JPH02199184A - Radiation-curable pressure-sensitive adhesive composition - Google Patents
Radiation-curable pressure-sensitive adhesive compositionInfo
- Publication number
- JPH02199184A JPH02199184A JP2046689A JP2046689A JPH02199184A JP H02199184 A JPH02199184 A JP H02199184A JP 2046689 A JP2046689 A JP 2046689A JP 2046689 A JP2046689 A JP 2046689A JP H02199184 A JPH02199184 A JP H02199184A
- Authority
- JP
- Japan
- Prior art keywords
- radiation
- sensitive adhesive
- adhesive composition
- curable pressure
- modified
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 19
- 239000000203 mixture Substances 0.000 title claims description 28
- 239000005062 Polybutadiene Substances 0.000 claims abstract description 36
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 36
- 229920001451 polypropylene glycol Polymers 0.000 claims abstract description 17
- 239000012986 chain transfer agent Substances 0.000 claims abstract description 10
- 239000003112 inhibitor Substances 0.000 claims abstract description 7
- DAHPIMYBWVSMKQ-UHFFFAOYSA-N n-hydroxy-n-phenylnitrous amide Chemical compound O=NN(O)C1=CC=CC=C1 DAHPIMYBWVSMKQ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 5
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 125000000524 functional group Chemical group 0.000 claims abstract description 4
- -1 methacryloyl group Chemical group 0.000 claims description 16
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 6
- 238000012546 transfer Methods 0.000 claims description 6
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 5
- 238000012719 thermal polymerization Methods 0.000 claims description 5
- 239000004970 Chain extender Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- 239000003607 modifier Substances 0.000 claims description 2
- 150000002832 nitroso derivatives Chemical group 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 abstract description 36
- 239000000853 adhesive Substances 0.000 abstract description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 238000013329 compounding Methods 0.000 abstract 1
- 230000014759 maintenance of location Effects 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 description 10
- 239000010959 steel Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 230000005855 radiation Effects 0.000 description 6
- 239000002313 adhesive film Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000003973 paint Substances 0.000 description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 238000005984 hydrogenation reaction Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 238000003847 radiation curing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 230000005865 ionizing radiation Effects 0.000 description 2
- 238000010551 living anionic polymerization reaction Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- HJUGFYREWKUQJT-UHFFFAOYSA-N tetrabromomethane Chemical compound BrC(Br)(Br)Br HJUGFYREWKUQJT-UHFFFAOYSA-N 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 1
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- GOJUJUVQIVIZAV-UHFFFAOYSA-N 2-amino-4,6-dichloropyrimidine-5-carbaldehyde Chemical group NC1=NC(Cl)=C(C=O)C(Cl)=N1 GOJUJUVQIVIZAV-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- SYUYTOYKQOAVDW-UHFFFAOYSA-N 2-nitrosonaphthalen-1-ol Chemical compound C1=CC=C2C(O)=C(N=O)C=CC2=C1 SYUYTOYKQOAVDW-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical group C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- UBJVUCKUDDKUJF-UHFFFAOYSA-N Diallyl sulfide Natural products C=CCSCC=C UBJVUCKUDDKUJF-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- YLKFDHTUAUWZPQ-UHFFFAOYSA-N N-Nitrosodi-n-propylamine Chemical compound CCCN(N=O)CCC YLKFDHTUAUWZPQ-UHFFFAOYSA-N 0.000 description 1
- UWSDONTXWQOZFN-UHFFFAOYSA-N N-nitrosopiperidine Chemical compound O=NN1CCCCC1 UWSDONTXWQOZFN-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical class CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910052801 chlorine Chemical group 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 229940117389 dichlorobenzene Drugs 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 150000002019 disulfides Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 229920006158 high molecular weight polymer Polymers 0.000 description 1
- 238000004128 high performance liquid chromatography Methods 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000000018 nitroso group Chemical group N(=O)* 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003204 osmotic effect Effects 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- DVQHRBFGRZHMSR-UHFFFAOYSA-N sodium methyl 2,2-dimethyl-4,6-dioxo-5-(N-prop-2-enoxy-C-propylcarbonimidoyl)cyclohexane-1-carboxylate Chemical compound [Na+].C=CCON=C(CCC)[C-]1C(=O)CC(C)(C)C(C(=O)OC)C1=O DVQHRBFGRZHMSR-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- UIYCHXAGWOYNNA-UHFFFAOYSA-N vinyl sulfide Chemical group C=CSC=C UIYCHXAGWOYNNA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は感圧性接着テープ類、特にカラー鋼板の表面保
護フィルムに用いられる放射線硬化型感圧性接着剤組成
物に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a radiation-curable pressure-sensitive adhesive composition used for pressure-sensitive adhesive tapes, particularly for surface protection films of color steel plates.
(従来の技術)
従来、表面保護フィルムは天然ゴムや合成ゴムなどの高
分子重合体を適当な有機溶剤に溶解した粘着剤t8液を
、プラスチックフィルムなどの基材上に塗布し、乾燥す
ることによって製造されてきた。しかし、近年、省資源
・省エネルギー・無公害及び安全性といった見地から無
溶剤化が検討されている。無溶剤化対策の一つとして、
液状オリゴマを利用した放射線硬化型接着剤がある。か
かる接着剤は比較的低分子量の液状オリゴマを基材上に
塗布したものに、電離性放射線を照射することによって
、基材上で高分子量化するものである。(Prior art) Conventionally, surface protection films have been produced by applying adhesive T8 liquid, which is made by dissolving a high molecular weight polymer such as natural rubber or synthetic rubber in an appropriate organic solvent, onto a base material such as a plastic film and drying it. has been manufactured by. However, in recent years, the use of solvents has been considered from the viewpoints of resource saving, energy saving, non-pollution, and safety. As one of the measures to eliminate solvents,
There are radiation-curable adhesives that use liquid oligomers. Such adhesives have a relatively low molecular weight liquid oligomer coated on a base material and are irradiated with ionizing radiation to increase the molecular weight on the base material.
このような液状オリゴマとしてブタジェンを低度に重合
させたポリブタジェンを用いることは既に公知である。It is already known to use polybutadiene obtained by polymerizing butadiene to a low degree as such a liquid oligomer.
ポリブタジェンとしてはl、4−型と1.2−型とがあ
るが、1.4−型はガラス転移点が低すぎるなどの理由
で、特に表面保護フィルムに必要な高速剥離性・高温接
着力などの粘着特性が出せない、そこで、特開昭63−
196680号公報に示されるように、1.2−型で、
主鎖または側鎖のビニル性二重結合を水素添加し、末端
に不飽和二重結合を導入したポリブタジェンの変性体に
、チオール化合物などの連鎖移動剤を配合してなる粘着
剤組成物がtiXされている。この組成物は表面保護フ
ィルムとしての基本的な粘着特性、例えば常態の接着性
、剥離性などはほとんど満足できるものである。There are two types of polybutadiene: l,4-type and 1.2-type, but 1.4-type has too low a glass transition point, so it is not suitable for high-speed peeling and high-temperature adhesive strength, which is especially necessary for surface protection films. It was difficult to obtain adhesive properties such as JP-A-63-
As shown in Publication No. 196680, it is a 1.2-type,
tiX is an adhesive composition made by blending a chain transfer agent such as a thiol compound with a modified polybutadiene in which vinylic double bonds in the main chain or side chain are hydrogenated and unsaturated double bonds are introduced at the terminals. has been done. This composition has almost satisfactory basic adhesive properties as a surface protection film, such as normal adhesion and releasability.
(発明が解決しようとする課題)
しかしながら、アルミ板や鉄板などに塗料を塗装したい
わいるカラー鋼板に、前記ポリブタジェンの変性体から
なる放射線硬化型粘着剤組成物の表面保護用粘着フィル
ムを使用すると、以下の問題点があった。即ち、この粘
着フィルムをカラー鋼板の加工や運搬等の使用終了後’
Jl離すると、カラー鋼板の塗装面が光沢変化する。こ
の現象を調ぺると、一般に言われている粘着剤のカラー
鋼板への転着やカラー鋼板塗料の粘着剤への転着などと
は異なり、塗装面の形状変化(凹凸)であることがわか
った、この原因は粘着剤が塗料よりも硬いためであり、
解決策としては粘着剤のTg(ガラス転移温度)を低く
すれば良いと考えられる。(Problem to be Solved by the Invention) However, if a surface protection adhesive film of a radiation-curable adhesive composition made of a modified polybutadiene is used on a so-called colored steel plate coated with paint on an aluminum plate or iron plate, , there were the following problems. In other words, this adhesive film can be used after processing or transporting color steel sheets.
When Jl is released, the painted surface of the colored steel plate changes in gloss. When this phenomenon was investigated, it was found that it is different from the generally known transfer of adhesive to the colored steel plate or transfer of color steel plate paint to the adhesive, and that it is due to changes in the shape of the painted surface (unevenness). This is because the adhesive is harder than the paint.
A possible solution is to lower the Tg (glass transition temperature) of the adhesive.
その具体的方法として、まず第一に低いTgの1゜4型
のポリブタジェン変性体を添加することが挙げられる。As a specific method, first of all, a 1°4-type polybutadiene modified product having a low Tg is added.
ここで、1.4型のポリブタジェン変性体の場合も、1
.2型と同様、耐候性をはじめとする適切な粘着特性を
維持するためには、主鎖のビニル性二重結合を水素添加
することが必要である。しかしながら、この1.4型を
水素添加すると、化学構造から推定されるように、ポリ
エチレンと類似特性を示す、つまり、結晶性が増すとと
もにワックス杖となり、粘着剤としての見かけ上の低T
g化が図れず、前記形状変化の問題点は解決されないう
えに、粘着剤組成物は粘度が上昇して塗工が難しいなど
の新たな問題も生じる。Here, in the case of 1.4-type polybutadiene modified product, 1
.. Similar to type 2, hydrogenation of the vinyl double bonds in the main chain is necessary to maintain appropriate adhesive properties, including weather resistance. However, when type 1.4 is hydrogenated, it exhibits properties similar to polyethylene, as estimated from its chemical structure, that is, it becomes more crystalline and becomes a wax cane, making it an apparent low-T adhesive.
g, and the above problem of shape change is not solved, and new problems arise such as the viscosity of the pressure-sensitive adhesive composition increases and coating becomes difficult.
次に、問題となるカラー鋼板は一般に建材用として屋根
や壁、家電用としてビデオデイツキ、ステレオのアンプ
・チューナーのハウジングと使用される。ところが、最
近は加工工程の簡略化などの合理化を目的とするため、
塗料は軟質化する傾向にある。即ち、塗料の硬さを鉛筆
硬度で表現すると、従来のHあるいは2Hから、Bある
いは2Bである。その結果、従来の粘着剤組成物からな
る粘着フィルムを使用した場合、前記形状変化による塗
装面の光沢変化という問題点は増々顕著になる傾向であ
る。Next, the colored steel sheets in question are generally used for building materials such as roofs and walls, and for home appliances such as video decks and housings for stereo amplifiers and tuners. However, recently, as the purpose of streamlining such as simplifying the processing process,
Paints tend to become softer. That is, if the hardness of the paint is expressed in terms of pencil hardness, it is B or 2B instead of the conventional H or 2H. As a result, when a pressure-sensitive adhesive film made of a conventional pressure-sensitive adhesive composition is used, the problem of a change in the gloss of the coated surface due to the change in shape tends to become more and more noticeable.
本発明はかかる状況に繻みなされたものであって、従来
の接着性や8m性などの表面保護用粘着フィルムの基本
特性は維持しながら、絞り加工などの工程を経た後に剥
離してもカラー鋼板表面の形状変化のない優れた放射線
硬化型接着剤組成物を提供することを目的とする。The present invention has been carefully designed to address this situation, and while maintaining the basic characteristics of conventional adhesive films for surface protection such as adhesiveness and 8-meter properties, the present invention retains its color even when peeled off after going through processes such as drawing. The purpose of the present invention is to provide an excellent radiation-curable adhesive composition that does not cause changes in the shape of the surface of a steel plate.
(1!111を解決するための手段)
本発明に係る放射線硬化型粘着WI&I成物は、特定の
構造を有する2種の液状オリゴマを主成分とする粘着剤
成分と連鎖移動剤および、熱重合禁止剤とからなり、更
に詳しくは90%以上の1,2型構造からなり、主鎖ま
たは側鎖のビニル性二重結合の90%以上が水素添加さ
れ、末端に不飽和二重結合を導入した数平均分子量が5
00乃至3゜000である変性ポリブタジェン100重
量部に対し、末端に不飽和二重結合を導入した数平均分
子量がi、ooo乃至20,000である変性ポリプロ
ピレングリコール5乃至50重量部、1分子中に官能基
を2個以上有する連鎖移動剤を0゜2乃至20重量部、
さらに熱重合禁止剤を0.001乃至10重量部配合し
てなる放射線硬化型粘着剤組成物に関する。(Means for solving 1!111) The radiation-curable adhesive WI&I composition according to the present invention comprises an adhesive component mainly composed of two types of liquid oligomers having a specific structure, a chain transfer agent, and a thermally polymerized adhesive component. More specifically, it consists of 90% or more of the 1,2 type structure, and 90% or more of the vinyl double bonds in the main chain or side chain are hydrogenated, and an unsaturated double bond is introduced at the terminal. The number average molecular weight is 5
5 to 50 parts by weight of modified polypropylene glycol having a number average molecular weight of i, ooo to 20,000 with an unsaturated double bond introduced at the terminal, per 1 molecule, per 100 parts by weight of modified polybutadiene having a molecular weight of 00 to 3°000. 0.2 to 20 parts by weight of a chain transfer agent having two or more functional groups;
The present invention further relates to a radiation-curable adhesive composition containing 0.001 to 10 parts by weight of a thermal polymerization inhibitor.
以下本発明につき詳述する。The present invention will be explained in detail below.
本発明に用いられる変性ポリブタジェンとは、次の一般
式(1)
(式中、R1,R1はそれぞれ水素原子、アルキル基、
シクロアルキル基、アリール基などの炭化水素基、ハロ
ゲン原子などの置換基を表す、ここでR,としては水素
原子、メチル基、塩素原子などが好ましい、またR8と
しては水素原子が好ましい、)
で表されるブタジェン類の中から選ばれる1種または2
種以上のものを、90%以上の1.2型構造となるリビ
ングアニオン重合によって得られるポリブタジェンオリ
ゴマを骨格構造とするものである。The modified polybutadiene used in the present invention has the following general formula (1) (wherein R1 and R1 are a hydrogen atom, an alkyl group,
Represents a hydrocarbon group such as a cycloalkyl group or an aryl group, or a substituent such as a halogen atom, where R is preferably a hydrogen atom, methyl group, or chlorine atom, and R8 is preferably a hydrogen atom). One or two selected from the butadines represented
The skeleton structure is a polybutadiene oligomer obtained by living anionic polymerization which results in a 1.2-type structure of 90% or more.
さらに、このポリブタジェンオリゴ7の分子内ビニル基
、すなわち、主鎖または側鎖のビニル性二重結合は90
%以上水素添加されたものである。Furthermore, the vinyl group in the molecule of this polybutadiene oligo 7, that is, the vinyl double bond in the main chain or side chain is 90
% or more hydrogenated.
水素添加率が90%未満では連鎖移動剤と併用すること
から、貯蔵時に暗反応を起こして増粘し、粘着剤として
使用不能となり易いこと、および、接着力の経時変化が
大きく脆いことなどが挙げられる。If the hydrogenation rate is less than 90%, since it is used in combination with a chain transfer agent, it may cause a dark reaction and thicken during storage, making it unusable as an adhesive. Also, adhesive strength may change over time and become brittle. Can be mentioned.
さらに、このポリブタジェンオリゴマは分子末端に、不
飽和二重結合を平均して1分子中に1個以上2個(すな
わち両末端)以下導入したものである。しかし、1個以
下では放射線硬化性が悪くなる。Furthermore, this polybutadiene oligomer has an average of 1 to 2 unsaturated double bonds (ie, at both ends) introduced into each molecule at the molecular ends. However, if there is less than one, radiation curability will be poor.
この不飽和二重結合としては、ビニルエステル系、ビニ
ルエーテル系、アクリル酸エステル系。Examples of this unsaturated double bond include vinyl ester, vinyl ether, and acrylic ester.
メタクリル酸エステル系、アクリルアミド系、メタクリ
ル酸アミド系などを挙げることができ6゜これらの具体
例を基として例示するならば、ビニルオキシ基、ビニル
オキシカルボニル基、アクリロイル基、メタクリロイル
基、アクリロイルアシド基、メタクリロイルアシド基、
アリル基、アIJ ルエーテル基、アリルチオエーテル
基、ビニルチオエーテル基などを挙げることができる。Examples include methacrylic acid ester type, acrylamide type, methacrylic acid amide type, etc. 6. Based on these specific examples, vinyloxy group, vinyloxycarbonyl group, acryloyl group, methacryloyl group, acryloyl acid group, methacryloyl acid group,
Examples include an allyl group, an allyl ether group, an allyl thioether group, and a vinyl thioether group.
特に硬化性の点から、高反応性のアクリロイル基やメタ
クリロイル基が好ましい。In particular, from the viewpoint of curability, highly reactive acryloyl groups and methacryloyl groups are preferred.
なお、ポリブタジェンオリゴマの分子末端の不飽和二重
結合は直接導入する方法もあるが、−数的には以下に示
すように末端変性剤あるいは鎖延長剤を介在して導入す
る。Although there is a method of directly introducing the unsaturated double bond at the molecular end of the polybutadiene oligomer, numerically it can be introduced through the intervention of a terminal modifier or chain extender as shown below.
即ち、水素添加された分子の両末端に水酸基。In other words, there are hydroxyl groups at both ends of the hydrogenated molecule.
カルボキシル基2アミノ基などの活性水素を有するポリ
ブタジェンオリゴマ(これらは市販されているものを使
用することができる)に鎖延長剤としてジイソシアネー
トを介したあと、(メタ)アクリル酸ヒドロキシエチル
等で変性して末端に不飽和二重結合を導入する。ここで
、鎖延長剤としてのジイソシアネートとしては、トリレ
ンジイソシアネート9 トリメチルへキサメチレンジイ
ソシアネート、ヘキサメチレンジイソシアネートなどが
あるが、耐熱性の点からトリレンジイソシアネートが特
に優れている。After passing a diisocyanate as a chain extender to a polybutadiene oligomer (commercially available products can be used) having active hydrogen such as a carboxyl group and 2 amino groups, it is treated with hydroxyethyl (meth)acrylate, etc. It is modified to introduce an unsaturated double bond at the end. Here, as the diisocyanate as a chain extender, there are tolylene diisocyanate 9, trimethylhexamethylene diisocyanate, hexamethylene diisocyanate, etc., but tolylene diisocyanate is particularly excellent from the viewpoint of heat resistance.
なお、本発明で使用する変性ポリブタジェンの分子量は
、通常の測定法、例えば浸透圧法、蒸気圧法、高速液体
クロマトグラフ法などによる数平均分子量で示すが、5
00以下では接着剤としての可とう性に欠けるほかに塗
布厚あたりの接着力が小さく、3,000以上では粘度
が高くなりすぎて無溶剤型にするのが困難であり、塗工
も難しい。The molecular weight of the modified polybutadiene used in the present invention is expressed as a number average molecular weight determined by a conventional measurement method, such as an osmotic pressure method, a vapor pressure method, or a high performance liquid chromatography method.
If it is less than 00, it lacks flexibility as an adhesive and the adhesive force per coated thickness is small, and if it is more than 3,000, the viscosity becomes too high, making it difficult to form a solvent-free type and making it difficult to apply.
次に、本発明に用いられる末端に不飽和二重結合を導入
した数千分子量が1.000乃至20゜000である変
性ポリプロピレングリコールとは、次の一般式〔…〕
(nは定数)
で示される構造であり、通常の縮合重合等によって得ら
れるポリエーテルが骨格である。Next, the modified polypropylene glycol used in the present invention with an unsaturated double bond introduced at the terminal and having a molecular weight of several thousand from 1.000 to 20°000 has the following general formula [...] (n is a constant). It has the structure shown, and the skeleton is polyether obtained by ordinary condensation polymerization.
従って、分子の両末端に存在する水酸基を前記変性ポリ
ブタジェンと同様に、トリレンジイソシアネートとアク
リル酸ヒドロキシエチル等と反応させて分子末端に不飽
和二重結合を平均して1分子中に1個以上2個以下導入
した変性プロピレングリコールを得る6分子量について
は、接着力や粘度の点から、数平均分子量でt、ooo
から2o、oooの範囲が望ましい。Therefore, the hydroxyl groups present at both ends of the molecule are reacted with tolylene diisocyanate, hydroxyethyl acrylate, etc. in the same manner as the modified polybutadiene described above, and an unsaturated double bond is created at the end of the molecule, with an average of one or more per molecule. Regarding the molecular weight to obtain modified propylene glycol with 2 or less introduced, from the point of view of adhesive strength and viscosity, the number average molecular weight is t, ooo
A range of 2o, ooo is desirable.
なお、配合量は、変性ポリブタジェン100重量部に対
して5乃至50重量部である。5重量部未満では、低T
g化が図れないため、カラー鋼板の形状変化の問題が解
消されない、一方50重量部以上では、逆にTgが低く
なりすぎて、高温接着力が低下するとともに浮きやすい
などの問題が生じる。なお、変性ポリブタジェンの分子
量が変化しても、変性ポリプロピレングリコールの配合
量は上記分子量範囲では同等と考えてよい。The blending amount is 5 to 50 parts by weight per 100 parts by weight of the modified polybutadiene. Less than 5 parts by weight, low T
g, the problem of shape change of the colored steel sheet cannot be solved. On the other hand, if it exceeds 50 parts by weight, the Tg becomes too low, leading to problems such as a decrease in high-temperature adhesive strength and a tendency to float. Note that even if the molecular weight of the modified polybutadiene changes, the amount of modified polypropylene glycol to be blended may be considered to be the same within the above molecular weight range.
次に、本発明に用いられる連鎖移動剤としては、エチレ
ングリコールジチオグリコレ−)、 1. 4−ブタ
ンジオールジチオプロピオネート トリメチロールプロ
パントリス−(β−チオプロピオネート)、ペンタエリ
スリトールテトラキス−(β−チオプロピオネート)な
どの多官能チオール化合物、ジフェニルジスルフィド等
の二硫化物、あるいは四塩化炭素、四臭化炭素、クロロ
ホルム。Next, as chain transfer agents used in the present invention, ethylene glycol dithioglycole), 1. 4-Butanediol dithiopropionate, polyfunctional thiol compounds such as trimethylolpropane tris-(β-thiopropionate), pentaerythritol tetrakis-(β-thiopropionate), disulfides such as diphenyl disulfide, or Carbon tetrachloride, carbon tetrabromide, chloroform.
ジクロロベンゼン等のハロゲン化合物が挙げられる。こ
れらは単独で用いてもよいし、また、2種以上混合して
用いてもよい、なお、好ましくは連鎖移動定数が108
以上のチオール化合物が適している。Examples include halogen compounds such as dichlorobenzene. These may be used alone or in combination of two or more, preferably having a chain transfer constant of 108
The above thiol compounds are suitable.
これらの連鎖移動剤は放射線硬化時の過剰に架橋するの
を抑制するために添加される。その目的のためには、そ
の配合量を0.2〜20重置%、好ましくは2〜15重
量%の範囲で選択する必要がある。この量が0.2重量
%未満であると、架橋抑制の効果が不充分となり、20
重量%を超えると硬化不充分で凝集力不足で接着特性に
悪影響を与える。These chain transfer agents are added to suppress excessive crosslinking during radiation curing. For that purpose, it is necessary to select the amount in the range of 0.2 to 20% by weight, preferably 2 to 15% by weight. If this amount is less than 0.2% by weight, the effect of suppressing crosslinking will be insufficient;
If it exceeds % by weight, curing is insufficient and cohesive force is insufficient, which adversely affects adhesive properties.
次に本発明で用いられる熱重合禁止剤としては、ハイド
ロキノンやハイドロキノンモノメチルエーテルなどのフ
ェノール類、β−ナフトキノンや2−エチルアントラキ
ノンなどのキノン類3 フェノチアジン、トリフェニル
メタン、ジフェニルビクリルヒドラジル、N−ニトロソ
ジフェニルアミンやN−ニトロソジプロピルアミンやニ
トロソナフトールやニトロソピペリジンやN−ニトロソ
フェニルヒドロキシアミンのアンモニウム塩あるいは金
属塩などのニトロソ系化合物などが挙げられる。Next, the thermal polymerization inhibitors used in the present invention include phenols such as hydroquinone and hydroquinone monomethyl ether, quinones such as β-naphthoquinone and 2-ethylanthraquinone, phenothiazine, triphenylmethane, diphenylvicrylhydrazyl, N Examples include nitroso-based compounds such as ammonium salts or metal salts of -nitrosodiphenylamine, N-nitrosodipropylamine, nitrosonaphthol, nitrosopiperidine, and N-nitrosophenylhydroxyamine.
それらの中でN−ニトロソフェニルヒドロキシアミンの
金属塩が効果的であり、特にアルミニウム塩が極めて有
利である。また、その配合量が0゜001重量部未満で
あると、貯蔵安定性の効果が少な(,10重量部を超え
ると、放射線重合反応において、重合阻害を起こすよう
になる。従って、配合量は0.001〜10重量部、特
に0.01〜1重量部であるのが好ましい。Among them, the metal salts of N-nitrosophenylhydroxyamine are effective, particularly the aluminum salts are very advantageous. In addition, if the amount is less than 0.001 parts by weight, the storage stability effect will be small (and if it exceeds 10 parts by weight, polymerization will be inhibited in the radiation polymerization reaction. It is preferably from 0.001 to 10 parts by weight, especially from 0.01 to 1 part by weight.
かかる熱重合禁止剤の添加方法としては、前記連鎖移動
剤に予め添加しておくか、又は配合時に添加してもよく
、添加方法により効果に差異を生じることはない。The thermal polymerization inhibitor may be added to the chain transfer agent in advance or may be added at the time of blending, and the effect will not vary depending on the addition method.
更に、本発明の粘着剤組成物は前記のような成分の他に
希釈モノマ、粘着付与剤1M化防止剤。Furthermore, in addition to the above-mentioned components, the adhesive composition of the present invention also contains a diluent monomer, a tackifier, and a 1M tackifier.
放射線硬化促進剤、紫外線吸収剤等の添加剤を含んでも
よく、少量の溶剤を含んでいてもよい、これらは、必要
に応じてその種類・組み合わせ・使用量等を適宜選定、
調節して用いることができる。It may contain additives such as radiation curing accelerators and ultraviolet absorbers, and it may also contain small amounts of solvents.
It can be adjusted and used.
本発明の粘着剤組成物は前記のような各種成分を配合し
て得られる。この粘着剤組成物をポリエチレンフィルム
等の基材に適切な塗布厚になるように塗布し、次いで放
射線で照射して硬化させることにより粘着フィルムとさ
れる。The adhesive composition of the present invention is obtained by blending the various components as described above. This pressure-sensitive adhesive composition is applied to a base material such as a polyethylene film to an appropriate coating thickness, and then irradiated with radiation to be cured to obtain a pressure-sensitive adhesive film.
本発明でいう放射線とは、活性エネルギー線であり、α
線、β線、T線、中性子線、加速電子線のような電離性
放射線をいう、その線量は、0゜5〜50 Mradの
範囲で使用できるが、1〜lOMrad程度が望ましい
、また、照射する場合に注意を要するのは照射雰囲気で
ある。つまり、発生したラジカルが空気中の酸素によっ
て阻害されるので場合により窒素等の不活性ガスを用い
て適当な酸素濃度にすることが必要である。The radiation referred to in the present invention refers to active energy rays, α
Ionizing radiation such as rays, β-rays, T-rays, neutron beams, and accelerated electron beams can be used at a dose in the range of 0°5 to 50 Mrad, but preferably about 1 to 10 Mrad. When doing so, care must be taken regarding the irradiation atmosphere. That is, since the generated radicals are inhibited by oxygen in the air, it may be necessary to use an inert gas such as nitrogen to maintain an appropriate oxygen concentration.
(作用)
本発明にかかる感圧性接着剤組成物は、放射線により硬
化させることができ、種々の優れた作用効果を奏する0
本発明で使用する変性ポリブタジェンや変性ポリプロピ
レングリコールは両末端に放射線官能基を有するため、
放射線硬化後に自由末端鎖がなく、架橋点間分子量が大
きくなる。従って、可とう性のある架橋構造を持ち、優
れた接着性や貼付温度特性が得られる。(Function) The pressure-sensitive adhesive composition according to the present invention can be cured by radiation, and exhibits various excellent effects.
Since the modified polybutadiene and modified polypropylene glycol used in the present invention have radiation functional groups at both ends,
After radiation curing, there are no free end chains and the molecular weight between crosslinking points becomes large. Therefore, it has a flexible crosslinked structure and provides excellent adhesiveness and application temperature characteristics.
特に変性ポリプロピレングリコールのエーテル結合が主
成分となる変性ポリブタジェンと充分に相溶しながら、
バランスよく低Tg化して、優れたゴム弾性のある粘着
剤を発現していると思われる。その結果、変性ポリブタ
ジェンのみで得られる耐水性、耐光性、耐熱性も維持で
きるものと思われる。In particular, while the ether bonds of modified polypropylene glycol are sufficiently compatible with modified polybutadiene, which is the main component,
It seems that the adhesive has a well-balanced low Tg and excellent rubber elasticity. As a result, it seems possible to maintain the water resistance, light resistance, and heat resistance obtained only with modified polybutadiene.
(実施例)
次に、実施例に基づいて本発明を詳述するが、本発明は
これに限定されるものではない。なお、実施例中の部は
特に断らない限り、重量部を意味する。(Example) Next, the present invention will be described in detail based on Examples, but the present invention is not limited thereto. In addition, unless otherwise specified, parts in the examples mean parts by weight.
〈変性ポリブタジェンの合成〉
ブタジェンをリビングアニオン重合で合成した1、2型
ポリブタジエン(商品名 Nl5SOPB G−10
00,両末端水酸基、数平均分子量約1000.日本曹
達■製)を白金触媒下オートクレーブ中、150℃、1
0kgf/−で水素を3時間反応させポリブタジェン中
のビニル性二重結合を水素添加したものを作った。その
時の水素添加率はIRの1600clI−’の吸収によ
り、90%である。<Synthesis of modified polybutadiene> Type 1 and 2 polybutadiene synthesized by living anionic polymerization of butadiene (trade name: Nl5SOPB G-10)
00, both terminal hydroxyl groups, number average molecular weight approximately 1000. (manufactured by Nippon Soda) in an autoclave under a platinum catalyst at 150°C for 1
Hydrogen was reacted at 0 kgf/- for 3 hours to produce polybutadiene with hydrogenated vinyl double bonds. The hydrogenation rate at that time was 90% due to the absorption of 1600 clI-' of IR.
次いで、アクリル酸しドロキシエチルと鎖延長側である
トリレンジイソシアネートを等モル混合し、70℃で4
時間攪拌反応させて得た、ビニル基を含有したイソシア
ネート化合物を、前記水添1.2−ポリブタジェン1モ
ル対して2モルを混合し、80℃で5時間反応させて、
末端にアクリロイル基を有する変性ポリブタジェン(理
論末端二重結合数=2)Aを得た。Next, droxyethyl acrylate and tolylene diisocyanate, which is a chain extension side, were mixed in equimolar amounts and heated at 70°C for 4 hours.
2 moles of the vinyl group-containing isocyanate compound obtained by the stirring reaction for hours were mixed with 1 mole of the hydrogenated 1,2-polybutadiene, and the mixture was reacted at 80° C. for 5 hours.
A modified polybutadiene having an acryloyl group at the end (theoretical number of terminal double bonds=2) was obtained.
同様な方法で、理論末端二重結合数が1.5個の変性ポ
リブタジェンBを合成した。Modified polybutadiene B having a theoretical terminal double bond number of 1.5 was synthesized in a similar manner.
〈変性ポリプロピレングリコールの合成〉ポリプロピレ
ングリコール(商品名PPG−3000、旭電化特製、
数平均分子量約1000)1モルに対してトリレンジイ
ソシアネート2モルを混合し、80℃で5時間加熱した
後、アクリル酸ヒドロキシエチル2モルを加え、再び8
0℃で4時間加熱して、変性ポリプロピレングリコール
■ (理論末端二重結合数=2)を得た。<Synthesis of modified polypropylene glycol> Polypropylene glycol (product name: PPG-3000, manufactured by Asahi Denka Special Co., Ltd.)
After mixing 2 mol of tolylene diisocyanate per 1 mol (number average molecular weight approximately 1000) and heating at 80°C for 5 hours, 2 mol of hydroxyethyl acrylate was added and 8 mol of hydroxyethyl acrylate was added.
The mixture was heated at 0° C. for 4 hours to obtain modified polypropylene glycol (theoretical number of terminal double bonds=2).
同様な方法で、表2に示す3種の変性ポリエーテルを合
成した。In a similar manner, three types of modified polyethers shown in Table 2 were synthesized.
得られた変性ポリブタジェンおよび変性ポリプロピレン
グリコールの特性を表1、表2に示す。The properties of the obtained modified polybutadiene and modified polypropylene glycol are shown in Tables 1 and 2.
表 1 変性ポリブタジェンの特性
実施例および比較例
前記変性ポリブタジェンと変性ポリプロピレングリコー
ルを基本成分として、さらにトリメチロールプロパント
リス(β−チオプロピオネート)とN−ニトロソフェニ
ルヒドロキシルアミンのアルミニウム塩(商品名q−t
3ot:和光純薬■製)を加えた放射線硬化型粘着剤組
成物(配合の詳細は表3に示す)を得た。Table 1 Characteristics of modified polybutadiene Examples and comparative examples In addition to the modified polybutadiene and modified polypropylene glycol as basic components, aluminum salt of trimethylolpropane tris (β-thiopropionate) and N-nitrosophenylhydroxylamine (trade name q -t
3ot: manufactured by Wako Pure Chemical Industries, Ltd.) to obtain a radiation-curable adhesive composition (details of formulation are shown in Table 3).
得られた粘着剤組成物をポリエチレンフィルム(厚さ6
0μ)に塗布厚みが10#sになるように塗布し、加速
電圧200KV、ビーム電流10mAの電子線照射装置
(リニアフィラメント型、 En6rgy 5cke
nce Inc、製、商品名エレクトロカーテン)で窒
素ガス雰囲気(酸素濃度500ppm)下で5 Mra
d照射し、表面保護用粘着フィルムを作成した。The obtained adhesive composition was spread on a polyethylene film (thickness 6
0 μ) to a coating thickness of 10 #s, and then using an electron beam irradiation device (linear filament type, En6rgy 5cke) with an acceleration voltage of 200 KV and a beam current of 10 mA.
5 Mra under a nitrogen gas atmosphere (oxygen concentration 500 ppm) using CE Inc., product name Electrocurtain).
d irradiation to create an adhesive film for surface protection.
この粘着フィルムを5OS−430BA板とカラー鋼板
に貼付け、種々の試験を行った。その結果を表4にまと
めて示す。This adhesive film was attached to a 5OS-430BA plate and a color steel plate, and various tests were conducted. The results are summarized in Table 4.
以下余白
(発明の効果)
上記実施例の結果からも明らかなように、本発明によれ
ば変性ポリブタジェンと変性ポリプロピレングリコール
を基本成分とする接着剤組成物は、塗布厚あたりの接着
力が大きく、高温接着力、低温貼付性、耐水性、耐候性
、経時後の形状変化。Margin below (Effects of the Invention) As is clear from the results of the above examples, according to the present invention, the adhesive composition containing modified polybutadiene and modified polypropylene glycol as basic components has a high adhesive strength per coating thickness. High temperature adhesive strength, low temperature adhesion, water resistance, weather resistance, shape change over time.
高速剥離性が優れ、バランスの良好な粘着特性を有して
おり、感圧性接着剤として非常に有用なものである。It has excellent high-speed peelability and well-balanced adhesive properties, making it very useful as a pressure-sensitive adhesive.
Claims (1)
側鎖のビニル性二重結合の90%以上が水素添加され、
末端に不飽和二重結合を導入した数平均分子量が500
乃至3,000である変性ポリブタジエン100重量部
に対し、末端に不飽和二重結合を導入した数平均分子量
が1,000乃至20,000である変性ポリプロピレ
ングリコール5乃至50重量部、1分子中に官能基を2
個以上有する連鎖移動剤を0.2乃至20重量部、さら
に熱重合禁止剤を0.001乃至10重量部配合するこ
とを特徴とする放射線硬化型感圧性接着剤組成物。 2、変性ポリブタジエン及び、変性ポリプロピレングリ
コールの末端の不飽和二重結合がアクリロイル基または
メタクリロイル基である請求項1記載の放射線硬化型感
圧性接着剤組成物。 3、変性ポリブタジエン及び変性ポリプロピレングリコ
ールの理論末端二重結合数が平均して、1分子中に1個
以上である請求項1記載の放射線硬化型感圧性接着剤組
成物。 4、変性ポリブタジエン及び変性ポリプロピレングリコ
ールが、末端変性剤あるいは鎖延長剤としてトリレンジ
イソシアネートを用いた重合体である請求項1乃至3記
載の放射線硬化型感圧性接着剤組成物。 5、連鎖移動剤が10^2以上の連鎖移動定数を有する
チオール化合物である請求項1記載の放射線硬化型感圧
性接着剤組成物。 6、熱重合禁止剤がニトロソ系化合物である請求項1記
載の放射線硬化型感圧性接着剤組成物。 7、ニトロソ系化合物がN−ニトロソフェニルヒドロキ
シルアミンの金属塩である請求項6記載の放射線硬化型
感圧性接着剤組成物。 8、N−ニトロソフェニルヒドロキシルアミンの金属塩
がアルミニウム塩である請求項7記載の放射線硬化型感
圧性接着剤組成物。[Claims] 1,90% or more of the 1,2-type structure, 90% or more of the vinyl double bonds in the main chain or side chain are hydrogenated,
The number average molecular weight with an unsaturated double bond introduced at the end is 500.
5 to 50 parts by weight of modified polypropylene glycol having a number average molecular weight of 1,000 to 20,000 with an unsaturated double bond introduced at the terminal, per 1 molecule, per 100 parts by weight of modified polybutadiene having a molecular weight of 1,000 to 3,000. 2 functional groups
1. A radiation-curable pressure-sensitive adhesive composition, characterized in that it contains 0.2 to 20 parts by weight of a chain transfer agent having at least 100% of the chain transfer agent, and 0.001 to 10 parts by weight of a thermal polymerization inhibitor. 2. The radiation-curable pressure-sensitive adhesive composition according to claim 1, wherein the terminal unsaturated double bond of the modified polybutadiene and modified polypropylene glycol is an acryloyl group or a methacryloyl group. 3. The radiation-curable pressure-sensitive adhesive composition according to claim 1, wherein the modified polybutadiene and the modified polypropylene glycol have an average theoretical number of terminal double bonds of 1 or more per molecule. 4. The radiation-curable pressure-sensitive adhesive composition according to any one of claims 1 to 3, wherein the modified polybutadiene and the modified polypropylene glycol are polymers using tolylene diisocyanate as a terminal modifier or chain extender. 5. The radiation-curable pressure-sensitive adhesive composition according to claim 1, wherein the chain transfer agent is a thiol compound having a chain transfer constant of 10^2 or more. 6. The radiation-curable pressure-sensitive adhesive composition according to claim 1, wherein the thermal polymerization inhibitor is a nitroso compound. 7. The radiation-curable pressure-sensitive adhesive composition according to claim 6, wherein the nitroso compound is a metal salt of N-nitrosophenylhydroxylamine. 8. The radiation-curable pressure-sensitive adhesive composition according to claim 7, wherein the metal salt of N-nitrosophenylhydroxylamine is an aluminum salt.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2046689A JP2621457B2 (en) | 1989-01-30 | 1989-01-30 | Radiation-curable pressure-sensitive adhesive composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2046689A JP2621457B2 (en) | 1989-01-30 | 1989-01-30 | Radiation-curable pressure-sensitive adhesive composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02199184A true JPH02199184A (en) | 1990-08-07 |
JP2621457B2 JP2621457B2 (en) | 1997-06-18 |
Family
ID=12027869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2046689A Expired - Lifetime JP2621457B2 (en) | 1989-01-30 | 1989-01-30 | Radiation-curable pressure-sensitive adhesive composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2621457B2 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06128538A (en) * | 1992-06-30 | 1994-05-10 | Kansai Paint Co Ltd | Antistatic sheet for protecting automobile coating film |
EP0707053A2 (en) | 1994-10-11 | 1996-04-17 | Nitto Denko Corporation | Paint film-protective sheet |
US6395390B1 (en) | 1998-10-07 | 2002-05-28 | Nitto Denko Corporation | Sheet for protecting paint films of automobiles |
JP2002322454A (en) * | 2001-04-26 | 2002-11-08 | Toppan Forms Co Ltd | Radiation-curing, peelable pressure-sensitive adhesive |
JP2007091956A (en) * | 2005-09-29 | 2007-04-12 | Sumitomo Bakelite Co Ltd | Resin composition and semiconductor device produced by using the resin composition |
WO2008129852A1 (en) | 2007-04-03 | 2008-10-30 | Nitto Denko Corporation | Coating protective sheet |
JP2011032410A (en) * | 2009-08-04 | 2011-02-17 | Bridgestone Corp | Photocurable resin composition and adhesive sheet obtained from the same |
WO2014061251A1 (en) * | 2012-10-16 | 2014-04-24 | 日本曹達株式会社 | Method for producing end-modified polybutadiene or end-modified hydrogenated polybutadiene and composition containing same |
WO2015151203A1 (en) * | 2014-03-31 | 2015-10-08 | リンテック株式会社 | Protective film, and protective-film-attached film on which transparent conductive film is to be laminated |
CN114729232A (en) * | 2019-12-17 | 2022-07-08 | 昭和电工株式会社 | Semiconductor processing belt |
-
1989
- 1989-01-30 JP JP2046689A patent/JP2621457B2/en not_active Expired - Lifetime
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06128538A (en) * | 1992-06-30 | 1994-05-10 | Kansai Paint Co Ltd | Antistatic sheet for protecting automobile coating film |
EP0707053A2 (en) | 1994-10-11 | 1996-04-17 | Nitto Denko Corporation | Paint film-protective sheet |
US6395390B1 (en) | 1998-10-07 | 2002-05-28 | Nitto Denko Corporation | Sheet for protecting paint films of automobiles |
JP2002322454A (en) * | 2001-04-26 | 2002-11-08 | Toppan Forms Co Ltd | Radiation-curing, peelable pressure-sensitive adhesive |
JP2007091956A (en) * | 2005-09-29 | 2007-04-12 | Sumitomo Bakelite Co Ltd | Resin composition and semiconductor device produced by using the resin composition |
WO2008129852A1 (en) | 2007-04-03 | 2008-10-30 | Nitto Denko Corporation | Coating protective sheet |
JP2011032410A (en) * | 2009-08-04 | 2011-02-17 | Bridgestone Corp | Photocurable resin composition and adhesive sheet obtained from the same |
US9815922B2 (en) | 2012-10-16 | 2017-11-14 | Nippon Soda Co., Ltd. | Method for producing end-modified polybutadiene or end-modified hydrogenated polybutadiene and composition containing same |
WO2014061251A1 (en) * | 2012-10-16 | 2014-04-24 | 日本曹達株式会社 | Method for producing end-modified polybutadiene or end-modified hydrogenated polybutadiene and composition containing same |
TWI504622B (en) * | 2012-10-16 | 2015-10-21 | Nippon Soda Co | A method for producing a polybutadiene or a terminal modified hydrogenated polybutadiene, and a composition containing the same |
JP5898781B2 (en) * | 2012-10-16 | 2016-04-06 | 日本曹達株式会社 | Process for producing terminal-modified polybutadiene or terminal-modified hydrogenated polybutadiene and composition containing them |
JPWO2014061251A1 (en) * | 2012-10-16 | 2016-09-05 | 日本曹達株式会社 | Process for producing terminal-modified polybutadiene or terminal-modified hydrogenated polybutadiene and composition containing them |
WO2015151203A1 (en) * | 2014-03-31 | 2015-10-08 | リンテック株式会社 | Protective film, and protective-film-attached film on which transparent conductive film is to be laminated |
KR20160140754A (en) * | 2014-03-31 | 2016-12-07 | 린텍 가부시키가이샤 | Protective film, and protective-film-attached film on which transparent conductive film is to be laminated |
JPWO2015151203A1 (en) * | 2014-03-31 | 2017-04-13 | リンテック株式会社 | Protective film and film for laminating transparent conductive film with protective film |
CN106133087A (en) * | 2014-03-31 | 2016-11-16 | 琳得科株式会社 | The nesa coating lamination thin film of protective film and band protective film |
TWI668288B (en) * | 2014-03-31 | 2019-08-11 | 日商琳得科股份有限公司 | Protective film and film for transparent conductive film lamination with protective film |
CN114729232A (en) * | 2019-12-17 | 2022-07-08 | 昭和电工株式会社 | Semiconductor processing belt |
Also Published As
Publication number | Publication date |
---|---|
JP2621457B2 (en) | 1997-06-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0289852B1 (en) | Radiation curable pressure sensitive adhesive composition | |
US4665106A (en) | Radiation curable pressure-sensitive adhesive composition | |
JP2909661B2 (en) | Radiation-curable pressure-sensitive adhesive composition | |
JP7076448B2 (en) | Liquid Adhesive Compositions, Adhesive Sheets and Adhesive Methods | |
JPH02199184A (en) | Radiation-curable pressure-sensitive adhesive composition | |
US4659788A (en) | Radiation curable adhesive composition for surface protective film | |
JPH0436192B2 (en) | ||
JP4945150B2 (en) | Protective sheet for urethane coatings for automobiles | |
JPS63260977A (en) | Radiation-curable pressure sensitive adhesive composition | |
US4554174A (en) | Process for producing radiation curable adhesive tape | |
JP5556593B2 (en) | One-pack type active energy ray-curable coating composition and composite coating film | |
JPH1060382A (en) | Pressure-sensitive urethane adhesive composition | |
JPS6049671B2 (en) | Radiation-curable pressure-sensitive adhesive composition | |
JPH01156386A (en) | Radiation-curable, pressure-sensitive adhesive composition | |
WO2019182155A1 (en) | Curable composition, cured product, method for producing cured product, and method for repairing damage of cured product | |
EP0210309B1 (en) | Radiation curable pressure-sensitive adhesive composition | |
JPH06122859A (en) | Pressure-sensitive adhesive composition | |
JPS636565B2 (en) | ||
JPH01156385A (en) | Radiation-curable, pressure-sensitive adhesive composition | |
JPH0153985B2 (en) | ||
JPH0236611B2 (en) | HYOMENHOGOFUIRUMUYOHOSHASENKOKAGATANENCHAKUZAI | |
JPH0144730B2 (en) | ||
JPH0463110B2 (en) | ||
JPH0798924B2 (en) | Radiation curable pressure sensitive adhesive composition | |
JPH0798925B2 (en) | Radiation curable pressure sensitive adhesive composition |