JPH0220129U - - Google Patents
Info
- Publication number
- JPH0220129U JPH0220129U JP9893488U JP9893488U JPH0220129U JP H0220129 U JPH0220129 U JP H0220129U JP 9893488 U JP9893488 U JP 9893488U JP 9893488 U JP9893488 U JP 9893488U JP H0220129 U JPH0220129 U JP H0220129U
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- pressure sensor
- temperature fluid
- pressure
- force transducer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012530 fluid Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000002485 combustion reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１図は本考案に係る圧力センサを燃焼圧セン
サとして形成した場合の好適な一例を示す説明図
、第２図は従来の燃焼圧センサの説明図である。
１０……ダイヤフラム部、１０ａ……接合用凸
部、１４……力変換素子、１６……ブロツク部、
１６ａ……接合用凹部。
FIG. 1 is an explanatory diagram showing a preferred example of the pressure sensor according to the present invention formed as a combustion pressure sensor, and FIG. 2 is an explanatory diagram of a conventional combustion pressure sensor. 10...Diaphragm part, 10a...Joining convex part, 14...Force conversion element, 16...Block part,
16a...Joining recess.
Claims (1)
の圧力を、圧縮力として力変換素子に伝達し、力
変換素子から出力される電気信号に基づき高温流
体の圧力を測定する圧力センサにおいて、 熱容量の大きいブロツク部に設けられた接合用
凹部を、前記ダイヤフラム部の表面中央部付近に
設けられた接合用凸部に接合し、ブロツク部をダ
イヤフラム部の表面に取り付け固定したことを特
徴とする高温流体用の圧力センサ。 (2) 実用新案登録請求の範囲(1)記載のセンサに
おいて、 前記ダイヤフラム部は、高温でのバネ特性のよ
い材料を用いて形成され、 前記放熱ブロツク部は、比熱、熱伝導が大きい
材料を用いて形成されたことを特徴とする高温流
体用の圧力センサ。[Claims for Utility Model Registration] (1) The pressure of the high-temperature fluid acting on the surface of the diaphragm is transmitted as compressive force to a force transducer, and the pressure of the high-temperature fluid is adjusted based on the electrical signal output from the force transducer. In the pressure sensor to be measured, a bonding recess provided in a block portion with a large heat capacity is bonded to a bonding convex portion provided near the center of the surface of the diaphragm portion, and the block portion is attached and fixed to the surface of the diaphragm portion. A pressure sensor for high temperature fluids. (2) In the sensor according to claim (1), the diaphragm part is formed of a material with good spring characteristics at high temperatures, and the heat dissipation block part is formed of a material with high specific heat and thermal conductivity. A pressure sensor for high-temperature fluid, characterized in that it is formed using
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988098934U JPH0619068Y2 (en) | 1988-07-26 | 1988-07-26 | Pressure sensor for high temperature fluids |
| US07/384,817 US4993266A (en) | 1988-07-26 | 1989-07-25 | Semiconductor pressure transducer |
| DE89113807T DE68905967T2 (en) | 1988-07-26 | 1989-07-26 | Piezoresistive Si single crystal pressure transducer. |
| EP89113807A EP0352773B1 (en) | 1988-07-26 | 1989-07-26 | Piezoresistive si single crystal pressure transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988098934U JPH0619068Y2 (en) | 1988-07-26 | 1988-07-26 | Pressure sensor for high temperature fluids |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0220129U true JPH0220129U (en) | 1990-02-09 |
| JPH0619068Y2 JPH0619068Y2 (en) | 1994-05-18 |
Family
ID=31325634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988098934U Expired - Lifetime JPH0619068Y2 (en) | 1988-07-26 | 1988-07-26 | Pressure sensor for high temperature fluids |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0619068Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009122076A (en) * | 2007-11-19 | 2009-06-04 | Nippon Soken Inc | Structure of mounting pressure sensor |
| JP2011163915A (en) * | 2010-02-09 | 2011-08-25 | Toyota Central R&D Labs Inc | Pressure sensor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3857287A (en) * | 1972-05-08 | 1974-12-31 | Kistler Instrumente Ag | Pressure transducers |
| JPS6327845U (en) * | 1986-08-05 | 1988-02-24 |
-
1988
- 1988-07-26 JP JP1988098934U patent/JPH0619068Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3857287A (en) * | 1972-05-08 | 1974-12-31 | Kistler Instrumente Ag | Pressure transducers |
| JPS6327845U (en) * | 1986-08-05 | 1988-02-24 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009122076A (en) * | 2007-11-19 | 2009-06-04 | Nippon Soken Inc | Structure of mounting pressure sensor |
| JP2011163915A (en) * | 2010-02-09 | 2011-08-25 | Toyota Central R&D Labs Inc | Pressure sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0619068Y2 (en) | 1994-05-18 |
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