JPH0219546U - - Google Patents
Info
- Publication number
- JPH0219546U JPH0219546U JP9721788U JP9721788U JPH0219546U JP H0219546 U JPH0219546 U JP H0219546U JP 9721788 U JP9721788 U JP 9721788U JP 9721788 U JP9721788 U JP 9721788U JP H0219546 U JPH0219546 U JP H0219546U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electrodes
- thermal head
- type thermal
- end surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案による端面型サーマルヘツドの
一実施例を示す部分平面図、第２図は同じく部分
正面図、第３図は同じく部分背面図、第４図は同
じく部分断面図、第５図及び第６図は本考案の一
実施例の製造工程を示す斜視図、第７図は従来の
端面型サーマルヘツドを示す断面図である。
１０……基板、１１……表面部個別電極、１２
……入力電極、１３……表面部共通電極、１６…
…裏面部共通電極、１９，２０……端面部個別電
極、２１……端面部共通電極。
FIG. 1 is a partial plan view showing an embodiment of the end-type thermal head according to the present invention, FIG. 2 is a partial front view, FIG. 3 is a partial rear view, FIG. 4 is a partial cross-sectional view, and FIG. 6 and 6 are perspective views showing the manufacturing process of an embodiment of the present invention, and FIG. 7 is a sectional view showing a conventional end face type thermal head. 10...Substrate, 11...Surface individual electrode, 12
...Input electrode, 13...Surface common electrode, 16...
... back surface common electrode, 19, 20 ... end surface individual electrode, 21 ... end surface common electrode.
Claims (1)
共に上記基板の表面部及び裏面部に電極を設けて
成る端面型サーマルヘツドにおいて、 上記基板の端面部に設ける電極と、上記基板の
表面部及び裏面部に設ける電極とをエツチング比
の異なる材料で形成したことを特徴とする端面型
サーマルヘツド。[Claims for Utility Model Registration] An edge-type thermal head in which a heating resistor and an electrode are provided on the end surface of the substrate, and electrodes are provided on the front and back surfaces of the substrate, the electrodes being provided on the end surface of the substrate; An edge type thermal head characterized in that the electrodes provided on the front surface and the back surface of the substrate are formed of materials having different etching ratios.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9721788U JPH0219546U (en) | 1988-07-22 | 1988-07-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9721788U JPH0219546U (en) | 1988-07-22 | 1988-07-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0219546U true JPH0219546U (en) | 1990-02-08 |
Family
ID=31322494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9721788U Pending JPH0219546U (en) | 1988-07-22 | 1988-07-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0219546U (en) |
-
1988
- 1988-07-22 JP JP9721788U patent/JPH0219546U/ja active Pending