JPH0220148U - - Google Patents
Info
- Publication number
- JPH0220148U JPH0220148U JP9823788U JP9823788U JPH0220148U JP H0220148 U JPH0220148 U JP H0220148U JP 9823788 U JP9823788 U JP 9823788U JP 9823788 U JP9823788 U JP 9823788U JP H0220148 U JPH0220148 U JP H0220148U
- Authority
- JP
- Japan
- Prior art keywords
- constant
- liquid tank
- temperature
- temperature liquid
- inner lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims description 9
- 238000010586 diagram Methods 0.000 description 5
Landscapes
- Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
- Control Of Non-Electrical Variables (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9823788U JPH0220148U (cs) | 1988-07-25 | 1988-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9823788U JPH0220148U (cs) | 1988-07-25 | 1988-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0220148U true JPH0220148U (cs) | 1990-02-09 |
Family
ID=31324323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9823788U Pending JPH0220148U (cs) | 1988-07-25 | 1988-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0220148U (cs) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5230142B2 (cs) * | 1973-07-28 | 1977-08-05 | ||
| JPS58186063A (ja) * | 1982-04-24 | 1983-10-29 | Nippon Telegr & Teleph Corp <Ntt> | 樹脂封止形半導体装置の耐湿性試験方法 |
-
1988
- 1988-07-25 JP JP9823788U patent/JPH0220148U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5230142B2 (cs) * | 1973-07-28 | 1977-08-05 | ||
| JPS58186063A (ja) * | 1982-04-24 | 1983-10-29 | Nippon Telegr & Teleph Corp <Ntt> | 樹脂封止形半導体装置の耐湿性試験方法 |
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