by weight, based on a total of 100 parts by weight of polyphenylene ether and polyamide.
本発明において樹脂混合物は、更に憤用の添加物を含む
ことができる。特に耐衝撃性の向上のためにゴム状重合
体をポリフェニレンエーテル及びポリアミドの合計10
0重量部に対して好ましくは20重間部以下の量で含む
ことができる。ゴム状重合体としてはスチレン−エチレ
ン−ブタジェン−スチレンブロック共重合体、スチレン
−ブタジェン−スチレンブロック共重合体、スチレン−
イソプレン−スチレンブロック共重合体、スチレン−エ
チレン−プロピレンブロック共重合体、スチレン−ブタ
ジェンブロック共重合体を挙げることができる。In the present invention, the resin mixture can further contain additives. In particular, to improve impact resistance, a total of 10% of rubber-like polymers are used, including polyphenylene ether and polyamide.
It can be contained preferably in an amount of 20 parts by weight or less relative to 0 parts by weight. Examples of rubbery polymers include styrene-ethylene-butadiene-styrene block copolymer, styrene-butadiene-styrene block copolymer, and styrene-butadiene-styrene block copolymer.
Examples include isoprene-styrene block copolymers, styrene-ethylene-propylene block copolymers, and styrene-butadiene block copolymers.
これらのゴム状重合体は水素化、部分水素化あるいは無
水マレイン酸等により酸変性されたものであることがで
きる。耐熱老化性を考慮した場合、水素化されたもので
あることが好ましい。These rubbery polymers may be hydrogenated, partially hydrogenated, or acid-modified with maleic anhydride or the like. In consideration of heat aging resistance, hydrogenated materials are preferred.
又、公知の如く加工性を向上するためにポリスチレン系
樹脂を添加することもできる。ポリスチ(式中Rは水素
または炭素原子数1〜4のアルキル基であり、Zはハロ
ゲンまたは炭素原子数1〜4のアルキル基である置換基
を示し、pは1〜5の整数である)
で示されるビニル芳香族化合物から誘導された繰返し構
造単位を、その重合体中に少くとも25重母%以上有す
るものでなければならない。Furthermore, as is well known, a polystyrene resin may be added to improve processability. Polystyrene (wherein R is hydrogen or an alkyl group having 1 to 4 carbon atoms, Z represents a substituent that is a halogen or an alkyl group having 1 to 4 carbon atoms, and p is an integer of 1 to 5) The polymer must contain at least 25% or more of repeating structural units derived from the vinyl aromatic compound represented by the formula.
かかるポリスチレン系樹脂としては例えばスチレンもし
くはその誘導体(たとえばα−メチルスチレン、ビニル
トルエン、ビニルキシレン、エチルビニルキシレン、ビ
ニルナフタレン及びこれらの混合物)の重合体並びに例
えばポリブタジェン、ポリイソプレン、ブチルゴム、E
PDMゴム、工ヂレンープロピレン共重合体、天然ゴム
、ポリスルフィドゴム、ポリウレタンゴム、エビクロロ
ヒドリンのごとき、天然又は合成エラストマー物質の混
合あるいは相互作用によって変性されたスチレン重合体
、更には、スチレン含有共重合体、例えば、スチレン−
アクリロニトリル共重合体(SAND、スチレン−ブタ
ジェン共重合体、スチレン−無水マレイン酸共重合体、
スチレン−アクリロニトリル−ブタジェンターポリマー
(ABS>、ポリ−α−メチル−スチレン、エチルビニ
ルベンゼンとジビニルベンゼンの共重合体などが挙げら
れる。更に、本発明のために好ましい樹脂はポリスチレ
ンホモポリマー、又はポリブタジェンゴムもしくはEP
DMゴムの3〜30重量%、好ましくは4〜12重量%
と混合、又はそれでグラフト化したゴム変性ポリスチレ
ンである。スチレン系樹脂の混合比率はポリフェニレン
エーテル樹脂及びポリアミドの優れた特性を損なわない
範囲にあるのが望ましく、従ってポリフェニレンエーテ
ルとポリアミドの合計5〜ioo重i部に対しスチレン
系樹脂95〜O重量部の比であることが好ましい。Such polystyrene resins include, for example, polymers of styrene or its derivatives (such as α-methylstyrene, vinyltoluene, vinylxylene, ethylvinylxylene, vinylnaphthalene, and mixtures thereof), as well as polybutadiene, polyisoprene, butyl rubber, E.
Styrenic polymers modified by mixing or interaction with natural or synthetic elastomer materials, such as PDM rubber, polyethylene-propylene copolymer, natural rubber, polysulfide rubber, polyurethane rubber, shrimp chlorohydrin, and also styrene. Containing copolymers, e.g. styrene-
Acrylonitrile copolymer (SAND, styrene-butadiene copolymer, styrene-maleic anhydride copolymer,
Examples include styrene-acrylonitrile-butadiene terpolymer (ABS), poly-α-methyl-styrene, copolymer of ethylvinylbenzene and divinylbenzene, etc. Further, preferred resins for the present invention are polystyrene homopolymer, or polystyrene homopolymer. Butadiene rubber or EP
3-30% by weight of DM rubber, preferably 4-12% by weight
Rubber-modified polystyrene mixed with or grafted with. The mixing ratio of the styrene resin is preferably within a range that does not impair the excellent properties of the polyphenylene ether resin and polyamide. Preferably, it is a ratio.
さらに本発明の樹脂組成物にはその物性を損なわない限
りにおいて樹脂の混合時、成形時に他の添加剤、たとえ
ば顔料、染料、補強剤、充填剤、耐熱剤、酸化劣化防止
剤、耐候剤、滑剤、離型剤、結晶核剤、可塑剤、難燃剤
、流動性改良剤、帯電防止剤などを添加することができ
る。Furthermore, the resin composition of the present invention may contain other additives such as pigments, dyes, reinforcing agents, fillers, heat resistant agents, oxidative deterioration inhibitors, weathering agents, A lubricant, a mold release agent, a crystal nucleating agent, a plasticizer, a flame retardant, a fluidity improver, an antistatic agent, etc. can be added.
本発明においてカーボンブラックを主にポリアミド相中
に含有せしめるためには、カーボンブラックをポリアミ
ド中に予め均一分散させた後に、ポリフェニレンエーテ
ルと混合する。こうすることによって、カーボンブラッ
クの過半、好ましくは70重量%以上、特に90重量%
以上、最も好ましくは95重量%以上がポリアミド相中
に含まれることになる。カーボンブラックをポリアミド
中に均一分散させるには、ポリアミドを溶融し、慣用の
混合手段で混合することができる。このために押出機、
ニーグー、ロールミキサー、バンバリーミキサ−などを
使用できる。続くポリフェニレンエーテルとの混合にお
いてもこれら慣用の手段を使用できる。In order to contain carbon black mainly in the polyamide phase in the present invention, carbon black is uniformly dispersed in the polyamide in advance and then mixed with polyphenylene ether. By doing so, the majority of the carbon black, preferably 70% by weight or more, especially 90% by weight
Most preferably, 95% by weight or more is contained in the polyamide phase. To uniformly disperse the carbon black in the polyamide, the polyamide can be melted and mixed by conventional mixing means. For this, an extruder,
You can use a Nigoo, roll mixer, Banbury mixer, etc. These conventional means can also be used in the subsequent mixing with polyphenylene ether.
本発明における導電性樹脂混合物とは、上記のような混
合物及び成形品を包含するものとする。The conductive resin mixture in the present invention includes the above-mentioned mixtures and molded products.
実施例
実施例で用いたポリフェニレンエーテルは、ポリ(2,
6−シメチルー1.4−フェニレン)エーテル(NOr
VI:商標、エンジニアリングプラスチックス株式会社
、クロロホルム中25℃での固有粘度0.48dρ/7
)である。Examples The polyphenylene ether used in the examples was poly(2,
6-dimethyl-1,4-phenylene)ether (NOr
VI: Trademark, Engineering Plastics Co., Ltd., intrinsic viscosity in chloroform at 25°C 0.48 dρ/7
).
ポリアミドは、ナイロン6(商標、ユニチカナイロン樹
脂A 8030A >である。The polyamide is nylon 6 (trademark, Unitika Nylon Resin A 8030A).
ゴム状重合体として5EBS(商標、クレイトン(31
651、シェル化学株式会社)を用いた。As a rubbery polymer, 5EBS (trademark, Kraton (31
651, Shell Chemical Co., Ltd.) was used.
また、ポリスチレン(商標、デイックスチレンCR35
00、大日本インキ化学工業株式会社も添加した。In addition, polystyrene (trademark, Dick Styrene CR35
00, Dainippon Ink & Chemicals Co., Ltd. was also added.
導電性カーボンブラックとしては、ケッチエンブラック
EC600JD(ライオン株式会社)を用いた。As the conductive carbon black, Ketchien Black EC600JD (manufactured by Lion Corporation) was used.
シリンダー温度270℃に設定した二軸押出機を用いて
、92重吊部のナイロン6と8重間部のケッチエンブラ
ックを均一に溶融混練し、押し出し、マスターぺ1ノツ
トを作った。Using a twin-screw extruder set at a cylinder temperature of 270° C., nylon 6 with a 92-fold suspension and Ketchen Black with an 8-fold suspension were uniformly melted and kneaded and extruded to make a master pellet.
次に該ペレットを表1に示す重量比で他の成分と予め均
一にトライブレンドした後に、シリンダー温度300’
Cに設定した二軸押出機を用いて押出し、ペレットを作
った。得たペレッ1〜を120°Cで4時間乾燥した後
、シリンダー温度280’C1金型濡度80℃に設定し
た射出成形機を用いて50x 50X3fflll+の
試験片を作成した。Next, the pellets were triblended uniformly with other ingredients in the weight ratio shown in Table 1, and then the cylinder temperature was 300'.
Pellets were made by extrusion using a twin screw extruder set at C. After drying the obtained pellets 1 to 1 at 120°C for 4 hours, test pieces of 50x50x3ffllll+ were prepared using an injection molding machine set at a cylinder temperature of 280'C1 and a mold wetness of 80°C.
得た試験片の表面抵抗を測定した。結果を表1に示す。The surface resistance of the obtained test piece was measured. The results are shown in Table 1.
比較例
200℃に設定したパンバリーミキナーを用いて80重
量部の溶融したポリスチレン中に20重量部の導電性カ
ーボンブラックを均一に練り込み次に200℃に設定し
た二軸押出機を用いてマスターペレットを作った。Comparative Example 20 parts by weight of conductive carbon black was uniformly kneaded into 80 parts by weight of molten polystyrene using a Panbury mixer set at 200°C, and then using a twin screw extruder set at 200°C. I made a master pellet.
該マスターペレッ1〜を表1に示す重量比の他の成分と
予め均一にトライブレンドした。以下、実施例と同様に
押出し、ペレットを作り、同様に試験片を作った。The master pellets 1 to 1 were homogeneously triblended in advance with other components in the weight ratios shown in Table 1. Thereafter, pellets were made by extrusion in the same manner as in Examples, and test pieces were made in the same manner.
用いた夫々の樹脂の量及び導電性カーボンブラックの量
は、実施例と比較例とで同じである。The amounts of each resin and the amount of conductive carbon black used were the same in the Examples and Comparative Examples.
表
ナイロン6マスターバッチ
37.5
ボ1ノスチレンマスターバッチ
(うらケッチエンブラック)
ポリフェニレンエーテル
クエン酸
(3,0)
(3,0)
ナイロン6
(ナイロン6の合計量)
6.5
ポリスチレン
(ポリスチレンの合計量)
上記衣より、実施例と比較例とては全く同じ組成である
にも拘らず、実施例においては成形品の表面抵抗が著し
く低いことが判る。Table Nylon 6 Masterbatch 37.5 Bo1 Nostyrene Masterbatch (Uraketchen Black) Polyphenylene Ether Citric Acid (3,0) (3,0) Nylon 6 (Total amount of Nylon 6) 6.5 Polystyrene (Polystyrene Total amount) From the above coating, it can be seen that although the Examples and Comparative Examples have exactly the same composition, the surface resistance of the molded product in the Examples is significantly lower.
Claims (2)
ブラックを含む導電性樹脂混合物において、カーボンブ
ラックが主にポリアミド相中に含有されることを特徴と
する導電性樹脂混合物。1. A conductive resin mixture containing polyphenylene ether, polyamide and carbon black, characterized in that the carbon black is mainly contained in the polyamide phase.
ブラックを含む導電性樹脂混合物を作る方法において、
予めカーボンブラックをポリアミド中へ均一分散させた
後、これとポリフェニレンエーテルとを混合することを
特徴とする方法。2. A method of making a conductive resin mixture comprising polyphenylene ether, polyamide and carbon black,
A method characterized by uniformly dispersing carbon black in polyamide in advance and then mixing this with polyphenylene ether.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1019630A JP2756548B2 (en) | 1989-01-31 | 1989-01-31 | Conductive resin mixture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1019630A JP2756548B2 (en) | 1989-01-31 | 1989-01-31 | Conductive resin mixture |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02201811A true JPH02201811A (en) | 1990-08-10 |
JP2756548B2 JP2756548B2 (en) | 1998-05-25 |
Family
ID=12004522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1019630A Expired - Lifetime JP2756548B2 (en) | 1989-01-31 | 1989-01-31 | Conductive resin mixture |
Country Status (1)
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JP (1) | JP2756548B2 (en) |
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EP0506386A2 (en) * | 1991-03-29 | 1992-09-30 | Sumitomo Chemical Company Limited | Antistatic resin compositions |
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EP0692136A1 (en) † | 1993-03-31 | 1996-01-17 | Hyperion Catalysis International, Inc. | High strength conductive polymers |
EP0866098A1 (en) * | 1997-03-17 | 1998-09-23 | General Electric Company | Electrically conductive polyphenylene ether-polyamide compositions |
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JP2002544308A (en) * | 1999-05-07 | 2002-12-24 | ゼネラル・エレクトリック・カンパニイ | Conductive composition whose volume resistivity is controlled by its composition |
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WO2004060980A1 (en) * | 2002-12-26 | 2004-07-22 | Asahi Kasei Kabushiki Kaisha | Conductive master batch and conductive resin composition |
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US6866798B2 (en) | 2000-02-15 | 2005-03-15 | Asahi Kasei Kabushiki Kaisha | Polyamide composition |
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US6894100B2 (en) | 2000-04-26 | 2005-05-17 | Asahi Kasei Kabushiki Kaisha | Electrically conductive resin composition and production process thereof |
US6919394B2 (en) | 2000-04-26 | 2005-07-19 | Asahi Kasei Kabushiki Kaisha | Electrically conductive resin composition and production process thereof |
JP2005200664A (en) * | 2002-12-26 | 2005-07-28 | Asahi Kasei Chemicals Corp | Preparation process of conductive masterbatch |
JP2005281616A (en) * | 2004-03-30 | 2005-10-13 | Asahi Kasei Chemicals Corp | Polyamide/polyphenylene ether resin composition |
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